CN205793613U - A high frequency impedance circuit board - Google Patents

Abstract

The utility model relates to a high-frequency impedance circuit board, which belongs to the field of circuit boards and comprises an aluminum substrate, wherein the top of the aluminum substrate is provided with an aluminum oxide ceramic plate, the top of the aluminum oxide ceramic plate is provided with an organic resin plate, the top of the organic resin plate is provided with a plurality of plug-in grooves, the bottom of the inner cavity of the plug-in groove is provided with a plug-in anode interface terminal and a plug-in cathode interface terminal, the top of the organic resin plate is connected with a heat dissipation device through a bracket, the top of the heat dissipation device is provided with a heat dissipation controller, one side of the heat dissipation controller is provided with a temperature sensor, the other side of the heat dissipation controller is provided with a temperature controller, the heat dissipation controller has good heat conductivity and high stability, can not be broken down by high frequency, can not affect signal transmission, simultaneously, the heat, the practicability is strong.

Description

A high frequency impedance circuit board

technical field

The utility model relates to a high-frequency impedance circuit board, which belongs to the field of circuit boards.

Background technique

With the rapid development of the electronics industry, the improvement of integrated circuit integration and the advancement of assembly technology, the changes in electronic products are changing with each passing day, and they are constantly trending towards light, thin, short, small, and high-frequency development. Technology has become an inevitable development trend. The PCB board supported by electronic components is no longer a simple electrical interconnection device. The PCB demand side is no longer satisfied with the "open'&" short" quality localization. It is more necessary to have the function of signal transmission, and it is becoming more and more important. If the impedance value is too large, the signal transmission will be lost, and it is necessary to prevent the insulation layer from being broken down. At the same time, the heat generation of electronic components is also increasing, making As the assembly density of circuit boards continues to rise, the heat dissipation problem is becoming more and more serious. Good heat dissipation measures can effectively improve the heat dissipation performance of circuit boards and improve the life of components. Due to the shrinking size of electronic products and the continuous increase in chip frequency Rising, with the rapid development of high-integration and high-performance electronic equipment, the volume of electronic components is getting smaller and smaller, and the requirements for working speed and efficiency are getting higher and higher. Correspondingly, the heat generation of electronic components is also increasing. As a result, the assembly density of circuit boards continues to rise, resulting in more and more serious heat dissipation problems. Good heat dissipation measures can effectively improve the heat dissipation performance of circuit boards and improve the life of components. The circuit boards provided by the prior art cannot Real-time monitoring of the working temperature of the circuit board, and timely and effective heat dissipation, the working environment of the circuit board is relatively harsh, and the working stability and reliability are not high, so further improvement is needed.

Contents of the invention

The technical problem to be solved by the utility model overcomes the existing defects, and provides a high-frequency impedance circuit board, which has good thermal conductivity and high stability, will not be broken down by high frequency, and will not affect signal transmission. On the circuit board, the heat is released by the heat sink to obtain an effective heat dissipation effect, and the distance between the electronic components can be effectively separated by setting the plug-in groove, which can effectively solve the problems in the background technology.

In order to solve the above technical problems, the utility model provides the following technical solutions:

A high-frequency impedance circuit board, comprising an aluminum substrate, the top of the aluminum substrate is provided with an alumina ceramic plate, the top of the alumina ceramic plate is provided with an organic resin plate, and the top of the organic resin plate is provided with several plug-in grooves, The bottom of the plug-in groove inner cavity is provided with a plug-in anode interface terminal and a plug-in cathode interface terminal, the top of the organic resin board is connected to the heat sink through a bracket, the top of the heat sink is provided with a heat dissipation controller, and one side of the heat dissipation controller is A temperature sensor is provided, a temperature controller is provided on the other side of the heat dissipation controller, a power supply anode interface and a power supply cathode interface are provided on the top of the heat dissipation device, a heat sink is provided at the bottom of the aluminum substrate, and a heat sink is provided at the bottom of the heat sink There are also support projections.

Furthermore, the aluminum base plate is fixedly connected to the alumina ceramic plate through bolts, and a heat-conducting adhesive is coated therebetween.

Further, a blue glue layer is coated between the aluminum substrate and the heat sink.

Further, the anode interface of the power supply and the cathode interface of the power supply are both electrically connected to the interface end of the circuit board.

Further, the supporting protrusions are made of rubber, and there are at least four supporting protrusions.

The utility model has beneficial effects: good thermal conductivity, high stability, will not be broken down by high frequency, and will not affect signal transmission. Excellent heat dissipation effect, setting the plug-in groove can effectively separate the distance of electronic components, and it will not be affected by high-temperature components during use. The support protrusion can be easily removed when the circuit board is used. The structure is simple, the design is reasonable, and the practicability is strong. .

Description of drawings

The accompanying drawings are used to provide a further understanding of the utility model, and constitute a part of the description, and are used to explain the utility model together with the embodiments of the utility model, and do not constitute a limitation to the utility model.

Fig. 1 is a sectional view of a high-frequency impedance circuit board of the present invention.

Fig. 2 is a top view of a high-frequency impedance circuit board of the present invention.

Labels in the figure: 1, aluminum substrate; 2, alumina ceramic plate; 3, organic resin plate; 4, plug-in groove; 5, plug-in anode interface terminal; 6, plug-in cathode interface terminal; 7, heat dissipation device; 8, heat dissipation Controller; 9. Temperature sensor; 10. Temperature controller; 11. Power supply anode interface; 12. Power supply cathode interface; 13. Heat sink; 14. Support protrusion; 15. Bolt; 16. Thermally conductive adhesive; Blue glue layer.

detailed description

The preferred embodiments of the present utility model are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present utility model, and are not intended to limit the present utility model.

As shown in Figures 1-2, a high-frequency impedance circuit board includes an aluminum substrate 1, and an alumina ceramic plate 2 is arranged on the top of the aluminum substrate 1. The alumina ceramic plate 2 has high temperature resistance, corrosion resistance, and oxidation and other advantages, and the aluminum substrate 1 is fixedly connected to the alumina ceramic plate 2 through bolts 15 to make the circuit board stronger and reduce the impact of vibration, and a thermally conductive adhesive 16 is coated between them, through thermally conductive bonding The agent 16 can be used for heat dissipation. The top of the alumina ceramic plate 2 is provided with an organic resin plate 3. The top of the organic resin plate 3 is provided with a number of plug-in grooves 4, through which electronic devices can be plugged in. The bottom of the inner cavity of the plug-in groove 4 is provided with a plug-in anode interface terminal 5 and a plug-in cathode interface terminal 6. The anode and the cathode are correctly plugged in to prevent reverse insertion. For heat dissipation, a heat dissipation controller 8 is provided on the top of the heat dissipation device 7 to control heat dissipation. A temperature sensor 9 is provided on one side of the heat dissipation controller 8 to sense the current temperature of the circuit board. The other side of the heat dissipation controller 8 A temperature controller 10 is provided on the side, which can control the temperature of the circuit board. The top of the heat sink 8 is also provided with a power supply anode interface 11 and a power supply cathode interface 12 to prevent reverse connection of the power supply. The power supply anode interface 11 and the power supply cathode interface 12 Both are electrically connected to the interface end of the circuit board, and by connecting with the interface end, it is convenient to supply power to the cooling device.

The bottom of the aluminum base plate 1 is provided with a heat sink 13, which can dissipate heat in time. A blue glue layer 17 is coated between the aluminum base plate 1 and the heat sink 13, and the blue glue layer 17 can effectively prevent circuit welding from being damaged. Damage to the circuit board, the bottom of the heat sink 13 is also provided with a supporting protrusion 14, which can support the circuit board, leaving a gap, which is conducive to the dissipation of heat. The number of the supporting protrusions 14 is at least four , it is convenient to take and place the circuit board through the support protrusion 14, and the support protrusion 14 is made of rubber material, which can prevent slipping.

When the utility model is in use, by setting the thermally conductive adhesive 16 and the heat sink 13, the thermal conductivity is good, the stability is high, it will not be broken down by high frequency, and the signal transmission will not be affected. On the top, the heat is discharged by means of the cooling device 7 to obtain an effective heat dissipation effect. The distance between the plug-in groove 4 and the electronic components can be effectively separated, and it will not be affected by the components with high temperature during use. The support protrusion 14 is in the circuit The board can be easily removed during use, has simple structure, reasonable design and strong practicability.

The above is a preferred embodiment of the utility model, and those skilled in the art of the utility model can also change and modify the above-mentioned implementation. Therefore, the utility model is not limited to the above-mentioned specific implementation. Any obvious improvement, replacement or modification made on the basis of the present utility model belongs to the protection scope of the present utility model.

Claims (5)

1. null1. a high-frequency resistance circuit board，Including aluminium base (1)，It is characterized in that，Described aluminium base (1) top is provided with alumina ceramic plate (2)，Described alumina ceramic plate (2) top is provided with organic resin plate (3)，Described organic resin plate (3) is if top is provided with stem plug groove (4)，Described plug-in unit groove (4) intracavity bottom is provided with plug-in unit anode Interface Terminal (5) and plug-in unit negative electrode Interface Terminal (6)，Described organic resin plate (3) top connects heat abstractor (7) by support，Described heat abstractor (7) top is provided with radiating control device (8)，Described radiating control device (8) side is provided with temperature sensor (9)，Described radiating control device (8) opposite side is provided with temperature controller (10)，Described heat abstractor (7) top is additionally provided with power anode interface (11) and power cathode interface (12)，Described aluminium base (1) bottom is provided with fin (13)，Described fin (13) bottom is additionally provided with support protrusion (14).
2. A kind of high-frequency resistance circuit board, it is characterised in that: described aluminium base (1) is fixed with alumina ceramic plate (2) by bolt (15) and is connected, and between scribble thermoconductive glue (16).
3. A kind of high-frequency resistance circuit board, it is characterised in that: scribble blue glue-line (17) between described aluminium base (1) and described fin (13).
4. A kind of high-frequency resistance circuit board, it is characterised in that: described power anode interface (11), power cathode interface (12) are all electrically connected with circuit board interface end.
5. A kind of high-frequency resistance circuit board, it is characterised in that: described support protrusion (14) uses quality of rubber materials, and the number of described support protrusion (14) is at least provided with four.