CN113337225A - Copper foil composite assembly structure and method for attaching copper foil composite assembly structure to FPC (flexible printed circuit) - Google Patents
Copper foil composite assembly structure and method for attaching copper foil composite assembly structure to FPC (flexible printed circuit) Download PDFInfo
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- CN113337225A CN113337225A CN202110744818.4A CN202110744818A CN113337225A CN 113337225 A CN113337225 A CN 113337225A CN 202110744818 A CN202110744818 A CN 202110744818A CN 113337225 A CN113337225 A CN 113337225A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 174
- 239000011889 copper foil Substances 0.000 title claims abstract description 171
- 239000002131 composite material Substances 0.000 title claims abstract description 79
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000010410 layer Substances 0.000 claims description 59
- 230000001681 protective effect Effects 0.000 claims description 35
- 239000012790 adhesive layer Substances 0.000 claims description 33
- 239000011247 coating layer Substances 0.000 claims description 22
- 239000000428 dust Substances 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000000741 silica gel Substances 0.000 claims description 13
- 229910002027 silica gel Inorganic materials 0.000 claims description 13
- 238000000926 separation method Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 239000012528 membrane Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 10
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 6
- 239000002390 adhesive tape Substances 0.000 abstract description 5
- 239000003292 glue Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0054—Casings specially adapted for display applications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to the technical field of liquid crystal modules, in particular to a copper foil composite assembly structure and a method for attaching the copper foil composite assembly structure to an FPC (flexible printed circuit). The structure of the invention is novel, and the problems that when the black insulating single-sided adhesive tape and the copper foil are attached together, bubbles are poor in the middle due to the fact that the materials of the black insulating single-sided adhesive tape and the copper foil are too thin, and the edges of the black insulating single-sided adhesive tape which exceeds the outer edge of the copper foil are poor in curling due to the fact that the black insulating single-sided adhesive tape is too thin are solved; the stability, the work efficiency and the quality of the copper foil composite assembly structure attached to the FPC of the FOG product are greatly improved, and the structure is reliable.
Description
Technical Field
The invention relates to the technical field of liquid crystal modules, in particular to a copper foil composite assembly structure and a method for attaching the copper foil composite assembly structure to an FPC (flexible printed circuit).
Background
In order to solve radio frequency interference, the conventional liquid crystal display screen is attached with a copper foil composite film on an FPC (flexible printed circuit) after an FOG assembly (the FOG assembly comprises an LCD, an upper polarizer, a lower polarizer, an IC and the FPC) is assembled, and the copper foil composite film basically covers the whole FPC area. The existing copper foil composite film is formed by compounding a copper foil and a black insulating single-sided adhesive tape, wherein the structure of the copper foil is as follows: copper foil layer + conductive adhesive layer, the simple description of conductive adhesive layer preparation technology does: a certain amount of conductive particles are mixed in the acrylic glue, and then the conductive particles are coated on the copper foil layer to form a conductive adhesive layer. The copper foil layer can be connected with the copper exposed area of the GND circuit on the FPC through the conductive adhesive layer, so that a large shielding cover is formed with the whole GND ground copper on the FPC circuit board, and finally, the effect of preventing radio frequency interference is effectively achieved. Because the copper foil is made of metal materials, metal elements are relatively active and are easily oxidized and deteriorated after being exposed outside for a long time, so that the shielding function is weakened; in addition, the copper foil is a conductive material, and if the copper foil is exposed on the outer side and contacts other conductive parts in the mobile phone complete machine, poor short circuit can occur; in addition, the copper foil is easily scratched when being directly exposed, which affects the shielding function.
In summary, an insulating layer must be attached to the copper foil.
The existing scheme is to additionally paste a layer of black insulating single-sided tape on a copper foil, because the current mobile phones in the liquid crystal module industry pursue lightness and thinness, the thickness of the current copper foil is basically about 0.03mm due to space limitation, the thickness of the black insulating single-sided tape is allowed to be basically about 0.01mm, the area of the black insulating single-sided tape is slightly larger than that of the copper foil, the periphery of the black insulating single-sided tape exceeds the copper foil by 0.5mm, and the edge of the copper foil can be covered by the black insulating single-sided tape under the condition of extreme deviation when the black insulating single-sided tape is pasted on the copper foil, and the black insulating single-sided tape is not exposed.
However, the above solution is prone to the following problems:
1. the manufacturing process flow of the existing copper foil composite film is briefly described as follows:
(1) punching the appearance of the copper foil, (2) punching the appearance of the black insulating single-sided tape, and (3) aligning and attaching the two together.
Because the thickness of the black single-sided insulating tape is only 0.01mm, the thickness of the copper foil is also only 0.03mm, the thickness of the black single-sided insulating tape and the thickness of the copper foil are both extremely thin, and the relative area is large, residual bubbles are easy to appear between the black single-sided insulating tape and the copper foil in the attaching process and cannot be effectively discharged, and the attaching yield is low. And because the periphery of the black single-sided insulating tape is about 0.5 percent higher than the copper foil layer, the black single-sided insulating tape with the width of 0.5mm higher than the periphery is easy to have poor edge curling due to too thin thickness. The copper foil composite film with the existing structure is difficult to manufacture by combining the above steps.
2. The thickness of the copper foil is 0.03mm + the thickness of the black insulating single-sided tape is 0.01mm, and the total thickness is 0.04mm, and the copper foil composite film covers the whole FPC area, so that the area of the copper foil composite film is relatively large, and in sum, the existing copper foil composite film is characterized by large area and thin thickness. The process steps of attaching the copper foil composite film of the existing liquid crystal display module to the FPC are as follows:
(1) staff gets copper foil composite film product from pressing from both sides with tweezers, then tears the dirt membrane of leaving of conducting resin face, because of the copper foil composite film is big thin again, leads to tearing the conducting resin face the copper foil composite film curls easily when leaving the dirt membrane, so when the attached copper foil composite film of actual, scrap more because of the material curls, lead to the attached station yield of copper foil composite film in the liquid crystal module production process to be lower.
(2) When the copper foil composite film is attached, two 'L' -shaped white oil pair bit lines are attached on the FPC in a silk-screen printing manner: the edge of the copper foil composite film is close to the opposite line during attaching, but the opposite line cannot be covered. The operation speed of the operation mode is low, the precision of the attaching position is not high, the operation stability is poor, and the dimensional tolerance of the attaching position of the copper foil composite film can only be controlled according to +/-0.5.
Therefore, the present copper foil composite assembly structure and the method for attaching the same to the FPC are needed to solve the above problems.
Disclosure of Invention
The invention provides a copper foil composite assembly structure and a method for attaching the copper foil composite assembly structure to an FPC (flexible printed circuit), aiming at the problems of novel structure, the invention solves the problems that when a black insulating single-sided tape and a copper foil are attached together, the material of the two is too thin, so that bad bubbles are remained in the middle, and the black insulating single-sided tape beyond the outer edge of the copper foil is too thin, so that the edge curling is easy to be bad; furthermore, the transparent bearing protective film is attached to the black insulating coating layer, and the transparent bearing protective film, the copper foil layer and the conductive adhesive layer form the copper foil composite assembly structure, so that the problem of curling and deformation easily caused in the process of tearing and removing a dust film in the attaching operation due to large and thin area of the copper foil composite film is solved, the stability and the working efficiency are greatly improved, the quality of the copper foil composite assembly structure attached to the FPC of the FOG product is improved, and the structure is reliable.
In order to solve the technical problems, the invention adopts the following technical scheme:
the invention provides a copper foil composite assembly structure which comprises a copper foil layer and a conductive adhesive layer arranged on the bottom surface of the copper foil layer, wherein a black insulating coating layer is coated on the upper end surface of the copper foil layer, a transparent bearing protective film is attached to the black insulating coating layer, and a dust separation film is arranged on the bottom surface of the conductive adhesive layer.
The transparent bearing protective film comprises a transparent PET substrate and a transparent silica gel layer adhered to the PET substrate, and the transparent silica gel layer is adhered to the black insulating coating layer.
The adhesive force of the transparent silica gel layer is 1-15 g/25 mm.
The thickness of the transparent bearing protective film is 0.05-0.12 mm.
And positioning holes are formed in the two sides of the transparent bearing protective film.
And the area of the transparent bearing protective film is larger than the area of the copper foil layer and the area of the conductive adhesive layer.
And the area of the dust separating film is larger than the area of the copper foil layer and the area of the conductive adhesive layer.
The invention also provides a method for attaching the copper foil composite component structure to the FPC, wherein the copper foil composite component structure comprises a copper foil layer and a conductive adhesive layer arranged on the bottom surface of the copper foil layer; a dust separation film is arranged on the bottom surface of the conductive adhesive layer;
the method comprises the following steps:
step A, coating a black insulating coating layer on a copper foil layer;
b, punching the copper foil layer and the conductive adhesive layer to form a shape meeting the processing requirement;
c, a transparent bearing protective film is additionally attached to the black insulating coating layer;
d, tearing off the dust separation film, and attaching the copper foil composite assembly structure assembled in the step C to the FPC;
and E, pressing the copper foil composite assembly structure attached in the step D, and tearing off the transparent bearing protective film.
Positioning holes are formed in the two sides of the transparent bearing protective film;
and D, in the step E or the step E, the copper foil composite assembly structure is placed on a copper foil attaching jig provided with the FOG assembly, then the copper foil composite assembly structure is matched and positioned with a positioning column of the copper foil attaching jig through a positioning hole, and after the copper foil composite assembly structure is attached to the FPC, the transparent bearing protective film is torn off.
The invention has the beneficial effects that:
the black insulating coating layer is coated on the copper foil layer, so that the problems that when the black insulating single-sided tape and the copper foil are attached together, bubbles are poor in the middle due to the fact that the materials of the black insulating single-sided tape and the copper foil are too thin, and the problem that the edges of the black insulating single-sided tape, which exceeds the outer edge of the copper foil in the periphery, are poor in curling due to the fact that the black insulating single-sided tape is too thin are solved; furthermore, the transparent bearing protective film is attached to the black insulating coating layer, and the transparent bearing protective film, the copper foil layer and the conductive adhesive layer form the copper foil composite assembly structure, so that the problem of curling and deformation easily caused in the process of tearing and removing a dust film in the attaching operation due to large and thin area of the copper foil composite film is solved, the stability and the working efficiency are greatly improved, the quality of the copper foil composite assembly structure attached to the FPC of the FOG product is improved, and the structure is reliable.
Drawings
Fig. 1 is a schematic structural view of a copper foil composite assembly structure according to the present invention.
The reference numerals in fig. 1 include:
1. a copper foil layer; 2. a conductive adhesive layer; 3. a black insulating coating layer; 4. a transparent load-bearing protective film; 5. a dust separation film; 6. and (7) positioning the holes.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention. The present invention is described in detail below with reference to the attached drawings.
Example 1
The utility model provides a copper foil composite assembly structure, as shown in figure 1, includes copper foil layer and sets up the conductive adhesive layer in the copper foil layer bottom surface, the upper end coating of copper foil layer has black insulating coating layer, black insulating coating layer facing has transparent to bear the weight of the protection film, conductive adhesive layer's bottom surface is provided with from the dirt membrane. The black insulating coating layer is coated on the copper foil layer, so that the problems that when the black insulating single-sided tape and the copper foil are attached together, bubbles remain in the middle of the tape due to the fact that the materials of the tape and the copper foil are too thin, and the problem that edge curling is poor easily caused by the fact that the black insulating single-sided tape exceeds the outer edge of the copper foil in the periphery is too thin are solved; furthermore, the transparent bearing protective film is attached to the black insulating coating layer, and the transparent bearing protective film, the copper foil layer and the conductive adhesive layer form the copper foil composite assembly structure, so that the problem of curling and deformation easily caused in the process of tearing and removing a dust film in the attaching operation due to large and thin area of the copper foil composite film is solved, the stability and the working efficiency are greatly improved, the quality of the copper foil composite assembly structure attached to the FPC of the FOG product is improved, and the structure is reliable.
In this embodiment, the area of the transparent load-bearing protection film is larger than the area of the copper foil layer and the area of the conductive adhesive layer.
In this embodiment, the area of the dust separating film is larger than the area of the copper foil layer and the area of the conductive adhesive layer.
This embodiment a copper foil composite assembly structure, transparent bear the protection film include transparent PET substrate and with the transparent silica gel layer that the PET substrate pasted, transparent silica gel layer pastes on the black insulation coating layer.
The attaching step of this embodiment is: taking the transparent bearing protective film together with the novel copper foil structural member from the dust separating film: therefore, the novel copper foil layer in the step is pasted on the transparent bearing protective film, the thickness of the transparent bearing protective film is about 0.1mm, and the base material is a PET base material, which is equivalent to playing a role in reinforcing the copper foil layer, so that the problem of curling caused by the fact that the copper foil layer is too thin and too soft when the copper foil layer is separated from the dust film can be thoroughly solved.
Further, the white oil of two "L" shapes on the FPC of the copper foil composite assembly structure contrast FPC that removes from the dirt membrane is attached on FPC to the bit line, and when counterpointing, the appearance border of copper foil layer and conductive adhesive layer counterpoints with the white oil on FPC, follows this step and sees that the area because of transparent bearing protection film is greater than copper foil layer and conductive adhesive layer, so transparent bearing protection film need choose for use whole transparent material: transparent PET substrate adds transparent silica gel layer, otherwise other colored materials are not good because of the transparency, and the appearance border of copper foil layer and conductive adhesive layer is looked when influencing attached easily and the white oil counterpoint effect of two "L" shapes on FPC.
In this embodiment, the adhesive force of the transparent silica gel layer is 1-15 g/25 mm. Specifically, the above arrangement mainly ensures the following two performances: (1) the weak viscosity function of the transparent silica gel layer needs to ensure that the composite assembly of the copper foil layer and the conductive adhesive layer can be stuck and taken up and does not fall off in the whole product sticking process; (2) the transparent silica gel layer of the transparent bearing protective film adopts silica gel glue, and the condition that no residual glue is on the black insulating coating layer of the embodiment when the transparent bearing protective film is subsequently torn off can be effectively ensured.
In this embodiment, the thickness of the transparent carrier protection film is between 0.05 mm and 0.12 mm. Specifically, the arrangement avoids the excessive thickness of the whole copper foil composite component structure.
In this embodiment, the two sides of the transparent bearing protection film are both provided with positioning holes. Specifically, during the use, place FOG product and fix a position on the attached tool of copper foil, the locating hole cooperates the location with the reference column on the attached tool of copper foil and fixes a position.
Example 2
the method comprises the following steps:
step A, coating a black insulating coating layer on a copper foil layer;
b, punching the copper foil layer and the conductive adhesive layer to form a shape meeting the processing requirement;
c, a transparent bearing protective film is additionally attached to the black insulating coating layer;
d, tearing off the dust separation film, and attaching the copper foil composite assembly structure assembled in the step C to the FPC;
and E, pressing the copper foil composite assembly structure attached in the step D, and tearing off the transparent bearing protective film.
Specifically, the copper foil composite assembly structure is attached to the FPC by the method, so that the problems that when the black insulating single-sided tape and the copper foil are attached together, bubbles remain in the middle of the black insulating single-sided tape and the copper foil are poor due to the fact that the materials of the black insulating single-sided tape and the copper foil are too thin, and the black insulating single-sided tape with the outer edge of the copper foil, which exceeds the periphery of the black insulating single-sided tape, is poor in edge curling due to the fact that the black insulating single-sided tape is too thin are solved; the problem of the curling deformation that easily appears in tearing and separating the dirt membrane in-process when solving the attached operation that the copper foil complex film caused because of the area is big and thin simultaneously, improve stability, work efficiency and the quality that the copper foil composite assembly structure is attached on the FPC of FOG product greatly, the structure is reliable.
In this embodiment, positioning holes are formed on both sides of the transparent bearing protection film; and D, in the step E or the step E, the copper foil composite assembly structure is placed on a copper foil attaching jig provided with the FOG assembly, then the copper foil composite assembly structure is matched and positioned with a positioning column of the copper foil attaching jig through a positioning hole, and after the copper foil composite assembly structure is attached to the FPC, the transparent bearing protective film is torn off.
Specifically, the improvement is as follows:
(1) placing the FOG product on a copper foil attaching jig for positioning;
(2) taking the transparent bearing protective film and the novel copper foil structural member together from the dust separating film, and then sleeving the positioning hole of the bearing film on the positioning column of the copper foil attaching jig to complete the attaching positioning of the copper foil;
(3) after the copper foil composite assembly structure is pressed and attached to the FPC, the transparent bearing protective film is torn off, and the attachment of a novel copper foil structural member is completed.
The copper foil composite assembly is attached to the FPC by aligning and attaching the jig, so that the operation speed and stability can be improved, and the operation precision is further improved; finally, the precision of the attaching position of the copper foil composite assembly is effectively improved, and the dimensional tolerance of the attaching position can be controlled according to +/-0.3, so that +/-0.2 is improved compared with +/-0.5 in the prior art.
In addition: the improvement of the positioning hole, the transparent bearing protective film uses the positioning hole for alignment, so the color of the material is not limited, and blue or any other color can be used.
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A copper foil composite component structure is characterized in that: including copper foil layer and the conductive adhesive layer of setting in copper foil layer bottom surface, the upper end coating of copper foil layer has the insulating coating layer of black, the transparent protection film that bears is attached to the insulating coating layer of black, conductive adhesive layer's bottom surface is provided with from the dirt membrane.
2. The copper foil composite assembly structure of claim 1, wherein: the transparent bearing protective film comprises a transparent PET substrate and a transparent silica gel layer adhered to the PET substrate, and the transparent silica gel layer is adhered to the black insulating coating layer.
3. The copper foil composite assembly structure of claim 2, wherein: the adhesive force of the transparent silica gel layer is 1-15 g/25 mm.
4. The copper foil composite assembly structure of claim 1, wherein: the thickness of the transparent bearing protective film is 0.05-0.12 mm.
5. The copper foil composite assembly structure of claim 1, wherein: and positioning holes are formed in the two sides of the transparent bearing protective film.
6. The copper foil composite assembly structure of claim 1, wherein: the area of the transparent bearing protective film is larger than the area of the copper foil layer and the area of the conductive adhesive layer.
7. The copper foil composite assembly structure of claim 1, wherein: the area of the dust separating film is larger than the area of the copper foil layer and the area of the conductive adhesive layer.
8. A method for attaching a copper foil composite component structure to an FPC is characterized in that the copper foil composite component structure comprises a copper foil layer and a conductive adhesive layer arranged on the bottom surface of the copper foil layer; a dust separation film is arranged on the bottom surface of the conductive adhesive layer;
the method comprises the following steps:
step A, coating a black insulating coating layer on a copper foil layer;
b, punching the copper foil layer and the conductive adhesive layer to form a shape meeting the processing requirement;
c, a transparent bearing protective film is additionally attached to the black insulating coating layer;
d, tearing off the dust separation film, and attaching the copper foil composite assembly structure assembled in the step C to the FPC;
and E, pressing the copper foil composite assembly structure attached in the step D, and tearing off the transparent bearing protective film.
9. The method for attaching the copper foil composite assembly structure to the FPC as recited in claim 8, wherein positioning holes are formed on both sides of the transparent carrier protective film;
and D, in the step E or the step E, the copper foil composite assembly structure is placed on a copper foil attaching jig provided with the FOG assembly, then the copper foil composite assembly structure is matched and positioned with a positioning column of the copper foil attaching jig through a positioning hole, and after the copper foil composite assembly structure is attached to the FPC, the transparent bearing protective film is torn off.
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| CN202110744818.4A CN113337225B (en) | 2021-06-30 | 2021-06-30 | Copper foil composite assembly structure and method for attaching copper foil composite assembly structure to FPC |
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| CN202110744818.4A CN113337225B (en) | 2021-06-30 | 2021-06-30 | Copper foil composite assembly structure and method for attaching copper foil composite assembly structure to FPC |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114479700A (en) * | 2022-03-17 | 2022-05-13 | 苏州佳值电子工业有限公司 | Bending type conduction heat dissipation functional film convenient to mount and electronic product |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109880544A (en) * | 2018-12-28 | 2019-06-14 | 新纶科技（常州）有限公司 | A kind of mute black copper foil one-faced tapes |
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| CN209989307U (en) * | 2019-05-26 | 2020-01-24 | 苏州玮俊电子科技有限公司 | Copper foil adhesive tape for mobile phone display screen |
| CN112764255A (en) * | 2021-01-23 | 2021-05-07 | 东莞市德普特电子有限公司 | Novel side shading glue and attaching method thereof |
| CN217709296U (en) * | 2021-06-30 | 2022-11-01 | 东莞市德普特电子有限公司 | Copper foil composite assembly structure |
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2021
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| CN109880544A (en) * | 2018-12-28 | 2019-06-14 | 新纶科技（常州）有限公司 | A kind of mute black copper foil one-faced tapes |
| CN209974681U (en) * | 2019-04-26 | 2020-01-21 | 苏州益邦电子材料有限公司 | Aluminum foil adhesive tape assembly |
| CN209989307U (en) * | 2019-05-26 | 2020-01-24 | 苏州玮俊电子科技有限公司 | Copper foil adhesive tape for mobile phone display screen |
| CN112764255A (en) * | 2021-01-23 | 2021-05-07 | 东莞市德普特电子有限公司 | Novel side shading glue and attaching method thereof |
| CN217709296U (en) * | 2021-06-30 | 2022-11-01 | 东莞市德普特电子有限公司 | Copper foil composite assembly structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114479700A (en) * | 2022-03-17 | 2022-05-13 | 苏州佳值电子工业有限公司 | Bending type conduction heat dissipation functional film convenient to mount and electronic product |
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| CN113337225B (en) | 2023-11-17 |
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