TWI550457B - Touch panel and touch control module - Google Patents
Touch panel and touch control module Download PDFInfo
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- TWI550457B TWI550457B TW103126542A TW103126542A TWI550457B TW I550457 B TWI550457 B TW I550457B TW 103126542 A TW103126542 A TW 103126542A TW 103126542 A TW103126542 A TW 103126542A TW I550457 B TWI550457 B TW I550457B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Description
本發明是關於一種觸控面板及觸控模組,特別是指一種有助於與軟性電路板接合的觸控面板及觸控模組。 The present invention relates to a touch panel and a touch module, and more particularly to a touch panel and a touch module that facilitate bonding with a flexible circuit board.
一般觸控面板是通過軟性電路板來與控制器進行信號傳遞及溝通。在架構上,觸控面板與軟性電路板之間是通過導電膠來進行貼合,換言之,觸控面板及軟性電路板是藉由導電膠來達到彼此電性連接及固定的效果。 Generally, the touch panel transmits and communicates with the controller through a flexible circuit board. In the architecture, the touch panel and the flexible circuit board are bonded together by a conductive adhesive. In other words, the touch panel and the flexible circuit board are electrically connected and fixed to each other by the conductive adhesive.
然而,由於導電膠對觸控面板的基板的黏著性相較於對軟性電路板而言較差,因此在觸控面板與軟性電路板之間,觸控面板相對容易受到外力(如:組裝生產時的整線拉扯、組裝完成後的信賴性測試等)的影響而與導電膠發生至少部分剝離的現象,進而與軟性電路板形成電路斷路,降低了產品生產良率。 However, since the adhesion of the conductive adhesive to the substrate of the touch panel is inferior to that of the flexible circuit board, the touch panel is relatively susceptible to external force between the touch panel and the flexible circuit board (eg, during assembly and production). The phenomenon of at least partial peeling of the conductive paste due to the influence of the whole line pulling and the reliability test after the assembly is completed, and further breaking the circuit with the flexible circuit board, thereby reducing the production yield of the product.
有鑑於此,本發明在觸控面板用來與軟性電路板貼合的區域中進行結構性的改良,讓觸控面板通過導電膠來與軟性電路板貼合時,觸控面板與導電膠之間具有較佳的附著力。 In view of the above, the invention is structurally improved in a region where the touch panel is used for bonding with the flexible circuit board, and the touch panel and the conductive adhesive are used when the touch panel is bonded to the flexible circuit board through the conductive adhesive. It has better adhesion between the two.
本發明提供一種觸控面板,包括:一基板,其中 該基板的一表面被定義一接合區,並且該基板在該接合區是通過一導電膠來與一軟性電路板貼合;複數個接合端子,形成於該基板之表面並位於該接合區;及複數個輔助墊,形成於該基板之表面並位於該接合區,其中至少部分的該些輔助墊是與該些接合端子形成交互間隔排列。 The present invention provides a touch panel comprising: a substrate, wherein a surface of the substrate is defined as a bonding region, and the substrate is bonded to a flexible circuit board through a conductive adhesive in the bonding region; a plurality of bonding terminals are formed on the surface of the substrate and located in the bonding region; A plurality of auxiliary pads are formed on the surface of the substrate and located in the bonding region, wherein at least a portion of the auxiliary pads are alternately spaced from the bonding terminals.
本發明更提供一種觸控模組,包括:一軟性電路板;以及一觸控面板,電性連接該軟性電路板,並且該觸控面板包含:一基板,其中該基板的一表面被定義一接合區,並且該基板在該接合區是通過一導電膠來與該軟性電路板貼合;複數個接合端子,形成於該基板之表面並位於該接合區;及複數個輔助墊,形成於該基板之表面並位於該接合區,其中至少部分的該些輔助墊是與該些接合端子形成交互間隔排列。 The present invention further provides a touch module comprising: a flexible circuit board; and a touch panel electrically connected to the flexible circuit board, and the touch panel comprises: a substrate, wherein a surface of the substrate is defined a bonding area, and the substrate is bonded to the flexible circuit board through a conductive adhesive in the bonding region; a plurality of bonding terminals are formed on the surface of the substrate and located in the bonding region; and a plurality of auxiliary pads are formed on the bonding pad The surface of the substrate is located in the joint region, and at least a portion of the auxiliary pads are arranged at an interval from the joint terminals.
藉此,本發明提供的觸控面板及觸控模組通過結構上的設計,有效地改善觸控面板與導電膠之間的結合強度,降低了觸控面板與軟性電路板產生電路斷路的風險,進而提高了觸控模組的生產良率,讓觸控模組具有良好的產品穩定性及品質。 Therefore, the touch panel and the touch module provided by the present invention effectively improve the bonding strength between the touch panel and the conductive adhesive through the structural design, and reduce the risk of circuit breaking of the touch panel and the flexible circuit board. In turn, the production yield of the touch module is improved, and the touch module has good product stability and quality.
1‧‧‧觸控模組 1‧‧‧Touch Module
10‧‧‧觸控面板 10‧‧‧Touch panel
11‧‧‧基板 11‧‧‧Substrate
12‧‧‧電極層 12‧‧‧electrode layer
13‧‧‧接合端子 13‧‧‧Join terminal
14‧‧‧輔助墊 14‧‧‧Auxiliary pads
15‧‧‧導線 15‧‧‧Wire
20‧‧‧軟性電路板 20‧‧‧Soft circuit board
21‧‧‧導電端子 21‧‧‧Electrical terminals
30‧‧‧導電膠 30‧‧‧ conductive adhesive
A‧‧‧接合區 A‧‧‧ junction area
第1圖係表示本發明一實施例之觸控模組的局部上視示意圖。 FIG. 1 is a partial top view showing a touch module according to an embodiment of the present invention.
第2圖係表示沿第1圖中的x-x剖面線的剖視示意圖。 Fig. 2 is a schematic cross-sectional view taken along the line x-x in Fig. 1.
第3圖係表示本發明另一實施例之觸控模組的剖視示意圖。 3 is a cross-sectional view showing a touch module according to another embodiment of the present invention.
在以下所說明的本發明的各種實施例中,所稱的方位“上”及“下”,僅是用來表示相對的位置關係,並非用來限制本發明。 In the various embodiments of the invention described below, the terms "upper" and "lower" are used to denote the relative positional relationship and are not intended to limit the invention.
請同時參閱第1圖及第2圖,分別繪示出本發明一實施例之觸控模組的局部上視示意圖及沿第1圖中的x-x剖面線的剖視示意圖。如圖所示,本實施例之觸控模組1包括彼此電性連接的一觸控面板10與一軟性電路板(Flexible Printed Circuit,FPC)20。其中,觸控面板10包括一基板11、一電極層12、複數個接合端子(Bonding Pad)13及複數個輔助墊(Auxiliary Pad)14。 Referring to FIG. 1 and FIG. 2, a partial top view of a touch module according to an embodiment of the present invention and a cross-sectional view along the x-x cross-sectional line in FIG. 1 are respectively illustrated. As shown in the figure, the touch module 1 of the present embodiment includes a touch panel 10 and a Flexible Printed Circuit (FPC) 20 electrically connected to each other. The touch panel 10 includes a substrate 11 , an electrode layer 12 , a plurality of bonding pads 13 , and a plurality of auxiliary pads 14 .
基板11的一表面被定義有一接合區A,並且基板11在所述接合區A上是通過一導電膠30來與軟性電路板20貼合。電極層12可例如是經一圖案化製程而形成於基板11上的透明導電層,用來實現觸控面板10的觸控感測之用。接合端子13是形成於基板11之表面並位於所述接合區A內,在設計上,接合端子13可例如是通過一導線15來與電極層12進行電性連接,並且通過導電膠30來電性連接軟性電路板20。輔助墊14是形成於基板11之表面並位於所述接合區A內,具體來講,本實施例的輔助墊14是與接合端子13形成在基板11的相同表面,並且至少部分的輔助墊14是與接合端子13形成交互間隔排列。 A surface of the substrate 11 is defined with a bonding area A, and the substrate 11 is bonded to the flexible circuit board 20 through a conductive paste 30 on the bonding area A. The electrode layer 12 can be, for example, a transparent conductive layer formed on the substrate 11 through a patterning process for performing touch sensing of the touch panel 10. The bonding terminal 13 is formed on the surface of the substrate 11 and located in the bonding area A. In the design, the bonding terminal 13 can be electrically connected to the electrode layer 12 through a wire 15, for example, and is electrically conductive through the conductive adhesive 30. The flexible circuit board 20 is connected. The auxiliary pad 14 is formed on the surface of the substrate 11 and located in the land A. Specifically, the auxiliary pad 14 of the present embodiment is formed on the same surface of the substrate 11 as the bonding terminal 13, and at least a portion of the auxiliary pad 14 It is arranged in an alternating interval with the bonding terminals 13.
值得一提的是,本實施例的輔助墊14在設計上可以採用導電或非導電材質,具體材質只要是能讓導電膠30對所採用之材質的黏著性相較於對基板11之材質的黏著性來得更佳即可。舉例而言,輔助墊14可以採用與接合端子13相同的材 料,如:銀、銅等導電金屬,或者也可以採用與電極層12相同的材料,如氧化銦錫(Indium Tin Oxide,ITO)等導電材料。具體的實驗數據中,當輔助墊14之材料為氧化銦錫時,觸控面板10與軟性電路板20之間的平均拉力為1.43牛頓,而在其餘條件相同、僅除去輔助墊14的情況下,觸控面板10與軟性電路板20之間的平均拉力下降為0.23牛頓。當然,若輔助墊14實際是採用導電材質來設計的話,本領域技術人員可以了解,間隔設置的接合端子13及輔助墊14之間會設計間隔一安全距離,避免接合端子13及輔助墊14之間發生電容耦合效應,然而實際安全距離並非為本發明所限制,實際是考量接合區A的大小、接合端子13的數量、尺寸以及輔助墊14與接合端子13的材料等因素來調整。 It is worth mentioning that the auxiliary pad 14 of the embodiment can be designed to be made of a conductive or non-conductive material. The specific material is as long as the adhesive of the conductive adhesive 30 to the material used is compared with the material of the substrate 11. Adhesiveness is better. For example, the auxiliary pad 14 may be the same material as the bonding terminal 13 For example, a conductive metal such as silver or copper, or the same material as the electrode layer 12, such as a conductive material such as Indium Tin Oxide (ITO). In the specific experimental data, when the material of the auxiliary pad 14 is indium tin oxide, the average tensile force between the touch panel 10 and the flexible circuit board 20 is 1.43 Newtons, and in the case where the remaining conditions are the same, only the auxiliary pad 14 is removed. The average tensile force between the touch panel 10 and the flexible circuit board 20 is reduced to 0.23 Newtons. Of course, if the auxiliary pad 14 is actually designed with a conductive material, those skilled in the art can understand that the spacing between the connecting terminal 13 and the auxiliary pad 14 is designed to be a safe distance, and the bonding terminal 13 and the auxiliary pad 14 are avoided. The capacitive coupling effect occurs, however, the actual safety distance is not limited by the present invention, and is actually adjusted in consideration of factors such as the size of the land A, the number and size of the joint terminals 13, and the material of the auxiliary pad 14 and the joint terminal 13.
此外,由於輔助墊14可以採用與接合端子13或電極層12相同的材料,因此本實施例的輔助墊14在製程上可以與接合端子13或電極層12在同一製程上形成,不會增加整個觸控模組1的製程步驟。再者,本領域技術人員可以了解,一般在觸控面板10的接合端子13或電極層12的製程中,通常是先利用靶材來濺鍍沈積成一整片膜層之後,再通過蝕刻來去除不需要的區域,最後用留下來的區域來實現所需的功能,因此本實施例通過增加與接合端子13或電極層12相同材料的輔助墊14之設計更能減少蝕刻去除的區域,有效地減少材料的浪費。 In addition, since the auxiliary pad 14 can be made of the same material as the bonding terminal 13 or the electrode layer 12, the auxiliary pad 14 of the present embodiment can be formed on the same process as the bonding terminal 13 or the electrode layer 12 in the process, without increasing the entire process. Process steps of the touch module 1. Moreover, those skilled in the art can understand that generally, in the process of the bonding terminal 13 or the electrode layer 12 of the touch panel 10, a target film is usually used for sputtering deposition to form a whole film layer, and then removed by etching. The unnecessary area, and finally the remaining area is used to achieve the desired function, so the present embodiment can reduce the area of the etching removal by increasing the design of the auxiliary pad 14 of the same material as the bonding terminal 13 or the electrode layer 12, effectively Reduce material waste.
承上所述之觸控模組1的架構,本實施例的觸控面板10在通過導電膠30與軟性電路板20貼合完成之後,接合端子13及輔助墊14是位於基板11及導電膠30之間,換言之,此一架 構可以減少基板11直接接觸導電膠30的面積。如此一來,由於本實施例的輔助墊14之材質相較於基板11之材質而言對導電膠30具有更佳的黏著性,因此當受到外力作用時,可以減少觸控面板10與導電膠30發生剝離的機會,進而穩定地維持觸控面板10與軟性電路板20之間的電路連線。 After the touch panel 10 of the present embodiment is bonded to the flexible circuit board 20 through the conductive adhesive 30, the bonding terminal 13 and the auxiliary pad 14 are located on the substrate 11 and the conductive adhesive. Between 30, in other words, this one The structure can reduce the area in which the substrate 11 directly contacts the conductive paste 30. In this way, since the material of the auxiliary pad 14 of the embodiment has better adhesion to the conductive adhesive 30 than the material of the substrate 11, the touch panel 10 and the conductive adhesive can be reduced when subjected to an external force. The chance of peeling occurs 30, and the circuit connection between the touch panel 10 and the flexible circuit board 20 is stably maintained.
在前述的輔助墊14的設計架構基礎下,在另一實施例中,更可設計更多的輔助墊14於基板11之表面並位於接合區A內,讓這些額外設計的輔助墊14在不影響觸控面板10及軟性電路板20之間的電路連線下,採取規則或不規則的方式來設置於接合區A中接合端子13和原本的輔助墊14以外的區域,藉以更加減少基板11直接接觸導電膠30的面積,更加提升導電膠30與觸控面板10之間的結合強度。 Based on the foregoing design structure of the auxiliary pad 14, in another embodiment, more auxiliary pads 14 can be designed on the surface of the substrate 11 and located in the bonding area A, so that the additional designed auxiliary pads 14 are not Under the circuit connection between the touch panel 10 and the flexible circuit board 20, a region other than the bonding terminal 13 and the original auxiliary pad 14 in the bonding area A is disposed in a regular or irregular manner, thereby further reducing the substrate 11 The area of the conductive adhesive 30 is directly contacted, and the bonding strength between the conductive adhesive 30 and the touch panel 10 is further improved.
進一步說明的是,軟性電路板20包含複數個導電端子21,當軟性電路板20通過導電膠30來與觸控面板10貼合時,導電端子21即可通過導電膠30來對應電性連接觸控面板10的接合端子13。其中,由於在實際應用上,導電膠30通常是以整面佈設的方式來設置於觸控面板10及軟性電路板20之間,因此本實施例所使用的導電膠30是具有異方性導電材料的膠體,讓觸控面板10上交互間隔排列的接合端子13及導電的輔助墊14之間不會相互導通而電性短路,且讓軟性電路板20的導電端子21之間也不會相互導通而電性短路。 It is further noted that the flexible circuit board 20 includes a plurality of conductive terminals 21. When the flexible circuit board 20 is bonded to the touch panel 10 through the conductive adhesive 30, the conductive terminals 21 can be electrically connected through the conductive adhesive 30. The joint terminal 13 of the control panel 10 is provided. The conductive adhesive 30 used in this embodiment is anisotropically conductive because the conductive adhesive 30 is disposed between the touch panel 10 and the flexible circuit board 20 in a practical manner. The colloid of the material prevents the conductive terminals 13 and the conductive auxiliary pads 14 which are alternately arranged on the touch panel 10 from being electrically connected to each other, and the conductive terminals 21 of the flexible circuit board 20 are not mutually connected to each other. Conducted and electrically shorted.
再者,在本實施例的觸控模組1中,觸控面板10的接合端子13及軟性電路板20的導電端子21在尺寸(長及寬)上是例如設計為相同大小,因此如第2圖所示的,接合端子13與導 電端子21是對齊且對應設置。當然,考量到實際製程可能存在對位公差的問題,實際接合端子13及導電端子21之間的尺寸大小可以根據需求來進行設計,並無加以限制。 Furthermore, in the touch module 1 of the present embodiment, the bonding terminals 13 of the touch panel 10 and the conductive terminals 21 of the flexible circuit board 20 are, for example, designed to have the same size in size (length and width), and thus 2, the joint terminal 13 and the guide The electrical terminals 21 are aligned and correspondingly disposed. Of course, considering the actual process, there may be a problem of alignment tolerance. The size between the actual bonding terminal 13 and the conductive terminal 21 can be designed according to requirements, and is not limited.
再請參閱第3圖,為對應第2圖的剖面位置所繪示出的本發明另一實施例之觸控模組的剖面示意圖。如圖所示,本實施例是假設在考量製程的對位公差下所製成的觸控模組1的架構。本實施例與第2圖之實施例的差異點僅在於,接合端子13與導電端子21是形成局部重疊的對應設置態樣。在此架構下,由於用來提升結合強度的輔助墊14是獨立於電極層12及接合端子13來設置,因此若輔助墊14是採用導電材質設計的話,輔助墊14也不會影響觸控面板10及軟性電路板20之間的電路連線。 Please refer to FIG. 3 , which is a cross-sectional view of the touch module according to another embodiment of the present invention, which is corresponding to the cross-sectional position of FIG. 2 . As shown in the figure, this embodiment assumes the architecture of the touch module 1 fabricated under the alignment tolerance of the process. The difference between this embodiment and the embodiment of FIG. 2 is only that the bonding terminal 13 and the conductive terminal 21 are correspondingly arranged to form a partial overlap. In this structure, since the auxiliary pad 14 for improving the bonding strength is disposed independently of the electrode layer 12 and the bonding terminal 13, if the auxiliary pad 14 is designed with a conductive material, the auxiliary pad 14 does not affect the touch panel. 10 and the circuit connection between the flexible circuit boards 20.
最後,於前述實施例中,所提及的基板10可例如是採用玻璃、塑膠、薄膜等透明基材,並且更可是上述透明基材進一步經強化過後所製成的兼具承載及保護用的基板。此外,電極層12可例如是採用氧化銦錫(Indium Tin Oxide)、氧化鋅鋁(Aluminum Zinc Oxide)、氧化銦鎵鋁(Indium Gallium Aluminum Oxide)等透明導電材料所製成,並且電極層12更可設計為單層或多層的透明導電層之設計。再者,電極層12經圖案化製程所形成的電極圖形可為長條形、相接的連續菱形等態樣。上述的各種實施態樣皆非為本發明所限制。 Finally, in the foregoing embodiments, the substrate 10 mentioned may be, for example, a transparent substrate such as glass, plastic, film, or the like, and further, the transparent substrate is further reinforced and has both load bearing and protection. Substrate. In addition, the electrode layer 12 can be made of, for example, a transparent conductive material such as Indium Tin Oxide, Aluminum Zinc Oxide, or Indium Gallium Aluminum Oxide, and the electrode layer 12 is further Designed as a single or multiple layer of transparent conductive layer. Furthermore, the electrode pattern formed by the patterning process of the electrode layer 12 may be a long strip-shaped, continuous continuous diamond shape. The various embodiments described above are not intended to be limiting of the invention.
綜上所述,本發明在觸控面板的基板的接合區中進行結構性的改良,增加了輔助墊來讓觸控面板通過導電膠來與軟性電路板貼合時,觸控面板與導電膠之間具有更佳的附著 力。藉此,本發明得以有效地改善觸控面板與導電膠之間的結合強度,降低了觸控面板與軟性電路板產生電路斷路的風險,進而提高了觸控模組的生產良率,讓觸控模組具有良好的產品穩定性及品質。 In summary, the present invention structurally improves the bonding area of the substrate of the touch panel, and adds the auxiliary pad to allow the touch panel to be bonded to the flexible circuit board through the conductive adhesive, and the touch panel and the conductive adhesive Better adhesion between force. Therefore, the invention can effectively improve the bonding strength between the touch panel and the conductive adhesive, reduce the risk of circuit breaking of the touch panel and the flexible circuit board, thereby improving the production yield of the touch module and allowing the touch. The control module has good product stability and quality.
雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可做些許之更動與潤飾。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. Those skilled in the art having the ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
1‧‧‧觸控模組 1‧‧‧Touch Module
10‧‧‧觸控面板 10‧‧‧Touch panel
11‧‧‧基板 11‧‧‧Substrate
12‧‧‧電極層 12‧‧‧electrode layer
14‧‧‧輔助墊 14‧‧‧Auxiliary pads
15‧‧‧導線 15‧‧‧Wire
20‧‧‧軟性電路板 20‧‧‧Soft circuit board
21‧‧‧導電端子 21‧‧‧Electrical terminals
A‧‧‧接合區 A‧‧‧ junction area
Claims (15)
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CN201310565606.5A CN104635968A (en) | 2013-11-09 | 2013-11-09 | Touch panel and touch module |
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TW201519044A TW201519044A (en) | 2015-05-16 |
TWI550457B true TWI550457B (en) | 2016-09-21 |
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TW103213791U TWM492474U (en) | 2013-11-09 | 2014-08-04 | Touch panel and touch control module |
TW103126542A TWI550457B (en) | 2013-11-09 | 2014-08-04 | Touch panel and touch control module |
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TW103213791U TWM492474U (en) | 2013-11-09 | 2014-08-04 | Touch panel and touch control module |
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CN104635968A (en) * | 2013-11-09 | 2015-05-20 | 宝宸(厦门)光学科技有限公司 | Touch panel and touch module |
TWI657362B (en) * | 2015-03-23 | 2019-04-21 | 群創光電股份有限公司 | Touch device |
Citations (2)
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TWM457920U (en) * | 2012-11-22 | 2013-07-21 | Tpk Touch Solutions Xiamen Inc | One-glass-solution touch panel |
TWM492474U (en) * | 2013-11-09 | 2014-12-21 | Tpk Touch Systems Xiamen Inc | Touch panel and touch control module |
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CN100362653C (en) * | 2003-11-05 | 2008-01-16 | 友达光电股份有限公司 | Display assembly |
WO2007039959A1 (en) * | 2005-10-05 | 2007-04-12 | Sharp Kabushiki Kaisha | Wiring board and display device provided with same |
US8456851B2 (en) * | 2008-05-16 | 2013-06-04 | Apple Inc. | Flex circuit with single sided routing and double sided attach |
CN103094737A (en) * | 2011-11-05 | 2013-05-08 | 宝宸(厦门)光学科技有限公司 | Pin structure and pin connecting structure |
CN202585815U (en) * | 2011-11-05 | 2012-12-05 | 宝宸(厦门)光学科技有限公司 | Pin structure and pin connection structure |
CN103294248B (en) * | 2012-08-17 | 2016-04-20 | 上海天马微电子有限公司 | The electric connection structure of touch control liquid crystal display device |
CN203596001U (en) * | 2013-11-09 | 2014-05-14 | 宝宸(厦门)光学科技有限公司 | Touch panel and touch module |
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- 2013-11-09 CN CN201310565606.5A patent/CN104635968A/en active Pending
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TWM457920U (en) * | 2012-11-22 | 2013-07-21 | Tpk Touch Solutions Xiamen Inc | One-glass-solution touch panel |
TWM492474U (en) * | 2013-11-09 | 2014-12-21 | Tpk Touch Systems Xiamen Inc | Touch panel and touch control module |
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CN104635968A (en) | 2015-05-20 |
TWM492474U (en) | 2014-12-21 |
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