CN103313518B - A kind of manufacture method of FPC one side Ultrathin substrate circuit - Google Patents
A kind of manufacture method of FPC one side Ultrathin substrate circuit Download PDFInfo
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- CN103313518B CN103313518B CN201310255507.7A CN201310255507A CN103313518B CN 103313518 B CN103313518 B CN 103313518B CN 201310255507 A CN201310255507 A CN 201310255507A CN 103313518 B CN103313518 B CN 103313518B
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- conductor surface
- dry film
- ultrathin substrate
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Abstract
A manufacture method for FPC one side Ultrathin substrate circuit, the two sides of described Ultrathin substrate is respectively conductor surface and PI face, comprises the following steps: (1) sticks dry film at the conductor surface of Ultrathin substrate and PI face respectively; (2) dry film on conductor surface is exposed; (3) remove the PE film of the dry film on conductor surface after leaving standstill a period of time, develop; (4) conductor surface after development is etched; (5) product after etching is removed the PE film of the dry film on PI face, two sides carries out moving back film simultaneously; (6), after moving back film, circuit manufacturing process is terminated.The manufacture method of FPC one side Ultrathin substrate circuit of the present invention, dry film is also posted in the PI face of Ultrathin substrate, makes base material have certain thickness, can effectively avoid base material foldover, it also avoid the incomplete and circuit of bad order that foldover causes, circuit and loosens.
Description
Technical field
The present invention relates to FPC and manufacture field, particularly a kind of manufacture method of FPC one side Ultrathin substrate circuit.
Background technology
In PCB industry, regardless of rigid flexible system plate or flexible board itself, use one side Ultrathin substrate sometimes, because the thin key factor being High Precision Traverses and obtaining of base material, but base material thin in circuit production process easy foldover, cause bad order and circuit incompleteness bad.Copper thickness is at 0.5OZ(17.5um) following base material is called extra thin copper foil base material (hereinafter referred to as UTF), and when producing UTF, need carries out with carrier.One directly uses carrier copper foil, and namely Copper Foil or Al foil substrate have carrier, the aluminum foil thickness of use is generally 50um-80um, the general 50um of copper thickness; Also have and to adopt carrier-free Copper Foil, during production, attach special CF carrier film again.But carrier copper foil is expensive, CF carrier film price is not low yet, and time in addition owing to utilizing them to produce UTF, carrier layer is easily peeled off with base material and remains liquid medicine, and after moving back film, liquid medicine is brought on copper face and causes copper face variable color.
Summary of the invention
For overcoming the shortcomings and deficiencies of above-mentioned prior art, the present invention proposes a kind of manufacture method of FPC one side Ultrathin substrate circuit.
The technical solution used in the present invention is:
A manufacture method for FPC one side Ultrathin substrate circuit, the two sides of described Ultrathin substrate is respectively conductor surface and PI face, comprises the following steps:
(1) dry film is sticked at the conductor surface of Ultrathin substrate and PI face respectively;
(2) dry film on conductor surface is exposed;
(3) remove the PE film of the dry film on conductor surface after leaving standstill a period of time, develop; (4) conductor surface after development is etched;
(5) product after etching is removed the PE film of the dry film on PI face, two sides carries out moving back film simultaneously;
(6), after moving back film, circuit manufacturing process is terminated.
Preferably, described step (1) is that first on Ultrathin substrate conductor surface, entire volume sticks dry film, not severing dry film, neatly rolled by the base material after pad pasting, and then entire volume sticks dry film on PI face with the axle center of same size, and by dry film severing.
Preferably, inspection is first carried out to the conductor surface after development and repaiies plate, then etch.
Preferably, in the development of described step (3), (4), etching process, close the nozzle to PI face spray liquid medicine.
Concrete, described step (6), after completing and moving back film, with dry clean paper as every paper, separating often opening product, loading polybag and also adding drier sealing.
In described step (3), time of repose is 10-20 minute.
Compared with prior art, beneficial effect of the present invention has:
(1) manufacture method of FPC one side Ultrathin substrate circuit of the present invention, dry film is also posted in the PI face of Ultrathin substrate, make base material have certain thickness, can effectively avoid base material foldover, it also avoid the incomplete and circuit of bad order that foldover causes, circuit and loosen;
(2) method of pasting dry film on Ultrathin substrate two sides of the present invention, that first on the conductor surface of Ultrathin substrate, entire volume base material sticks dry film, with spool, the base material after pad pasting is neatly rolled, then on PI face, entire volume sticks dry film, then by the two-sided base material all posting dry film by size severing, first pasting conductor surface can effectively prevent from conductor surface to be stained with foreign material affecting surface cleaning, also prevent in pad pasting process conductor copper face because protecting the adverse consequences of bad generation;
(3) manufacture method of Ultrathin substrate circuit of the present invention, peels off two-layer dry film when moving back film simultaneously, and finished goods circuit quality is good, and face remains hidden danger without liquid medicine to plate;
(4) manufacture method of Ultrathin substrate circuit of the present invention, in development, etching process, respectively to conductor surface spray developing liquid and etching solution, and PI face is without the need to spraying liquid medicine, the attack of nozzle to PE film on the dry film of PI face can be alleviated, if supplement film layering, the adverse consequencess such as copper face variable color can be caused after residual moisture.
Accompanying drawing explanation
Fig. 1 is the flow chart of a kind of implementation process of the manufacture method of FPC one side Ultrathin substrate circuit of the present invention.
Embodiment
For the ease of the understanding of those skilled in the art, below in conjunction with drawings and Examples, the present invention is described in further detail:
As shown in Figure 1, the manufacture method of disclosed FPC one side Ultrathin substrate circuit, comprises conductor surface pad pasting, PI mask, exposure, development, etches and move back film.Concrete, the present embodiment is with 0.5OZ Copper Foil, 0.5milPI face, and the glue-free Ultrathin substrate that gross thickness is about 30um makes example, and concrete steps are as follows:
(1) dry film of Ultrathin substrate conductor surface is first pasted, entire volume pad pasting is carried out by existing operating type, note avoiding hot-pressing roller glue face injustice to cause base material wrinkling, the dry film not severing posted, neatly spool with the base material of identical axle center by pad pasting, dry film 1.2mil, about 30um, after conductor surface pad pasting, thickness is about 60um(and does not calculate PE film on dry film).
Subsides dry film is carried out again at the PI face same method of Ultrathin substrate, equipment is the same, post base material severing on request, build 2mil, about 50um, after PI mask, gross thickness is about 110um(and does not calculate PE film on dry film), this thickness effectively can avoid foldover, it also avoid the dry film circuit that foldover causes and loosens;
(2) expose dry film by existing operating type, PI face dry film does not at this moment need shading.
(3) leave standstill 15 minutes after exposure, PE film on conductor surface dry film is torn off, develops, in the process of development, retain PE film on the dry film of PI face, close the nozzle to PI face spray liquid medicine.
(4) to dry film line maintenance after developing, by required condition, product is etched again after having overhauled, in the process of etching, close the nozzle to PI face spray liquid medicine.
(5) after having etched, PE film on the dry film of PI face is torn off, product two sides is carried out move back film simultaneously.
(6) move back the Ultrathin substrate circuit that namely film finished goods makes individual, with dry clean paper do every, put into polybag and place drier sealing, entering next procedure, namely complete circuit manufacturing process.
Need to handle with care in the production process of whole Ultrathin substrate circuit, each production link carries out product protection consciously.
The above embodiment only have expressed embodiments of the present invention; it describes comparatively concrete and detailed; but therefore can not be interpreted as the restriction to the scope of the claims of the present invention; in every case the technical scheme that the form of equivalent replacement or equivalent transformation obtains is adopted, all should within protection scope of the present invention.
Claims (5)
1. a manufacture method for FPC one side Ultrathin substrate circuit, the two sides of described Ultrathin substrate is respectively conductor surface and PI face, it is characterized in that, comprises the following steps:
(1) dry film is sticked at the conductor surface of Ultrathin substrate and PI face respectively;
(2) dry film on conductor surface is exposed;
(3) remove the PE film of the dry film on conductor surface after leaving standstill a period of time, develop;
(4) conductor surface after development is etched;
(5) product after etching is removed the PE film of the dry film on PI face, two sides carries out moving back film simultaneously;
(6), after moving back film, circuit manufacturing process is terminated;
In the development of described step (3), (4), etching process, to conductor surface spray developing liquid and etching solution, close the nozzle to PI face spray liquid medicine.
2. the manufacture method of Ultrathin substrate circuit according to claim 1, it is characterized in that, described step (1) is that first on the conductor surface of Ultrathin substrate, entire volume base material sticks dry film, with spool, the base material after pad pasting is neatly rolled, then on PI face, entire volume sticks dry film, then by the two-sided base material all posting dry film by size severing.
3. the manufacture method of Ultrathin substrate circuit according to claim 1, is characterized in that, first carries out inspection and repaiies plate, then etch the conductor surface after development.
4. the manufacture method of Ultrathin substrate circuit according to claim 1, is characterized in that, described step (6), after completing and moving back film, with dry clean paper as every paper, separates often opening product, loads polybag and also adds drier sealing.
5. the manufacture method of Ultrathin substrate circuit according to claim 1, is characterized in that, in described step (3), time of repose is 10-20 minute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310255507.7A CN103313518B (en) | 2013-06-25 | 2013-06-25 | A kind of manufacture method of FPC one side Ultrathin substrate circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310255507.7A CN103313518B (en) | 2013-06-25 | 2013-06-25 | A kind of manufacture method of FPC one side Ultrathin substrate circuit |
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| Publication Number | Publication Date |
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| CN103313518A CN103313518A (en) | 2013-09-18 |
| CN103313518B true CN103313518B (en) | 2016-04-06 |
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| CN201310255507.7A Expired - Fee Related CN103313518B (en) | 2013-06-25 | 2013-06-25 | A kind of manufacture method of FPC one side Ultrathin substrate circuit |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411093A (en) * | 2014-11-05 | 2015-03-11 | 深圳市新宇腾跃电子有限公司 | Production technique of single-sided flexible circuit board |
| CN110611992A (en) * | 2019-08-16 | 2019-12-24 | 珠海超群电子科技有限公司 | Efficient single-side FPC board processing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101282616A (en) * | 2007-04-06 | 2008-10-08 | 比亚迪股份有限公司 | Method for preparing location hole of flexible circuit board |
| CN102765267A (en) * | 2012-07-31 | 2012-11-07 | 意力(广州)电子科技有限公司 | Roll-to-roll printing process of capacitance product |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002016169A (en) * | 2000-06-29 | 2002-01-18 | Ibiden Co Ltd | Method for manufacturing printed board |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101282616A (en) * | 2007-04-06 | 2008-10-08 | 比亚迪股份有限公司 | Method for preparing location hole of flexible circuit board |
| CN102765267A (en) * | 2012-07-31 | 2012-11-07 | 意力(广州)电子科技有限公司 | Roll-to-roll printing process of capacitance product |
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| CN103313518A (en) | 2013-09-18 |
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Effective date of registration: 20170523 Address after: 516300, Huizhou District, Guangdong City, Huidong Province town of camphor Hill Industrial Zone two Patentee after: Huidong Jian Xiang Electronic Technology Co., Ltd. Address before: 516008 Guangdong province Huizhou City Road seven Lane three, eling Park in Beijing Patentee before: Huizhou China Eagle Electronic Technology Co., Ltd. |
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