CN218183582U - Printed circuit board and display device - Google Patents
Printed circuit board and display device Download PDFInfo
- Publication number
- CN218183582U CN218183582U CN202123439953.2U CN202123439953U CN218183582U CN 218183582 U CN218183582 U CN 218183582U CN 202123439953 U CN202123439953 U CN 202123439953U CN 218183582 U CN218183582 U CN 218183582U
- Authority
- CN
- China
- Prior art keywords
- component
- printed circuit
- circuit board
- area
- layout
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002344 surface layer Substances 0.000 claims description 29
- 239000010410 layer Substances 0.000 claims description 15
- 239000004973 liquid crystal related substance Substances 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 21
- 230000008569 process Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000010354 integration Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000013491 COF-202 Substances 0.000 description 3
- 239000013310 covalent-organic framework Substances 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The application discloses printed circuit board and display device. The printed circuit board comprises a first outer surface and a second outer surface which are opposite, at least one component layout area is arranged on the first outer surface, a plurality of pad areas are arranged in the component layout area, and position marks are arranged on the peripheral sides of the component layout area; the second outer surface is provided with at least one mark distribution area, the mark distribution area and the component distribution area are arranged correspondingly, and the mark distribution area is used for setting component marks corresponding to the component distribution area. The scheme of the application can increase the outer surface layout area of the printed circuit board, and can meet the identification requirements of components under the condition that the quantity of the components required to be welded by the printed circuit board is increased.
Description
Technical Field
The application relates to the technical field of liquid crystal display, in particular to a printed circuit board and a display device.
Background
With the development of display technology, flat panel display devices such as liquid crystal displays have advantages such as high image quality, power saving, thin body, and wide application range, and thus are widely used in various consumer electronics products such as mobile phones, televisions, personal digital assistants, digital cameras, notebook computers, and desktop computers, which are the mainstream of display devices.
Printed circuit boards are an important component of liquid crystal displays. The printed circuit board is composed of a board and components. Along with the increase of functions of the liquid crystal display, the performance requirement is improved, more and more components are required to be integrated on the printed circuit board, more and more component marks are required to be marked on the printed circuit board, the marking area of the printed circuit board is limited, and the component marks are not completely distributed under the condition that the size of the printed circuit board is small.
Content of application
For solving printed circuit board welded components and parts quantity increase, lead to the unable complete technical problem of sign of components and parts sign, this application embodiment provides a printed circuit board and display device.
The technical scheme of the embodiment of the application is realized as follows:
the embodiment of the application provides a printed circuit board, which comprises a first outer surface and a second outer surface which are opposite,
the first outer surface is provided with at least one component arrangement area, a plurality of pad areas are arranged in the component arrangement area, and position marks are arranged on the peripheral sides of the component arrangement area;
the second outer surface is provided with at least one mark distribution area, the mark distribution area and the component distribution area are arranged correspondingly, and the mark distribution area is used for setting component marks corresponding to the component distribution area.
In an embodiment, a setting position of the component layout region on the first outer surface is the same as a setting position of the mark layout region on the second outer surface.
In an embodiment, the size of the component layout area is the same as the size of the mark layout area.
In an embodiment, the printed circuit board comprises a first surface layer, at least one intermediate layer and a second surface layer, wherein the first surface layer comprises the first outer surface and the second surface layer comprises the second outer surface.
In an embodiment, the component layout region is located on an outer surface of the first surface layer, and the identifier layout region is located on an outer surface of the second surface layer.
In an embodiment, the first outer surface is used for bonding a flip chip.
In an embodiment, the position mark is arranged on the periphery of one pad area in the component layout area.
In an embodiment, the shape of the location indicator comprises a triangle, a circle, a square or a sector.
In an embodiment, the distance between the position identifier and the component layout area is within a preset range.
The embodiment of the application also provides a display device which comprises a liquid crystal panel and the printed circuit board.
The printed circuit board comprises a first outer surface and a second outer surface which are opposite, at least one component arrangement area is arranged on the first outer surface, a plurality of pad areas are arranged in the component arrangement area, and position marks are arranged on the peripheral sides of the component arrangement areas; the second outer surface is provided with at least one mark distribution area, the mark distribution area and the component distribution area are arranged correspondingly, and the mark distribution area is used for setting component marks corresponding to the component distribution area. The scheme provided by the application can increase the outer surface layout area of the printed circuit board, and can meet the identification requirement of components under the condition that the quantity of the components required to be welded by the printed circuit board is increased. In addition, the application is also beneficial to product technology protection.
Drawings
FIG. 1 is a schematic diagram of a layer structure of a printed circuit board in an exemplary technique;
FIG. 2 is a diagram illustrating a process for bonding printed circuit boards in an exemplary technique;
FIG. 3 is a schematic diagram of component identification of a printed circuit board in an exemplary technique;
fig. 4 is a schematic structural diagram of a first outer surface of a printed circuit board according to an embodiment of the present application.
Fig. 5 is a schematic structural diagram of a second outer surface of the printed circuit board according to the embodiment of the application.
Fig. 6 is a schematic structural diagram of a first outer surface of a printed circuit board according to another embodiment of the present application.
Fig. 7 is a schematic structural diagram of a second outer surface of a printed circuit board according to another embodiment of the present application.
Fig. 8 is a schematic process diagram of a layout method of a printed circuit board according to an embodiment of the present application.
The reference signs are:
101-exposed component part 102-first surface layer
103- -intermediate layer 104- -second skin layer
201-bonding device 202-chip on film
203- -printed circuit board 204- -machine
301- -component device integration region 1 302- -component device integration region 2
303-component device integration area 3 304-component device identification area 1
305-component identification area 2 306-component identification area 3
401-mark layout area 402-pad area
403-position identification 501-identification layout area
502-component identifier 601-identifier layout area
602- -pad area 603- -position identification
701-mark layout area 702-component mark
Detailed Description
In order to more clearly explain technical solutions in the embodiments or exemplary techniques of the present application, specific embodiments of the present application will be described below with reference to the accompanying drawings. It should be apparent that the drawings in the following description are merely examples of the present application, and that those skilled in the art will be able to derive other drawings and other embodiments from them without any inventive step.
For the sake of simplicity, only the parts relevant to the present application are schematically shown in the drawings, and they do not represent the actual structure as a product. Moreover, in order to make the drawings concise and understandable, components having the same structure or function in some of the figures are only schematically depicted, or only one of them is labeled. In this document, "one" means not only "only one" but also "a plurality of one".
Before the present application is described, the process of identifying a printed circuit board in an exemplary technique is described.
Referring to fig. 1, the printed circuit board may be multi-layered, and specifically includes a first surface layer 102, a middle layer 103, a second surface layer 104, and a component exposed portion 101 on the first surface layer 102. Components (including chips, resistors, capacitors, connectors, diodes, transistors, etc.) are exposed, and then placed on the first surface layer 102. In addition, when the printed circuit board needs to be bonded to glass through a chip on film (also called COF), referring to fig. 2, the printed circuit board 203 is placed on the Bonding stage 204, the COF202 is only connected to an outer surface of the printed circuit board 203, and the Bonding device (also called Bonding bar) 201 needs to press the COF202 to bond the COF202 to the printed circuit board 203, so that the other outer surface of the printed circuit board 203 (i.e. the other surface not in contact with the COF 202) cannot be provided with components in order to prevent the components from being damaged in the Bonding process. For the above reasons, the layer structure of the printed circuit board is shown in fig. 1, and the components are located on the top layer of the printed circuit board and partially exposed.
Based on the above layer structure, in the exemplary technology, as the size of the liquid crystal display panel in the liquid crystal display increases, more functions are required, and more components to be integrated on the printed circuit board are necessary. Referring to fig. 3, fig. 3 is a schematic representation of a printed circuit board identification in accordance with an exemplary technique. Where 301 is a component integration region 1, 302 is a component integration region 2, 303 is a component integration region 3, 304 is a corresponding component identification region 1, 305 is a corresponding component identification region 2, and 306 is a corresponding component identification region 3. Taking the C1 component as an example, 301 in fig. 3 represents the area that this component C1 needs to occupy on the printed circuit board. Reference numeral 304 in fig. 3 denotes an area on the printed circuit board corresponding to the reference numeral C1. Therefore, the marks correspond to the components one to one, and checking and inspection can be facilitated. However, as the number of components and the number of labels are increased, the labels of the components may not be completely arranged under the condition that the size of the printed circuit board is small.
The present application will be described in further detail with reference to the drawings and examples.
The first embodiment is as follows:
the embodiment of the application provides a printed circuit board, which comprises a first outer surface and a second outer surface which are opposite,
as shown in fig. 4, at least one component layout area 401 is disposed on the first outer surface, a plurality of pad areas 402 are disposed in the component layout area 401, and a position mark 403 is disposed on the periphery of the component layout area 401;
the component layout area 401 is used for determining a position area where components are located after the components are welded on the printed circuit board; the pad area 402 is used to determine a soldering area for soldering a pin of a component on the printed circuit board, and the position identifier 403 is used to identify a positional relationship of the component soldered in the component layout area 401.
As shown in fig. 5, at least one identifier layout region 501 is disposed on the second outer surface, the identifier layout region 501 and the component layout region 401 are disposed correspondingly, and the identifier layout region 501 is configured to set a component identifier 502 corresponding to the component layout region 401.
Optionally, the setting position of the component layout region 401 on the first outer surface is the same as the setting position of the identifier layout region 501 on the second outer surface.
The identifier layout area 501 and the component layout area 401 are correspondingly arranged, so that the integrated position and the identifier of the component can be clearly identified.
Optionally, the size of the component layout region 401 is the same as that of the identifier layout region 501.
Optionally, the printed circuit board comprises a first surface layer, at least one intermediate layer, and a second surface layer, wherein the first surface layer comprises the first outer surface and the second surface layer comprises the second outer surface.
Optionally, the component layout region 401 is located on an outer surface of the first surface layer, and the identifier layout region 501 is located on an outer surface of the second surface layer.
Optionally, the first outer surface is used for bonding a chip on film.
Because the integrated area of the component is positioned on the first outer surface, the first outer surface can be used for binding the chip on film, and the component is prevented from being damaged in the binding process.
Optionally, the position identifier 403 is disposed on a periphery of one pad region 402 in the component layout region 401. A better representation of the location of the pad area 402 within the component placement area 401 can be achieved.
Optionally, the shape of the position marker 403 includes a triangle, a circle, a square or a fan. Of course, the position mark 403 may be provided in other shapes.
Optionally, the distance between the position identifier 403 and the component layout area 401 is within a preset range. For example 5 cm.
This embodiment sets up components and parts and sign respectively in two different surfaces, forms two-layer overall arrangement, can increase the usable area of printed circuit board overall arrangement under the fixed condition of printed circuit board size.
Example two:
embodiments of the present application also provide a printed circuit board, the printed circuit board including opposing first and second outer surfaces,
as shown in fig. 6, 2 component layout areas 601 are disposed on the first outer surface, a plurality of pad areas 602 are disposed in the component layout areas 601, and a position identifier 603 is disposed on the periphery of each component layout area 601;
the component layout area 601 is used for determining a position area where components are located after the components are welded on the printed circuit board; the pad area 602 is configured to determine a soldering area for soldering a pin of a component on the printed circuit board, and the position identifier 603 is configured to identify a positional relationship of the component soldered in the component layout area 601.
As shown in fig. 7, 2 identifier layout regions 701 are disposed on the second outer surface, the identifier layout regions 701 and the component layout regions 601 are disposed correspondingly, and the identifier layout regions 701 are used to set component identifiers 702 corresponding to the component layout regions 601.
Optionally, the position of the component layout region 601 on the first outer surface is the same as the position of the identifier layout region 701 on the second outer surface.
The identifier layout area 701 and the component layout area 601 are correspondingly arranged, so that the integration position and the identifier of the component can be clearly identified.
Optionally, the size of the component layout region 601 is the same as that of the mark layout region 701.
Optionally, the printed circuit board comprises a first surface layer, at least one intermediate layer and a second surface layer, wherein the first surface layer comprises the first outer surface and the second surface layer comprises the second outer surface.
Optionally, the component layout region 601 is located on the outer surface of the first surface layer, and the identifier layout region 701 is located on the outer surface of the second surface layer.
Optionally, the first outer surface is used for bonding a chip on film.
Because the integrated area of the component is positioned on the first outer surface, the first outer surface can be used for binding the chip on film, and the damage of the component in the binding process is prevented.
Optionally, the position mark 603 is disposed on a periphery of one of the pad regions 602 in the component layout region 601. It is possible to achieve better representation of the position of the pad section 602 within the component layout area 601.
Optionally, the shape of the position marker 603 includes a triangle, a circle, a square or a sector. Of course, the position mark 603 may be provided in other shapes in addition to the above.
Optionally, the distance between the position mark 603 and the component layout area 601 is within a preset range. For example 5 cm.
This embodiment sets up components and parts and sign respectively in two different surfaces, forms two-layer overall arrangement, can increase the usable area of printed circuit board overall arrangement under the fixed condition of printed circuit board size.
Example three:
based on the structure of the printed circuit board, an embodiment of the present application provides a layout method of a printed circuit board, as shown in fig. 8, the method includes:
step 801: setting a first component outline dimension area on a first outer surface of the printed circuit board according to the dimension of a component to be welded on the printed circuit board;
step 802: setting a corresponding pad area in the first component outline size area based on the number and the position of the pins of the component;
step 803: determining the position of the position mark on the printed circuit board according to the welding direction of the component on the printed circuit board;
step 804: and arranging a second component overall dimension area corresponding to the first component overall dimension area on the second outer surface of the printed circuit board, and identifying the component identification of the component welded in the first component overall dimension area in the second component overall dimension area.
The first outer surface and the second outer surface in this embodiment may be outer surfaces on opposite sides of the printed circuit board, for example, when the printed circuit board is multi-layered, the first outer surface may be an upper surface of the top layer and the second outer surface may be a lower surface of the bottom layer.
The printed circuit board comprises a first outer surface and a second outer surface which are opposite, at least one component arrangement area is arranged on the first outer surface, a plurality of pad areas are arranged in the component arrangement area, and position marks are arranged on the peripheral sides of the component arrangement area; the second outer surface is provided with at least one mark distribution area, the mark distribution area and the component distribution area are arranged correspondingly, and the mark distribution area is used for setting component marks corresponding to the component distribution area. The scheme provided by the application can increase the outer surface layout area of the printed circuit board, and can meet the identification requirement of components under the condition that the quantity of the components required to be welded by the printed circuit board is increased. In addition, this application still is favorable to product technology protection.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (8)
1. A printed circuit board comprising opposing first and second outer surfaces, wherein:
the first outer surface is provided with at least one component arrangement area, a plurality of pad areas are arranged in the component arrangement area, and position marks are arranged on the periphery of the component arrangement area;
the second outer surface is provided with at least one mark layout area, the mark layout area and the component layout area are correspondingly arranged, and the mark layout area is used for setting component marks corresponding to the component layout area;
the printed circuit board comprises a first surface layer, at least one intermediate layer and a second surface layer, wherein the first surface layer comprises the first outer surface and the second surface layer comprises the second outer surface; the component layout area is located on the outer surface of the first surface layer, and the mark layout area is located on the outer surface of the second surface layer.
2. The printed circuit board according to claim 1, wherein a position where the component layout region is provided on the first outer surface is the same as a position where the identification layout region is provided on the second outer surface.
3. The printed circuit board of claim 1, wherein the component layout region has the same size as the identification layout region.
4. The printed circuit board of claim 1, wherein the first outer surface is used for bonding a flip chip.
5. The printed circuit board of claim 1, wherein the position mark is disposed on a periphery of one of the pad regions in the component layout region.
6. The printed circuit board of claim 1, wherein the shape of the position indicator comprises a triangle, a circle, a square, or a sector.
7. The printed circuit board of claim 1, wherein the distance between the position mark and the component layout area is within a preset range.
8. A display device comprising a liquid crystal panel and the printed circuit board of any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123439953.2U CN218183582U (en) | 2021-12-31 | 2021-12-31 | Printed circuit board and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123439953.2U CN218183582U (en) | 2021-12-31 | 2021-12-31 | Printed circuit board and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218183582U true CN218183582U (en) | 2022-12-30 |
Family
ID=84605824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123439953.2U Active CN218183582U (en) | 2021-12-31 | 2021-12-31 | Printed circuit board and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218183582U (en) |
-
2021
- 2021-12-31 CN CN202123439953.2U patent/CN218183582U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7763986B2 (en) | Semiconductor chip, film substrate, and related semiconductor chip package | |
| US6744638B2 (en) | Construction and method for interconnecting flexible printed circuit and wiring board, liquid crystal display device, and method for manufacturing the same | |
| CN109068478B (en) | Flexible circuit board and display device | |
| CN100461984C (en) | Circuit assembling structure | |
| US20040159930A1 (en) | Semiconductor device, method of manufacturing the same, and electronic device using the semiconductor device | |
| US20230301150A1 (en) | Display device | |
| CN111508399A (en) | Display panel and display device | |
| CN218183582U (en) | Printed circuit board and display device | |
| US20030227593A1 (en) | Liquid crystal display device and manufacturing method of liquid crystal display device | |
| CN101309550B (en) | Circuit board and electronic device applying the same | |
| CN113301713A (en) | Printed circuit board, flexible circuit board, display panel and manufacturing method | |
| JP5414551B2 (en) | Labeling method and electronic device | |
| US10032708B2 (en) | Circuit board and smart card module and smart card utilizing the same | |
| CN108828856B (en) | Array substrate and display panel | |
| CN207909880U (en) | Display panel | |
| CN111668257A (en) | Display device | |
| EP4202893A1 (en) | Display substrate and display device | |
| CN217709296U (en) | Copper foil composite assembly structure | |
| US11947227B2 (en) | Display device | |
| CN101290406A (en) | Line and liquid crystal display panel applying same | |
| KR20110004117A (en) | Cof package and test method thereof | |
| US7515238B2 (en) | Electronic bonding structure with separately distributed anisotropic conductive film units and liquid crystal panel having same | |
| US6458608B1 (en) | Alignment check method on printed circuit board | |
| CN217061304U (en) | TFT glass, display module assembly and electronic equipment | |
| CN105607353A (en) | Liquid crystal panel, display and terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |