CN112105162A - Ultrathin core continuous pressing process - Google Patents
Ultrathin core continuous pressing process Download PDFInfo
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- CN112105162A CN112105162A CN202011087134.3A CN202011087134A CN112105162A CN 112105162 A CN112105162 A CN 112105162A CN 202011087134 A CN202011087134 A CN 202011087134A CN 112105162 A CN112105162 A CN 112105162A
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- inner layer
- core
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- etching
- pattern
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- 238000003825 pressing Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000005530 etching Methods 0.000 claims abstract description 42
- 238000005260 corrosion Methods 0.000 claims abstract description 20
- 230000007797 corrosion Effects 0.000 claims abstract description 19
- 238000010030 laminating Methods 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000011889 copper foil Substances 0.000 claims abstract description 4
- 238000005520 cutting process Methods 0.000 claims description 16
- 238000004080 punching Methods 0.000 claims description 16
- 229920000742 Cotton Polymers 0.000 claims description 15
- 239000000428 dust Substances 0.000 claims description 13
- 230000003647 oxidation Effects 0.000 claims description 10
- 238000007254 oxidation reaction Methods 0.000 claims description 10
- 238000005553 drilling Methods 0.000 claims description 9
- 238000007689 inspection Methods 0.000 claims description 9
- 235000013405 beer Nutrition 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 6
- 230000004927 fusion Effects 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a continuous laminating process of ultrathin core, wherein L4-5 single core is subjected to an etching process, an anti-corrosion film is adhered to the surface L4, and an etching pattern is etched on the surface L5; l12-13 single core, wherein an L13 surface is pasted with an etching resistant film, and an L12 surface is etched to form a pattern; l2-3 single core is in the etching process, the corrosion resistant film is adhered to the L2 surface, and the pattern is etched on the L3 surface; l14-15 single core, adhering a corrosion resistant film on the L15 surface, etching a pattern on the L14 surface, and then pressing the Sub Assembly L2-15 surface; the Core-Lam multi-time pressing and laminating process is used for replacing the original Foil-Lam single pressing and laminating process, a single-side etching mode is adopted for 8-micrometer & 12-micrometer Core, one side of the Core is etched to form a pattern, the other side of the Core is not etched, the 1oz copper Foil is used for providing supporting force, and the circuit board manufacturing is completed through three times of pressing and laminating. The invention has the advantages that the Core-Lam multi-time pressing and laminating process is used, and the single-side etching mode of 8-12 micrometers is adopted to increase the support force of the plate frame.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing industry, in particular to an ultrathin core continuous pressing process.
Background
With the continuous improvement of the technological level and the continuous upgrading and upgrading of electronic products, the PCB is required to be developed towards the direction of high, fine and sharp, components and parts need to be fully distributed on the tiny PCB to the maximum extent, more capacitors are required to bear, and the existing capacitor on the surface cannot meet the requirement of a circuit, so that the soft (25.4um, 12um and 8um) materials of the PCB are produced at the same time and are mixed and pressed with other hard materials to serve as a capacitor.
The existing manufacturing process of the inner layer of the mixed compression plate with the thickness of 8 mu m and 12 mu m comprises the following steps: pattern transfer → inner layer etching → beer hole → inner layer middle → inner layer oxidation → pairing → pressing plate → cutting plate side → beer hole.
The existing PCB process adopts a single-pressing Foil-Lam design, an 8-micrometer & 12-micrometer ultrathin core belongs to a glass fiber-free soft base material, and cannot provide enough supporting force for the edge of a board after a pattern is etched, so that great challenges are brought to the operation of etching, punching, board arrangement and pressing procedures. At present, the domestic PCB manufacturers are mature in the manufacturing process of glass fiber rigid base materials, but the manufacturing process of combining ultrathin core soft base materials and rigid base materials, in particular to circuit boards with high alignment requirement, and the PCB manufacturers still have technical barriers.
Disclosure of Invention
The invention aims to provide an ultrathin Core continuous pressing process, which has the advantages that the Core-Lam multi-time pressing and pressing process is adopted, the supporting force of a plate frame is increased by adopting a single-side etching mode for 8-micrometer & 12-micrometer, and the problems that the supporting force of a copper-free area of a unit and the plate frame is insufficient, PEP is punched with a crooked hole and the plate frame is pulled horizontally by oxidation due to deformation of the plate frame are solved.
In order to achieve the purpose, the invention provides the following technical scheme: a Core-Lam multi-time press-fit process is used to replace the original Foil-Lam single press-fit process, a single-side etching mode is adopted for 8-Lam & 12-Lam Core, one side is etched to form a pattern, the other side is not etched, a 1oz copper Foil is used for providing a supporting force, and circuit board manufacturing is completed through three times of press-fit.
As a further scheme of the invention, L4-5 single core is in the etching process, a corrosion-resistant film is attached to the surface L4, and a pattern is etched on the surface L5; l12-13 single core, L13 face paste corrosion-resistant film, L12 face etching figure.
As a further scheme of the invention, the L2-3 single core is in the etching process, the corrosion resistant film is adhered to the L2 surface, and the pattern is etched on the L3 surface; l14-15 single core, adhering corrosion-resistant film on L15 surface, etching pattern on L14 surface, and pressing Sub Assembly L2-15 surface.
As a further aspect of the present invention, a film: passing through a dust sticking machine before film sticking, wherein the dust sticking air pressure is 3kg/cm 2; the film sticking uses thin plate parameters, the film sticking pressure is 3.5kg/cm2, and the temperature is 90 +/-5 ℃; the pearl cotton is placed in the rubber basin at intervals.
As a further scheme of the invention, the inner layer pattern is transferred: passing through a dust sticking machine before exposure, wherein the dust sticking air pressure is 3kg/cm 2; production by a semi-automatic exposure machine; the pearl cotton is placed in the rubber basin at intervals.
As a further aspect of the invention, the inner layer is etched: placing the strip pads at two ends of the plate at the beginning of development, and reducing the pressure of stripping to 1.0kg/cm 2; after drying, the pearl cotton is placed in the rubber basin at intervals.
As a further scheme of the invention, typesetting: bonding adopts a Pin-positioned fusion mode, 12 fusion points are designed, and multiple points are fused; the row plates use binding + Pin positioning mode.
An ultrathin core continuous pressing process comprises the following manufacturing processes:
s1, first pressing, Sub Assembly L4 ~ 13 flow:
cutting, inner layer pattern transfer (producing L4-13 surfaces, wherein L4& L13 are corrosion-resistant surfaces), etching, punching, AOI, inner layer pairing, browning, pairing, pressing plates, cutting plate edges, punching pipe position holes, inner layer inspection, mechanical drilling, outer layer dry film, pattern electroplating, outer layer etching plates, punching holes, inner layer AOI, inner layer middle detection and inner layer pairing;
s2, second pressing, Sub Assembly L2-15 flow:
cutting, transferring an inner layer pattern (producing L2-3& L14-15, wherein L3& L14 are circuit surfaces, and L2& L15 are corrosion-resistant surfaces), etching, punching, AOI, inner layer matching (together with L4-13 matching after the first pressing process is finished), inner layer oxidation, secondary pressing plate, cutting plate edges, punching of a beer pipe position, glue removal, inner layer inspection, mechanical drilling, outer layer dry film, pattern electroplating, inner layer AOI, inner layer detection and inner layer matching;
s3, third pressing, L1-16 process:
inner layer oxidation, inner layer pairing, third pressing plate, beer pipe position holes, plate cutting edges, inner layer inspection, mechanical drilling and outer layer process.
Compared with the prior art, the invention has the following beneficial effects: the supporting force of the plate frame is increased by adopting a single-sided etching mode in the range of 8 micrometers to 12 micrometers, and the problems that the supporting force of a copper-free area of a unit and the plate frame is insufficient, the plate frame deforms to cause PEP to punch askew holes, and the clamping plate is horizontally pulled by oxidation and the like are effectively solved by matching with special process control. The Core-Lam multi-time pressing and laminating process is used for replacing the original Foil-Lam single pressing and laminating process, and the board arrangement adopts a binding and Pin positioning mode, so that the problem of thin Core pressure arrangement Core shift is effectively solved.
Drawings
Fig. 1 is a structure diagram of three-time pressing in the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1
Referring to fig. 1, an embodiment of the present invention: a continuous lamination process for ultrathin core comprises the steps of carrying out an etching process on L4-5 single core, attaching an etching-resistant film to the surface L4, and etching a pattern on the surface L5; l12-13 single core, L13 face paste corrosion-resistant film, L12 face etching figure. Firstly pressing L4-13 to solve the problem of double-sided etching deformation of 12 mu m thin core of L4-5& L12-13 layers, wherein an L4/L13 side pattern is made by an LDI exposure machine to ensure the alignment degree;
l2-3 single core is in the etching process, the corrosion resistant film is adhered to the L2 surface, and the pattern is etched on the L3 surface; l14-15 single core, adhering corrosion-resistant film on L15 surface, etching pattern on L14 surface, and pressing Sub Assembly L2-15 surface. The L2/L15 face pattern is made by an LDI exposure machine to ensure the alignment degree, and the alignment degree is caused by the double-sided etching deformation of 8 mu m thin core of the L2-3& L14-15 layer;
and finishing the manufacture of the circuit board by three times of pressing. The Core-Lam multi-time pressing and laminating process is used for replacing the original Foil-Lam single pressing and laminating process, a single-side etching mode is adopted for 8-micrometer & 12-micrometer Core, one side is etched to form a pattern, the other side is not etched, and the 1oz copper Foil is used for providing supporting force.
Example 2
The embodiment provided by the invention comprises the following steps: a continuous pressing process of ultra-thin core,
film pasting: a chemical cleaning process is cancelled, and a film is pasted after cleaning by using a dust sticking machine; passing through a dust sticking machine before film sticking, wherein the dust sticking air pressure is 3kg/cm 2; the film sticking uses thin plate parameters, the film sticking pressure is 3.5kg/cm2, and the temperature is 90 +/-5 ℃; the pearl cotton is placed in the rubber basin in a separated mode, the number of the pearl cotton blocks in each rubber basin is less than six, the stacking height is less than eight, and the pearl cotton serves as a medium of the partition plate to avoid the problem that the plate is broken by manual operation.
Inner layer pattern transfer: passing through a dust sticking machine before exposure, wherein the dust sticking air pressure is 3kg/cm 2; production by a semi-automatic exposure machine; the pearl cotton is placed in the rubber basin in a separated mode, the number of the pearl cotton blocks in each rubber basin is less than six, the stacking height is less than eight, and the pearl cotton serves as a medium of the partition plate to avoid the problem that the plate is broken by manual operation.
Inner layer etching: the developing begins to use the filler strip to put on both ends of the board, play a role in guiding; the pressure of the decolouring film is reduced to 1.0kg/cm 2; after drying, the pearl cotton is placed in the rubber basin in a separated mode, the number of the pearl cotton blocks in each rubber basin is less than six, the stacking height is less than eight, and the pearl cotton serves as a medium of the partition plate to avoid the problem that the plate is broken by manual operation.
Typesetting: the binding adopts a Pin-positioned fusion mode, so that the problem of deformation of the thin Core due to the adsorption of a CCD (charge coupled device) sucker is well solved; 12 fusing points are designed, and the precision is ensured by multi-point fusing; the row plate uses a binding + Pin positioning mode, the operation is simple, and the problem that a Pin hole is easy to damage due to the fact that a thin Core sleeve is Pin is solved.
Example 3
The embodiment provided by the invention comprises the following steps: an ultrathin core continuous pressing process comprises the following manufacturing processes:
s1, first pressing, Sub Assembly L4 ~ 13 flow:
cutting, inner layer pattern transfer (producing L4-13 surfaces, wherein L4& L13 are corrosion-resistant surfaces), etching, punching, AOI, inner layer pairing, browning, pairing, pressing plates, cutting plate edges, punching pipe position holes, inner layer inspection, mechanical drilling, outer layer dry film, pattern electroplating, outer layer etching plates, punching holes, inner layer AOI, inner layer middle detection and inner layer pairing;
s2, second pressing, Sub Assembly L2-15 flow:
cutting, transferring an inner layer pattern (producing L2-3& L14-15, wherein L3& L14 are circuit surfaces, and L2& L15 are corrosion-resistant surfaces), etching, punching, AOI, inner layer matching (together with L4-13 matching after the first pressing process is finished), inner layer oxidation, secondary pressing plate, cutting plate edges, punching of a beer pipe position, glue removal, inner layer inspection, mechanical drilling, outer layer dry film, pattern electroplating, inner layer AOI, inner layer detection and inner layer matching;
s3, third pressing, L1-16 process:
inner layer oxidation, inner layer pairing, third pressing plate, beer pipe position holes, plate cutting edges, inner layer inspection, mechanical drilling and outer layer process.
The supporting force of the plate frame is increased by adopting a single-sided etching mode in the range of 8 micrometers to 12 micrometers, and the problems that the supporting force of a copper-free area of a unit and the plate frame is insufficient, the plate frame deforms to cause PEP to punch askew holes, and the clamping plate is horizontally pulled by oxidation and the like are effectively solved by matching with special process control. The Core-Lam multi-time pressing and laminating process is used for replacing the original Foil-Lam single pressing and laminating process, and the board arrangement adopts a binding and Pin positioning mode, so that the problem of thin Core pressure arrangement Core shift is effectively solved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The continuous pressing process of the ultrathin core is characterized by comprising the following steps: the Core-Lam multi-time pressing and laminating process is used for replacing the original Foil-Lam single pressing and laminating process, a single-side etching mode is adopted for 8-micrometer & 12-micrometer Core, one side of the Core is etched to form a pattern, the other side of the Core is not etched, the 1oz copper Foil is used for providing supporting force, and the circuit board manufacturing is completed through three times of pressing and laminating.
2. The ultra-thin core continuous press-fitting process according to claim 1, wherein: l4-5 single core is in the etching process, the corrosion resistant film is adhered to the L4 surface, and the pattern is etched on the L5 surface; l12-13 single core, L13 face paste corrosion-resistant film, L12 face etching figure.
3. The ultra-thin core continuous press-fitting process according to claim 1, wherein: l2-3 single core is in the etching process, the corrosion resistant film is adhered to the L2 surface, and the pattern is etched on the L3 surface; l14-15 single core, adhering corrosion-resistant film on L15 surface, etching pattern on L14 surface, and pressing Sub Assembly L2-15 surface.
4. The ultra-thin core continuous press-fitting process according to claim 1, wherein: film pasting: passing through a dust sticking machine before film sticking, wherein the dust sticking air pressure is 3kg/cm 2; the film sticking uses thin plate parameters, the film sticking pressure is 3.5kg/cm2, and the temperature is 90 +/-5 ℃; the pearl cotton is placed in the rubber basin at intervals.
5. The ultra-thin core continuous press-fitting process according to claim 1, wherein: inner layer pattern transfer: passing through a dust sticking machine before exposure, wherein the dust sticking air pressure is 3kg/cm 2; production by a semi-automatic exposure machine; the pearl cotton is placed in the rubber basin at intervals.
6. The ultra-thin core continuous press-fitting process according to claim 1, wherein: inner layer etching: placing the strip pads at two ends of the plate at the beginning of development, and reducing the pressure of stripping to 1.0kg/cm 2; after drying, the pearl cotton is placed in the rubber basin at intervals.
7. The ultra-thin core continuous press-fitting process according to claim 1, wherein: typesetting: bonding adopts a Pin-positioned fusion mode, 12 fusion points are designed, and multiple points are fused; the row plates use binding + Pin positioning mode.
8. The ultra-thin core continuous press-fitting process according to claim 1, wherein: the manufacturing process comprises the following steps:
s1, first pressing, Sub Assembly L4 ~ 13 flow:
cutting, inner layer pattern transfer (producing L4-13 surfaces, wherein L4& L13 are corrosion-resistant surfaces), etching, punching, AOI, inner layer pairing, browning, pairing, pressing plates, cutting plate edges, punching pipe position holes, inner layer inspection, mechanical drilling, outer layer dry film, pattern electroplating, outer layer etching plates, punching holes, inner layer AOI, inner layer middle detection and inner layer pairing;
s2, second pressing, Sub Assembly L2-15 flow:
cutting, transferring an inner layer pattern (producing L2-3& L14-15, wherein L3& L14 are circuit surfaces, and L2& L15 are corrosion-resistant surfaces), etching, punching, AOI, inner layer matching (together with L4-13 matching after the first pressing process is finished), inner layer oxidation, secondary pressing plate, cutting plate edges, punching of a beer pipe position, glue removal, inner layer inspection, mechanical drilling, outer layer dry film, pattern electroplating, inner layer AOI, inner layer detection and inner layer matching;
s3, third pressing, L1-16 process:
inner layer oxidation, inner layer pairing, third pressing plate, beer pipe position holes, plate cutting edges, inner layer inspection, mechanical drilling and outer layer process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011087134.3A CN112105162A (en) | 2020-10-12 | 2020-10-12 | Ultrathin core continuous pressing process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011087134.3A CN112105162A (en) | 2020-10-12 | 2020-10-12 | Ultrathin core continuous pressing process |
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| CN112105162A true CN112105162A (en) | 2020-12-18 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102762036A (en) * | 2012-07-12 | 2012-10-31 | 深圳崇达多层线路板有限公司 | Method for circuit manufacture of ultra-thin inner-layer board |
| CN203407070U (en) * | 2013-08-07 | 2014-01-22 | 东莞森玛仕格里菲电路有限公司 | Thin core plate laminating structure |
| CN106231805A (en) * | 2016-08-15 | 2016-12-14 | 建业科技电子（惠州）有限公司 | A kind of semi-automatic exposure machine does the processing technology of inner plating |
| CN107072060A (en) * | 2017-05-25 | 2017-08-18 | 江门崇达电路技术有限公司 | A kind of method for solving thin plate circuit dog tooth |
| CN108174534A (en) * | 2018-01-09 | 2018-06-15 | 广州添利电子科技有限公司 | The KU spectrum conversion device circuit board air chamber manufacturing process of flush antenna formula |
| CN108770216A (en) * | 2018-08-03 | 2018-11-06 | 诚亿电子（嘉兴）有限公司 | PCB plate production method containing ultra-thin buried capacitor core plate |
-
2020
- 2020-10-12 CN CN202011087134.3A patent/CN112105162A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102762036A (en) * | 2012-07-12 | 2012-10-31 | 深圳崇达多层线路板有限公司 | Method for circuit manufacture of ultra-thin inner-layer board |
| CN203407070U (en) * | 2013-08-07 | 2014-01-22 | 东莞森玛仕格里菲电路有限公司 | Thin core plate laminating structure |
| CN106231805A (en) * | 2016-08-15 | 2016-12-14 | 建业科技电子（惠州）有限公司 | A kind of semi-automatic exposure machine does the processing technology of inner plating |
| CN107072060A (en) * | 2017-05-25 | 2017-08-18 | 江门崇达电路技术有限公司 | A kind of method for solving thin plate circuit dog tooth |
| CN108174534A (en) * | 2018-01-09 | 2018-06-15 | 广州添利电子科技有限公司 | The KU spectrum conversion device circuit board air chamber manufacturing process of flush antenna formula |
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Application publication date: 20201218 |
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