CN107072060A - A kind of method for solving thin plate circuit dog tooth - Google Patents
A kind of method for solving thin plate circuit dog tooth Download PDFInfo
- Publication number
- CN107072060A CN107072060A CN201710379594.5A CN201710379594A CN107072060A CN 107072060 A CN107072060 A CN 107072060A CN 201710379594 A CN201710379594 A CN 201710379594A CN 107072060 A CN107072060 A CN 107072060A
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- Prior art keywords
- plate
- pad pasting
- dog tooth
- production
- circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Abstract
The invention discloses a kind of method for solving thin plate circuit dog tooth, comprise the following steps：Pad pasting pre-treatment, plate surface is produced with adhesive-bonded fabric polish-brush, and nog plate speed is 3.0 3.4m/min, a width of 12 16mm of polishing scratch, microetch is then carried out to production plate, erosion amount of copper is 0.8 μm；The production plate is by heavy copper and electric plating of whole board process；Pad pasting, carries out pad pasting, it is 100 130 DEG C to cross plate rumble temperature, pad pasting pressure is 4 6kg/cm using automatic film applicator to production plate2, pad pasting speed is 3.0 3.8m/min；Exposure, development：Using Full-automatic exposure machine and positive line film, outer-layer circuit exposure is completed with 6 lattice exposure guide rules, it is developed, form outer-layer circuit figure on production plate.The inventive method by control thin plate be roughened and pad pasting parameter, increase the adhesion of wiring board and dry film, prevent occurring oozing the problem of situation of tin is to solve circuit dog tooth during electrotinning.
Description
Technical field
The present invention relates to wiring board production technical field, more particularly to a kind of method for solving thin plate circuit dog tooth.
Background technology
The production procedure of wiring board generally comprises sawing sheet → negative film makes internal layer circuit → pressing → drilling → heavy copper → complete
Plate plating → positive blade technolgy makes outer-layer circuit → making solder mask → surface treatment → shaping.Make appearance during outer-layer circuit
The problem of easily circuit dog tooth occur, circuit dog tooth is that circuit both sides locally fail normal etches, forms overall line width and differs
Cause.
Circuit dog tooth problem is concentrated mainly on thin plate (thickness of slab<In production plate 1.0mm), thickness of slab<1.0mm thin plate is entering
During row outer layer pre-treatment, if polish-brush amount is excessive, plank deformation is easily caused；If outer graphics polish-brush amount is not enough, dry film and plate
The adhesion in face not enough, causes during graphic plating, there occurs during electrotinning at the dry film side inadequate with plate face adhesion
Tin is oozed, when etching in the later stage, the layers of copper for oozing Xi Weizhichu is not etched and causes circuit dog tooth；Also be exactly a kind of situation just
Be with electroplating hanging-plate direction it is at 45 °~easily there is dog tooth in 90 ° of outer-layer circuit position, be primarily due in etching non-outer layer line
During the copper face of road, with electroplating hanging-plate direction it is at 45 °~90 ° of outer-layer circuit easily hides etching solution, causes circuit lateral erosion to form dog tooth,
And the outer-layer circuit consistent with electroplating hanging-plate direction, due to being vertical, etching solution flows downward soon, will not hide etching solution.
The content of the invention
The present invention is directed to thickness of slab<1.0mm thin plate make outer-layer circuit when easily there is circuit dog tooth the problem of there is provided
It is a kind of solve thin plate circuit dog tooth method, this method by control thin plate be roughened and pad pasting parameter, increase wiring board with
The adhesion of dry film, prevents occurring oozing the problem of situation of tin is to solve circuit dog tooth during electrotinning.
In order to solve the above-mentioned technical problem, the invention provides a kind of method for solving thin plate circuit dog tooth, including it is following
Step：
S1, pad pasting pre-treatment：Plate surface is produced with adhesive-bonded fabric polish-brush, nog plate speed is 3.0-3.4m/min, and polishing scratch is a width of
12-16mm, then carries out microetch to production plate, and erosion amount of copper is 0.8 μm；
The production plate is by heavy copper and electric plating of whole board process；
S2, pad pasting：Pad pasting is carried out to production plate using automatic film applicator, it is 100-130 DEG C to cross plate rumble temperature, and pad pasting pressure is
4-6kg/cm2, pad pasting speed is 3.0-3.8m/min；
S3, exposure, development：Using Full-automatic exposure machine and positive line film, complete outer-layer circuit with 6 lattice exposure guide rules and expose
Light, it is developed, form outer-layer circuit figure on production plate；
S4, rear process：Successively on production plate graphic plating, make and solder mask, silk-screen character and be surface-treated, system
Obtain wiring board.
Preferably, in step S1, nog plate speed is 3.2m/min, a width of 14mm of polishing scratch.
Preferably, in step S2, it is 115 DEG C to cross plate rumble temperature, and pad pasting pressure is 5kg/cm2, pad pasting speed is 3.4m/min.
Preferably, in step S3, the developer pressure in production plate upper surface is 1.1-1.7kg/cm2, in production plate following table
The developer pressure in face is 1.0-1.6kg/cm2, development temperature is 28-32 DEG C.
Preferably, the developer pressure in production plate upper surface is 1.4kg/cm2, it is in the developer pressure of production plate lower surface
1.3kg/cm2, development temperature is 29 DEG C.
Preferably, in step S4, when graphic plating process is tin plating, the vibration frequency of tin cylinder stops 60s for the 10s that shakes.
Preferably, in step S4, before tin plating, the sulfuric acid for being 10-12% with concentration of volume percent carries out leaching cylinder processing.
Compared with prior art, the beneficial effects of the invention are as follows：Parameter of the invention by controlling thin plate roughening and pad pasting,
Do not result in plank deformation, and make the adhesion of wiring board and dry film enough, and the vibration frequency of the tin cylinder 10s that is adjusted to shake is stopped
60s, prevents occurring oozing the problem of situation of tin is to solve circuit dog tooth during electrotinning；Being tried one's best during other hanging plate, it is most of outer to avoid
Sandwich circuit figure is vertical with hanging plate direction, and most of outer-layer circuit figure should be consistent with hanging plate direction, keeping parallelism, i.e., most of
Outer-layer circuit figure is vertical, and when etching non-outer layer circuit copper face, etching solution flows downward soon, will not be stayed in outer-layer circuit
Etching solution is hidden, prevents outer-layer circuit from being caused dog tooth problem by lateral erosion.
Embodiment
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme
It is described further and illustrates.
Embodiment 1
The present embodiment provides a kind of preparation method of thin plate, especially wherein solves thickness of slab<1.0mm thin plate circuit dog tooth
Method, comprise the following steps that：
(1) by heavy copper and the production plate of electric plating of whole board process：
According to prior art, sawing sheet → making internal layer circuit → pressing → drilling → heavy copper → electric plating of whole board is sequentially passed through,
Base material is fabricated to semi-finished product production plate；It is specific as follows：
A, sawing sheet：Core plate, core thickness 0.5mmH/H are outputed by jigsaw size 520mm × 620mm.
B, making internal layer circuit (negative film technique)：Produced with vertical application machine, 8 μm of film thickness monitoring, using fully automatic exposure
Machine, completes internal layer circuit exposure with 5-6 lattice exposure guide rule (21 lattice exposure guide rule), line pattern, internal layer line width amount is etched after development
Survey as 3mil, then check internal layer opens the defects such as short circuit, circuit breach, circuit pin hole, it is defective to scrap processing, it is flawless
Product goes out to downstream.
C, pressing：After lamination, appropriate lamination bar is selected according to the characteristic of plate according to bottom copper copper thick brown for brown speed
Part is pressed, and forms production plate.
D, drilling：Drilling operation is carried out using borehole data.
E, heavy copper：Make the hole metallization on production plate, backlight tests 10 grades, the heavy copper thickness in hole is 0.5 μm.
F, electric plating of whole board：With 1.8ASD current density electric plating of whole board 20min.
(2) outer-layer circuit (positive blade technolgy) is made：
S1, pad pasting pre-treatment：Plate surface is produced with 600# adhesive-bonded fabric polish-brush, nog plate speed is 3.2m/min, and polishing scratch is wide
For 14mm, super roughening microetch is then carried out to production plate with organic acid, erosion amount of copper is 0.8 μm；
S2, pad pasting：Patch dry film is carried out to production plate using automatic film applicator, during patch dry film, the plate rumble temperature of crossing of production plate is
115 DEG C, speed is 3.4m/min, and the pad pasting pressure that laminator applies is 5kg/cm2；
S3, exposure, development：It is complete with 6 lattice exposure guide rules (21 lattice exposure guide rule) using Full-automatic exposure machine and positive line film
Into outer-layer circuit exposure, the Na for being then 0.8-1.2% with weight percent concentration2CO3Developed, formed on production plate
The control of outer-layer circuit figure, wherein development temperature is at 29 DEG C, developing powder 4.5m/min, and the developer pressure of production plate upper surface is
1.4kg/cm2, the developer pressure of production plate lower surface is 1.3kg/cm2；
S4, graphic plating：Then copper facing and tin plating, the electroplating parameter of copper facing parameter are distinguished on production plate:1.8ASD×
60min, tin plating electroplating parameter：1.2ASD × 10min, tin thickness is 3-5 μm；Then move back film successively again, etch and move back tin, in life
Outer-layer circuit is etched on production plate.
In graphic plating process, when etching non-outer layer circuit copper face with vertical line, most of outer-layer circuit figure side
The hanging plate direction of Xiang Yingyu production plates is consistent, should be tried one's best during production plate hanging plate and avoid outer-layer circuit figure vertical with hanging plate direction,
Prevent from staying Tibetan etching solution in outer-layer circuit, cause circuit lateral erosion to form dog tooth；And before tin plating, use concentration of volume percent
Leaching cylinder processing is carried out for 10-12% sulfuric acid, it is ensured that the sulfuric acid concentration in tin cylinder, prevent plate face from aoxidizing；When tin plating, tin cylinder
The vibration frequency 10s that is adjusted to shake stops 60s.
(3) solder mask and silk-screen character are made：Solder mask is made according to prior art and by design requirement on production plate
And silk-screen character.
(4) it is surface-treated, detects and shaping：
It is surface-treated according to prior art and by design requirement on production plate, then the electrical resistance of test production plate
Can, circuit board finished product is made in gong profile and the outward appearance for taking a sample test plate again.
500 pieces of circuit board finished products are made with the preparation method of thin plate in embodiment 1, during outer-layer circuit is made, led to
The method and parameter for crossing the present embodiment are controlled links, it is ensured that while the adhesion of dry film and production plate, outer layer
Dry film on line pattern can also be fallen by abundant development, and residual is not had and causes circuit dog tooth, and is reduced in etching non-outer layer
Circuit is by the situation of lateral erosion during the copper face of circuit, eventually through inspection, and the qualification rate of outer-layer circuit reaches more than 99%, there is line
The situation of road dog tooth is less than 1%.
Embodiment 2
The present embodiment provides a kind of preparation method of thin plate, especially wherein solves thickness of slab<1.0mm thin plate circuit dog tooth
Method, this method is essentially identical with embodiment 1, and difference is step S1 to S3, specific as follows：
S1, pad pasting pre-treatment：Plate surface is produced with 600# adhesive-bonded fabric polish-brush, nog plate speed is 3.0m/min, and polishing scratch is wide
For 12mm, super roughening microetch is then carried out to production plate with organic acid, erosion amount of copper is 0.8 μm；
S2, pad pasting：Patch dry film is carried out to production plate using automatic film applicator, during patch dry film, the plate rumble temperature of crossing of production plate is
100 DEG C, speed is 3.0m/min, and the pad pasting pressure that laminator applies is 4kg/cm2；
S3, exposure, development：It is complete with 6 lattice exposure guide rules (21 lattice exposure guide rule) using Full-automatic exposure machine and positive line film
Into outer-layer circuit exposure, the Na for being then 0.8-1.2% with weight percent concentration2CO3Developed, formed on production plate
The control of outer-layer circuit figure, wherein development temperature is at 28 DEG C, developing powder 4.0m/min, and the developer pressure of production plate upper surface is
1.1kg/cm2, the developer pressure of production plate lower surface is 1.0kg/cm2。
The implementation parameter of each step when making outer-layer circuit is changed in embodiment 2, with the making side of thin plate in embodiment 2
Legal system obtains 500 pieces of circuit board finished products, by examining, and the qualification rate of outer-layer circuit reaches more than 97%, the feelings that there is circuit dog tooth
Condition is less than 3%.
Embodiment 3
The present embodiment provides a kind of preparation method of thin plate, especially wherein solves thickness of slab<1.0mm thin plate circuit dog tooth
Method, this method is essentially identical with embodiment 1, and difference is step S1 to S3, specific as follows：
S1, pad pasting pre-treatment：Plate surface is produced with 600# adhesive-bonded fabric polish-brush, nog plate speed is 3.4m/min, and polishing scratch is wide
For 16mm, super roughening microetch is then carried out to production plate with organic acid, erosion amount of copper is 0.8 μm；
S2, pad pasting：Patch dry film is carried out to production plate using automatic film applicator, during patch dry film, the plate rumble temperature of crossing of production plate is
130 DEG C, speed is 3.8m/min, and the pad pasting pressure that laminator applies is 6kg/cm2；
S3, exposure, development：It is complete with 6 lattice exposure guide rules (21 lattice exposure guide rule) using Full-automatic exposure machine and positive line film
Into outer-layer circuit exposure, the Na for being then 0.8-1.2% with weight percent concentration2CO3Developed, formed on production plate
The control of outer-layer circuit figure, wherein development temperature is at 32 DEG C, developing powder 5.0m/min, and the developer pressure of production plate upper surface is
1.7kg/cm2, the developer pressure of production plate lower surface is 1.6kg/cm2。
The implementation parameter of each step when making outer-layer circuit is changed in embodiment 3, dry film and production plate is being ensure that
On the basis of adhesion, production plate again will not be because polish-brush amount is too big and causes plank to deform；With the making of thin plate in embodiment 3
500 pieces of circuit board finished products are made in method, and by examining, the qualification rate of outer-layer circuit reaches more than 98%, there is circuit dog tooth
Situation is less than 2%.
In other embodiments, in being handled before step S1 pad pastings, nog plate speed can also be adjusted to 3.0-3.4m/
Min, polishing scratch is wide to be adjusted to 12-16mm；In the processing of step S2 pad pastings, the plate rumble temperature of crossing for producing plate can also be adjusted to 100-130
DEG C, speed is 3.0-3.8m/min, and the pad pasting pressure that laminator applies is 4-6kg/cm2；, can also be by when step S3 develops
Development temperature is adjusted to 28-32 DEG C, and developing powder is adjusted to 4.0-5.0m/min, and the developer pressure of production plate upper surface is 1.1-
1.7kg/cm2, the developer pressure of production plate lower surface is 1.0-1.6kg/cm2。
Comparative example 1：
This comparative example provides a kind of preparation method of thin plate, especially wherein solves thickness of slab<1.0mm thin plate circuit dog tooth
Method, this method is essentially identical with embodiment 1, and difference is step S1 to S2, is specially：Before step S1 pad pastings
In processing, nog plate speed is adjusted to be less than 3.0m/min, polishing scratch is wide to be adjusted to less than 12mm；, will in the processing of step S2 pad pastings
The plate rumble temperature of crossing of production plate is adjusted to less than 100 DEG C, and the pad pasting pressure that laminator applies is adjusted to less than 4kg/cm2。
The implementation parameter of step S1 and S2 when making outer-layer circuit are changed in comparative example 1, with the system of thin plate in comparative example 1
Make method and 500 pieces of circuit board finished products are made, by examining, the qualification rate of outer-layer circuit has circuit dog tooth 85% or so
Problem is relatively more.
Comparative example 2：
This comparative example provides a kind of preparation method of thin plate, especially wherein solves thickness of slab<1.0mm thin plate circuit dog tooth
Method, this method is essentially identical with embodiment 1, and difference is step S1 to S2, is specially：Before step S1 pad pastings
In processing, nog plate speed is adjusted to be more than 3.4m/min, polishing scratch is wide to be adjusted to more than 16mm；, will in the processing of step S2 pad pastings
The plate rumble temperature of crossing of production plate is adjusted to higher than 130 DEG C, and the pad pasting pressure that laminator applies is adjusted to more than 6kg/cm2。
The implementation parameter of step S1 and S2 when making outer-layer circuit are changed in comparative example 2, with the system of thin plate in comparative example 2
Make method and 500 pieces of circuit board finished products are made, by examining, the qualification rate of outer-layer circuit has plank deformation 95% or so
Situation it is relatively more, the plank of deformation reaches more than 20%；It can be seen that, though comparative example 2 increases dry film and produces the combination of plate
Power, but the situation that plank plank is deformed caused by polish-brush amount is excessive is relatively more.
The technology contents described above that the present invention is only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, and any technology done according to the present invention extends or recreated, and is sent out by this
Bright protection.
Claims (7)
1. a kind of method for solving thin plate circuit dog tooth, it is characterised in that comprise the following steps：
S1, pad pasting pre-treatment：Plate surface is produced with adhesive-bonded fabric polish-brush, nog plate speed is 3.0-3.4m/min, a width of 12- of polishing scratch
16mm, then carries out microetch to production plate, and erosion amount of copper is 0.8 μm；
The production plate is by heavy copper and electric plating of whole board process；
S2, pad pasting：Pad pasting is carried out to production plate using automatic film applicator, it is 100-130 DEG C to cross plate rumble temperature, and pad pasting pressure is 4-
6kg/cm2, pad pasting speed is 3.0-3.8m/min；
S3, exposure, development：Using Full-automatic exposure machine and positive line film, outer-layer circuit exposure is completed with 6 lattice exposure guide rules,
It is developed, form outer-layer circuit figure on production plate；
S4, rear process：Successively on production plate graphic plating, make and solder mask, silk-screen character and be surface-treated, obtained line
Road plate.
2. the method according to claim 1 for solving thin plate circuit dog tooth, it is characterised in that in step S1, nog plate speed
For 3.2m/min, a width of 14mm of polishing scratch.
3. the method according to claim 1 for solving thin plate circuit dog tooth, it is characterised in that in step S2, crosses plate rumble temperature
For 115 DEG C, pad pasting pressure is 5kg/cm2, pad pasting speed is 3.4m/min.
4. the method according to claim 1 for solving thin plate circuit dog tooth, it is characterised in that in step S3, in production plate
The developer pressure of upper surface is 1.1-1.7kg/cm2, it is 1.0-1.6kg/cm in the developer pressure of production plate lower surface2, development temperature
Spend for 28-32 DEG C.
5. the method according to claim 4 for solving thin plate circuit dog tooth, it is characterised in that in the aobvious of production plate upper surface
Shadow pressure is 1.4kg/cm2, it is 1.3kg/cm in the developer pressure of production plate lower surface2, development temperature is 29 DEG C.
6. the method according to claim 1 for solving thin plate circuit dog tooth, it is characterised in that in step S4, in figure electricity
When plating process is tin plating, the vibration frequency of tin cylinder stops 60s for the 10s that shakes.
7. the method according to claim 6 for solving thin plate circuit dog tooth, it is characterised in that in step S4, before tin plating,
The sulfuric acid for being 10-12% with concentration of volume percent carries out leaching cylinder processing.
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| CN201710379594.5A CN107072060A (en) | 2017-05-25 | 2017-05-25 | A kind of method for solving thin plate circuit dog tooth |
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| CN201710379594.5A CN107072060A (en) | 2017-05-25 | 2017-05-25 | A kind of method for solving thin plate circuit dog tooth |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108289377A (en) * | 2018-01-30 | 2018-07-17 | 江西景旺精密电路有限公司 | A kind of pcb board outer layer connection line operation method |
| CN108650800A (en) * | 2018-06-29 | 2018-10-12 | 奥士康精密电路（惠州）有限公司 | A kind of PCB production procedures reducing dry film holes |
| CN109275277A (en) * | 2018-10-17 | 2019-01-25 | 江门崇达电路技术有限公司 | A kind of solder-resisting manufacturing methods for preventing PCB aperture from entering ink |
| CN112105162A (en) * | 2020-10-12 | 2020-12-18 | 广州添利电子科技有限公司 | Ultrathin core continuous pressing process |
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| CN106019861A (en) * | 2016-07-04 | 2016-10-12 | 奥士康精密电路（惠州）有限公司 | Method for quick developing of dry film |
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| CN103458619A (en) * | 2013-08-19 | 2013-12-18 | 四川海英电子科技有限公司 | Method for producing double-sided PCB |
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| CN112105162A (en) * | 2020-10-12 | 2020-12-18 | 广州添利电子科技有限公司 | Ultrathin core continuous pressing process |
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Application publication date: 20170818 |