CN210519033U

CN210519033U - Pad structure and printed circuit board

Info

Publication number: CN210519033U
Application number: CN201920976356.7U
Authority: CN
Inventors: 马志鹏; 双强
Original assignee: InfoVision Optoelectronics Kunshan Co Ltd
Current assignee: InfoVision Optoelectronics Kunshan Co Ltd
Priority date: 2019-06-26
Filing date: 2019-06-26
Publication date: 2020-05-12
Anticipated expiration: 2029-06-26

Abstract

The embodiment of the utility model discloses pad structure and printed circuit board. The pad structure comprises at least two basic pads and at least one spare pad, wherein the at least two basic pads and the at least one spare pad are mutually insulated; the at least two basic welding pads comprise a first basic welding pad and a second basic welding pad which are respectively connected with an electric circuit, the basic welding pads and the spare welding pads can be used for welding components, and at least one component is controlled to be connected into the electric circuit. The utility model discloses can solve current pad structure and can not satisfy the problem of series connection or a plurality of parallelly connected components and parts demand simultaneously, can realize the target components and parts parameter through the series connection of a plurality of components and parts or parallelly connected mode when the components and parts parameter is unsatisfied to convenient operation when carrying out the series connection of a plurality of components and parts or parallelly connected welding can guarantee welding quality.

Description

Pad structure and printed circuit board

Technical Field

The embodiment of the utility model provides a relate to printed circuit board design technique, especially relate to a pad structure and printed circuit board.

Background

With the continuous development of electronic technology, the demand for circuits is more and more complicated. Particularly, when a circuit is debugged, because a resistor with a specific resistance value or a capacitor with a specific capacitance value cannot be found, the resistor with other resistance values or the capacitor with other capacitance values is often used for realizing the specific resistance value or the capacitance value in a series or parallel connection mode.

For example, when an LED fixture is designed, different types of backlight current require different current, and the ISET resistance needs to be adjusted according to the requirements, so as to change the current. And adjusting the resistance of the ISET requires two resistors to be connected in series or in parallel. At present, a welding tool such as a soldering iron and a hot air gun is used, two resistors are connected in series and bridged on the same resistor pad, namely, a target resistance value is realized in a mode that the two resistors are connected in parallel, the mode is inconvenient to operate, and the welding quality is difficult to guarantee.

SUMMERY OF THE UTILITY MODEL

The utility model provides a pad structure and printed circuit board can provide reserve pad for electronic component, realizes two at least electronic component's series-parallel connection, guarantees welding quality.

In a first aspect, an embodiment of the present invention provides a pad structure, including at least two basic pads and at least one spare pad, where the at least two basic pads and the at least one spare pad are insulated from each other;

the at least two basic welding pads comprise a first basic welding pad and a second basic welding pad which are respectively connected with an electric circuit, the basic welding pads and the spare welding pads can be used for welding components, and at least one component is controlled to be connected into the electric circuit.

Further, at least one of the spare pads includes a first spare pad and a second spare pad;

the orthographic projections of the first basic pad and the second basic pad in the first direction are overlapped; the orthographic projections of the first spare pad and the second spare pad in the first direction are overlapped; the orthographic projections of the first basic pad and the first spare pad in the second direction are overlapped; the second basic pad and the second spare pad are overlapped in a second direction; the first direction is any direction on a plane where the pad structure is located, and the first direction and the second direction intersect.

Further, at least one of the spare pads includes a third spare pad;

the orthographic projections of the first basic pad and the second basic pad in the first direction are overlapped; the third spare pad is respectively overlapped with orthographic projections of the first basic pad and the second basic pad in a second direction; or

The orthographic projection of the third spare pad and the first basic pad in the second direction is overlapped; the second basic pad is overlapped with orthographic projections of the first basic pad and the third spare pad in a first direction;

the first direction is any direction on a plane where the pad structure is located, and the first direction and the second direction intersect.

Further, the pad structure further comprises at least one auxiliary pad, and the minimum distance between the auxiliary pad and the edge of the basic pad and/or the minimum distance between the auxiliary pad and the edge of the standby pad are smaller than the minimum distance between the basic pad and the edge of the standby pad;

at least one of the auxiliary pads can connect the basic pad and the spare pad, and/or at least one of the auxiliary pads can connect two of the spare pads when at least one of the spare pads includes at least two spare pads.

the orthographic projections of the first basic pad and the second basic pad in the first direction are overlapped; the orthographic projections of the first spare pad and the second spare pad in the first direction are overlapped; the orthographic projections of the first basic pad and the first spare pad in the second direction are overlapped; the second basic pad and the second spare pad are overlapped in a second direction; the first direction is any direction on the plane of the pad structure, and the first direction and the second direction are intersected;

at least one of the satellite pads includes a first satellite pad and a second satellite pad; the minimum distance between the first auxiliary pad and the edge of the first basic pad and the minimum distance between the first auxiliary pad and the edge of the first standby pad are smaller than the minimum distance between the first basic pad and the edge of the first standby pad; the minimum distance between the second auxiliary pad and the edge of the second basic pad and the minimum distance between the second auxiliary pad and the edge of the second standby pad are both smaller than the minimum distance between the second basic pad and the edge of the second standby pad;

alternatively, at least one of the accessory pads includes the first and third accessory pads; the minimum distance between the first auxiliary pad and the edge of the first basic pad and the minimum distance between the first auxiliary pad and the edge of the first standby pad are smaller than the minimum distance between the first basic pad and the edge of the first standby pad; the minimum distance between the third auxiliary pad and the edge of the first standby pad and the minimum distance between the third auxiliary pad and the edge of the second standby pad are both smaller than the minimum distance between the first standby pad and the edge of the second standby pad.

Further, at least one of the accessory pads includes the first, second and third accessory pads.

Further, at least one of the satellite pads includes at least one of the first satellite pad, the second satellite pad, and the third satellite pad;

the first auxiliary pad and the first basic pad or the first spare pad are integrally arranged; and/or the second auxiliary pad and the second basic pad or the second spare pad are integrally arranged; and/or the third auxiliary pad and the first spare basic pad or the second spare pad are integrally provided.

Further, at least one of the spare pads includes a third spare pad; at least one of the satellite pads comprises a fourth satellite pad;

the orthographic projections of the first basic pad and the second basic pad in the first direction are overlapped; the third spare pad is respectively overlapped with orthographic projections of the first basic pad and the second basic pad in a second direction; or the orthographic projections of the third spare pad and the second basic pad in the second direction are overlapped; the first basic pad is overlapped with orthographic projections of the second basic pad and the third spare pad in a first direction respectively; the first direction is any direction on a plane where the pad structure is located, and the first direction and the second direction are intersected;

the minimum distance between the fourth auxiliary pad and the edge of the first basic pad and the minimum distance between the fourth auxiliary pad and the edge of the third standby pad are both smaller than the minimum distance between the first basic pad and the edge of the third standby pad.

Further, the fourth auxiliary pad is provided integrally with the first basic pad, or the fourth auxiliary pad is provided integrally with the third spare pad.

In a second aspect, the present invention provides a printed circuit board, including the pad structure according to any one of the first aspects.

The embodiment of the utility model provides a pad structure and printed circuit board, through setting up two at least basic pads, and set up at least one spare pad simultaneously, two at least basic pads and at least one spare pad are mutual insulation between two liang, basic pad is including the first basic pad and the second basic pad of connecting electrical circuit respectively simultaneously, basic pad and spare pad homoenergetic weld component, control at least one component and connect into electrical circuit, can realize that single component connects into electrical circuit, can satisfy simultaneously that a plurality of components and parts connect into electrical circuit through series connection or parallelly connected mode. The embodiment of the utility model provides a pad structure and printed circuit board have solved current pad structure and can not satisfy the problem of establishing ties simultaneously or parallelly connected a plurality of components and parts demand, can realize the target components and parts parameter through the series connection of a plurality of components and parts or parallelly connected mode when the components and parts parameter is unsatisfied to convenient operation when carrying out the series connection of a plurality of components and parts or parallelly connected welding can guarantee welding quality.

Drawings

Fig. 1 is a schematic diagram of a pad structure according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a pad structure of FIG. 1 for bonding two components in series;

FIG. 3 is a schematic diagram of the bonding pad structure of FIG. 1 for bonding two components in parallel;

fig. 4 is a schematic diagram of another pad structure provided in the embodiment of the present invention;

FIG. 5 is a schematic diagram of the pad structure of FIG. 4 with two components soldered in series;

FIG. 6 is a schematic diagram of the pad structure of FIG. 4 with two components soldered in parallel;

fig. 7 is a schematic diagram of another pad structure provided in an embodiment of the present invention;

FIG. 8 is a schematic diagram of the pad structure of FIG. 7 with two components soldered in series;

FIG. 9 is a schematic diagram of the pad structure of FIG. 7 with two components soldered in parallel;

fig. 10 is a schematic structural diagram of another pad structure provided in an embodiment of the present invention;

FIG. 11 is a schematic diagram of the pad structure of FIG. 10 with two components soldered in series;

FIG. 12 is a schematic diagram of the pad structure of FIG. 10 with two components soldered in parallel;

fig. 13 is a schematic structural diagram of another pad structure provided in an embodiment of the present invention;

FIG. 14 is a schematic diagram of the pad structure of FIG. 13 with two components soldered in series;

FIG. 15 is a schematic diagram of the pad structure of FIG. 13 with two components soldered in parallel;

fig. 16 is a schematic structural diagram of another pad structure provided in an embodiment of the present invention;

fig. 17 is a schematic diagram of the pad structure of fig. 16 with two components soldered in series;

fig. 18 is a schematic diagram of the pad structure of fig. 16 with two components soldered in parallel;

fig. 19 is a schematic structural diagram of another pad structure provided in an embodiment of the present invention;

fig. 20 is a schematic diagram of another pad structure provided in an embodiment of the present invention;

fig. 21 is a schematic diagram of the pad structure of fig. 20 with two components soldered in series;

fig. 22 is a schematic diagram of the pad structure of fig. 20 with two components soldered in parallel;

fig. 23 is a schematic structural diagram of another pad structure provided in an embodiment of the present invention;

fig. 24 is a schematic diagram of the pad structure of fig. 23 with two components soldered in series;

FIG. 25 is a schematic diagram of the pad structure of FIG. 23 with two components soldered in parallel;

fig. 26 and 27 are schematic diagrams of two other pad structures provided in the embodiments of the present invention.

Wherein 1-4-component, 11-first basic pad, 12-second basic pad, 21-first spare pad, 22-second spare pad, 23-third spare pad, 31-first auxiliary pad, 32-second auxiliary pad, 33-third auxiliary pad, 34-fourth auxiliary pad, 100-first direction, 200-second direction.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

As described in the background art, in the pad structure in the prior art, a group of pads is usually provided for only a single component, so that the component is soldered to the group of pads, but for components such as resistors and capacitors, there are many cases where the market does not have a resistor with a target resistance value or a capacitor with a target capacitance value, so that the target resistance value or capacitance value needs to be achieved by connecting two resistors or capacitors in parallel or in series, however, the existing group of pads cannot meet the requirement of parallel or series soldering two resistors or capacitors. In view of the above, an embodiment of the present invention provides a pad structure, which includes at least two basic pads and at least one spare pad, where the at least two basic pads and the at least one spare pad are insulated from each other; the at least two basic welding pads comprise a first basic welding pad and a second basic welding pad which are respectively connected with an electric circuit, the basic welding pads and the spare welding pads can be used for welding components, and at least one component is controlled to be connected into the electric circuit.

The circuit comprises at least two basic pads, wherein the basic pads are normally connected in an electric circuit so as to meet the requirement that a single component is welded in the electric circuit to work, and generally, for components such as capacitors and resistors, the circuit generally comprises a first basic pad and a second basic pad, and the first basic pad and the second basic pad are respectively connected in the circuit and are used for welding two ends of the components such as capacitors or resistors. The spare bonding pads are arranged near the basic bonding pads, so that two ends of the component are respectively welded on the basic bonding pads and the spare bonding pads, or two ends of the component are respectively welded on the two spare bonding pads, the spare bonding pads can be welded with the basic bonding pads by utilizing conductive materials such as soldering tin and the like, and finally, at least two components can be connected in series or in parallel in a circuit formed by welding at least two basic bonding pads and at least one spare bonding pad. The spare pad and the basic pad may be made of the same material and may be formed in the same process. There should be no direct electrical connection between the spare pads and the basic pads so as to avoid interference of the spare pads with the basic pads.

The embodiment of the utility model provides a pad structure, through setting up two at least basic pads, and set up at least one reserve pad simultaneously, two at least basic pads and at least one reserve pad are insulating each other between two liang, basic pad is including the first basic pad and the second basic pad of connecting electrical circuit respectively simultaneously, basic pad and reserve pad homoenergetic weld component, control at least one component and connect into electrical circuit, can realize single component and connect into electrical circuit, can satisfy simultaneously that a plurality of components and parts connect into electrical circuit through series connection or parallelly connected mode. The embodiment of the utility model provides a pad structure has solved current pad structure and can not satisfy the problem of establishing ties simultaneously or parallelly connected a plurality of components and parts demands, can realize the target components and parts parameter through the series connection of a plurality of components and parts or parallelly connected mode when the components and parts parameter is unsatisfied to convenient operation when carrying out the series connection of a plurality of components and parts or parallelly connected welding can guarantee welding quality.

Above is the core thought of the utility model, will combine the attached drawing in the embodiment of the utility model below, to the technical scheme in the embodiment of the utility model clearly, describe completely. Based on the embodiments in the present invention, under the premise that creative work is not done by ordinary skilled in the art, all other embodiments obtained all belong to the protection scope of the present invention.

Fig. 1 is a schematic view of a pad structure provided in an embodiment of the present invention, fig. 2 is a schematic view of a structure of series welding two components in the pad structure shown in fig. 1, fig. 3 is a schematic view of a structure of parallel welding two components in the pad structure shown in fig. 1, referring to fig. 1, the pad structure includes at least two basic pads and at least one spare pad, and at least two of the basic pads and at least one of the spare pads are insulated from each other; the at least two basic pads comprise a first basic pad 11 and a second basic pad 12 which are respectively connected with an electric circuit, the basic pads and the spare pads can be used for welding components, and at least one component is controlled to be connected into the electric circuit. At least one of the spare pads includes a first spare pad 21 and a second spare pad 22; the orthographic projections of the first basic pad 11 and the second basic pad 12 in the first direction 100 are overlapped; an overlap exists between orthographic projections of the first spare pad 21 and the second spare pad 22 in the first direction 100; an overlap exists between orthographic projections of the first basic pad 11 and the first spare pad 21 in the second direction 200; the second primary pad 12 and the second spare pad 22 overlap in a second direction 200; the first direction 100 is an arbitrary direction on a plane where the pad structure is located, and the first direction 100 and the second direction 200 intersect. Referring to fig. 2, the component 1 and the component 2 may be connected in series in a pad structure along a route shown in the figure consisting of the first basic pad 11, the first spare pad 21, the second spare pad 22, and the second basic pad 12, wherein the first spare pad 21 and the second spare pad 22 may be soldered by a conductive material such as solder, a jumper wire, or the like. Referring to fig. 3, the component 3 and the component 4 may be connected in parallel in the pad structure along a route composed of the first basic pad 11 and the second basic pad 12 and a route composed of the first basic pad 11, the first spare pad 21, the second spare pad 22, and the second basic pad 12, respectively, as shown in the figure, and the first basic pad 11 and the first spare pad 21, the second basic pad 12, and the second spare pad 22 may be soldered by a conductive material such as solder or a jumper wire.

As shown in the figure, the first direction 100 and the second direction 200 may be two directions perpendicular to each other, for example, the first direction 100 is a transverse direction, the second direction 200 is a longitudinal direction, orthographic projections of the first basic pad 11 and the second basic pad 12 in the first direction 100 overlap, orthographic projections of the first spare pad 21 and the second spare pad 22 in the first direction 100 overlap, and it is ensured that a component soldered at both ends to the first basic pad 11 and the second basic pad 12 and a component soldered at both ends to the first spare pad 21 and the second spare pad 22 extend in the direction of the first direction 100, that is, the component is soldered and then extends in the transverse direction; and the orthographic projections of the first basic pad 11 and the first spare pad 21 in the second direction 200 are overlapped, and the orthographic projections of the second basic pad 12 and the second spare pad 22 in the second direction 200 are overlapped, so that the component with two ends soldered on the first basic pad 11 and the first spare pad 21 and the component with two ends soldered on the second basic pad 12 and the second spare pad 22 can be ensured to extend along the direction of the second direction 200, namely the component extends along the longitudinal direction after being soldered. When a plurality of components are welded into the electric circuit in series or in parallel, the welding mode is relatively regular, and the welding quality can be ensured.

The components shown in fig. 2 and 3 may be resistors, capacitors, and the like that can achieve target parameter values in series or in parallel, for example, two resistors can achieve target resistance values in series or in parallel, and the type of the components is not limited here.

Fig. 4 is a schematic diagram of another pad structure provided in an embodiment of the present invention, fig. 5 is a schematic diagram of a structure in which two components are welded in series in the pad structure shown in fig. 4, fig. 6 is a schematic diagram of a structure in which two components are welded in parallel in the pad structure shown in fig. 4, and referring to fig. 4, in the pad structure, at least one spare pad includes a third spare pad 23; there is an overlap of the orthographic projections of the first basic pad 11 and the second basic pad 12 in the first direction 100; the third spare pad 23 overlaps with orthographic projections of the first basic pad 11 and the second basic pad 12 in the second direction 200, respectively; the first direction 100 is an arbitrary direction on a plane of the pad structure, and the first direction 100 intersects the second direction 200.

The third spare pad 23 has a larger area than the first basic pad 11 and the second basic pad 12, as shown in fig. 5, two components can be simultaneously soldered to the third spare pad 23, and when two components are soldered in series to the two spare pads shown in fig. 2, it is not necessary to additionally add solder or jumper to solder the two spare pads. Of course, the third spare pad 23 as shown in fig. 6 still needs to be soldered or jumpered to the second basic pad 12 to ensure that the second component is connected in parallel to the electrical circuit.

Similarly, when the basic pads are arranged, the area of a certain basic pad may be relatively larger. Fig. 7 is a schematic diagram of another pad structure provided in an embodiment of the present invention, fig. 8 is a schematic diagram of a pad structure shown in fig. 7 for serially welding two components, fig. 9 is a schematic diagram of a pad structure shown in fig. 7 for parallelly welding two components, and referring to fig. 7, in the pad structure, orthographic projections of a third spare pad 23 and a first basic pad 11 in a second direction 200 overlap; the second basic pad 12 overlaps with the orthographic projections of the first basic pad 11 and the third spare pad 23 in the first direction 100 respectively; the first direction 100 is an arbitrary direction on a plane of the pad structure, and the first direction 100 intersects the second direction 200.

The second basic pad 12 has a larger area than the first basic pad 11 and the third spare pad 23, as shown in fig. 9, two components can be simultaneously soldered on the second basic pad 12, and when two components are soldered in parallel with the second basic pad 12 and the second spare pad 22 shown in fig. 3, additional solder or jumper wires are not needed to solder the pads. Of course, the first primary pads 11 shown in fig. 9 still require solder or jumpers to be added to solder the third spare pads 23, thereby ensuring that the second component is connected in parallel to the electrical circuit. It should be noted here that the second basic pad 12 with a larger relative area may be disposed on any side of the first basic pad 11 in the first direction 100, and in the pad structures shown in fig. 7 to 9, only the second basic pad 12 with a larger relative area is exemplarily shown to be disposed on the right side of the first basic pad 11, and the second basic pad 12 may also be disposed on the left side of the first basic pad 11.

In the pad structure shown in fig. 1-9, when two components are soldered, additional solder or jumper is required to solder two spare pads or solder a basic pad and a spare pad, and since any two pads are soldered, the distance between the pads is relatively large, which easily causes the soldering quality to be reduced when soldering through the solder or jumper. Therefore, optionally, in order to reduce the distance between the pads, optionally, in the pad structure provided by the embodiment of the present invention, at least one auxiliary pad may be further provided, where a minimum distance between the auxiliary pad and the edge of the basic pad, and/or a minimum distance between the auxiliary pad and the edge of the spare pad are both smaller than a minimum distance between the basic pad and the edge of the spare pad; at least one of the auxiliary pads can connect the basic pad and the spare pad, and/or at least one of the auxiliary pads can connect two of the spare pads when at least one of the spare pads includes at least two spare pads.

The minimum distance between the edges of the auxiliary bonding pad, the basic bonding pad and the spare bonding pad indicates that the two bonding pads are closer to each other, and when soldering tin is performed, the soldering tin can be added at the minimum distance so as to solder the two bonding pads. The auxiliary bonding pad can be arranged near two bonding pads needing soldering, wherein the two bonding pads can be a basic bonding pad and a spare bonding pad, and the two bonding pads can also be two spare bonding pads. When the two bonding pads are soldered by the auxiliary bonding pad, the auxiliary bonding pad is convenient to solder because the distance between the auxiliary bonding pad and the basic bonding pad or the spare bonding pad is small.

The following describes the arrangement and position of the auxiliary pads in detail by way of specific examples. Fig. 10 is a schematic structural diagram of another pad structure according to an embodiment of the present invention, fig. 11 is a schematic structural diagram of a series connection welding of two components by the pad structure shown in fig. 10, fig. 12 is a schematic structural diagram of a parallel connection welding of two components by the pad structure shown in fig. 10, and referring to fig. 10, in the pad structure, at least one spare pad includes a first spare pad 21 and a second spare pad 22; there is an overlap of the orthographic projections of the first basic pad 11 and the second basic pad 12 in the first direction 100; the orthographic projections of the first spare pad 21 and the second spare pad 22 in the first direction 100 are overlapped; there is an overlap of orthographic projections of the first basic pad 11 and the first spare pad 21 in the second direction 200; the second primary pad 12 and the second spare pad 22 overlap in the second direction 200; the first direction 100 is any direction on the plane of the pad structure, and the first direction 100 and the second direction 200 intersect; the at least one auxiliary pad includes a first auxiliary pad 31 and a second auxiliary pad 32; the minimum distance between the first auxiliary pad 31 and the edge of the first basic pad 11 and the minimum distance between the first auxiliary pad 31 and the edge of the first spare pad 21 are both smaller than the minimum distance between the first basic pad 11 and the edge of the first spare pad 21; the minimum distance between the second auxiliary pad 32 and the edge of the second base pad 12 and the minimum distance between the second auxiliary pad 32 and the edge of the second spare pad 22 are both smaller than the minimum distance between the second base pad 12 and the edge of the second spare pad 22.

Fig. 10 exemplarily shows that the first auxiliary pad 31 is equally spaced from the first basic pad 11 and the first spare pad 21, respectively, the second auxiliary pad 32 is equally spaced from the second basic pad 12 and the second spare pad 22, respectively, the first auxiliary pad 31 is less spaced from the first basic pad 11 and the first spare pad 21 by a distance D1, respectively, than the first basic pad 11 and the first spare pad 21 by a distance L1, and the second auxiliary pad 32 is less spaced from the second basic pad 12 and the second spare pad 22 by a distance D2, respectively, than the second basic pad 12 and the second spare pad 22 by a distance L2. In fig. 11, the component 1 and the component 2 are connected in series in the electrical circuit by the lines of the first basic pad 11, the first auxiliary pad 31, the first spare pad 21, the second spare pad 22, the second auxiliary pad 32, and the second basic pad 12, in fig. 12, the component 3 and the component 4 are connected in parallel in the electrical circuit by the lines of the first basic pad 11 and the second basic pad 12, the first basic pad 11, the first auxiliary pad 31, the first spare pad 21, the second spare pad 22, the second auxiliary pad 32, and the second basic pad 12, respectively, and the two basic pads and the two spare pads are soldered by the auxiliary pads, respectively. As can be seen from fig. 11 and 12, when the basic pad and the spare pad are bonded, the bonding can be performed with a small amount of solder and the bonding quality can be ensured.

Fig. 13 is a schematic structural diagram of another pad structure according to an embodiment of the present invention, fig. 14 is a schematic structural diagram of a series connection welding of two components by the pad structure shown in fig. 13, fig. 15 is a schematic structural diagram of a parallel connection welding of two components by the pad structure shown in fig. 13, and referring to fig. 13, in the pad structure, at least one spare pad includes a first spare pad 21 and a second spare pad 22; there is an overlap of the orthographic projections of the first basic pad 11 and the second basic pad 12 in the first direction 100; the orthographic projections of the first spare pad 21 and the second spare pad 22 in the first direction 100 are overlapped; there is an overlap of orthographic projections of the first basic pad 11 and the first spare pad 21 in the second direction 200; the second primary pad 12 and the second spare pad 22 overlap in the second direction 200; the first direction 100 is any direction on the plane of the pad structure, and the first direction 100 and the second direction 200 intersect; the at least one auxiliary pad includes a first auxiliary pad 31 and a third auxiliary pad 33; the minimum distance between the first auxiliary pad 31 and the edge of the first basic pad 11 and the minimum distance between the first auxiliary pad 31 and the edge of the first spare pad 21 are both smaller than the minimum distance between the first basic pad 11 and the edge of the first spare pad 21; the minimum distance between the third auxiliary pad 33 and the edge of the first spare pad 21 and the minimum distance between the third auxiliary pad 33 and the edge of the second spare pad 22 are both smaller than the minimum distance between the first spare pad 21 and the edge of the second spare pad 22.

Fig. 13 shows, by way of example, that the first auxiliary pad 31 is equal to the pitch of the first basic pad 11 and the first spare pad 21, the third auxiliary pad 33 is equal to the pitch of the first spare pad 21 and the second spare pad 22, the pitch D1 of the first auxiliary pad 31 is smaller than the pitch L1 of the first basic pad 11 and the first spare pad 21, and the pitch D3 of the third auxiliary pad 33 is smaller than the pitch L3 of the first spare pad 21 and the second spare pad 22. In fig. 14, the component 1 and the component 2 are connected in series in the electrical circuit by the lines of the first basic pad 11, the first spare pad 21, the third auxiliary pad 33, the second spare pad 22 and the second basic pad 12, in fig. 15, the component 3 and the component 4 are connected in parallel in the electrical circuit by the lines of the first basic pad 11 and the second basic pad 12, the first basic pad 11, the first auxiliary pad 31, the first spare pad 21, the third auxiliary pad 33, the second spare pad 22 and the second basic pad 12, respectively, the basic pad and the spare pad are bonded by the auxiliary pads, and the two spare pads are bonded by the auxiliary pads. As can be seen from fig. 11 and 12, when the basic pad and the spare pad are bonded, the bonding can be performed by the auxiliary pad with a small amount of solder, and the bonding quality can be ensured.

It should be noted that the first auxiliary pad shown in fig. 13 to 15 is exemplarily disposed at the left side of the basic pad and the spare pad, and it may also be disposed at the right side of the basic pad and the spare pad, and correspondingly, the parallel connection mode of the components shown in fig. 15 is horizontally inverted.

It should be noted that, in the pad structures shown in fig. 10 to 15, the position of the auxiliary pad may not be disposed on the same side of the two pads to be connected, or may be disposed in the region between the two pads to be connected, and the shape of the auxiliary pad is also limited to the long shape as shown in the figure, and may be any other shape that facilitates solder welding, which is not limited herein.

Fig. 16 is a schematic structural diagram of another pad structure according to an embodiment of the present invention, fig. 17 is a schematic structural diagram of a pad structure shown in fig. 16 for serially welding two components, and fig. 18 is a schematic structural diagram of a pad structure shown in fig. 16 for parallelly welding two components, and referring to fig. 16, it is preferable that at least one of the auxiliary pads includes a first auxiliary pad 31, a second auxiliary pad 32, and a third auxiliary pad 33.

Wherein the first auxiliary pad 31 is used for bonding the first basic pad 11 and the first spare pad 21, the second auxiliary pad 32 is used for bonding the second basic pad 12 and the second spare pad 22, and the third auxiliary pad 33 is used for bonding the first spare pad 21 and the second spare pad 22. As shown in fig. 17, the component 1 and the component 2 are connected in series to the electric circuit via the third auxiliary pad 33, and as shown in fig. 18, the component 4 is connected in parallel to the electric circuit via the first auxiliary pad 31, the first spare pad 21, the second spare pad 22, and the second auxiliary pad 32. Through setting up the pad structure of two spare pads and three subsidiary pads, can guarantee to weld two components and parts of inserting in electric circuit according to horizontal or longitudinal arrangement, guaranteed on the one hand that components and parts welded regular, on the other hand has realized that the both ends of components and parts weld respectively on single pad, provides sufficient welding area for the welding of components and parts on the pad, can guarantee welding quality.

Further, the present invention also provides a pad structure in which at least one of the auxiliary pads includes at least one of a first auxiliary pad 31, a second auxiliary pad 32, and a third auxiliary pad 33; the first auxiliary pad 31 and the first basic pad 11 or the first spare pad 21 are integrally provided; and/or the second auxiliary pad 32 is integrally provided with the second basic pad 12 or the second spare pad 22; and/or the third subsidiary pad 33 is integrally provided with the first spare pad 21 or the second spare pad 22.

Fig. 19 is a schematic structural diagram of another pad structure according to an embodiment of the present invention, and referring to fig. 19, at least one auxiliary pad is exemplarily shown to include a first auxiliary pad 31 and a second auxiliary pad 32, and the first auxiliary pad 31 is integrally provided with the first basic pad 11, and the second auxiliary pad 32 is integrally provided with the second basic pad 12.

As above, in the pad structure, all be provided with two spare pads, the embodiment of the utility model provides a still provides a pad structure, wherein only is provided with a spare pad. Such a pad structure is described below. Fig. 20 is a schematic diagram of another pad structure according to an embodiment of the present invention, fig. 21 is a schematic diagram of a pad structure shown in fig. 20 for serially welding two components, fig. 22 is a schematic diagram of a pad structure shown in fig. 20 for parallelly welding two components, and referring to fig. 20, at least one spare pad in the pad structure includes a third spare pad 23; the at least one satellite pad includes a fourth satellite pad 34; there is an overlap of the orthographic projections of the first basic pad 11 and the second basic pad 12 in the first direction 100; the third spare pad 23 overlaps with orthographic projections of the first basic pad 11 and the second basic pad 12 in the second direction 200, respectively; the first direction 100 is any direction on a plane where the pad structure is located, and the first direction 100 intersects with the second direction 200; the minimum distance D4 between the fourth satellite pad 34 and the edge of the first base pad 11 and the minimum distance D4 between the fourth satellite pad 34 and the edge of the third spare pad 23 are both smaller than the minimum distance L4 between the edges of the first base pad 11 and the third spare pad 23.

Fig. 21 and 22 show the welding modes of the pad structure in fig. 20 for achieving the series connection of the component 1 and the component 2 and the parallel connection of the component 3 and the component 4, which are not described herein again. Therefore, the pad structure shown in fig. 20 can also solve the problem that the existing pad structure cannot meet the requirement of simultaneously connecting a plurality of components in series or in parallel, can realize the target component parameters in a series or parallel mode of the plurality of components when the component parameters do not meet the requirement, is convenient to operate when welding the plurality of components in series or in parallel, and can ensure the welding quality.

Fig. 23 is a schematic structural diagram of another pad structure according to an embodiment of the present invention, fig. 24 is a schematic structural diagram of two components serially welded in the pad structure shown in fig. 23, fig. 25 is a schematic structural diagram of two components parallelly welded in the pad structure shown in fig. 23, comparing with the pad structure shown in fig. 21, in which at least one spare pad includes a third spare pad 23; the at least one satellite pad includes a fourth satellite pad 34; the orthographic projections of the third spare pad 23 and the second basic pad 12 in the second direction 200 are overlapped; the first basic pad 11 overlaps with the orthographic projections of the second basic pad 12 and the third spare pad 23 in the first direction 100 respectively; the first direction 100 is any direction on a plane where the pad structure is located, and the first direction 100 intersects with the second direction 200; a minimum distance D4 between the fourth satellite pad 34 and the edge of the first basic pad 11, and a minimum distance D4 between the fourth satellite pad 34 and the edge of the third spare pad 23 are both smaller than the minimum distance L4 between the edges of the first basic pad 11 and the third spare pad 23.

Fig. 24 and fig. 25 show the manner in which the pad structure in fig. 23 realizes series connection of the component 1 and the component 2 and parallel connection of the component 3 and the component 4, respectively, and details are not repeated here again. Therefore, the pad structure shown in fig. 23 can also solve the problem that the existing pad structure cannot meet the requirement of simultaneously connecting a plurality of components in series or in parallel, can realize the target component parameters in a series or parallel mode of the plurality of components when the component parameters do not meet the requirement, is convenient to operate when welding the plurality of components in series or in parallel, and can ensure the welding quality.

The pad structure shown in fig. 21 in which the fourth subsidiary pad 34 is provided on the left side of the first basic pad 11 and the third spare pad 23, and the pad structure shown in fig. 23 in which the first basic pad 11 is provided on the left side of the second basic pad 12 and the third spare pad 23 are merely examples. Alternatively, the fourth subsidiary pad 34 in fig. 21 may be disposed to the right of the second base pad 12 and the third spare pad 23, and the first base pad 11 in fig. 23 may be disposed to the right of the second base pad 12 and the third spare pad 23. Correspondingly, when two components are welded, the arrangement mode of the components needs to be turned over correspondingly, and the details are omitted here.

Furthermore, on the basis of fig. 21 and fig. 23, the embodiment of the present invention further provides a pad structure. Fig. 26 and 27 are schematic diagrams of two pad structures provided in an embodiment of the present invention, and referring to fig. 26 and 27, it is preferable that the fourth auxiliary pad 34 is integrally provided with the first basic pad 11, or the fourth auxiliary pad 34 is integrally provided with the third spare pad 23.

Of course, the embodiment of the present invention only exemplarily shows the setting number, the setting position, the setting number and the setting position of the auxiliary pad, and the manner of integrally setting the auxiliary pad and the basic pad or the spare pad, and those skilled in the art can reasonably deform and simply modify according to the embodiment provided by the present invention, and all will fall into the protection scope of the embodiment of the present invention.

The embodiment of the utility model provides a still provide a printed circuit board, including the arbitrary pad structure that above-mentioned embodiment provided in this printed circuit board, through this pad structure, can satisfy in single components and parts or a plurality of components and parts weld the electric circuit in going into printed circuit board through series connection or parallelly connected mode.

The embodiment of the utility model provides a printed circuit board, through set up two at least basic pads in the pad structure, and set up at least one spare pad simultaneously, two at least basic pads and at least one spare pad are mutual insulation between two liang, basic pad is including the first basic pad and the second basic pad of connecting electrical circuit respectively simultaneously, basic pad and spare pad homoenergetic weld component, control at least one component and connect into electrical circuit, can realize that single component connects into electrical circuit, can satisfy simultaneously that a plurality of components and parts connect into electrical circuit through series connection or parallelly connected mode. The embodiment of the utility model provides a printed circuit board, the pad structure of having solved current printed circuit board can not satisfy the problem of series connection or a plurality of parallelly connected components and parts demand simultaneously, can realize the target components and parts parameter through the series connection of a plurality of components and parts or parallelly connected mode when the components and parts parameter is unsatisfied to convenient operation when carrying out the series connection of a plurality of components and parts or parallelly connected welding can guarantee welding quality.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims

1. A pad structure comprises at least two basic pads and is characterized by further comprising at least one spare pad, wherein the at least two basic pads and the at least one spare pad are mutually insulated;

2. The pad structure of claim 1, wherein at least one of the spare pads comprises a first spare pad and a second spare pad;

3. The pad structure of claim 1, wherein at least one of the spare pads comprises a third spare pad;

4. The pad structure according to claim 1, wherein the pad structure further comprises at least one auxiliary pad, and the minimum distance between the auxiliary pad and the edge of the basic pad and/or the minimum distance between the auxiliary pad and the edge of the standby pad are smaller than the minimum distance between the basic pad and the edge of the standby pad;

5. The pad structure of claim 4, wherein at least one of the spare pads comprises a first spare pad and a second spare pad;

6. The pad structure of claim 5,

at least one of the accessory pads includes the first accessory pad, the second accessory pad, and the third accessory pad.

7. Pad structure according to claim 5 or 6,

at least one of the accessory pads includes at least one of the first, second and third accessory pads;

8. The pad structure of claim 4, wherein at least one of the spare pads comprises a third spare pad; at least one of the satellite pads comprises a fourth satellite pad;

9. The pad structure of claim 8, wherein the fourth satellite pad is integrally disposed with the first base pad or the fourth satellite pad is integrally disposed with the third spare pad.

10. A printed circuit board comprising a pad structure according to any one of claims 1-9.