CN100576972C - A kind of manufacture method of location hole of flexible circuit board - Google Patents
A kind of manufacture method of location hole of flexible circuit board Download PDFInfo
- Publication number
- CN100576972C CN100576972C CN200710073826A CN200710073826A CN100576972C CN 100576972 C CN100576972 C CN 100576972C CN 200710073826 A CN200710073826 A CN 200710073826A CN 200710073826 A CN200710073826 A CN 200710073826A CN 100576972 C CN100576972 C CN 100576972C
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- copper foil
- location hole
- coverlay
- dry film
- apical pore
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Abstract
The invention relates to a kind of manufacture method of location hole of flexible circuit board, its step comprises: 1. offer on the end, top coverlay and the corresponding bottom outlet of position of positioning hole, apical pore; 2. end coverlay is pressed on the back side of Copper Foil; 3. on Copper Foil front and end coverlay, paste one deck photosensitive dry film respectively; 4. with having circuit image and the dry film on the Copper Foil front being exposed, the dry film on the end coverlay is carried out blanket exposure with the egative film of the corresponding negativity circular image of location hole; 5. display on the Copper Foil front with circuit image with the corresponding negativity circular image of location hole, make the Copper Foil of logicalnot circuit part and location hole part expose out; 6. remove exposed Copper Foil with etching solution; 7. with liquid parting remaining dry film is sloughed; 8. the top coverlay is pressed on the front of Copper Foil, make the location hole that etches on this apical pore and the Copper Foil corresponding.Adopt said method that circuit and location hole are formed simultaneously, guarantee that the position of location hole is accurate.
Description
Technical field
The present invention relates to a kind of manufacture method of flexible circuit board, especially relate to a kind of manufacture method of location hole of flexible circuit board.
Background technology
Flexible circuit board (FPC) has gently, thin, short, little characteristic, be widely used in electronic device field such as computer, communication, consumer electronics, automobile, military affairs and space flight, medical treatment, for example: video camera, mobile phone, CD-audio player, notebook computer, high speed ink-jet printer magnetic head etc.Along with the development in flexible circuit board market reaches its maturity, market constantly promotes for the requirement of flexible circuit board manufacturing speed, precision, the external form moulding of flexible circuit board all is to adopt the mould punching moulding, so needs the accurate localization hole on the flexible circuit board, to guarantee the precision of punch forming.At present, the making step of location hole is as follows: 1. paste dry film: overleaf pressing paste one deck photosensitive dry film respectively on the positive and end coverlay of the Copper Foil of end coverlay; 2. exposure: with the egative film that has circuit image the dry film on the Copper Foil front is exposed, the dry film on the end coverlay is carried out blanket exposure; 3. develop: circuit image is displayed on the Copper Foil front, make the Copper Foil of logicalnot circuit part expose out; 4. etching: remove exposed Copper Foil with etching solution; 5. the demoulding: remaining dry film is sloughed with liquid parting; 6. paste the top coverlay: the top coverlay is pressed on the front of Copper Foil; 7. surface treatment: exposed copper foil surface carries out gold-plated or turmeric is handled; 8. make location hole: on surface treated semi-finished product, offer location hole.This method is made location hole, beats the location hole operation owing to be provided with specially, need accurately locate semi-finished product, tends to take very long portion of time, at the bottom of the efficient; Unavoidably error can occur owing to semi-finished product are positioned in the process, cause the position of positioning hole of offering not accurate enough, during with the mould punching moulding, occur waste product easily.
Summary of the invention
In view of above-mentioned deficiency, main purpose of the present invention is to provide a kind of manufacture method that can accurately offer the location hole of flexible circuit board of location hole.
The objective of the invention is to be achieved through the following technical solutions:
The manufacture method of a kind of location hole of flexible circuit board of the present invention, its step comprises:
1. open bottom outlet and apical pore: offer on the end coverlay with Copper Foil on the corresponding bottom outlet of position of positioning hole that need offer, offer on the coverlay of top with Copper Foil on the corresponding apical pore of position of positioning hole that need offer;
Site error when the aperture that the aperture of described apical pore equals the location hole on the described Copper Foil adds the described top of pressing coverlay between this apical pore and this location hole;
Negativity circular image when the aperture that the aperture of described bottom outlet equals the location hole on the described Copper Foil adds exposure on the described egative film and the site error between this bottom outlet;
2. paste end coverlay: end coverlay is pressed on the back side of Copper Foil;
3. paste dry film: overleaf pressing paste one deck photosensitive dry film respectively on the positive and end coverlay of the Copper Foil of end coverlay;
4. exposure:, the dry film on the end coverlay is carried out blanket exposure with having circuit image and the dry film on the Copper Foil front being exposed with the egative film of the corresponding negativity circular image of location hole;
5. develop: display on the Copper Foil front with circuit image with the corresponding negativity circular image of location hole, make the Copper Foil of logicalnot circuit part and location hole part expose out;
6. etching: remove exposed Copper Foil with etching solution;
7. the demoulding: remaining dry film is sloughed with liquid parting;
8. paste the top coverlay: the top coverlay is pressed on the front of Copper Foil, make the location hole that etches on this apical pore and the Copper Foil corresponding.
The invention has the advantages that, the manufacture method of a kind of location hole of flexible circuit board of the present invention, because with having circuit image and with the egative film of the corresponding negativity circular image of location hole the dry film on the Copper Foil front being exposed and develop, dry film on the end coverlay is carried out blanket exposure and development, remove the Copper Foil of logicalnot circuit part and location hole part then with etching solution, the circuit and the location hole of flexible circuit board are formed simultaneously, guaranteed in process of production, the location hole on the flexible circuit board and the position of circuit are consistent, and the position of location hole is accurate.
Description of drawings
In order to be easy to explanation, the present invention is described in detail by following preferred embodiment and accompanying drawing.
Fig. 1 be in the manufacture method of a kind of location hole of flexible circuit board of the present invention flexible circuit board analyse and observe the TV structure schematic diagram.
Embodiment
See also Fig. 1, the manufacture method of a kind of location hole of flexible circuit board of the present invention, its step comprises:
1. open bottom outlet and apical pore: offer on the end coverlay 3 with Copper Foil 2 on the corresponding bottom outlet 30 in location hole 20 positions that need offer, negativity circular image when the aperture that the aperture of this bottom outlet 30 equals the location hole 20 on the described Copper Foil 2 adds exposure on the described egative film and the site error between this bottom outlet 20, for example, the aperture of the location hole 20 on the Copper Foil 2 is 2.0mm, negativity circular image and the site error between this bottom outlet 20 during exposure on the described egative film are 0.4mm, and then the aperture of bottom outlet 30 equals 2.8mm;
Offer on the top coverlay 1 with Copper Foil 2 on the corresponding apical pore 10 in location hole 20 positions that need offer, site error when the aperture that the aperture of described apical pore 10 equals the location hole 20 on the described Copper Foil 2 adds the described top of pressing coverlay 1 between this apical pore 10 and this location hole 20, for example, the aperture of the location hole 20 on the Copper Foil 2 is 2.0mm, site error during the described top of pressing coverlay 1 between this apical pore 10 and this location hole 20 is 0.3mm, and then the aperture of apical pore 10 equals 2.6mm;
2. paste end coverlay: end coverlay 3 is pressed on the back side of Copper Foil 2, that is: the end coverlay 3 that will process, opening requirement according to finished product flexible circuit board FPC, fit on the bottom surface of Copper Foil 2, insert the hot press pressing after the FPC semi-finished product that will post end coverlay 3 are then folded, making end coverlay 3 and Copper Foil 2 pressings is one, and pressing-in temp is 175 ℃, pressing pressure is 2MPa, and pressing total time is 150min;
3. paste dry film: overleaf pressing paste one deck photosensitive dry film respectively on the positive and end coverlay 3 of the Copper Foil 2 of end coverlay 3;
4. exposure: with having circuit image and the dry film on Copper Foil 2 fronts being exposed with the egative film of the corresponding negativity circular image of location hole, dry film on the end coverlay is carried out blanket exposure, by egative film with image transfer above dry film, that is: on Copper Foil 2 fronts that post dry film, stick have circuit and with the egative film of the corresponding negativity circular image of location hole, put exposure machine then into and expose, exposure energy is 60mj/cm
2Time for exposure 10s, by the irradiation of directional light, on the egative film circuit image of white printing opacity partly and the light-sensitive surface below the corresponding negativity circular image of location hole because being subjected to UV-irradiation polymerization reaction take place and solidifying, promptly circuit pack and location hole peripheral part are cured; Lighttight logicalnot circuit part of black and location hole partly do not react because receive luminous energy, can be developed the liquid flush away in developing process, in addition, directly put the dry film that is attached on the end coverlay 3 into the exposure machine exposure, and exposure energy is 60mj/cm
2, time for exposure 10s is by the irradiation of directional light;
5. develop: on Copper Foil 2 fronts, display with circuit image with the corresponding negativity circular image of location hole, make the Copper Foil of logicalnot circuit part and location hole part expose out, that is: with the developer solution flush away part dry film of sensitization not, the semi-finished product that exposed are put into developing machine develop, developer solution is that the concentration weight ratio is the Na of 0.95-1.2%
2CO
3Solution, development temperature are 48 ℃, and development production line roller transfer rate is 2.0m/min, and the developer solution pressure of roller top spray head ejection is 0.15MPa, and the developer solution pressure of roller below spray head ejection is 0.1MPa;
6. etching: remove exposed Copper Foil with etching solution, that is: with semi-finished product after the video picture and etching solution even contact, remove exposed copper foil surface, the visuals of preserving sensitization and solidifying is the circuit that needs, used etching solution is that the concentration weight ratio is 1.25% copper chloride solution, etch temperature is 48 ℃, etching production line roller transfer rate is 2.0m/min, the etching solution pressure of roller top spray head ejection is 0.15MPa, and the etching solution pressure of roller below spray head ejection is 0.14MPa;
7. the demoulding: remaining dry film is sloughed with liquid parting, that is: the part photosensitive dry film that will solidify is sloughed with highly basic, used liquid parting is that the concentration weight ratio is the NaOH solution of 1-3%, temperature is 48 ℃, demoulding production line roller transfer rate is 2.0m/min, the liquid parting pressure of roller top spray head ejection is 0.2MPa, and the liquid parting pressure of roller below spray head ejection is 0.14MPa.
8. paste the top coverlay: top coverlay 1 is pressed on the front of Copper Foil 2, make the location hole 20 that etches on this apical pore 10 and the Copper Foil 2 corresponding, that is: the top coverlay 1 that will process, according to the opening requirement of finished product flexible circuit board FPC, fit on the front of Copper Foil 2, after folding, the FPC semi-finished product that will post top coverlay 1 then insert the hot press pressing, making top coverlay 1 and Copper Foil 2 pressings is one, pressing-in temp is 175 ℃, and pressing pressure is 2MPa, and pressing total time is 150min.
Claims (1)
1. the manufacture method of a location hole of flexible circuit board, its step comprises:
1. open bottom outlet and apical pore: offer on the end coverlay with Copper Foil on the corresponding bottom outlet of position of positioning hole that need offer, offer on the coverlay of top with Copper Foil on the corresponding apical pore of position of positioning hole that need offer;
Site error when the aperture that the aperture of described apical pore equals the location hole on the described Copper Foil adds the described top of pressing coverlay between this apical pore and this location hole;
Negativity circular image when the aperture that the aperture of described bottom outlet equals the location hole on the described Copper Foil adds exposure on the described egative film and the site error between this bottom outlet;
2. paste end coverlay: end coverlay is pressed on the back side of Copper Foil;
3. paste dry film: overleaf pressing paste one deck photosensitive dry film respectively on the positive and end coverlay of the Copper Foil of end coverlay;
4. exposure:, the dry film on the end coverlay is carried out blanket exposure with having circuit image and the dry film on the Copper Foil front being exposed with the egative film of the corresponding negativity circular image of location hole;
5. develop: display on the Copper Foil front with circuit image with the corresponding negativity circular image of location hole, make the Copper Foil of logicalnot circuit part and location hole part expose out;
6. etching: remove exposed Copper Foil with etching solution;
7. the demoulding: remaining dry film is sloughed with liquid parting;
8. paste the top coverlay: the top coverlay is pressed on the front of Copper Foil, make the location hole that etches on this apical pore and the Copper Foil corresponding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710073826A CN100576972C (en) | 2007-04-06 | 2007-04-06 | A kind of manufacture method of location hole of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710073826A CN100576972C (en) | 2007-04-06 | 2007-04-06 | A kind of manufacture method of location hole of flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101282616A CN101282616A (en) | 2008-10-08 |
| CN100576972C true CN100576972C (en) | 2009-12-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710073826A Expired - Fee Related CN100576972C (en) | 2007-04-06 | 2007-04-06 | A kind of manufacture method of location hole of flexible circuit board |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101925257B (en) * | 2010-05-07 | 2012-07-04 | 竞华电子(深圳)有限公司 | Copper window manufacturing method of printed circuit board |
| CN103068174A (en) * | 2011-10-24 | 2013-04-24 | 悦虎电路(苏州)有限公司 | Manufacturing method for metallization slotted hole circuit board |
| CN103205783B (en) * | 2012-01-16 | 2016-01-20 | 昆山允升吉光电科技有限公司 | A kind of preparation method of electroforming mask plate locating point |
| CN103203981B (en) * | 2012-01-16 | 2015-05-13 | 昆山允升吉光电科技有限公司 | SMT (surface mounting technology) template with locating points and manufacturing method thereof |
| CN103203975B (en) * | 2012-01-16 | 2015-09-23 | 昆山允升吉光电科技有限公司 | The preparation method of electroforming mask plate anchor point |
| CN103079365B (en) * | 2012-12-28 | 2016-04-06 | 深圳市新宇腾跃电子有限公司 | Multi-layer flexible circuit board internal layer circuit one-step moulding method |
| CN103313518B (en) * | 2013-06-25 | 2016-04-06 | 惠州中京电子科技股份有限公司 | A kind of manufacture method of FPC one side Ultrathin substrate circuit |
| CN107993832A (en) * | 2017-11-27 | 2018-05-04 | 深圳光韵达激光应用技术有限公司 | A kind of low resistance high charge rate FPC flexibility Wireless charging coil manufacture crafts |
| CN108792093A (en) * | 2018-05-30 | 2018-11-13 | 深圳市华旭达精密电路科技有限公司 | A kind of technique that FPC is packed using low mucous membrane |
| CN109246928A (en) * | 2018-09-27 | 2019-01-18 | 常州市武进三维电子有限公司 | The production technology of the flexible wires wiring board of new-energy automobile |
| CN114599164B (en) * | 2022-03-11 | 2023-09-29 | 博敏电子股份有限公司 | Method for solving damage of copper sheet on outer circuit of COB product |
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2007
- 2007-04-06 CN CN200710073826A patent/CN100576972C/en not_active Expired - Fee Related
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| CN101282616A (en) | 2008-10-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Method for preparing location hole of flexible circuit board License type: Exclusive license Record date: 20080504 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201130 Address after: Group 17, Beiliu, Chengnan Park, Jingjiang Economic Development Zone, Taizhou City, Jiangsu Province, 214500 (No.18 Deyu Road) Patentee after: Jingjiang Huade HVAC Engineering Co., Ltd Address before: 518119 BYD Industrial Park, Yanan Road, Kwai Chung Town, Longgang District, Guangdong, Shenzhen Patentee before: BYD Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091230 Termination date: 20210406 |