CN206314056U - A kind of circuit board of intelligent heat dissipation - Google Patents
A kind of circuit board of intelligent heat dissipation Download PDFInfo
- Publication number
- CN206314056U CN206314056U CN201621262744.1U CN201621262744U CN206314056U CN 206314056 U CN206314056 U CN 206314056U CN 201621262744 U CN201621262744 U CN 201621262744U CN 206314056 U CN206314056 U CN 206314056U
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- CN
- China
- Prior art keywords
- circuit board
- groove
- base plate
- cooling piece
- heat dissipation
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Abstract
The utility model discloses a kind of circuit board of intelligent heat dissipation, including circuit board body, the circuit board body includes base plate and enclosing cover, the enclosing cover is nested in outside base plate, it is the structure being fully sealed between enclosing cover and base plate, the base plate is provided with the groove of temperature detector and S-shaped, the groove is provided with the closure of the S-shaped corresponding with the shape of groove, one end of the groove is provided with through hole, several equally distributed cooling pieces are provided with groove, it is serially connected between the cooling piece, the temperature detector is connected by electric wire by through hole with cooling piece.The utility model good airproof performance, will not produce dust stratification in circuit board, and circuit board is radiated using the cooling piece of series connection, can effectively strengthen radiating effect.
Description
Technical field
The utility model is related to circuit board technology field, and in particular to a kind of circuit board of intelligent heat dissipation.
Background technology
At present, circuit board typically uses epoxy resin fiberglass cloth as base material, then printed circuit is formed with base material,
This usual heat dispersion of circuit board is poor, it is impossible to be connected with the electronic component for having heating higher, when the component on circuit board leads to
Electricity will inevitably produce substantial amounts of heat after work a period of time, if heat can not be discharged in time, may result in electricity
Road runnability declines, or even triggers failure, damages circuit board, the normal service life of reduction circuit plate, and circuit board is wide
General is applied in electronics manufacturing enterprise, and circuit board is typically connected with the electric elements of many by welding manner, in circuit board
Because external environment influences when installing and using, can be piled up on circuit board and electric elements and be paved with thicker dust, can not only influenceed
The normal work of electric elements, but also short trouble can be caused, so as to reduce the service life of circuit board and electric elements,
The also more inconvenience when being purged to dust simultaneously, it is careless slightly to damage electric elements.
Utility model content
The utility model is in order to solve the above problems, there is provided one kind can effectively prevent circuit board because of environment or use
The dust stratification problem that journey is brought, and it is capable of the circuit board of effective automatic heat radiation.
The utility model is adopted the following technical scheme that：
A kind of circuit board of intelligent heat dissipation, including circuit board body, the circuit board body include base plate and enclosing cover, described
Enclosing cover is nested in outside base plate, is the structure that is fully sealed between enclosing cover and base plate, and the base plate is provided with the recessed of temperature detector and S-shaped
Groove, the groove is provided with the closure of the S-shaped corresponding with the shape of groove, and one end of the groove is provided with through hole, groove
Several equally distributed cooling pieces are inside provided with, are serially connected between the cooling piece, the temperature detector is by through hole by electric wire
It is connected with cooling piece.
Used as a kind of optimal technical scheme of the present utility model, the length of the groove of the S-shaped accounts for circuit board body length
3/4~4/5.
Used as a kind of optimal technical scheme of the present utility model, the closure is made up of completely waterproof material.
Used as a kind of optimal technical scheme of the present utility model, the cooling piece is semiconductor chilling plate.
The beneficial effects of the utility model are：
The utility model simple structure, will be set to the structure being fully sealed between base plate and enclosing cover, can effectively prevent
Only the dust accretions in environment on circuit boards, cooling piece are arranged in the groove of S-shaped, and the length of the groove of S-shaped is whole
The 3/4~4/5 of individual circuit board body length, can cause the refrigeration of circuit board faster, evenly, it is to avoid circuit board occur
The situation that upper part is caught a cold or is heated, and cooling piece using series connection by the way of connect, the refrigeration of cooling piece can be caused more
It is good；Temperature detector is provided with circuit boards, temperature detector is connected with cooling piece, when the temperature on circuit board is higher, temperature detector will be believed
Number cooling piece is sent to, then cooling piece work, lowers the temperature to circuit board, when the temperature of circuit board reaches normal value, temperature-sensitive
Device transmits signals to cooling piece again, then cooling piece is stopped, it is possible thereby to effectively prevent cooling piece from freezing excessively and producing
The phenomenons such as frosting, thus, it is possible to realize increasingly automated refrigeration；And closure is made up of completely waterproof material, even if occurring
Surprisingly cause cooling piece transition to be freezed and cause frosting in groove, it is also ensured that the safety of circuit board.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the circuit board of intelligent heat dissipation of the utility model；
Symbol description in figure：
Base plate 1, enclosing cover 2, temperature detector 3, groove 4, closure 5, through hole 6, cooling piece 7.
Specific embodiment
The utility model row is further described presently in connection with accompanying drawing.
As shown in figure 1, a kind of circuit board of intelligent heat dissipation, including circuit board body, the circuit board body includes base plate 1
With enclosing cover 2, the enclosing cover 2 is nested in outside base plate 1, is the structure being fully sealed between enclosing cover 2 and base plate 1, is set on the base plate 1
There is the groove 4 of temperature detector 3 and S-shaped, the groove 4 is provided with the closure 5 of the S-shaped corresponding with 4 shapes of groove, described recessed
One end of groove 4 is provided with through hole 6, groove 4 and is provided with several equally distributed cooling pieces 7, is mutually gone here and there between the cooling piece 7
Connection, the temperature detector 3 is connected by electric wire by through hole 6 with cooling piece 7.
The length of the groove 4 of the S-shaped accounts for the 4/5 of circuit board body length.
The closure 5 is made up of completely waterproof material.
The cooling piece 7 is semiconductor chilling plate.
Finally it should be noted that：These implementation methods are merely to illustrate the utility model without limiting model of the present utility model
Enclose.Additionally, to those of ordinary skill in the art, other multi-forms can also be made on the basis of the above description
Change changes.There is no need and unable to be exhaustive to all of implementation method.And thus amplify out it is obvious
Among change or variation are still in protection domain of the present utility model.
Claims (4)
1. a kind of circuit board of intelligent heat dissipation, including circuit board body, it is characterised in that：The circuit board body includes base plate
(1) and enclosing cover (2), the enclosing cover (2) is nested in base plate (1) outward, is the structure being fully sealed between enclosing cover (2) and base plate (1),
The base plate (1) is provided with the groove (4) of temperature detector (3) and S-shaped, and the groove (4) is provided with relative with the shape of groove (4)
The closure (5) of the S-shaped answered, one end of the groove (4) is provided with through hole (6), groove (4) that to be provided with several equally distributed
Cooling piece (7), is serially connected between the cooling piece (7), and the temperature detector (3) is by through hole (6) by electric wire and cooling piece (7)
It is connected.
2. the circuit board of a kind of intelligent heat dissipation according to claim 1, it is characterised in that：The length of the groove (4) of the S-shaped
Degree accounts for the 3/4~4/5 of circuit board body length.
3. the circuit board of a kind of intelligent heat dissipation according to claim 1, it is characterised in that：The closure (5) is by complete
The material of waterproof is made.
4. the circuit board of a kind of intelligent heat dissipation according to claim 1, it is characterised in that：The cooling piece (7) is partly to lead
Body cooling piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621262744.1U CN206314056U (en) | 2016-11-24 | 2016-11-24 | A kind of circuit board of intelligent heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621262744.1U CN206314056U (en) | 2016-11-24 | 2016-11-24 | A kind of circuit board of intelligent heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206314056U true CN206314056U (en) | 2017-07-07 |
Family
ID=59244730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621262744.1U Active CN206314056U (en) | 2016-11-24 | 2016-11-24 | A kind of circuit board of intelligent heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206314056U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109379836A (en) * | 2018-10-29 | 2019-02-22 | 付秀华 | Pipeline type electron plate |
| CN115460762A (en) * | 2022-09-27 | 2022-12-09 | 维沃移动通信有限公司 | Circuit board device and electronic equipment |
-
2016
- 2016-11-24 CN CN201621262744.1U patent/CN206314056U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109379836A (en) * | 2018-10-29 | 2019-02-22 | 付秀华 | Pipeline type electron plate |
| CN109379836B (en) * | 2018-10-29 | 2021-09-07 | 义乌市嘉诗电子科技有限公司 | Pipeline type electronic board |
| CN115460762A (en) * | 2022-09-27 | 2022-12-09 | 维沃移动通信有限公司 | Circuit board device and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Radiating circuit board of intelligence Effective date of registration: 20180905 Granted publication date: 20170707 Pledgee: Zhejiang Tonglu Hengfeng village bank Limited by Share Ltd Pledgor: HANGZHOU TIANFENG ELECTRONICS CO., LTD. Registration number: 2018330000260 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210122 Granted publication date: 20170707 Pledgee: Zhejiang Tonglu Hengfeng village bank Limited by Share Ltd. Pledgor: HANGZHOU TIANFENG ELECTRONICS Co.,Ltd. Registration number: 2018330000260 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |