CN202455651U - Double-sided flexible circuit board adopting wave soldering - Google Patents
Double-sided flexible circuit board adopting wave soldering Download PDFInfo
- Publication number
- CN202455651U CN202455651U CN2012200338828U CN201220033882U CN202455651U CN 202455651 U CN202455651 U CN 202455651U CN 2012200338828 U CN2012200338828 U CN 2012200338828U CN 201220033882 U CN201220033882 U CN 201220033882U CN 202455651 U CN202455651 U CN 202455651U
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- Prior art keywords
- copper foil
- foil layer
- rete
- layer
- double
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Abstract
The utility model discloses a double-sided flexible circuit board adopting wave soldering, which comprises an insulation base material layer, a first copper foil layer and a second copper foil layer which are respectively distributed at the upper surface and the lower surface of the insulation base material layer, a first cover film layer which covers the upper surface of the first copper foil layer and a second cover film layer which covers the lower surface of the second copper foil layer, wherein a plurality of through component jacks are arranged between the first copper foil layer and the second copper foil layer, pads are respectively arranged on the first copper foil layer and the second copper foil layer which are adjacent to all the components jacks, all the pads on the first copper foil layer are separated by the first cover film layer, all the pads on the second copper foil layer are separated by the second cover film layer, and a strengthening layer is arranged below the second cover film layer at the edges of all the pads on the second copper foil layer; and the pads are preferentially in a ring form. Continuous soldering cannot be generated among all the pads, and the product yield is beneficial to improvement.
Description
Technical field
The utility model relates to flexible PCB manufacturing technology field, especially a kind of double-sided flex circuit plate that adopts the crest welding.
Background technology
Wave-soldering is meant the solder (terne metal) with fusing; Become the solder wave of designing requirement through electrodynamic pump or electromagnetic pump jet flow; Also can be through forming to the solder pot nitrogen injection; Make the circuit board that components and parts are housed in advance through solder wave, realize machinery and the solder that is electrically connected between components and parts weldering end or pin and the board pads.Wave-soldering is because the efficient height has been widely used in the components and parts welding on various PCB and the FPC circuit board; Existing known double-sided flex circuit plate such as the accompanying drawing 1 that is used for the crest welding, it forms a plurality of pad 2a at copper foil layer 1a place, and the centre of each pad 2a is components and parts jack 3a; Between each pad 2a separator is not set; Because the components and parts jack 3a of most double-sided flex circuit plates arranges than comparatively dense, make between each pad 2a relatively near, make easily when therefore adopting the crest welding to occur connecting weldering between each pad 2a; Cause the product electrical property to lose efficacy, influence yield of products.
The utility model content
The technical problem that the utility model will solve provides a kind of double-sided flex circuit plate that adopts the crest welding, can not occur between each pad connecting weldering, helps improving yield of products.
For achieving the above object; The technical scheme of the utility model is: a kind of double-sided flex circuit plate that adopts the crest welding; Comprise insulated base material layer, be distributed in above the insulated base material layer and the first following copper foil layer and second copper foil layer, cover first above first copper foil layer and cover rete and cover second below second copper foil layer and cover rete; Be provided with a plurality of components and parts jacks that run through between first copper foil layer and second copper foil layer; Be provided with pad with second copper foil layer on first copper foil layer on each components and parts jack side; It is isolated that each pad on first copper foil layer covers rete through first, and it is isolated that each pad on second copper foil layer covers rete through second, and second of each the pad limit on second copper foil layer covers and is provided with strengthening course below the rete.
Preferred described pad is an annular.
Preferred described strengthening course is by the PI material layer and stick to second hot-setting adhesive that cover between rete and the PI material layer and constitute.
Preferred as another kind, described strengthening course is by the FR4 material layer and stick to second hot-setting adhesive that cover between rete and the FR4 material layer and constitute.
It is the PI material layer that the described first covering rete and second covers rete.
The utility model is because each pad on first copper foil layer is isolated through the first covering rete; It is isolated that each pad on second copper foil layer covers rete through second; When after the double-sided flex circuit plate is inserted good components and parts, delivering to crest welder like this and carrying out the crest welding, cover the buffer action that rete and second covers rete because of first, just can not occur connecting between each pad welding; Guarantee the electrical property of product, help improving yield of products.
Description of drawings
Fig. 1 is a kind of double-sided flex circuit plate partial top view of known employing crest welding;
Fig. 2 is the utility model vertical view;
Fig. 3 is the A place enlarged drawing of Fig. 2;
Fig. 4 is the utility model upward view;
Fig. 5 is the B place enlarged drawing of Fig. 4;
Fig. 6 is the C-C cutaway view Amplified image of Fig. 5.
Embodiment
Below in conjunction with accompanying drawing and concrete execution mode the utility model is done further explain.
Fig. 2 is to shown in Figure 6; A kind of double-sided flex circuit plate that adopts the crest welding; Comprise insulated base material layer 1, be distributed in above the insulated base material layer 1 and the first following copper foil layer 2 and second copper foil layer 3, cover first above first copper foil layer 2 and cover rete 4 and cover second below second copper foil layer 3 and cover rete 5; Be provided with a plurality of components and parts jacks 6 that run through between first copper foil layer 2 and second copper foil layer 3; Be provided with pad 7 with second copper foil layer 3 on first copper foil layer 2 on each components and parts jack 6 side; It is isolated that each pad 7 on first copper foil layer 2 covers rete 4 through first, and it is isolated that each pad 7 on second copper foil layer 3 covers rete 5 through second, and second of each pad 7 limit on second copper foil layer 3 cover and are provided with strengthening course 8 below the rete 5.
Described each pad 7 is an annular; The pad 7 of annular can form like this; Earlier between first copper foil layer 2 and second copper foil layer 3, get out components and parts jack 6; Then behind heavy copper facing and etching work procedure; Covering rete 5 at the first covering rete 4 and second adopts the method for jumping hole drill to get out than the bigger through hole of components and parts jack 6 diameters with components and parts jack 6 opposite positions; Then again first cover rete 4 and second cover rete 5 cover respectively on first copper foil layer 2 with second copper foil layer 3 on and make the through hole on the first covering rete 4 and the second covering rete 5 corresponding with components and parts jack 6; A plurality of like this annular pads 7 just on first copper foil layer 2 with second copper foil layer 3 on form and first copper foil layer 2 on each pad 7 to cover rete 4 through first isolated, it is isolated that each pad 7 on second copper foil layer 3 covers rete 5 through second.
Preferred described strengthening course 8 is by PI material layer 81 and stick to second hot-setting adhesive 82 that cover between rete 5 and the PI material layer 81 and constitute.
Preferred as another kind, described strengthening course 8 also can be made up of FR4 material layer 81 and the hot-setting adhesive 82 that sticks between the second covering rete 5 and the FR4 material layer 81.
The described first covering rete 4 and second covers rete 5 and can select the PI material layer for use.
Below only be preferred embodiment of the utility model, the change that those skilled in the art does to be equal to by claim all falls into the protection range of this case.
Claims (5)
1. double-sided flex circuit plate that adopts crest welding; Comprise insulated base material layer, be distributed in above the insulated base material layer and the first following copper foil layer and second copper foil layer, cover first above first copper foil layer and cover rete and cover second below second copper foil layer and cover rete; It is characterized in that: be provided with a plurality of components and parts jacks that run through between first copper foil layer and second copper foil layer; Be provided with pad with second copper foil layer on first copper foil layer on each components and parts jack side; It is isolated that each pad on first copper foil layer covers rete through first; It is isolated that each pad on second copper foil layer covers rete through second, and second of each the pad limit on second copper foil layer covers and is provided with strengthening course below the rete.
2. a kind of double-sided flex circuit plate that adopts the crest welding according to claim 1, it is characterized in that: described pad is an annular.
3. a kind of double-sided flex circuit plate that adopts crest welding according to claim 1 is characterized in that: described strengthening course is by the PI material layer and stick to second hot-setting adhesive that cover between rete and the PI material layer and constitute.
4. a kind of double-sided flex circuit plate that adopts crest welding according to claim 1 is characterized in that: described strengthening course is by the FR4 material layer and stick to second hot-setting adhesive that cover between rete and the FR4 material layer and constitute.
5. according to each described a kind of double-sided flex circuit plate that adopts the crest welding of claim 1 to 4, it is characterized in that: it is the PI material layer that the described first covering rete and second covers rete.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200338828U CN202455651U (en) | 2012-02-03 | 2012-02-03 | Double-sided flexible circuit board adopting wave soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200338828U CN202455651U (en) | 2012-02-03 | 2012-02-03 | Double-sided flexible circuit board adopting wave soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202455651U true CN202455651U (en) | 2012-09-26 |
Family
ID=46871469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200338828U Expired - Lifetime CN202455651U (en) | 2012-02-03 | 2012-02-03 | Double-sided flexible circuit board adopting wave soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202455651U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902678A (en) * | 2014-03-07 | 2015-09-09 | 富葵精密组件(深圳)有限公司 | Flexible printed circuit board and manufacturing method for the same |
| CN105430896A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| CN108040422A (en) * | 2018-01-05 | 2018-05-15 | 深圳市合利来科技有限公司 | A kind of fine definition PCB circuit board |
-
2012
- 2012-02-03 CN CN2012200338828U patent/CN202455651U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902678A (en) * | 2014-03-07 | 2015-09-09 | 富葵精密组件(深圳)有限公司 | Flexible printed circuit board and manufacturing method for the same |
| CN104902678B (en) * | 2014-03-07 | 2018-02-02 | 鹏鼎控股(深圳)股份有限公司 | Flexible printed circuit board and preparation method thereof |
| CN105430896A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| WO2017113797A1 (en) * | 2015-12-29 | 2017-07-06 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| CN105430896B (en) * | 2015-12-29 | 2018-06-29 | 广东欧珀移动通信有限公司 | Flexible PCB and mobile terminal |
| CN108040422A (en) * | 2018-01-05 | 2018-05-15 | 深圳市合利来科技有限公司 | A kind of fine definition PCB circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120926 |