CN104411093A - Production technique of single-sided flexible circuit board - Google Patents
Production technique of single-sided flexible circuit board Download PDFInfo
- Publication number
- CN104411093A CN104411093A CN201410620957.6A CN201410620957A CN104411093A CN 104411093 A CN104411093 A CN 104411093A CN 201410620957 A CN201410620957 A CN 201410620957A CN 104411093 A CN104411093 A CN 104411093A
- Authority
- CN
- China
- Prior art keywords
- substrate
- production technology
- enhancement layer
- technology according
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a production technique of a single-sided flexible circuit board. The production technique comprises the following steps that: copper foil attached to a single surface of an insulating base film is selected as a substrate, and the substrate, adopted as a material, is composited with an enhancement layer; on the basis of the above step, a dry film is composited; circuit pattern transfer is performed; a circuit is processed on the substrate according to a transferred pattern; electrical nickel-gold plating processing is performed on the substrate; and the enhancement layer stripped from the substrate. With the production technique of the single-sided flexible circuit board of the invention adopted, a circuit board will not be wrinkled due to movement in a production process, and operation of workers can be greatly facilitated, and reject ratio can be reduced.
Description
Technical field
The present invention relates to a kind of flexible PCB.
Background technology
Along with electron trade is gradually towards the future development such as smart, thin, thin, the application of single-sided flexible circuit plate is more extensive, it is made up of Copper Foil and insulating basement membrane (polyamides Asia is pacified), relative to thinner thickness double-deck or multi-layered product, easily unreducible wrinkle are produced in making or transportation, cause product rejection, in prior art, single-sided flexible circuit board machining process has two kinds:
1. slice to the sheet mode of production, make the hardboard framework of hollow out, circuit board material to be processed is pasted thereon, after machining, removes framework again.Which operation more complicated, needs processing staff to have higher concentrated force; Simultaneously still there is the risk producing wrinkle in material and the bonding of framework and unloading process.
2. the volume to volume mode of production, to single-sided flexible circuit plate to enclose the processing of material mode entire volume, reduce the production rate of wrinkle, but this mode needs supporting volume to volume equipment, price comparison is expensive, needs producer to have certain economic strength.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of production technology of single-sided flexible circuit plate, by composite strengthening layer on substrate, give the support that flexible circuit board is stable, make circuit board in process of production, not easily produce fold because of mobile, greatly facilitate the operation of workman, decrease the generation of fraction defective.
The technical solution adopted for the present invention to solve the technical problems is:
A production technology for single-sided flexible circuit plate, comprises the following steps: select the Copper Foil be attached on insulating basement membrane one side as substrate, with this substrate for material:
S10: by substrate and enhancement layer compound;
S20: compound dry film on the basis of step S10;
S30: the transfer substrate in step S20 carrying out circuit pattern;
S40: according to pattern processing circuit on substrate of transfer;
S50: the process of electric nickel gold is carried out to substrate;
S60: enhancement layer is peeled off from described substrate.
As the further improved procedure of such scheme, in step S10, complex method is under the condition of certain temperature and pressure, is compounded on insulating basement membrane by enhancement layer.
As the further improved procedure of such scheme, temperature interval is 110 ° ± 5 ° C, and pressure value interval is 2-3Kg/cm3.
As the further improved procedure of such scheme, enhancement layer is the PET film with adhesive linkage.
As the further improved procedure of such scheme, in step S30, the transfer method of pattern is: carry out according to the order of sequence exposing and development treatment.
As the further improved procedure of such scheme, in step S40, the processing method of circuit is: carry out microetch, etching and demoulding process according to the order of sequence.
As the further improved procedure of such scheme, in step S60, stripping means is: by Copper Foil with the smooth placement of enhancement layer mode upward, provokes enhancement layer, then it all peeled off from side local.
As the further improved procedure of such scheme, be also provided with between step S40 and S50 and the substrate of completing circuit processing is protected and surface-treated step.
As the further improved procedure of such scheme, to the protection of substrate and surface-treated method be:
A: spot welding coverlay on substrate;
B: after spot welding completes, pressing and solidification are carried out to coverlay;
C: effects on surface carries out template and blasting treatment.
As the further improved procedure of such scheme, also comprise the cutting step of substrate.
The invention has the beneficial effects as follows:
Make circuit board in process of production, not easily produce fold because of mobile, greatly facilitate the operation of workman, decrease the generation of fraction defective.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is flow chart of the present invention;
Fig. 2 is the structural representation of substrate of the present invention and enhancement layer.
Embodiment
Be clearly and completely described below with reference to embodiment and the accompanying drawing technique effect to design of the present invention, concrete structure and generation, to understand object of the present invention, scheme and effect fully.It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.
It should be noted that, if no special instructions, when a certain feature is called as " fixing ", " connection " in another feature, it can directly be fixed, be connected in another feature, also indirectly can fix, be connected in another feature.In addition, it is only relative to the mutual alignment relation of each part of the present invention in accompanying drawing that the upper and lower, left and right used in the present invention etc. describe.
In addition, unless otherwise defined, all technology used herein are identical with the implication that those skilled in the art understand usually with scientific terminology.The term used in specification is herein to describe specific embodiment, instead of in order to limit the present invention.Term as used herein " and/or " comprise the arbitrary combination of one or more relevant Listed Items.
With reference to Fig. 1 and Fig. 2, the invention discloses a kind of production technology of flexible PCB, it adopts and is attached to Copper Foil 20 on insulating basement membrane 10 as substrate, and production technology comprises:
S10: by substrate and enhancement layer compound.
Preferably, enhancement layer, under certain pressure and temperature condition, is connected as one by dry film compounding machine with insulating basement membrane, plays a part to strengthen supporting, and its temperature interval is 110 ° ± 5 ° C, and pressure value interval is 2-3Kg/cm3.
Preferred further, enhancement layer is the PET film 40 being provided with adhesive linkage 30, and its thickness is not less than 0.15cm.
S20: by dry film compounding machine compound dry film on substrate on the basis of step S10, be convenient to the processing of circuit, the temperature that compound tense adopts is preferably 110 °, and pressure is 5.5Kg/cm3, and the speed of substrate with 1.5m/min on compounding machine moves.
S30: after completing compound, substrate carries out the transfer of circuit pattern, and as the template of circuit fabrication, its concrete grammar is:
S31: under the condition of 7 lattice half energy, carries out one side exposure with 5KW parallel exposing machine to dry film;
S32: the substrate after exposing is immersed in the copper carbonate liquid under 0.8%-1.2% solubility, moves with the speed of 3.0-4.0m/min and develop.
S40: according to pattern processing circuit on substrate of transfer, preferably, its concrete grammar is:
S41: first carry out microetch process, its technological parameter adopted is: in the sulfuric acid liquid of 2%-6%, be less than the condition of 30g/L at bivalent cupric ion under, form preliminary circuit;
S42: further etch under the environment of the hydrogen ion of 2-3N and the bivalent cupric ion of 130-150g/L.
In above step S41 and S42, the translational speed of substrate is 3.0-4.0m/min.
S43: finally carry out demoulding process, selected release agent is the sodium hydroxide solution of 3%-7%, and the translational speed of substrate in release agent is 3.0-4.0m/min.
S50: the process of electric nickel gold is carried out to substrate;
S60: enhancement layer is peeled off from described substrate.
Preferably, first by circuit board with enhancement layer mode horizontal positioned upward, then from a side, its local is provoked, last overall to peel off, adopt this mode, avoid directly peeling off the circuit board that may cause and damage.
As an optimal way of the present embodiment, be also provided with between step S40 and S50 and the substrate of completing circuit processing is protected and surface-treated step, concrete:
A: spot welding coverlay on substrate;
B: first carry out pressing to the fast press of coverlay after spot welding completes, its parameter is: under the condition of temperature 180 ° and pressure 12mpa/cm2, compressing through 100s after carrying out 5s precompressed with fast press; Substrate after pressing toasts 90min putting into baking oven at 170 ° of temperature, completes solidification;
C: effects on surface carries out template and blasting treatment.
The production technology of this circuit board also comprises the cutting step of circuit board.
By composite strengthening layer on substrate, give the support that flexible circuit board is stable, make circuit board in process of production, not easily produce fold because of mobile, greatly facilitate the operation of workman, decrease the generation of fraction defective.
More than that better enforcement of the present invention is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent variations or replacement under the prerequisite without prejudice to spirit of the present invention, and these equivalent distortion or replacement are all included in the application's claim limited range.
Claims (10)
1. a production technology for single-sided flexible circuit plate, comprises the following steps: select the Copper Foil be attached on insulating basement membrane one side as substrate, with this substrate for material:
S10: by described substrate and enhancement layer compound;
S20: compound dry film on the basis of step S10;
S30: the transfer substrate in step S20 carrying out circuit pattern;
S40: according to pattern processing circuit on substrate of transfer;
S50: the process of electric nickel gold is carried out to substrate;
S60: enhancement layer is peeled off from described substrate.
2. production technology according to claim 1, is characterized in that: complex method described in step S10 is under the condition of certain temperature and pressure, is compounded on described insulating basement membrane by enhancement layer.
3. production technology according to claim 2, is characterized in that: described temperature interval is 110 ° ± 5 ° C, and described pressure value interval is 2-3Kg/cm3.
4. the production technology according to any one of claims 1 to 3, is characterized in that: described enhancement layer is the PET film with adhesive linkage.
5. production technology according to claim 1, is characterized in that: in step S30, the transfer method of pattern is: carry out according to the order of sequence exposing and development treatment.
6. production technology according to claim 1, is characterized in that: the processing method of circuit described in step S40 is: carry out microetch, etching and demoulding process according to the order of sequence.
7. production technology according to claim 1, is characterized in that: stripping means described in step S60 is: by Copper Foil with the smooth placement of described enhancement layer mode upward, provokes enhancement layer, then it all peeled off from side local.
8. the production technology according to any one of claim 1,2,3,5,6,7, is characterized in that: be also provided with between step S40 and S50 and protect and surface-treated step the substrate of completing circuit processing.
9. production technology according to claim 8, is characterized in that: the described protection to substrate and surface-treated method are:
A: spot welding coverlay on substrate;
B: after spot welding completes, pressing and solidification are carried out to coverlay;
C: effects on surface carries out template and blasting treatment.
10. production technology according to claim 9, is characterized in that: the cutting step also comprising substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410620957.6A CN104411093A (en) | 2014-11-05 | 2014-11-05 | Production technique of single-sided flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410620957.6A CN104411093A (en) | 2014-11-05 | 2014-11-05 | Production technique of single-sided flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104411093A true CN104411093A (en) | 2015-03-11 |
Family
ID=52648673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410620957.6A Pending CN104411093A (en) | 2014-11-05 | 2014-11-05 | Production technique of single-sided flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104411093A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017113325A1 (en) * | 2015-12-31 | 2017-07-06 | 安徽省大富光电科技有限公司 | Method of preparing patterned conductive material |
| CN113013371A (en) * | 2021-02-20 | 2021-06-22 | 上海毅蓝电子科技有限公司 | Method for perforating metal foil for lithium battery |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1662120A (en) * | 2004-01-30 | 2005-08-31 | 日立化成工业株式会社 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
| CN1878459A (en) * | 2005-06-10 | 2006-12-13 | 有限会社韩国泰康利 | Carrier tape for loading flexible printed circuits |
| CN101990363A (en) * | 2010-08-06 | 2011-03-23 | 雷玉菡 | Gold plating method for electronic circuit board |
| CN102307436A (en) * | 2011-04-03 | 2012-01-04 | 广东生益科技股份有限公司 | Method for manufacturing flexible printed circuit board |
| CN103313518A (en) * | 2013-06-25 | 2013-09-18 | 惠州中京电子科技股份有限公司 | Manufacturing method for flexible printed circuit (FPC) single-side ultra-thin base material line |
| CN203840630U (en) * | 2014-01-17 | 2014-09-17 | 杨秀英 | Carrier film suitable for single-side flexible circuit board |
-
2014
- 2014-11-05 CN CN201410620957.6A patent/CN104411093A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1662120A (en) * | 2004-01-30 | 2005-08-31 | 日立化成工业株式会社 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
| CN1878459A (en) * | 2005-06-10 | 2006-12-13 | 有限会社韩国泰康利 | Carrier tape for loading flexible printed circuits |
| CN101990363A (en) * | 2010-08-06 | 2011-03-23 | 雷玉菡 | Gold plating method for electronic circuit board |
| CN102307436A (en) * | 2011-04-03 | 2012-01-04 | 广东生益科技股份有限公司 | Method for manufacturing flexible printed circuit board |
| CN103313518A (en) * | 2013-06-25 | 2013-09-18 | 惠州中京电子科技股份有限公司 | Manufacturing method for flexible printed circuit (FPC) single-side ultra-thin base material line |
| CN203840630U (en) * | 2014-01-17 | 2014-09-17 | 杨秀英 | Carrier film suitable for single-side flexible circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017113325A1 (en) * | 2015-12-31 | 2017-07-06 | 安徽省大富光电科技有限公司 | Method of preparing patterned conductive material |
| CN107615895A (en) * | 2015-12-31 | 2018-01-19 | 安徽省大富光电科技有限公司 | A kind of preparation method of figure conductive material |
| CN113013371A (en) * | 2021-02-20 | 2021-06-22 | 上海毅蓝电子科技有限公司 | Method for perforating metal foil for lithium battery |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI454190B (en) | Attached to the metal foil | |
| JP3224281U (en) | Flexible printed circuit board | |
| CN103731993A (en) | Machining method for single-side flexible printed circuit board | |
| CN109451655B (en) | Method for producing PCB control panel body size and warping and structure thereof | |
| CN105185716A (en) | ELectronic package, package carrier, and methods of manufacturing electronic package and package carrier | |
| CN104411093A (en) | Production technique of single-sided flexible circuit board | |
| CN102448249B (en) | Method for manufacturing double-sided circuit board | |
| CN103467763A (en) | Insulating plate manufacture method and insulating plate manufactured by using same | |
| CN104183567B (en) | Thin encapsulation substrate and its processing technology | |
| JP2007152869A (en) | Adhesive tape with ultra thin metal foil | |
| CN104185363A (en) | Composite type ultra-thin non-core substrate and manufacturing method thereof | |
| CN103635027B (en) | The manufacture method and wiring board of a kind of wiring board | |
| CN104051278A (en) | Molding and milling-cutting method of DBC ceramic substrate | |
| JP6341644B2 (en) | Metal foil with carrier and method for producing laminated substrate | |
| CN106028666A (en) | Gilding process of bonding circuit board | |
| CN103458630B (en) | A kind of method overcoming printed circuit board (PCB) copper-clad base plate thin plate operation to limit | |
| CN103481525A (en) | Method for manufacturing insulating plate and method for manufacturing CCP (copper-clad plate) by using insulating plate | |
| CN112384005B (en) | Lead etching method for gold-plated printed circuit board | |
| CN106098633A (en) | A kind of base plate for packaging and preparation method thereof | |
| CN104538314B (en) | Three layer package substrates and the preparation method and three layer package substrates for encapsulating chip | |
| CN104320915B (en) | A kind of preparation method of mobile phone module flexibility double face hollow out printed board | |
| CN110572962A (en) | lamination manufacturing process of HDI product | |
| CN102791079B (en) | Manufacturing method of flexible circuit board and flexible circuit board manufactured by using manufacturing method | |
| CN102510670A (en) | Method and tool for manufacturing flexible PCB (printed circuit board) | |
| CN105957930A (en) | Manufacturing method of RGB metal substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150311 |
|
| RJ01 | Rejection of invention patent application after publication |