CN110827702A - Assembled display panel and manufacturing process method of assembled display panel - Google Patents
Assembled display panel and manufacturing process method of assembled display panel Download PDFInfo
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- CN110827702A CN110827702A CN201911035309.3A CN201911035309A CN110827702A CN 110827702 A CN110827702 A CN 110827702A CN 201911035309 A CN201911035309 A CN 201911035309A CN 110827702 A CN110827702 A CN 110827702A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
- G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
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Abstract
The embodiment of the application provides an assembled display panel and a manufacturing process method of the assembled display panel, wherein the assembled display panel comprises a plurality of micro display panels and a glass substrate, and the micro display panels are tightly spliced and arranged on the glass substrate; the micro display panel comprises a flexible substrate, a solid crystal layer, a sealing adhesive layer and a micro light-emitting diode chip; the flexible substrate is provided with a first surface and a second surface which are oppositely arranged, the first surface is provided with an effective display area, the solid crystal layer is pasted on the first surface of the flexible substrate and corresponds to the effective display area, the sealing adhesive layer is arranged on the surface, far away from the flexible substrate, of the solid crystal layer, the sealing adhesive layer corresponds to the solid crystal layer, the micro light-emitting diode chip is arranged on the surface, far away from the solid crystal layer, of the sealing adhesive layer, and the micro light-emitting diode chip corresponds to the effective display area. The embodiment of the application can reduce the assembling gap of the assembled display panel.
Description
Technical Field
The present disclosure relates to the field of panel manufacturing technologies, and in particular, to an assembled display panel and a manufacturing method of the assembled display panel.
Background
As a next generation Display technology, Micro Light Emitting Diode (Mini/Micro-LED) Display has the advantages of excellent Display effect, strong color reproducibility, wide viewing angle, high refresh rate, high contrast, high stability, low power consumption, high gray scale, and the like, and shows more excellent performance than Liquid Crystal Display (LCD) and Organic Light Emitting Diode (OLED). In the long run, with the breakthrough of key technologies such as transfer, the micro light emitting diode will be fully used in various display fields from small screen to large screen.
However, the existing WeChat light-emitting diode display panel still has a large gap in the splicing process, which is not beneficial to the display effect of the display panel. Therefore, it is an urgent technical problem to be solved by those skilled in the art to provide a display panel with a small splicing gap.
Disclosure of Invention
The embodiment of the application provides an assembled display panel and a manufacturing process method of the assembled display panel. The splicing gap for splicing the display panel can be reduced.
The embodiment of the application provides an assembled display panel, which comprises a plurality of miniature display panels and a glass substrate, wherein the miniature display panels are tightly spliced and arranged on the glass substrate;
the micro display panel comprises a flexible substrate, a solid crystal layer, a sealing adhesive layer and a micro light-emitting diode chip; the flexible substrate is provided with a first surface and a second surface which are oppositely arranged, the first surface is provided with an effective display area, the solid crystal layer is pasted on the first surface of the flexible substrate and corresponds to the effective display area, the sealing adhesive layer is arranged on the surface, far away from the flexible substrate, of the solid crystal layer, the sealing adhesive layer corresponds to the solid crystal layer, the micro light-emitting diode chip is arranged on the surface, far away from the solid crystal layer, of the sealing adhesive layer, and the micro light-emitting diode chip corresponds to the effective display area.
In some implementations, the flexible substrate is rectangular, the active display area also has a rectangle, one corner of the active display area is aligned with one corner of the flexible substrate, and the flexible substrate has a right-angle notch located at a diagonal position of the aligned corners of the flexible substrate and the active display area.
In some implementations, the micro display panel further includes source and drain traces on the flexible substrate at the edge of the active display area.
In some implementations, the planarity between the solid crystal layer and the flexible substrate is less than 10 μm.
The embodiment of the present application further provides a manufacturing method for assembling a display panel, including:
providing a flexible substrate, wherein the flexible substrate is provided with a first surface and a second surface which are oppositely arranged, and the first surface is provided with an effective display area;
sticking a crystal fixing layer on the first surface of the flexible substrate;
arranging a sealing adhesive layer on one surface of the solid crystal layer, which is far away from the flexible substrate;
a micro light-emitting diode chip is arranged on one surface of the sealing adhesive layer, which is far away from the solid crystal layer, and the micro light-emitting diode chip corresponds to the effective display area to form a micro display panel;
stripping the solid crystal layer and the sealing adhesive layer at the edge of the effective display area by laser;
and tightly splicing a plurality of the micro display panels and arranging the micro display panels on a glass substrate.
In some implementations, after passing the solid crystal layer and the sealant layer at the edge of the active display area through the laser glass, the method includes:
aligning one corner of the effective display area with one corner of the flexible substrate, wherein a right-angle notch is cut on the flexible substrate and is positioned at the diagonal position of the aligned corner of the flexible substrate and the effective display area.
In some implementations, the flexible substrate has a right angle notch cut therein, including:
and cutting a right-angle notch on the flexible substrate in a laser cutting mode.
In some implementations, after the die bonding layer and the sealant layer at the edge of the active display area are peeled off by a laser:
and arranging a source electrode wire and a drain electrode wire on the flexible substrate at the edge of the effective display area.
In some implementations, the planarity between the solid crystal layer and the flexible substrate is less than 10 μm.
In some implementations, the side of the encapsulant layer away from the die bonding layer is provided with a micro light emitting diode chip, including:
and arranging the micro light-emitting diode chip on the sealing adhesive layer in a die bonding process.
The assembled display panel comprises a plurality of micro display panels and a glass substrate, wherein the micro display panels are tightly spliced and arranged on the glass substrate; the micro display panel comprises a flexible substrate, a solid crystal layer, a sealing adhesive layer and a micro light-emitting diode chip; the flexible substrate is provided with a first surface and a second surface which are oppositely arranged, the first surface is provided with an effective display area, the solid crystal layer is pasted on the first surface of the flexible substrate and corresponds to the effective display area, the sealing adhesive layer is arranged on the surface, far away from the flexible substrate, of the solid crystal layer, the sealing adhesive layer corresponds to the solid crystal layer, the micro light-emitting diode chip is arranged on the surface, far away from the solid crystal layer, of the sealing adhesive layer, and the micro light-emitting diode chip corresponds to the effective display area. The display panel is assembled in the embodiment of the application, so that the assembling gap of the display panel can be reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.
Fig. 1 is a schematic structural diagram of an assembled display panel in the embodiment of the present application.
Fig. 2 is a schematic structural diagram of a micro display panel in an embodiment of the present application.
Fig. 3 is a flow chart illustrating a manufacturing method of the assembled display panel according to the embodiment of the present application.
FIG. 4 is a schematic view illustrating a manufacturing process scenario of the micro display panel according to an embodiment of the present disclosure.
Fig. 5 is a schematic view illustrating a manufacturing process scenario of the assembled display panel in the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a color film substrate and a display panel. The color filter substrate according to the embodiment of the present application is described in detail below.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an assembled display panel 100 according to an embodiment of the present disclosure. Fig. 2 is a schematic structural diagram of the micro display panel 10 in the embodiment of the present application. The embodiment of the present application provides an assembled display panel 100, and the assembled display panel 100 includes a plurality of micro display panels 10 and a glass substrate 20, and is a plurality of the micro display panels 10 are closely spliced and disposed on the glass substrate 20. The micro display panel 10 includes a flexible substrate 11, a die attach layer 12, a sealant layer 13, and a micro led chip 14; the flexible substrate 11 has a first surface 11a and a second surface 11b which are oppositely disposed, the first surface 11a has an effective display area 111, the solid crystal layer 12 is adhered to the first surface 11a of the flexible substrate 11 and corresponds to the effective display area 111, the sealant layer 13 is disposed on a surface of the solid crystal layer 12 away from the flexible substrate 11, the sealant layer 13 corresponds to the solid crystal layer 12, the micro light emitting diode chip 14 is disposed on a surface of the sealant layer 13 away from the solid crystal layer 12, and the micro light emitting diode chip 14 corresponds to the effective display area 111.
Note that the effective display Area 111 (AA) refers to an operable Area on the display screen where text and graphics are displayed.
The first surface 11a may be an upper surface of the flexible substrate 11, and the second surface 11b may be a lower surface of the flexible substrate 11. Of course, the first surface 11a may be a lower surface of the flexible substrate 11, and the second surface 11b may be an upper surface of the flexible substrate 11. In the embodiment of the present application, it is assumed that the first surface 11a is an upper surface of the flexible substrate 11, and the second surface 11b is a lower surface of the flexible substrate 11.
It should be noted that the area of the flexible substrate 11 is larger than the area of the effective display area 111, the sealant layer 13, the solid crystal layer 12 and the micro light emitting diode correspond to the effective display area 111, and because the area of the flexible substrate 11 is larger than the area of the effective display area 111, the edge of the micro light emitting diode chip also has an extending edge of the flexible substrate 11, when the micro display panel 10 is assembled, the micro light emitting diode chip is in close contact with the extending edge of the flexible substrate 11, and the gap of the assembled display panel 100 is shielded. And the close contact of the micro display panel 10 reduces the assembling gap of the assembled display panel 100.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
The flexible substrate 11 is rectangular, the effective display area 111 also has a rectangle, one of the corners of the effective display area 111 aligns with one of the corners of the flexible substrate 11, the flexible substrate 11 is provided with a right-angle notch 112, and the right-angle notch 112 is located at a diagonal position of the corners aligned with the flexible substrate 11 and the effective display area 111.
It should be noted that the flexible substrate 11 may be rectangular, square, or the like, and details of the shape of the flexible substrate 11 are not repeated in this embodiment of the application. In addition, the flexible substrate 11 is provided with a right-angle notch 112, and the right-angle notch 112 is located at a diagonal position of a corner where the flexible substrate 11 and the effective display area 111 are aligned. Because the right-angle notch 112 is arranged, the flexible substrates 11 at the right-angle notch 112 are not overlapped in the assembling process of the micro display panel 10, so that the flatness of the assembled display panel 100 is ensured, and the display quality of the display panel is improved.
In addition, the right-angle notch 112 may be cut by laser cutting, and of course, the right-angle notch 112 may also be formed by other cutting methods. The forming manner of the right-angle notch 112 is not limited in the embodiment of the present application.
The micro display panel 10 further includes a source trace 15 and a drain trace 16, where the source trace 15 and the drain trace 16 are located on the flexible substrate 11 at the edge of the micro led chip.
It should be noted that the source trace 15 is disposed transversely along the flexible substrate 11, and the drain trace 16 is disposed vertically along the flexible substrate 11. In addition, the source trace 15 and the drain trace 16 are located on the flexible substrate 11 at the edge of the micro led chip. When the micro display panel 10 is assembled, the source traces 15 and the drain traces 16 may be hidden at the backlight side of the micro display panel 10. This is more beneficial for reducing the gap of the assembled display panel 100.
Wherein, the flatness between the solid crystal layer 12 and the flexible substrate 11 is less than 10 μm.
Note that the flatness between the solid crystal layer 12 and the flexible substrate 11 is set to be less than 10 μm. This can ensure the quality of the display panel.
The assembled display panel 100 of the embodiment of the application comprises a plurality of micro display panels 10 and a glass substrate 20, wherein the micro display panels 10 are tightly spliced and arranged on the glass substrate 20; the micro display panel 10 includes a flexible substrate 11, a die attach layer 12, a sealant layer 13, and a micro led chip 14; the flexible substrate 11 has a first surface 11a and a second surface 11b which are oppositely disposed, the first surface 11a has an effective display area 111, the solid crystal layer 12 is adhered to the first surface 11a of the flexible substrate 11 and corresponds to the effective display area 111, the sealant layer 13 is disposed on a surface of the solid crystal layer 12 away from the flexible substrate 11, the sealant layer 13 corresponds to the solid crystal layer 12, the micro light emitting diode chip 14 is disposed on a surface of the sealant layer 13 away from the solid crystal layer 12, and the micro light emitting diode chip 14 corresponds to the effective display area 111. The assembled display panel 100 in the embodiment of the present application can reduce the assembling gap of the assembled display panel 100.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a micro display panel according to an embodiment of the present disclosure. The embodiment of the present application further provides a manufacturing method for assembling a display panel, including:
201. the method comprises the steps of providing a flexible substrate, wherein the flexible substrate is provided with a first surface and a second surface which are oppositely arranged, and the first surface is provided with an effective display area.
Note that the Active Area (AA) refers to an operable Area on the display screen where text and graphics are displayed. In addition, the first surface may be an upper surface of the flexible substrate, and the second surface may be a lower surface of the flexible substrate. Of course, the first surface may be a lower surface of the flexible substrate, and the second surface may be an upper surface of the flexible substrate. In the embodiment of the present application, without specific description, the default is that the first surface is an upper surface of the flexible substrate, and the second surface is a lower surface of the flexible substrate.
202. And adhering a solid crystal layer on the first surface of the flexible substrate.
It should be noted that the die attach layer is formed on the flexible substrate by a die attach process, and the die attach process mainly fixes the micro light emitting diode chip on the flexible substrate.
203. And arranging the sealing adhesive layer on one surface of the solid crystal layer, which is far away from the flexible substrate.
It should be noted that the sealant layer is formed on the flexible substrate by a precision packaging process, and the sealant layer mainly seals the micro light emitting diode chip on the flexible substrate.
204. And a miniature light-emitting diode chip is arranged on one surface of the sealing adhesive layer, which is far away from the solid crystal layer, and corresponds to the effective display area to form a miniature display panel.
205. And stripping the solid crystal layer and the sealing adhesive layer at the edge of the effective display area by laser.
It should be noted that the solid crystal layer and the sealant layer at the edge of the active display area may also be peeled off by other methods. In the embodiment of the present application, the peeling manner of the die attach layer and the sealant layer at the edge of the active display area is not limited thereto.
206. And tightly splicing a plurality of the micro display panels and arranging the micro display panels on a glass substrate.
It should be noted that the micro display panel may include two, three, twenty, thirty, and so on. In the embodiment of the present application, the specific number of the micro display panels is not limited.
In addition, please refer to fig. 4, fig. 4 is a schematic view illustrating a manufacturing method scenario of the assembled display panel in the embodiment of the present application. The specific process is already described in the above embodiments, and will not be described herein.
Wherein, after the solid crystal layer and the sealant layer at the edge of the effective display area are processed by laser glass, the method comprises the following steps:
aligning one corner of the effective display area with one corner of the flexible substrate, wherein a right-angle notch is cut on the flexible substrate and is positioned at the diagonal position of the aligned corner of the flexible substrate and the effective display area.
It should be noted that a right-angle notch is formed in the flexible substrate, and the right-angle notch is located at a diagonal position of a corner where the flexible substrate and the effective display area are aligned. Because be provided with this right angle breach, consequently at the process that miniature display panel assembled, can not make the flexible substrate of right angle breach department overlap to guarantee to assemble display panel's levelness degree, thereby improve display panel's display quality.
In addition, in the embodiment of the application, a right-angle notch is cut on the flexible substrate by means of laser cutting.
Wherein, after the solid crystal layer and the sealant layer at the edge of the effective display area are stripped by laser:
and arranging a source electrode wire and a drain electrode wire on the flexible substrate at the edge of the effective display area.
It should be noted that the source trace is disposed transversely along the flexible substrate, and the drain trace is disposed vertically along the flexible substrate. In addition, the source electrode routing and the drain electrode routing are positioned on the flexible substrate at the edge of the micro light-emitting diode chip. When the micro display panel is assembled, the source wire and the drain wire can be hidden at the backlight side of the micro display panel. This is more beneficial to reduce the gap of the assembled display panel.
Wherein the flatness between the solid crystal layer and the flexible substrate is less than 10 μm.
Note that the flatness between the solid crystal layer and the flexible substrate is less than 10 μm. This can ensure the quality of the display panel.
In addition, please refer to fig. 5, fig. 5 is a schematic view illustrating a manufacturing scenario of the micro display panel according to an embodiment of the present disclosure. The specific process is already described in the above embodiments, and will not be described herein.
The assembled display panel and the manufacturing method of the assembled display panel provided by the embodiment of the application are described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. The assembled display panel is characterized by comprising a plurality of micro display panels and a glass substrate, wherein the micro display panels are tightly spliced and arranged on the glass substrate;
the micro display panel comprises a flexible substrate, a solid crystal layer, a sealing adhesive layer and a micro light-emitting diode chip; the flexible substrate is provided with a first surface and a second surface which are oppositely arranged, the first surface is provided with an effective display area, the solid crystal layer is pasted on the first surface of the flexible substrate and corresponds to the effective display area, the sealing adhesive layer is arranged on the surface, far away from the flexible substrate, of the solid crystal layer, the sealing adhesive layer corresponds to the solid crystal layer, the micro light-emitting diode chip is arranged on the surface, far away from the solid crystal layer, of the sealing adhesive layer, and the micro light-emitting diode chip corresponds to the effective display area.
2. The tiled display panel of claim 1, wherein the flexible substrate is rectangular and the active display area is also rectangular, wherein one of the corners of the active display area is aligned with one of the corners of the flexible substrate, and wherein the flexible substrate has a right angle notch located diagonally opposite the aligned corners of the flexible substrate and the active display area.
3. The assembled display panel of claim 1, wherein the micro display panel further comprises source and drain traces on the flexible substrate at the edge of the micro led chip.
4. The assembled display panel according to any one of claims 1 to 3, wherein the flatness between the solid crystal layer and the flexible substrate is less than 10 μm.
5. A manufacturing process method for assembling a display panel is characterized by comprising the following steps:
providing a flexible substrate, wherein the flexible substrate is provided with a first surface and a second surface which are oppositely arranged, and the first surface is provided with an effective display area;
sticking a crystal fixing layer on the first surface of the flexible substrate;
arranging a sealing adhesive layer on one surface of the solid crystal layer, which is far away from the flexible substrate;
a micro light-emitting diode chip is arranged on one surface of the sealing adhesive layer, which is far away from the solid crystal layer, and the micro light-emitting diode chip corresponds to the effective display area to form a micro display panel;
stripping the solid crystal layer and the sealing adhesive layer at the edge of the effective display area by laser;
and tightly splicing a plurality of the micro display panels and arranging the micro display panels on a glass substrate.
6. The manufacturing process of the assembled display panel according to claim 5, wherein after passing the solid crystal layer and the sealant layer at the edge of the active display area through laser glass, the method comprises:
aligning one corner of the effective display area with one corner of the flexible substrate, wherein a right-angle notch is cut on the flexible substrate and is positioned at the diagonal position of the aligned corner of the flexible substrate and the effective display area.
7. The manufacturing method of assembled display panel of claim 6, wherein said flexible substrate has a right-angle notch cut therein, comprising:
and cutting a right-angle notch on the flexible substrate in a laser cutting mode.
8. The manufacturing process of the assembled display panel according to claim 6, wherein after the die bonding layer and the sealant layer on the edge of the active display area are peeled off by laser:
and arranging a source electrode wire and a drain electrode wire on the flexible substrate at the edge of the effective display area.
9. The manufacturing process of assembled display panel according to claim 5, wherein the flatness between the solid crystal layer and the flexible substrate is less than 10 μm.
10. The manufacturing process method of an assembled display panel according to claim 5, wherein the surface of the sealant layer away from the die bonding layer is provided with a micro light emitting diode chip, comprising:
and arranging the micro light-emitting diode chip on the sealing adhesive layer in a die bonding process.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911035309.3A CN110827702A (en) | 2019-10-29 | 2019-10-29 | Assembled display panel and manufacturing process method of assembled display panel |
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| CN201911035309.3A CN110827702A (en) | 2019-10-29 | 2019-10-29 | Assembled display panel and manufacturing process method of assembled display panel |
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| CN111402755A (en) * | 2020-05-28 | 2020-07-10 | 上海天马微电子有限公司 | Display panel and display device |
| CN113112925A (en) * | 2021-04-16 | 2021-07-13 | 深圳市华星光电半导体显示技术有限公司 | Spliced display screen and manufacturing method thereof |
| WO2023000369A1 (en) * | 2021-07-22 | 2023-01-26 | 惠州华星光电显示有限公司 | Light-emitting diode panel and splicing panel |
| US12100700B2 (en) | 2021-07-22 | 2024-09-24 | Huizhou China Star Optoelectronics Display Co., Ltd. | Light-emitting diode panel and spliced panel |
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