CN212849143U

CN212849143U - Circuit board structure of intelligent socket and intelligent socket

Info

Publication number: CN212849143U
Application number: CN202021412653.8U
Authority: CN
Inventors: 向路
Original assignee: Zhuhai Lanbo Electronic Technology Co ltd
Current assignee: Zhuhai Lanbo Electronic Technology Co ltd
Priority date: 2020-07-16
Filing date: 2020-07-16
Publication date: 2021-03-30
Anticipated expiration: 2030-07-16

Abstract

The utility model discloses a circuit board structure of an intelligent socket and the intelligent socket, which comprises a main circuit board provided with a vertical element; the height adjusting plate is mounted on the main circuit board through a pin header connector and is electrically connected with the main circuit board, and the pin header connector extends along a direction perpendicular to the plane of the main circuit board; the wireless communication module is installed on the height adjusting plate and electrically connected with the height adjusting plate, and the height difference between the wireless communication module and the upright element is not larger than half of the height of the upright element. The height adjusting plate is connected with the main circuit board through the pin header female connector, and the height of the height adjusting plate can be adjusted by adjusting the plugging depth of the pin header female connector, so that the height of the wireless communication module is adjusted, the height difference between the wireless communication module and the vertical element is reduced, the interference of the vertical element on the wireless communication module is reduced, and the communication quality of the wireless communication module is improved.

Description

Circuit board structure of intelligent socket and intelligent socket

Technical Field

The utility model relates to a socket technical field, in particular to smart jack's circuit board structure and smart jack.

Background

The conventional socket only has functions of connecting electric equipment and supplying power, and in order to meet the increasingly wide application requirements, a built-in circuit board of the existing intelligent socket is added with different functions, such as a wireless communication function. The wireless communication function is generally realized by welding an integrated wireless communication module on a main circuit board, however, because the circuit board is provided with more vertical elements, such as an electrolytic capacitor and a safety capacitor, after the wireless communication module is welded on the circuit board, the vertical elements surround the wireless communication module, so that a certain interference effect is realized on the communication of the wireless communication module, and the communication quality is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a smart jack's circuit board structure and smart jack can reduce the difference in height between wireless communication module and the upright component, improves wireless communication module's communication quality.

In a first aspect, a circuit board structure of a smart jack according to an embodiment of the present invention includes a main circuit board provided with an upright element; the height adjusting plate is mounted on the main circuit board through a pin header connector and is electrically connected with the main circuit board, and the pin header connector extends along a direction perpendicular to the plane of the main circuit board; the wireless communication module is installed on the height adjusting plate and electrically connected with the height adjusting plate, and the height difference between the wireless communication module and the upright element is not larger than half of the height of the upright element.

According to the utility model discloses a some embodiments, the both sides of altitude mixture control board are provided with a plurality of copper facing holes respectively, copper facing hole welding has row's pin connector or row's female connector.

According to the utility model discloses a some embodiments, be provided with on the altitude mixture control board walk the line and a plurality of be used for with wireless communication module welded pad, the pad passes through walk the line with copper facing hole electric connection.

According to some embodiments of the present invention, the height adjustment plate is provided with a plurality of height adjustment plates.

According to some embodiments of the present invention, the wireless communication module is connected to the height adjustment plate by bonding.

In a second aspect, the present invention provides a smart jack, including the circuit board structure of the above smart jack.

According to the utility model discloses one or more technical scheme have following beneficial effect at least:

the height adjusting plate is connected with the main circuit board through the pin header female connector, and the height of the height adjusting plate can be adjusted by adjusting the plugging depth of the pin header female connector, so that the height of the wireless communication module is adjusted, the height difference between the wireless communication module and the vertical element is reduced, the interference of the vertical element on the wireless communication module is reduced, and the communication quality of the wireless communication module is improved.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a first view angle of a circuit board structure of an intelligent socket according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a second view angle of a circuit board structure of an intelligent socket according to an embodiment of the present invention;

fig. 3 is a partially enlarged view of circled position a in fig. 2.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper and lower directions, is the orientation or positional relationship shown on the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore should not be construed as limiting the present invention.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

Referring to fig. 1, the present embodiment discloses a circuit board structure of an intelligent socket, including a main circuit board 100, a height adjustment board 200 and a wireless communication module 300, wherein the main circuit board 100 is provided with an upright component 110, the upright component 110 surrounds the outer side of the wireless communication module 300, the height adjustment board 200 is mounted on the main circuit board 100 through a pin header connector 210 and electrically connected to the main circuit board 100, the pin header connector 210 extends in a direction perpendicular to a plane of the main circuit board 100, the wireless communication module 300 is mounted on the height adjustment board 200 and electrically connected to the height adjustment board 200, and a height difference between the wireless communication module 300 and the upright component 110 is not greater than half of a height of the upright component 110. It should be noted that half the height of the upright 110 is referenced to the highest of all the upright on the main circuit board 100.

The height adjustment plate 200 is connected to the main circuit board 100 through the pin header connector 210, and the height adjustment plate 200 can be adjusted by adjusting the insertion depth of the pin header connector 210, so as to adjust the height of the wireless communication module 300, thereby reducing the height difference between the wireless communication module 300 and the upright element 110, reducing the interference of the upright element 110 to the wireless communication module 300, and facilitating the improvement of the communication quality of the wireless communication module 300.

Referring to fig. 2 and 3, a plurality of copper plating holes 220 are respectively formed at both sides of the height adjustment plate 200, the pin header connector 210 includes a pin header connector and a box header connector that are matched with each other, and the pin header connector or the box header connector is welded to the copper plating holes 220. Correspondingly, a pin header connector or a pin header connector is welded on the main circuit board 100, and after the assembly is completed, the height adjusting plate 200 is electrically connected with the main circuit board 100 through the pin header connector 210.

Referring to fig. 3, the height adjustment plate 200 is provided with a plurality of pads 230 for soldering with the wireless communication module 300, and the pads 230 are electrically connected to the copper plated holes 220 through traces, wherein the traces are metal lines on the height adjustment plate 200. The wireless communication module 300 is a ready-made integrated circuit module, and when the wireless communication module 300 is assembled, the wireless communication module 300 is soldered to the soldering pad 230, so that the wireless communication module 300 is electrically connected to the height adjustment plate 200, and is electrically connected to the main circuit board 100 through the height adjustment plate 200.

Referring to fig. 1, in order to fully utilize the limited wiring area of the main circuit board 100, a patch element or a horizontal element 120 is disposed on the main circuit board 100 and below the height adjustment plate 200, and the horizontal element 120 may be a horizontal resistor or a horizontal capacitor.

In order to secure the connection between the wireless communication module 300 and the height adjustment plate 200, the wireless communication module 300 is adhesively connected to the height adjustment plate 200.

Referring to fig. 1 to fig. 3, an embodiment of the present invention further discloses an intelligent socket, including the circuit board structure of the intelligent socket. The height adjustment plate 200 is connected to the main circuit board 100 through the pin header connector 210, and the height adjustment plate 200 can be adjusted by adjusting the insertion depth of the pin header connector 210, so as to adjust the height of the wireless communication module 300, thereby reducing the height difference between the wireless communication module 300 and the upright element 110, reducing the interference of the upright element 110 to the wireless communication module 300, and facilitating the improvement of the communication quality of the wireless communication module 300.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims

1. A circuit board structure of smart jack, comprising:

a main circuit board (100) provided with an upright element (110);

the height adjusting plate (200) is mounted on the main circuit board (100) through a pin header connector (210) and is electrically connected with the main circuit board (100), and the pin header connector (210) extends along a direction perpendicular to the plane of the main circuit board (100);

a wireless communication module (300) mounted on the height adjustment plate (200) and electrically connected with the height adjustment plate (200), a height difference between the wireless communication module (300) and the upright member (110) being not more than half of a height of the upright member (110).

2. The circuit board structure of the smart socket according to claim 1, wherein a plurality of copper plating holes (220) are respectively disposed at both sides of the height adjusting plate (200), and pin connectors or female connectors are welded to the copper plating holes (220).

3. The circuit board structure of the smart socket according to claim 2, wherein the height adjustment board (200) is provided with a plurality of pads (230) for soldering with the wireless communication module (300), and the pads (230) are electrically connected with the copper-plated holes (220) through the traces.

4. The circuit board structure of a smart socket according to claim 1, characterized in that a patch element or a horizontal element (120) is arranged on the main circuit board (100) and below the height adjustment plate (200).

5. The circuit board structure of a smart socket according to claim 1, wherein the wireless communication module (300) is adhesively connected with the height adjustment plate (200).

6. A smart jack comprising the circuit board structure of the smart jack of any one of claims 1 to 5.