CN220254765U - Multi-PCB assembly structure - Google Patents
Multi-PCB assembly structure Download PDFInfo
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- CN220254765U CN220254765U CN202321409205.6U CN202321409205U CN220254765U CN 220254765 U CN220254765 U CN 220254765U CN 202321409205 U CN202321409205 U CN 202321409205U CN 220254765 U CN220254765 U CN 220254765U
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- 238000003466 welding Methods 0.000 claims abstract description 90
- 229910000679 solder Inorganic materials 0.000 claims 16
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 150000002739 metals Chemical class 0.000 abstract description 3
- 239000011120 plywood Substances 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The utility model discloses a multi-PCB assembly structure, which comprises a PCB upper layer plate, a PCB lower layer plate and a PCB connecting plate; the PCB upper layer plate comprises a PCB upper layer plate main body, a first protruding slot hole, N first high-current through slots, a first signal position slot hole and a first lower slot hole which are formed in the main mounting surface of the PCB upper layer plate main body, and the PCB lower layer plate comprises a PCB lower layer plate main body, a second protruding slot hole, N second high-current through slots, a second signal position slot hole and a second lower slot hole which are formed in the main mounting surface of the PCB lower layer plate main body; the connecting plate comprises a connecting plate main body, a first high-current-passing welding member, a first communication welding member, a second high-current-passing welding member and a second communication signal welding member; this many PCB board assembly structure has reduced upper and lower plywood and has connected required connector, five metals terminal and cable, reduces the required space of complete machine assembly, can prevent the PCB board during the assembly and insert the reflection.
Description
Technical Field
The utility model relates to the technical field of PCB assembly, in particular to a multi-PCB assembly structure.
Background
In the prior art, a plurality of metal studs and plastic isolation columns are assembled between the upper PCB and the lower PCB for supporting, and signals and large currents are transmitted between the upper PCB and the lower PCB through a plurality of connectors, hardware terminals and cables;
the prior art PCB upper board or PCB lower board is shown in figure 1; because more bearing structures are needed between the PCB upper plate and the PCB lower plate during assembly, the space is wasted during assembly of the whole machine, more connectors, hardware terminals and cables are used, the material is wasted, and the connecting lines are too many, so that potential safety hazards are easily caused, and the lines are also easily connected in error, so that the PCB is burnt out.
Disclosure of Invention
The utility model aims to solve the technical problem of providing a multi-PCB assembly structure, which reduces connectors, hardware terminals and cables required by connection of upper and lower laminates, reduces space required by complete machine assembly, and can prevent PCB reverse insertion during assembly.
In order to solve the technical problems, the utility model provides a multi-PCB assembly structure, which comprises a PCB upper layer plate, a PCB lower layer plate and a PCB connecting plate; the PCB upper layer plate comprises a PCB upper layer plate main body, a first protruding slot hole, N first high-current through slot holes, a first signal position slot hole and a first lower slot hole which are formed in a main mounting surface of the PCB upper layer plate main body, and the PCB lower layer plate comprises a PCB lower layer plate main body, a second protruding slot hole, N second high-current through slot holes, a second signal position slot hole and a second lower slot hole which are formed in a main mounting surface of the PCB lower layer plate main body; the connecting plate comprises a connecting plate main body, a first high-current welding component and a first communication welding component which are arranged at one end of the connecting plate main body, and a second high-current welding component and a second communication signal welding component which are arranged at the other end of the connecting plate main body; the N first high-current through slots are assembled and welded with corresponding parts of the first high-current through welding members, and the first signal position slots are assembled and welded with corresponding parts of the first high-current through welding members; the N second high-current slotted holes are assembled and welded with corresponding parts of the second high-current welding members, and the second signal position slotted holes are assembled and welded with corresponding parts of the second high-current welding members;
the first protruding slot and the first lower slot are respectively assembled with corresponding parts of the first high-current welding component and the first communication welding component, or the first lower slot and the first protruding slot are respectively assembled with corresponding parts of the first high-current welding component and the first communication welding component; the second protruding slot hole and the second recessed slot hole are respectively assembled with corresponding parts of the second high-current welding component and the second signal welding component, or the second recessed slot hole and the second protruding slot hole are respectively assembled with corresponding parts of the second high-current welding component and the second signal welding component.
Preferably, when the first protruding slot hole and the first lower slot hole are assembled with the corresponding parts of the first high-current through welding member and the first low-current through welding member respectively, the first high-current through welding member comprises a first mounting square device matched with the first protruding slot hole, N first metallized bonding pads matched with all the first high-current through slot holes, and the first low-current through welding member comprises a first PCB signal end member matched with the first signal position slot hole and a first sinking platform matched with the first lower slot hole.
Preferably, when the first lower groove hole and the first protruding groove hole are assembled with the corresponding parts of the first high-current-passing welding member and the first communication welding member respectively, the first high-current-passing welding member comprises a first sinking table mutually matched with the first lower groove hole, N first metallized bonding pads matched with all the first high-current-passing groove holes, and the first communication welding member comprises a first PCB signal end member matched with the first signal position groove hole and a first mounting square device matched with the first protruding groove hole.
Preferably, when the second protruding slot hole and the second recessed slot hole are assembled together with the corresponding parts of the second high-current welding component and the second signal welding component respectively, the second high-current welding component comprises a first mounting square device matched with the second protruding slot hole and N second metallized bonding pads matched with all the second high-current slot holes, and the second signal welding component comprises a second PCB signal end component matched with the second signal position slot hole and a second sinking platform matched with the second recessed slot hole.
Preferably, when the second lower groove hole and the second raised groove hole are assembled with the corresponding parts of the second high-current welding member and the second signal welding member respectively, the second high-current welding member comprises a second sinking table mutually matched with the second lower groove hole and N second metalized bonding pads matched with all the second high-current groove holes, and the second signal welding member comprises a second PCB signal end member matched with the second signal position groove hole and a second mounting square device matched with the second raised groove hole.
Preferably, a plurality of first PCB signal end pads are arranged on two side surfaces of the first PCB signal end member, and a plurality of first side metallized pads corresponding to all the first PCB signal end pads are arranged on the upper and lower sides of the slot hole at the first signal position.
Preferably, a plurality of second PCB signal end pads are arranged on two sides of the second PCB signal end member, and a plurality of second side metallized pads corresponding to all the second PCB signal end pads are arranged on the upper and lower sides of the second signal position slot.
After the structure is adopted, the multi-PCB assembly structure comprises a PCB upper layer plate, a PCB lower layer plate and a PCB connecting plate; the PCB upper layer plate comprises a PCB upper layer plate main body, a first protruding slot hole, N first high-current through slot holes, a first signal position slot hole and a first lower slot hole which are formed in a main mounting surface of the PCB upper layer plate main body, and the PCB lower layer plate comprises a PCB lower layer plate main body, a second protruding slot hole, N second high-current through slot holes, a second signal position slot hole and a second lower slot hole which are formed in a main mounting surface of the PCB lower layer plate main body; the connecting plate comprises a connecting plate main body, a first high-current welding component and a first communication welding component which are arranged at one end of the connecting plate main body, and a second high-current welding component and a second communication signal welding component which are arranged at the other end of the connecting plate main body; the N first high-current through slots are assembled and welded with corresponding parts of the first high-current through welding members, and the first signal position slots are assembled and welded with corresponding parts of the first high-current through welding members; the N second high-current slotted holes are assembled and welded with corresponding parts of the second high-current welding members, and the second signal position slotted holes are assembled and welded with corresponding parts of the second high-current welding members; this many PCB board assembly structure has reduced upper and lower plywood and has connected required connector, five metals terminal and cable, reduces the required space of complete machine assembly, can prevent the PCB board during the assembly and insert the reflection.
Drawings
Fig. 1 is a structural diagram of a PCB upper board and a PCB lower board of the prior art;
fig. 2 is a structural view of a PCB upper plate of the multi-PCB assembly structure of the present utility model;
fig. 3 is a structural view of a PCB connecting plate of the multi-PCB assembly structure of the present utility model;
fig. 4 is an assembly structure diagram of the multi-PCB assembly structure of the present utility model.
The realization, functional characteristics and advantages of the present application will be further described with reference to the embodiments, referring to the attached drawings.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved by the application clearer and more obvious, the application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
In the description of the present application, it should be understood that the directions or positional relationships indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description of the present application and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Example 1
Referring to fig. 2 and 3, fig. 2 is a structural diagram of a PCB upper plate of the multi-PCB assembly structure according to the present utility model; fig. 3 is a structural view of a PCB connecting plate of the multi-PCB assembly structure of the present utility model;
the embodiment discloses a multi-PCB assembly structure, which comprises a PCB upper plate 10, a PCB lower plate 30 and a PCB connecting plate 20; the upper PCB plate 10 comprises an upper PCB plate body, a first protruding slot 11, N first high-current through slots 13, a first signal position slot 15 and a first lower slot 16 which are formed in the main mounting surface of the upper PCB plate body, and the lower PCB plate 30 comprises a lower PCB plate body, a second protruding slot, N second high-current through slots, a second signal position slot and a second lower slot which are formed in the main mounting surface of the lower PCB plate body; the PCB connecting plate 20 comprises a connecting plate body, a first high-current welding member 21 and a first communication welding member 22 arranged at one end of the connecting plate body, and a second high-current welding member 23 and a second communication signal welding member 24 arranged at the other end of the connecting plate body; the N first high-current through slots 13 are assembled and welded with the corresponding parts of the first high-current through welding members 21, and the first signal position slots 15 are assembled and welded with the corresponding parts of the first communication welding members 22; the N second high-current slotted holes are assembled and welded with corresponding parts of the second high-current welding members, and the second signal position slotted holes are assembled and welded with corresponding parts of the second high-current welding members;
the first protruding slot 11 and the first lower slot 16 are assembled with the corresponding portions of the first large current passing welding member 21 and the first communication welding member 22, respectively, or the first lower slot 16 and the first protruding slot 11 are assembled with the corresponding portions of the first large current passing welding member 21 and the first communication welding member 22, respectively; the second protruding slot hole and the second recessed slot hole are respectively assembled with corresponding parts of the second high-current welding component and the second signal welding component, or the second recessed slot hole and the second protruding slot hole are respectively assembled with corresponding parts of the second high-current welding component and the second signal welding component.
In this embodiment, the protruding slot holes and the recessed slot holes of the upper layer board or the lower layer board of the PCB are simultaneously matched with the high-current welding members and the communication welding members of the PCB connecting board, so that the occurrence of a reverse installation of the upper layer board or the lower layer board of the PCB and the occurrence of a short circuit of the PCB board can be avoided.
Example two
In the first embodiment, when the first protruding slot 11 and the first recessed slot 16 are assembled with the corresponding parts of the first high current passing soldering member 21 and the first communication soldering member 22, respectively, the first high current passing soldering member 21 includes the first mounting square device 211 matched with the first protruding slot 11, the N first metallized pads 212 matched with all the first high current passing slots 13, and the first communication soldering member 22 includes the first PCB board signal end member 221 matched with the first signal position slot 15 and the first sink 222 matched with the first recessed slot 16.
Example III
In this embodiment, when the first concave slot and the first convex slot are assembled with the corresponding parts of the first high-current through welding member and the first high-current through welding member respectively, the first high-current through welding member includes a first sinking table mutually matched with the first concave slot, N first metallized pads matched with all the first high-current through slots, and the first high-current through welding member includes a first PCB board signal end member matched with the first signal position slot and a first mounting square device matched with the first convex slot.
Example IV
In this embodiment, when the second protruding slot and the second recessed slot are assembled with the corresponding parts of the second high-current welding member and the second signal welding member, the second high-current welding member includes a first mounting square device matched with the second protruding slot, N second metallized pads matched with all the second high-current slots, and the second signal welding member includes a second PCB board signal end member matched with the second signal position slot and a second sink table matched with the second recessed slot.
Example five
In this embodiment, when the second concave slot hole and the second convex slot hole are assembled with the corresponding parts of the second high-current welding member and the second high-current signal welding member respectively, the second high-current welding member includes a second sinking platform that is mutually matched with the second concave slot hole, N second metallized bonding pads that are matched with all second high-current slot holes, and the second high-current signal welding member includes a second PCB board signal end member that is matched with the slot hole at the second signal position, and a second mounting square device that is matched with the slot hole at the second convex position.
Example six
In this embodiment, a plurality of first PCB signal end pads 223 are disposed on two sides of the first PCB signal end member 221, and a plurality of first side metallized pads 14 corresponding to all the first PCB signal end pads 223 are disposed on the upper and lower sides of the first signal position slot 15.
Example seven
In this embodiment, a plurality of second PCB signal end pads are disposed on two sides of the second PCB signal end member, and a plurality of second side metallized pads corresponding to all the second PCB signal end pads are disposed on upper and lower sides of the slot hole in the second signal position.
This many PCB board assembly structure has reduced upper and lower plywood and has connected required connector, five metals terminal and cable, reduces the required space of complete machine assembly, can prevent the PCB board during the assembly and insert the reflection.
The preferred embodiments of the present application have been described above with reference to the accompanying drawings, and are not thereby limiting the scope of the claims of the present application. Any modifications, equivalent substitutions and improvements made by those skilled in the art without departing from the scope and spirit of the present application shall fall within the scope of the claims of the present application.
Claims (7)
1. The multi-PCB assembly structure is characterized by comprising a PCB upper layer plate, a PCB lower layer plate and a PCB connecting plate; the PCB upper layer plate comprises a PCB upper layer plate main body, a first protruding slot hole, N first high-current through slot holes, a first signal position slot hole and a first lower slot hole which are formed in a main mounting surface of the PCB upper layer plate main body, and the PCB lower layer plate comprises a PCB lower layer plate main body, a second protruding slot hole, N second high-current through slot holes, a second signal position slot hole and a second lower slot hole which are formed in a main mounting surface of the PCB lower layer plate main body; the PCB connecting plate comprises a connecting plate main body, a first high-current welding component and a first communication welding component which are arranged at one end of the connecting plate main body, and a second high-current welding component and a second communication signal welding component which are arranged at the other end of the connecting plate main body; the N first high-current through slots are assembled and welded with corresponding parts of the first high-current through welding members, and the first signal position slots are assembled and welded with corresponding parts of the first high-current through welding members; the N second high-current slotted holes are assembled and welded with corresponding parts of the second high-current welding members, and the second signal position slotted holes are assembled and welded with corresponding parts of the second high-current welding members;
the first protruding slot and the first lower slot are respectively assembled with corresponding parts of the first high-current welding component and the first communication welding component, or the first lower slot and the first protruding slot are respectively assembled with corresponding parts of the first high-current welding component and the first communication welding component; the second protruding slot hole and the second recessed slot hole are respectively assembled with corresponding parts of the second high-current welding component and the second signal welding component, or the second recessed slot hole and the second protruding slot hole are respectively assembled with corresponding parts of the second high-current welding component and the second signal welding component.
2. The multi-PCB assembly structure of claim 1, wherein when the first raised slots and the first lower recessed slots are assembled with the corresponding portions of the first high current pass solder member and the first low current pass solder member, respectively, the first high current pass solder member includes a first mounting square device mated with the first raised slots, N first metallized pads mated with all the first high current pass slots, and the first low current pass solder member includes a first PCB signal end member mated with the first signal position slots, a first countersink mated with the first lower recessed slots.
3. The multi-PCB assembly structure of claim 1, wherein when the first lower recess slot and the first protruding slot are assembled with the corresponding portions of the first high current passing solder member and the first high current passing solder member, respectively, the first high current passing solder member includes a first sink table that is mated with the first lower recess slot, N first metallized pads that are mated with all of the first high current passing slots, and the first high current passing solder member includes a first PCB signal end member that is mated with the first signal position slot, a first mounted square device that is mated with the first protruding slot.
4. The multi-PCB assembly structure of claim 1, wherein when the second raised slot and the second recessed slot are assembled with the corresponding portions of the second high current solder member and the second signal solder member, respectively, the second high current solder member includes a first mounted square device mated with the second raised slot, N second metallized pads mated with all the second high current slots, and the second signal solder member includes a second PCB signal end member mated with the second signal position slot, and a second countersink mated with the second recessed slot.
5. The multi-PCB assembly structure of claim 1, wherein when the second recessed slot and the second raised slot are assembled with the corresponding portions of the second high current solder member and the second signal solder member, respectively, the second high current solder member includes a second sink table that mates with the second recessed slot, N second metallized pads that mate with all the second high current slots, and the second signal solder member includes a second PCB signal end member that mates with the second signal position slot, a second mounting square device that mates with the second raised slot.
6. A multi-PCB assembly structure according to claim 2 or 3, wherein a plurality of first PCB signal end pads are provided on both sides of the first PCB signal end member, and a plurality of first side metallized pads corresponding to all of the first PCB signal end pads are provided on upper and lower sides of the first signal position slot.
7. The multi-PCB assembly structure of claim 4 or 5, wherein a plurality of second PCB signal end pads are disposed on both sides of the second PCB signal end member, and a plurality of second side metallized pads corresponding to all of the second PCB signal end pads are disposed on upper and lower sides of the second signal position slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321409205.6U CN220254765U (en) | 2023-06-05 | 2023-06-05 | Multi-PCB assembly structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321409205.6U CN220254765U (en) | 2023-06-05 | 2023-06-05 | Multi-PCB assembly structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220254765U true CN220254765U (en) | 2023-12-26 |
Family
ID=89227304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321409205.6U Active CN220254765U (en) | 2023-06-05 | 2023-06-05 | Multi-PCB assembly structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220254765U (en) |
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2023
- 2023-06-05 CN CN202321409205.6U patent/CN220254765U/en active Active
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