CN113337225B - Copper foil composite assembly structure and method for attaching copper foil composite assembly structure to FPC - Google Patents
Copper foil composite assembly structure and method for attaching copper foil composite assembly structure to FPC Download PDFInfo
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- CN113337225B CN113337225B CN202110744818.4A CN202110744818A CN113337225B CN 113337225 B CN113337225 B CN 113337225B CN 202110744818 A CN202110744818 A CN 202110744818A CN 113337225 B CN113337225 B CN 113337225B
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- copper foil
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- composite assembly
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 173
- 239000011889 copper foil Substances 0.000 title claims abstract description 170
- 239000002131 composite material Substances 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000010410 layer Substances 0.000 claims description 61
- 230000001681 protective effect Effects 0.000 claims description 36
- 239000012790 adhesive layer Substances 0.000 claims description 32
- 239000000428 dust Substances 0.000 claims description 24
- 239000011247 coating layer Substances 0.000 claims description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 239000000741 silica gel Substances 0.000 claims description 15
- 229910002027 silica gel Inorganic materials 0.000 claims description 15
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 14
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 14
- 238000000926 separation method Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 5
- -1 polyethylene terephthalate Polymers 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 abstract description 15
- 239000000463 material Substances 0.000 abstract description 11
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 6
- 239000003292 glue Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0054—Casings specially adapted for display applications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
Abstract
The invention relates to the technical field of liquid crystal modules, in particular to a copper foil composite assembly structure and a method for attaching the copper foil composite assembly structure to an FPC. The invention has novel structure, solves the problem that when the black insulating single-sided adhesive tape and the copper foil are attached together, the middle residual bubble is bad because the materials of the black insulating single-sided adhesive tape and the copper foil are too thin, and the problem that the edge curl is bad because the black insulating single-sided adhesive tape with the periphery exceeding the outer edge of the appearance of the copper foil is too thin; the stability and the working efficiency are greatly improved, the quality of the copper foil composite assembly structure attached to the FPC of the FOG product is improved, and the structure is reliable.
Description
Technical Field
The invention relates to the technical field of liquid crystal modules, in particular to a copper foil composite assembly structure and a method for attaching the copper foil composite assembly structure to an FPC.
Background
In order to solve radio frequency interference, the conventional liquid crystal display screen is to attach a copper foil composite film on the FPC after the FOG assembly (the FOG assembly comprises an LCD, an upper polarizer, a lower polarizer, an IC and an FPC) is assembled, wherein the copper foil composite film basically covers the whole FPC area. The existing copper foil composite film is formed by compounding a copper foil and a black insulating single-sided tape, wherein the copper foil has the following structure: the copper foil layer and the conductive adhesive layer are simply described as follows: and mixing a certain amount of conductive particles in the acrylic glue, and then coating the mixture on the copper foil layer to form a conductive adhesive layer. The copper foil layer is connected with the copper exposed area of the GND line on the FPC through the conductive adhesive layer, so that a large shielding cover is formed with the whole GND ground copper on the FPC circuit board, and finally, the effect of preventing radio frequency interference is effectively achieved. Because the copper foil is made of metal, metal elements are relatively active, and are exposed outside for a long time and are easy to oxidize and deteriorate, so that the shielding function is weakened; the copper foil is a conductive material, and if the copper foil is exposed outside and contacts with other conductive components in the whole mobile phone, poor short circuit can occur; furthermore, the copper foil is directly exposed to the outside and is easy to scratch, so that the shielding function of the copper foil is affected.
To sum up, an insulating layer must be attached to the copper foil.
The existing scheme is to attach a layer of black insulating single-sided tape on the copper foil, and because the current mobile phones in the liquid crystal module industry are light and thin, the space limitation leads to the thickness of the current copper foil to be about 0.03mm, the thickness of the black insulating single-sided tape is allowed to be attached to be about 0.01mm, the area of the black insulating single-sided tape is required to be slightly larger than that of the copper foil, the periphery of the black insulating single-sided tape exceeds the copper foil by 0.5mm, and therefore the edge of the copper foil can be covered by the black insulating single-sided tape under the condition of extreme deviation when the black insulating single-sided tape is attached to the copper foil, and the edge of the copper foil is not exposed.
However, the above scheme is prone to the following problems:
1. the existing copper foil composite film manufacturing process flow is briefly described as follows:
the method comprises the steps of (1) punching the appearance of the copper foil, (2) punching the appearance of the black insulating single-sided adhesive tape, and (3) aligning and attaching the two.
Because the thickness of the black single-sided insulating tape is only 0.01mm, the thickness of the copper foil is also only 0.03mm, the thickness of the black single-sided insulating tape and the thickness of the copper foil are both thin, and the relative area is relatively large, residual bubbles are easy to occur between the black single-sided insulating tape and the copper foil in the attaching process and cannot be effectively discharged, and the attaching yield is low. The periphery of the black single-sided insulating tape exceeds the copper foil layer by about 0.5, so that the black single-sided insulating tape with the width of 0.5mm exceeding the periphery is too thin and is easy to have edge curling failure. The copper foil composite film with the existing structure is difficult to manufacture by combining the above steps.
2. The copper foil thickness is 0.03mm and the total thickness is 0.04mm only when the black insulating single-sided tape is 0.01mm, and the copper foil composite film covers the whole FPC area, so that the area of the copper foil composite film is relatively large, and the existing copper foil composite film is characterized by large area and thin thickness. The copper foil composite film of the existing liquid crystal display module is attached to the FPC by the following process steps:
(1) Staff uses tweezers to clamp copper foil composite film products, then tears the dust separation film of conductive adhesive surface, and because the copper foil composite film is big again thin, the copper foil composite film is easy to curl when tearing the dust separation film of conductive adhesive surface, so when actually attaching the copper foil composite film, because the material curls and scrapps more, the copper foil composite film attachment station yield in the liquid crystal module production process is lower.
(2) When the copper foil composite film is attached, the two L-shaped white oil alignment wires which are silk-screened on the FPC are attached: the edge of the copper foil composite film is close to the alignment line during attachment, but cannot cover the alignment line. The operation mode has low operation speed, low accuracy of the attached position, poor operation stability and only management and control of dimensional tolerance of the attached position of the copper foil composite film according to +/-0.5.
Therefore, there is a need for a copper foil composite assembly structure and a method for attaching the copper foil composite assembly structure to an FPC to solve the above problems.
Disclosure of Invention
The invention provides a copper foil composite assembly structure and a method for attaching the copper foil composite assembly structure to an FPC, aiming at the problems in the prior art, the structure is novel, and the problem that when a black insulating single-sided adhesive tape and a copper foil are attached together, residual bubbles in the middle are bad due to too thin materials of the two materials is solved, and the problem that edge curling is bad due to too thin black insulating single-sided adhesive tape on the outer edge of the appearance of the copper foil with the periphery exceeding the periphery is solved; furthermore, the transparent bearing protective film, the copper foil layer and the conductive adhesive layer are adhered on the black insulating coating layer to form the copper foil composite component structure, so that the problem of curling deformation easily occurring in the process of tearing off the dust film in the adhering operation of the copper foil composite film due to large and thin area is solved, the stability and the working efficiency are greatly improved, the quality of adhering the copper foil composite component structure on the FPC of the FOG product is greatly improved, and the structure is reliable.
In order to solve the technical problems, the invention adopts the following technical scheme:
the invention provides a copper foil composite assembly structure which comprises a copper foil layer and a conductive adhesive layer arranged on the bottom surface of the copper foil layer, wherein a black insulating coating layer is coated on the upper end surface of the copper foil layer, a transparent bearing protective film is attached to the black insulating coating layer, and a dust separation film is arranged on the bottom surface of the conductive adhesive layer.
The transparent bearing protective film comprises a transparent PET (polyethylene terephthalate) substrate and a transparent silica gel layer adhered to the PET substrate, and the transparent silica gel layer is adhered to the black insulating coating layer.
Wherein the adhesive force of the transparent silica gel layer is 1-15 g/25mm.
Wherein the thickness of the transparent bearing protective film is between 0.05 and 0.12 mm.
Wherein, both sides of transparent bearing protection film all are provided with the locating hole.
The area of the transparent bearing protective film is larger than the area of the copper foil layer and the area of the conductive adhesive layer.
The dust separation film is larger than the copper foil layer and the conductive adhesive layer.
The invention also provides a method for attaching the copper foil composite assembly structure to the FPC, wherein the copper foil composite assembly structure comprises a copper foil layer and a conductive adhesive layer arranged on the bottom surface of the copper foil layer; the bottom surface of the conductive adhesive layer is provided with a dust separation film;
the method comprises the following steps:
step A, coating a black insulating coating layer on a copper foil layer;
step B, punching the copper foil layer and the conductive adhesive layer to form an appearance meeting the processing requirements;
step C, a transparent bearing protective film is attached to the black insulating coating layer;
step D, tearing off the dust separating film, and attaching the copper foil composite assembly structure assembled in the step C to the FPC;
and E, pressing the copper foil composite assembly structure attached in the step D, and tearing off the transparent bearing protective film.
Wherein, positioning holes are formed on both sides of the transparent bearing protective film;
in the step D or the step E, the copper foil composite assembly structure is placed on a copper foil attaching jig provided with the FOG assembly, then the copper foil composite assembly structure is matched and positioned with a positioning column of the copper foil attaching jig through a positioning hole, and after the copper foil composite assembly structure is attached to the FPC, the transparent bearing protective film is torn off.
The invention has the beneficial effects that:
the invention has novel structure and ingenious design, and solves the problem that when the black insulating single-sided adhesive tape and the copper foil are attached together, the intermediate residual bubble is bad because the materials of the black insulating single-sided adhesive tape and the copper foil are too thin, and the problem that the edge curling is bad because the black insulating single-sided adhesive tape with the periphery exceeding the outer edge of the appearance of the copper foil is too thin is solved by coating the black insulating coating layer on the copper foil layer; furthermore, the transparent bearing protective film, the copper foil layer and the conductive adhesive layer are adhered on the black insulating coating layer to form the copper foil composite component structure, so that the problem of curling deformation easily occurring in the process of tearing off the dust film in the adhering operation of the copper foil composite film due to large and thin area is solved, the stability and the working efficiency are greatly improved, the quality of adhering the copper foil composite component structure on the FPC of the FOG product is greatly improved, and the structure is reliable.
Drawings
Fig. 1 is a schematic structural view of a copper foil composite assembly structure according to the present invention.
The reference numerals in fig. 1 include:
1. a copper foil layer; 2. a conductive adhesive layer; 3. a black insulating coating layer; 4. a transparent carrier protective film; 5. separating a dust film; 6. and positioning holes.
Detailed Description
The invention will be further described with reference to examples and drawings, to which reference is made, but which are not intended to limit the scope of the invention. The present invention will be described in detail below with reference to the accompanying drawings.
Example 1
The utility model provides a copper foil composite assembly structure, as shown in fig. 1, includes copper foil layer and sets up the conductive adhesive layer in copper foil layer bottom surface, the up end coating of copper foil layer has black insulating coating layer, the transparent protection film that bears that is attached to on the black insulating coating layer, the bottom surface of conductive adhesive layer is provided with the dust separation membrane. Specifically, the invention has novel structure and ingenious design, and solves the problem that when the black insulating single-sided adhesive tape and the copper foil are attached together, the middle residual bubble is bad because the materials of the black insulating single-sided adhesive tape and the copper foil are too thin, and the problem that the edge curling is bad because the black insulating single-sided adhesive tape with the periphery exceeding the outer edge of the appearance of the copper foil is too thin; furthermore, the transparent bearing protective film, the copper foil layer and the conductive adhesive layer are adhered on the black insulating coating layer to form the copper foil composite component structure, so that the problem of curling deformation easily occurring in the process of tearing off the dust film in the adhering operation of the copper foil composite film due to large and thin area is solved, the stability and the working efficiency are greatly improved, the quality of adhering the copper foil composite component structure on the FPC of the FOG product is greatly improved, and the structure is reliable.
In this embodiment, the area of the transparent bearing protection film is larger than the area of the copper foil layer and the area of the conductive adhesive layer.
In this embodiment, the area of the dust separating film is larger than the area of the copper foil layer and the area of the conductive adhesive layer.
The embodiment of the copper foil composite assembly structure, wherein the transparent bearing protection film comprises a transparent PET (polyethylene terephthalate) substrate and a transparent silica gel layer adhered to the PET substrate, and the transparent silica gel layer is adhered to the black insulating coating layer.
The attaching step of this embodiment is: taking down the transparent bearing protective film and the novel copper foil structural member from the dust separating film: therefore, the novel copper foil layer is adhered to the transparent bearing protective film, the thickness of the transparent bearing protective film is about 0.1mm, and the base material is a PET base material, which is equivalent to the reinforcing effect on the copper foil layer, so that the curling problem caused by too thin and too soft copper foil layer and dust separating film during separation can be thoroughly solved.
Further, the copper foil composite assembly structure with the dust removing film is attached to the FPC by comparing the two L-shaped white oil alignment lines on the FPC, and when the alignment is performed, the appearance edges of the copper foil layer and the conductive adhesive layer are aligned with the white oil alignment lines on the FPC, so that the transparent bearing protective film is made of an integrally transparent material because the area of the transparent bearing protective film is larger than that of the copper foil layer and the conductive adhesive layer: transparent PET substrate adds transparent silica gel layer, otherwise other colored materials are because of the transparency is not good, and visual copper foil layer and conductive adhesive layer's appearance border and the white oil of two "L" shapes on the FPC counterpoint effect on easily influencing when attaching.
In the embodiment, the adhesive force of the transparent silica gel layer is 1-15 g/25mm. Specifically, the above arrangement mainly ensures the following two properties: (1) The weak viscosity function of the transparent silica gel layer needs to ensure that the composite component of the copper foil layer and the conductive gel layer can be stuck and taken up, and the composite component is ensured not to fall off in the whole product attaching process; (2) The transparent silica gel layer of the transparent bearing protective film adopts silica gel glue, so that the situation that no residual glue is on the black insulating coating layer in the embodiment when the transparent bearing protective film is torn off in the following process can be effectively ensured.
In this embodiment, the thickness of the transparent bearing protection film is between 0.05 and 0.12 mm. Specifically, the arrangement avoids the excessive thickness of the whole copper foil composite assembly structure.
In this embodiment, positioning holes are formed on both sides of the transparent bearing protection film. Specifically, when in use, the FOG product is placed on the copper foil attaching jig for positioning, and the positioning holes are matched with the positioning columns on the copper foil attaching jig for positioning.
Example 2
Embodiment 2 also provides a method for attaching a copper foil composite assembly structure to an FPC, the copper foil composite assembly structure including a copper foil layer and a conductive adhesive layer disposed on a bottom surface of the copper foil layer; the bottom surface of the conductive adhesive layer is provided with a dust separation film;
the method comprises the following steps:
step A, coating a black insulating coating layer on a copper foil layer;
step B, punching the copper foil layer and the conductive adhesive layer to form an appearance meeting the processing requirements;
step C, a transparent bearing protective film is attached to the black insulating coating layer;
step D, tearing off the dust separating film, and attaching the copper foil composite assembly structure assembled in the step C to the FPC;
and E, pressing the copper foil composite assembly structure attached in the step D, and tearing off the transparent bearing protective film.
Specifically, the method of the steps is used for attaching the copper foil composite assembly structure to the FPC, so that the problem that air bubbles remain in the middle and are bad due to too thin materials of the black insulating single-sided adhesive tape and the copper foil when the black insulating single-sided adhesive tape and the copper foil are attached together, and the problem that the edge curl is bad due to too thin black insulating single-sided adhesive tape with the periphery exceeding the outer edge of the copper foil appearance are solved; meanwhile, the problem of curling deformation easily occurring in the process of tearing off the dust film during the attaching operation of the copper foil composite film caused by large and thin area is solved, the stability and the working efficiency are greatly improved, the quality of the copper foil composite assembly structure attached to the FPC of the FOG product is improved, and the structure is reliable.
In this embodiment, positioning holes are formed on both sides of the transparent bearing protection film; in the step D or the step E, the copper foil composite assembly structure is placed on a copper foil attaching jig provided with the FOG assembly, then the copper foil composite assembly structure is matched and positioned with a positioning column of the copper foil attaching jig through a positioning hole, and after the copper foil composite assembly structure is attached to the FPC, the transparent bearing protective film is torn off.
Specifically, the improvement is as follows:
(1) Placing the FOG product on a copper foil attaching jig for positioning;
(2) Taking down the transparent bearing protective film and the novel copper foil structural member from the dust separating film, and sleeving the positioning holes of the bearing film on the positioning columns of the copper foil attaching jig to finish attaching and positioning of the copper foil;
(3) After the copper foil composite assembly structure is pressed to be attached to the FPC, the transparent bearing protective film is torn off, and the attachment of the novel copper foil structural member is completed.
The copper foil composite assembly is attached to the FPC, and the jig is used for alignment and attachment, so that the operation speed and stability can be improved, and the operation precision is further improved; and finally, the attaching position precision of the copper foil composite assembly is effectively improved, and the dimensional tolerance of the attaching position can be controlled according to +/-0.3, which is improved by +/-0.2 compared with the prior +/-0.5.
Another: the positioning holes are improved, and the transparent bearing protective film is aligned by the positioning holes, so that the color of the material is not limited, and blue or any other color can be used.
The present invention is not limited to the preferred embodiments, but is intended to be limited to the following description, and any modifications, equivalent changes and variations in light of the above-described embodiments will be apparent to those skilled in the art without departing from the scope of the present invention.
Claims (7)
1. The utility model provides a copper foil composite assembly structure which characterized in that: the anti-dust conductive film comprises a copper foil layer and a conductive adhesive layer arranged on the bottom surface of the copper foil layer, wherein a black insulating coating layer is coated on the upper end surface of the copper foil layer, a transparent bearing protective film is attached to the black insulating coating layer, and a dust separation film is arranged on the bottom surface of the conductive adhesive layer;
the transparent bearing protective film comprises a transparent PET (polyethylene terephthalate) substrate and a transparent silica gel layer adhered to the PET substrate, and the transparent silica gel layer is adhered to the black insulating coating layer;
the area of the transparent bearing protective film is larger than the area of the copper foil layer and the area of the conductive adhesive layer.
2. The copper foil composite assembly structure of claim 1, wherein: the adhesive force of the transparent silica gel layer is 1-15 g/25mm.
3. The copper foil composite assembly structure of claim 1, wherein: the thickness of the transparent bearing protective film is between 0.05 and 0.12 mm.
4. The copper foil composite assembly structure of claim 1, wherein: positioning holes are formed in two sides of the transparent bearing protective film.
5. The copper foil composite assembly structure of claim 1, wherein: the area of the dust separation film is larger than the area of the copper foil layer and the area of the conductive adhesive layer.
6. The method for attaching the copper foil composite assembly structure to the FPC is characterized in that the copper foil composite assembly structure comprises a copper foil layer and a conductive adhesive layer arranged on the bottom surface of the copper foil layer; the bottom surface of the conductive adhesive layer is provided with a dust separation film;
the method comprises the following steps:
step A, coating a black insulating coating layer on a copper foil layer;
step B, punching the copper foil layer and the conductive adhesive layer to form an appearance meeting the processing requirements;
step C, a transparent bearing protective film is attached to the black insulating coating layer;
step D, tearing off the dust separating film, and attaching the copper foil composite assembly structure assembled in the step C to the FPC;
step E, pressing the copper foil composite assembly structure attached in the step D, and tearing off the transparent bearing protective film;
the transparent bearing protective film comprises a transparent PET (polyethylene terephthalate) substrate and a transparent silica gel layer adhered to the PET substrate, and the transparent silica gel layer is adhered to the black insulating coating layer;
the area of the transparent bearing protective film is larger than the area of the copper foil layer and the area of the conductive adhesive layer.
7. The method for attaching a copper foil composite assembly structure to an FPC according to claim 6, wherein positioning holes are formed on both sides of said transparent carrier protective film;
in the step D or the step E, the copper foil composite assembly structure is placed on a copper foil attaching jig provided with the FOG assembly, then the copper foil composite assembly structure is matched and positioned with a positioning column of the copper foil attaching jig through a positioning hole, and after the copper foil composite assembly structure is attached to the FPC, the transparent bearing protective film is torn off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110744818.4A CN113337225B (en) | 2021-06-30 | 2021-06-30 | Copper foil composite assembly structure and method for attaching copper foil composite assembly structure to FPC |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110744818.4A CN113337225B (en) | 2021-06-30 | 2021-06-30 | Copper foil composite assembly structure and method for attaching copper foil composite assembly structure to FPC |
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| Publication Number | Publication Date |
|---|---|
| CN113337225A CN113337225A (en) | 2021-09-03 |
| CN113337225B true CN113337225B (en) | 2023-11-17 |
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| CN202110744818.4A Active CN113337225B (en) | 2021-06-30 | 2021-06-30 | Copper foil composite assembly structure and method for attaching copper foil composite assembly structure to FPC |
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| CN114479700A (en) * | 2022-03-17 | 2022-05-13 | 苏州佳值电子工业有限公司 | Bending type conduction heat dissipation functional film convenient to mount and electronic product |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109880544A (en) * | 2018-12-28 | 2019-06-14 | 新纶科技（常州）有限公司 | A kind of mute black copper foil one-faced tapes |
| CN209974681U (en) * | 2019-04-26 | 2020-01-21 | 苏州益邦电子材料有限公司 | Aluminum foil adhesive tape assembly |
| CN209989307U (en) * | 2019-05-26 | 2020-01-24 | 苏州玮俊电子科技有限公司 | Copper foil adhesive tape for mobile phone display screen |
| CN112764255A (en) * | 2021-01-23 | 2021-05-07 | 东莞市德普特电子有限公司 | Novel side shading glue and attaching method thereof |
| CN217709296U (en) * | 2021-06-30 | 2022-11-01 | 东莞市德普特电子有限公司 | Copper foil composite assembly structure |
-
2021
- 2021-06-30 CN CN202110744818.4A patent/CN113337225B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109880544A (en) * | 2018-12-28 | 2019-06-14 | 新纶科技（常州）有限公司 | A kind of mute black copper foil one-faced tapes |
| CN209974681U (en) * | 2019-04-26 | 2020-01-21 | 苏州益邦电子材料有限公司 | Aluminum foil adhesive tape assembly |
| CN209989307U (en) * | 2019-05-26 | 2020-01-24 | 苏州玮俊电子科技有限公司 | Copper foil adhesive tape for mobile phone display screen |
| CN112764255A (en) * | 2021-01-23 | 2021-05-07 | 东莞市德普特电子有限公司 | Novel side shading glue and attaching method thereof |
| CN217709296U (en) * | 2021-06-30 | 2022-11-01 | 东莞市德普特电子有限公司 | Copper foil composite assembly structure |
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| CN113337225A (en) | 2021-09-03 |
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