JP2001142574A - Electronic instrument - Google Patents
Electronic instrumentInfo
- Publication number
- JP2001142574A JP2001142574A JP32775999A JP32775999A JP2001142574A JP 2001142574 A JP2001142574 A JP 2001142574A JP 32775999 A JP32775999 A JP 32775999A JP 32775999 A JP32775999 A JP 32775999A JP 2001142574 A JP2001142574 A JP 2001142574A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- housing
- fan
- keyboard
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、筐体内に発熱素子
を搭載した配線基板、キーボード、ファンなどを収容し
た電子装置の冷却構造に係り、発熱素子の発生する熱を
放熱する冷却構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for an electronic device in which a wiring board, a keyboard, a fan, and the like, in which a heating element is mounted in a housing, and to a cooling structure for radiating heat generated by the heating element.
【０００２】[0002]
【従来の技術】携帯型パーソナルコンピュータなどに代
表される電子装置では、性能の向上による素子の高発熱
化とともに、装置の薄型化、軽量化の傾向がある。2. Description of the Related Art In electronic devices typified by portable personal computers and the like, there is a tendency for devices to generate more heat due to improved performance and to be thinner and lighter.
【０００３】従来の技術は、特開平８−２８６７８３に
見られるように、発熱素子を搭載した第１の筐体内底部
に放熱板を設置し、発生した熱を発熱素子から筐体底部
の放熱板及びキーボード底面に熱伝導して、筐体表面で
熱を広げて筐体の外部へ放熱している。特開平８−２６
３１６２には、筐体内にファンを収容し、発熱素子の発
生した熱を放出する例が開示されている。In the prior art, as disclosed in Japanese Patent Application Laid-Open No. HEI 8-286833, a heat radiating plate is provided at the bottom inside a first housing on which a heating element is mounted, and generated heat is transferred from the heating element to the heat radiating plate at the bottom of the housing. In addition, heat is conducted to the bottom surface of the keyboard, spreads heat on the surface of the housing, and radiates heat to the outside of the housing. JP-A-8-26
3162 discloses an example in which a fan is housed in a housing and the heat generated by the heating element is released.
【０００４】[0004]
【発明が解決しようとする課題】上記特開平８−２８６
７８３の例では、筐体表面が放熱面であるため、放熱面
積が筐体サイズに限定されてしまう。すなわち、自然冷
却のため放熱量の上限が一意的に決まってしまい、放熱
量の限界以上で素子を動作させることが不可能となる。
従って、素子の高性能化に伴い、発熱素子の冷却が困難
となり、電子装置の高性能化が妨げられる。さらに、筐
体表面温度分布が不均一になり、発熱素子近傍に局所的
に高温部が発生する問題もあった。SUMMARY OF THE INVENTION The above-mentioned JP-A-8-286
In the example of 783, since the surface of the housing is a heat dissipation surface, the heat dissipation area is limited to the size of the housing. That is, the upper limit of the amount of heat radiation is uniquely determined due to natural cooling, and it becomes impossible to operate the element at or above the limit of the amount of heat radiation.
Therefore, as the performance of the element increases, it becomes difficult to cool the heating element, which hinders the performance of the electronic device. Further, there is a problem that the temperature distribution on the surface of the housing becomes non-uniform, and a high-temperature portion is locally generated near the heating element.
【０００５】また、特開平８−２６３１６２の例では、
筐体サイズの薄型化のためファンを横置きに収容してい
る。しかし、素子の高性能化に伴い、発熱量が大きくな
る場合、発熱素子に効果的に冷却風を供給するためファ
ンを発熱素子近傍に配置しなければならず、筐体内の部
品レイアウトに大きな制約ができるという問題があっ
た。たとえば、発熱素子が、筐体の端部から離れた位置
に実装された場合、ファンを発熱素子近傍に設置すると
筐体内部の温度上昇した空気が発熱素子に供給されるこ
とになる。すなわち、温度上昇していない外気の供給に
よって発熱素子を冷却することについては考慮されてい
なかった。In the example of Japanese Patent Application Laid-Open No. 8-263162,
The fan is housed horizontally to reduce the size of the housing. However, if the amount of heat generation increases with the performance of the element, a fan must be arranged near the heat generation element in order to effectively supply cooling air to the heat generation element, which greatly restricts the layout of components in the housing. There was a problem that can be. For example, when the heating element is mounted at a position distant from the end of the housing, if the fan is installed near the heating element, the heated air inside the housing will be supplied to the heating element. That is, no consideration has been given to cooling the heating element by supplying outside air whose temperature has not risen.
【０００６】本発明の目的は、電子装置の処理性能向上
に伴う装置の発熱量増大に対して、温度上昇していない
外気の供給によって発熱素子の温度を所定の温度に冷却
するとともに筐体表面の温度上昇を抑える薄型筐体に適
した構造を提供することである。SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for cooling a heating element to a predetermined temperature by supplying outside air which has not risen in temperature while increasing the heat generation of the apparatus accompanying the improvement of the processing performance of an electronic apparatus, and to reduce the temperature of a housing surface. It is an object of the present invention to provide a structure suitable for a thin housing that suppresses a temperature rise of the device.
【０００７】[0007]
【課題を解決するための手段】発熱素子を搭載した配線
基板、キーボード、発熱素子の放熱部材などを収容した
筐体内に、筐体の内壁面もしくはキーボード背面に、放
熱部材を介して発熱素子と熱的に接続された放熱板を設
置するとともに、筐体端部近傍にファンを配置した。こ
こで、放熱板と筐体表面とは、発熱素子の直下もしくは
直上部で接触せず、外周部で接触するようにした。この
ため筐体表面の温度が局所的に上昇することはない。Means for Solving the Problems In a housing containing a wiring board on which a heating element is mounted, a keyboard, and a heat dissipation member for the heating element, the heating element is connected to the inner wall surface of the housing or the back of the keyboard via a heat dissipation member. A heat sink connected thermally was installed, and a fan was arranged near the end of the housing. Here, the heat radiating plate and the housing surface did not contact directly below or directly above the heating element, but contacted at the outer peripheral portion. Therefore, the temperature of the housing surface does not rise locally.
【０００８】また、筐体の内壁面もしくはキーボード背
面に、放熱部材を介して発熱素子両面に発熱素子と熱的
に接続された放熱板を設置するとともに、筐体端部近傍
に設けたファンと、少なくとも一方の放熱板が熱的に接
続するようにした。これにより、電子装置筐体内の発熱
部材で発生した熱は、発熱部材に接続された放熱部材を
介して筐体内壁面ならびにキーボード背面に設置された
放熱板に伝熱され、放熱板で放熱板の面方向に拡散され
た後、ファンにより外気に放熱される。In addition, a heat radiating plate is provided on the inner wall surface of the housing or on the back of the keyboard via heat radiating members on both sides of the heating element, and a fan provided near the end of the housing. At least one of the heat sinks is thermally connected. As a result, the heat generated by the heat generating member in the electronic device housing is transferred to the heat radiating plate installed on the inner wall surface of the housing and the back of the keyboard via the heat radiating member connected to the heat generating member, and the heat radiating plate generates heat. After being diffused in the plane direction, the heat is radiated to the outside air by the fan.
【０００９】このとき、放熱板の発熱素子直下もしくは
直上部以外の外周部で筐体表面に接触するようにした。
これにより、発熱素子の熱は、一旦、放熱板外周方向に
拡散した後、筐体表面からも外気に放熱される。At this time, the outer peripheral portion of the heat sink other than immediately below or directly above the heating element is brought into contact with the housing surface.
As a result, the heat of the heat generating element is once diffused in the outer peripheral direction of the heat radiating plate and then radiated to the outside air from the housing surface.
【００１０】また、前記放熱板と筐体壁面にファンの冷
却風が流動できる間隙を設けた。これにより放熱板およ
び筐体壁面が冷却され、面方向の見掛けの熱伝導が向上
し、筐体表面の温度上昇が抑制される。[0010] Further, a gap is provided between the heat radiating plate and the casing wall so that the cooling air of the fan can flow. As a result, the heat radiating plate and the housing wall surface are cooled, apparent heat conduction in the surface direction is improved, and a rise in the temperature of the housing surface is suppressed.
【００１１】さらに、前記発熱素子の直下もしくは直上
部の放熱板と筐体の隙間とファンの間に冷却風が流動で
きるように前記隙間を形成した。これにより、発熱素子
近傍の冷却効率が向上する。Further, the gap is formed so that cooling air can flow between the fan and the gap between the radiator plate immediately below or directly above the heating element and the housing and the fan. Thereby, the cooling efficiency near the heating element is improved.
【００１２】また、発熱素子両面に発熱素子と熱的に接
続された放熱板を設置するとともに、ファンを両放熱板
と熱的に接続したので、両放熱板の熱がファンとの接続
部分でファンを介して互いに分配されてファンで放熱さ
れる。従って、両放熱板の温度が平均化され、放熱板が
設置された筐体表面の温度上昇が抑制される。In addition, since a radiator plate thermally connected to the heat generating element is provided on both sides of the heat generating element and the fan is thermally connected to both the heat radiator plates, the heat of both the heat radiator plates is transferred to the connecting portion with the fan. The heat is dissipated by the fan through the fan. Therefore, the temperatures of the heat sinks are averaged, and the temperature rise on the surface of the housing on which the heat sinks are installed is suppressed.
【００１３】また、前記放熱板にヒートパイプを一体成
形または固定し、放熱板の面方向の熱伝導を向上するこ
ともできる。Further, a heat pipe may be integrally formed or fixed to the heat radiating plate to improve heat conduction in a plane direction of the heat radiating plate.
【００１４】[0014]
【発明の実施の形態】本発明の実施例を図１および図２
に示す。図１に本実施例の電子装置の平面図、図２に本
実施例の断面図を示す。本実施例では、ＣＰＵ１及び複
数の素子（図示せず）を搭載しているメイン配線基板１
２、キーボード１４などを収容した筐体１００からな
る。筐体１００の底面部には、第１の放熱板１１が敷設
されている。第１の放熱板１１は、できるだけ大きい面
積であることが望ましく、必要に応じて筐体底面とほぼ
同面積で、さらに筐体背面まで設置されてもよい。筐体
１００は、それ自体をＭｇ合金などの高熱伝導性材料で
成形してもよい。また、キーボード１４背面に第２の放
熱板１３が敷設されている。ＣＰＵ１は、メイン配線基
板１２上のキーボード側に実装され、ＣＰＵ１の実装さ
れたメイン配線基板１２背面は、柔軟熱伝導部材（たと
えばＳｉゴムに酸化アルミなどのフィラーを混入したも
の）３を介して第１の放熱板１１と熱的に接続される。
一方、 ＣＰＵ１は、柔軟熱伝導部材２を介してキーボ
ード１４背面に設置した第２の放熱板１３に熱的に接続
される。第１の放熱板１１と筐体底面、及び、第２の放
熱板１３とキーボード１４背面とは、ＣＰＵ１の直下も
しくは直上部で接触せず（空間２１、２２を設け）、外
周部で接触するようにした。また、ファン１６が、筐体
１００内部の端部近傍に設置されている。ファン16は、
放熱板161がファンケースと一体で形成されており、放熱
板161が第２の放熱板1３と高熱伝導性のシート、グリー
スなどを介して熱的に接触している。また、ファン16は、
ファンの回転軸が筐体底面に対して概略垂直になるよう
に設置される。したがって、筐体の厚さ（高さ）以上の
口径を持つファンが搭載できるため、高い冷却性能を得
ることができる。また、ファン16は、ファン側面から排
気する構造となっており、筐体側面に設けられた空気排
気口１０１から筐体外部に排気される。ファン吸気は、
図２では、メイン配線基板１２と筐体底面に形成される
空間から吸気する例を示した（空気は図中の矢印の方向
に概略流れる。）が、ファンを第１の放熱板に取り付け
メイン配線基板１２とキーボードとの間に形成される空
間から吸気するようにしてもよい。また、両空間から吸
気するようにしてもよい。1 and 2 show an embodiment of the present invention.
Shown in FIG. 1 is a plan view of the electronic device of the present embodiment, and FIG. 2 is a cross-sectional view of the present embodiment. In this embodiment, the main wiring board 1 on which the CPU 1 and a plurality of elements (not shown) are mounted
2, a housing 100 containing the keyboard 14 and the like. A first heat sink 11 is laid on the bottom of the housing 100. The first radiator plate 11 preferably has an area as large as possible, and if necessary, may have an area approximately equal to the bottom surface of the housing, and may be installed to the rear surface of the housing. The housing 100 may be formed of a highly heat conductive material such as an Mg alloy. The second heat sink 13 is laid on the back of the keyboard 14. The CPU 1 is mounted on the keyboard side of the main wiring board 12, and the rear surface of the main wiring board 12 on which the CPU 1 is mounted is connected via a flexible heat conductive member (for example, a mixture of Si rubber and a filler such as aluminum oxide) 3. Thermally connected to first heat sink 11.
On the other hand, the CPU 1 is thermally connected to the second heat sink 13 provided on the back of the keyboard 14 via the flexible heat conductive member 2. The first radiator plate 11 and the bottom surface of the housing, and the second radiator plate 13 and the back surface of the keyboard 14 do not contact directly below or directly above the CPU 1 (provided with the spaces 21 and 22) but come into contact at the outer peripheral portion. I did it. Further, the fan 16 is installed near the end inside the housing 100. Fan 16
The radiator plate 161 is formed integrally with the fan case, and the radiator plate 161 is in thermal contact with the second radiator plate 13 via a highly thermally conductive sheet, grease, or the like. In addition, fan 16
The fan is installed such that the rotation axis of the fan is substantially perpendicular to the bottom of the housing. Therefore, since a fan having a diameter larger than the thickness (height) of the housing can be mounted, high cooling performance can be obtained. Further, the fan 16 has a structure in which air is exhausted from the side of the fan, and is exhausted to the outside of the housing from an air exhaust port 101 provided on the side of the housing. Fan intake
FIG. 2 shows an example in which air is taken in from the space formed in the main wiring board 12 and the housing bottom (air flows roughly in the direction of the arrow in the figure). Air may be taken from a space formed between the wiring board 12 and the keyboard. Further, air may be taken from both spaces.
【００１５】ＣＰＵ１で発生した熱は、柔軟熱伝導部材
２、３を介して筐体底面ならびにキーボード背面に設置
された第１及び第２の放熱板１１、１３に伝熱され、放
熱板１１、１３で放熱板の面方向に拡散された後、筐体
壁面及びキーボードを介して外気に放熱される。この
時、第１及び第２の放熱板と筐体壁面及びキーボード背
面とは、ＣＰＵ１の直下もしくは直上部で接触しないた
め、筐体底面及びキーボード表面の温度が局所的に上昇
することはない。この効果は、筐体材料を金属製（例え
ば、Ｍｇ合金、Ａｌ合金など）にした場合に、特に、有
効である。筐体表面が同一温度であっても、人が触れた
時に感じる温度は、樹脂より金属のほうが高く感じるか
らである。また、ファン１６は、ファン放熱板161を介
して第２の放熱板１３を冷却するので、ＣＰＵ１を冷却
するとともにキーボード表面温度の上昇を抑えることが
できる。また、メイン配線基板１２と筐体底面に形成さ
れる空間から吸気することによって、筐体底面側の温度
上昇した空気が排気され、筐体底面側の冷却も行える。The heat generated by the CPU 1 is transferred to first and second heat radiating plates 11 and 13 provided on the bottom surface of the housing and the back of the keyboard via the flexible heat conducting members 2 and 3, and the heat radiating plates 11 and 13 are provided. After being diffused in the surface direction of the heat radiating plate at 13, the heat is radiated to the outside air via the housing wall surface and the keyboard. At this time, the first and second heat sinks do not contact the housing wall surface and the keyboard rear surface directly below or directly above the CPU 1, so that the temperatures of the housing bottom surface and the keyboard surface do not locally increase. This effect is particularly effective when the casing material is made of a metal (for example, an Mg alloy, an Al alloy, or the like). This is because, even if the surface of the housing is the same temperature, the temperature felt by a person when touched is higher for metal than for resin. Further, since the fan 16 cools the second heat radiating plate 13 via the fan heat radiating plate 161, it is possible to cool the CPU 1 and suppress a rise in the keyboard surface temperature. Further, by inhaling air from the space formed between the main wiring board 12 and the bottom surface of the housing, the heated air on the bottom surface side of the housing is exhausted, and the bottom surface of the housing can be cooled.
【００１６】図３の実施例は、図２の場合と同様な構成
であるが、ファンによる冷却効果をさらに高めた例であ
る。第２の放熱板にヒートパイプ３０を固定（もしく
は、一体成形、あるいは放熱板自体を偏平形状のヒート
パイプとしてもよい）した。ヒートパイプにより、ＣＰ
Ｕ１からファン１６までの熱拡散効果を増大し、ファン
による放熱割合を増大させることができる。これによ
り、ＣＰＵの放熱効果を高めるとともに、キーボード表
面温度の上昇をより抑えることができる。また、ヒート
パイプによる高い熱輸送効果により、ＣＰＵとファンを
必ずしも近接して実装する必要はなく、実装の自由度が
大きくなる。The embodiment of FIG. 3 has the same configuration as that of FIG. 2, but further enhances the cooling effect of the fan. The heat pipe 30 was fixed to the second heat radiating plate (or may be integrally formed, or the heat radiating plate itself may be a flat heat pipe). CP by heat pipe
The heat diffusion effect from U1 to the fan 16 can be increased, and the rate of heat dissipation by the fan can be increased. Thereby, the heat radiation effect of the CPU can be enhanced, and the rise in the keyboard surface temperature can be further suppressed. In addition, due to the high heat transport effect of the heat pipe, it is not always necessary to mount the CPU and the fan close to each other, and the degree of freedom in mounting is increased.
【００１７】他の実施例を図４および図９に示す。図９
は本実施例の裏面図である。図４の実施例は、図２の場
合と同様な構成であるが、第１の放熱板１１と筐体底面
との間に形成する空間２１をＣＰＵ１の直下だけでな
く、ファン近傍まで拡大し、空間を形成している放熱板
のの壁面１７をダクトとし、第１の放熱板１１と筐体底
面との間にファン冷却風の流路２３を形成したものであ
る。この第１の放熱板１１と筐体底面との間の空間にフ
ァンの冷却風が流れる（図中矢印で表示）ことにより、
第１の放熱板１１は、両面が放熱面として作用するた
め、図２の実施例に記した効果に加え、さらに、効果的
な冷却ができる。本構造は、特に、筐体材料を金属製に
した場合に有効である。ＣＰＵの熱は、第１の放熱板１
１から筐体底面に熱伝導され、壁面内に拡散するため、
筐体底面自体も両面から放熱されることになる（筐体内
側：ファンによる冷却、筐体外側：自然放熱）。Another embodiment is shown in FIGS. FIG.
Is a rear view of the present embodiment. The embodiment of FIG. 4 has the same configuration as that of FIG. 2 except that the space 21 formed between the first heat radiating plate 11 and the housing bottom is expanded not only immediately below the CPU 1 but also to the vicinity of the fan. The wall surface 17 of the heat radiating plate forming the space is a duct, and a flow path 23 for fan cooling air is formed between the first heat radiating plate 11 and the bottom surface of the housing. The cooling air of the fan flows into the space between the first heat sink 11 and the bottom of the housing (indicated by the arrow in the figure),
Since both surfaces of the first heat radiating plate 11 function as heat radiating surfaces, in addition to the effects described in the embodiment of FIG. 2, more effective cooling can be performed. This structure is particularly effective when the casing material is made of metal. The heat of the CPU is transferred to the first heat sink 1
Since heat is conducted from 1 to the bottom of the housing and diffuses into the wall,
The bottom surface of the housing itself is also radiated from both sides (inside the housing: cooling by a fan, outside the housing: natural heat dissipation).
【００１８】図５の実施例は、図４の実施例において、
さらに、第１の放熱板１１と筐体底面との間に形成する
ファン冷却風の流路２３に外気導入のための開口２４を
設けたものである。本実施例では、開口２４から、外気
が導入されるため図４の実施例で記した効果がより高く
なる。従って、ＣＰＵ及びＣＰＵ以外の配線基板上に搭
載された発熱素子の冷却、及び、筐体表面の温度上昇抑
制が効果的に行われる。The embodiment of FIG. 5 differs from the embodiment of FIG.
Further, an opening 24 for introducing outside air is provided in a fan cooling air flow path 23 formed between the first heat sink 11 and the housing bottom. In this embodiment, since the outside air is introduced from the opening 24, the effect described in the embodiment of FIG. Therefore, the cooling of the CPU and the heating elements mounted on the wiring board other than the CPU and the suppression of the temperature rise on the surface of the housing are effectively performed.
【００１９】図６に他の実施例を示す。本実施例では、
図３の実施例の構成で、ファン１６をボス２５を用い、
第１及び第２の放熱板１１、１３に取り付ける。ボス２
５は、銅などの熱伝導率の高い金属製であるとともに、
ファン放熱板161に固定されるようにし、第１及び第２
の放熱板１１、１３及びファン放熱板161が互いに熱的
に接続されるようにする。本実施例によれば、第１及び
第２の放熱板１１、１３及びファン放熱板161が互いに
熱的に接続されるため、両放熱板の温度が平均化される
ように第１、第２の放熱板の間で熱が移動する。本実施
例では、第２の放熱板１３にヒートパイプ３０が取り付
けられており、ファン１６には、第２の放熱板を介して
の方が大きい。従って、第２の放熱板から第１の放熱板
の方向に熱が流れる。熱の流れを図中破線矢印で示し
た。すなわち、ファンとの接続部分で、熱が第１、第２
の放熱板の間でファンを介して互いに分配されてファン
で放熱される。したがって、キーボード表面及び筐体底
面の表面温度をともに低く抑えることができる。FIG. 6 shows another embodiment. In this embodiment,
In the configuration of the embodiment shown in FIG.
It is attached to the first and second heat radiating plates 11 and 13. Boss 2
5 is made of metal having high thermal conductivity such as copper,
It is fixed to the fan radiator plate 161 and the first and second
Radiating plates 11, 13 and fan radiating plate 161 are thermally connected to each other. According to the present embodiment, since the first and second radiating plates 11 and 13 and the fan radiating plate 161 are thermally connected to each other, the first and second radiating plates are averaged so that the temperatures of both radiating plates are equalized. Heat moves between the heat sinks. In this embodiment, the heat pipe 30 is attached to the second radiator plate 13, and the fan 16 is larger via the second radiator plate. Therefore, heat flows from the second heat sink to the first heat sink. The flow of heat is indicated by a dashed arrow in the figure. That is, at the connection portion with the fan, the heat is first and second.
Are distributed to each other via a fan between the heat radiating plates and radiated by the fan. Therefore, both the surface temperature of the keyboard surface and the surface temperature of the housing bottom can be suppressed to be low.
【００２０】図７に他の実施例を示す。本実施例は図２
の場合と同様な構成であるが、ＣＰＵ１の直下もしくは
直上部に設けた空間２１、２２に低熱伝導部材４を設置
した。これにより、ＣＰＵ１の直下もしくは直上部で熱
的に接触するが、熱伝導部材４の熱伝導率が低い為、移
動する熱量は少なくヒートスポットは回避される。また
図２の実施例の空間２１、２２の空気による熱の移動に
比べ、低熱伝導部材４により熱伝導されるためより効果
的に熱を移動させることができる。FIG. 7 shows another embodiment. This embodiment is shown in FIG.
However, the low heat conductive member 4 is installed in the spaces 21 and 22 provided directly below or directly above the CPU 1. As a result, thermal contact is made directly below or directly above the CPU 1, but since the thermal conductivity of the heat conducting member 4 is low, the amount of heat to be moved is small and a heat spot is avoided. Further, as compared with the heat transfer by the air in the spaces 21 and 22 in the embodiment of FIG. 2, the heat is transferred by the low heat conductive member 4, so that the heat can be transferred more effectively.
【００２１】図８に他の実施例を示す。本実施例は図２
においてはＣＰＵ１の直下もしくは直上部に設置された
空間２１、２２を，ＣＰＵの直下もしくは直上に設置せ
ず、ＣＰＵから離れた場所に設置し、ＣＰＵ１と空間２
１、２２をヒートパイプ３０にて熱的に接続させた。Ｃ
ＰＵの熱はヒートパイプから放熱板１１、１３に熱伝導
され壁面内に拡散するが、その際ピートパイプ先端部は
直下もしくは直上部において、空間を設けることで、直
接筐体底面やキーボード１４背面と直接接触しないた
め、ヒートスポットを回避できかつ有効に熱を移動させ
ることができる。これはＣＰＵ直下もしくは直上部に構
造上空間を設置するスペースがなかった場合に有効であ
る。FIG. 8 shows another embodiment. This embodiment is shown in FIG.
In the above, the spaces 21 and 22 installed immediately below or directly above the CPU 1 are not installed immediately below or directly above the CPU, but are installed at a location away from the CPU 1.
1 and 22 were thermally connected by a heat pipe 30. C
The heat of the PU is conducted from the heat pipe to the heat radiating plates 11 and 13 and diffuses into the wall surface. At this time, a space is provided directly below or directly above the end of the pete pipe so that the bottom of the casing or the back of the keyboard 14 can be directly provided. Since it does not come into direct contact with heat, heat spots can be avoided and heat can be transferred effectively. This is effective when there is no space for installing a space directly below or directly above the CPU.
【００２２】[0022]
【発明の効果】本発明によれば、発熱素子を効果的に冷
却するとともに、筐体表面の温度上昇を抑えることがで
きる。According to the present invention, it is possible to effectively cool the heating element and to suppress a rise in the temperature of the housing surface.
【図１】本発明の第１実施例の平面図。FIG. 1 is a plan view of a first embodiment of the present invention.
【図２】本発明の第１実施例の断面図。FIG. 2 is a sectional view of the first embodiment of the present invention.
【図３】本発明の第２実施例の断面図。FIG. 3 is a sectional view of a second embodiment of the present invention.
【図４】本発明の第３実施例の断面図。FIG. 4 is a sectional view of a third embodiment of the present invention.
【図５】本発明の第４実施例の断面図。FIG. 5 is a sectional view of a fourth embodiment of the present invention.
【図６】本発明の第５実施例の断面図。FIG. 6 is a sectional view of a fifth embodiment of the present invention.
【図７】本発明の第６実施例の断面図。FIG. 7 is a sectional view of a sixth embodiment of the present invention.
【図８】本発明の第７実施例の断面図。FIG. 8 is a sectional view of a seventh embodiment of the present invention.
【図９】本発明の第３実施例の裏面図。FIG. 9 is a rear view of the third embodiment of the present invention.
１：ＣＰＵ １１：第１の放熱板 １３：第２の放
熱板 １６：ファン １４:キーボード ３０：ヒートパイプ １００：筐
体 １２：配線基板 １０１：吸気口1: CPU 11: First heat sink 13: Second heat sink 16: Fan 14: Keyboard 30: Heat pipe 100: Housing 12: Wiring board 101: Inlet
───────────────────────────────────────────────────── フロントページの続き (72)発明者 浦野 真一 千葉県習志野市東習志野７丁目１番１号 日立京葉エンジニアリング株式会社内 (72)発明者 松岡 達彦 神奈川県海老名市下今泉810番地 株式会 社日立製作所ＰＣ事業部内 Ｆターム(参考） 5E322 AA03 AA11 BA01 BA05 BB03 DB10 FA05 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shinichi Urano 7-1-1, Higashi Narashino, Narashino City, Chiba Prefecture Inside Hitachi Keiyo Engineering Co., Ltd. (72) Tatsuhiko Matsuoka 810 Shimoimaizumi, Ebina City, Kanagawa Prefecture Hitachi, Ltd. F term in the PC Division of the Works (reference) 5E322 AA03 AA11 BA01 BA05 BB03 DB10 FA05
Claims (5)
と、放熱部材を介して熱的に発熱素子が接続された放熱
板と、前記基板と前記キーボードと少なくともひとつの
前記放熱板を層上に収容した筐体からなる電子装置にお
いて、前記放熱板の前記発熱素子に接続する部分を筐体
またはキーボードと接触しないように凹み形状とし、放
熱板と筐体内面または、放熱板とキーボード背面に隙間
を設けたことを特徴とする電子装置。1. A board on which a heating element is mounted, a keyboard, a heat sink to which the heating element is thermally connected via a heat dissipation member, and at least one of the board and the keyboard and at least one of the heat dissipation plates on a layer. In the electronic device including the housing, the portion of the heat sink connected to the heating element has a concave shape so as not to contact the housing or the keyboard, and a gap is formed between the heat sink and the inner surface of the housing or between the heat sink and the back of the keyboard. An electronic device, comprising:
放熱板が筐体内面またはキーボードの背面に熱的に接続
したことを特徴とする電子装置。2. The electronic device according to claim 1, wherein the heat radiating plate is thermally connected to an inner surface of a housing or a back surface of a keyboard except for a portion of the heat radiating plate connected to the heating element.
熱板の少なくともひとつがファン部に熱的に接続されて
いることを特徴とする電子装置。3. The device according to claim 1, further comprising a fan near an end of the housing, wherein at least one of the heat radiating plates is thermally connected to the fan at the fan. Electronic device.
キーボード背面の間に、前記ファンの冷却風の流路を設
けたことを特徴とする電子装置。4. The electronic device according to claim 3, wherein a cooling air flow path for the fan is provided between the heat sink and the inner surface of the housing or between the heat sink and the back of the keyboard. apparatus.
介して熱的に接続する放熱板部の凹み部であり、他方が
ファン部であることを特徴とする電子装置。5. The device according to claim 4, wherein at least one end of the flow path is a concave portion of a heat radiating plate portion to which the heating element is thermally connected via a heat radiating member, and the other is a fan portion. Electronic device characterized by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32775999A JP2001142574A (en) | 1999-11-18 | 1999-11-18 | Electronic instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32775999A JP2001142574A (en) | 1999-11-18 | 1999-11-18 | Electronic instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001142574A true JP2001142574A (en) | 2001-05-25 |
Family
ID=18202681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32775999A Pending JP2001142574A (en) | 1999-11-18 | 1999-11-18 | Electronic instrument |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001142574A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2006203018A (en) * | 2005-01-21 | 2006-08-03 | Matsushita Electric Ind Co Ltd | Method of adjusting surface temperature distribution in electronic apparatus |
| JP2006301715A (en) * | 2005-04-15 | 2006-11-02 | Toshiba Corp | Electronic equipment |
| JP2007027520A (en) * | 2005-07-20 | 2007-02-01 | Nec Access Technica Ltd | Radiator |
| US7280359B2 (en) | 2003-12-11 | 2007-10-09 | Matsushita Electric Industrial Co., Ltd. | Heat-radiating structure of electronic apparatus |
| JP2007286785A (en) * | 2006-04-14 | 2007-11-01 | Fujitsu Ltd | Electronic device and cooling part |
| JP2008084215A (en) * | 2006-09-28 | 2008-04-10 | Fujitsu Ltd | Electronic appliance and cooling component |
| JP2008084216A (en) * | 2006-09-28 | 2008-04-10 | Fujitsu Ltd | Electronic appliance |
| JP2009129378A (en) * | 2007-11-27 | 2009-06-11 | Sony Corp | Heat radiation structure of electronic component, and display device |
| JP2010009430A (en) * | 2008-06-27 | 2010-01-14 | Fujitsu Ltd | Electronic apparatus |
| JP2011040203A (en) * | 2009-08-07 | 2011-02-24 | Sanyo Electric Co Ltd | Battery pack |
| JP2011155089A (en) * | 2010-01-27 | 2011-08-11 | Nec Access Technica Ltd | Housing and electronic device |
| WO2014155685A1 (en) * | 2013-03-29 | 2014-10-02 | 株式会社 東芝 | Display device and electronic device |
| JP2015012250A (en) * | 2013-07-02 | 2015-01-19 | 株式会社村田製作所 | Module and portable device with the same |
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| US7280359B2 (en) | 2003-12-11 | 2007-10-09 | Matsushita Electric Industrial Co., Ltd. | Heat-radiating structure of electronic apparatus |
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| WO2014155685A1 (en) * | 2013-03-29 | 2014-10-02 | 株式会社 東芝 | Display device and electronic device |
| JP2015012250A (en) * | 2013-07-02 | 2015-01-19 | 株式会社村田製作所 | Module and portable device with the same |
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| JP2019207974A (en) * | 2018-05-30 | 2019-12-05 | キヤノン株式会社 | Cooling unit and electronic device using the same |
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