TWM542324U - Heat dissipation coating structure of portable electronic device - Google Patents

Description

Heat-dissipating coating structure of portable electronic device

The present invention relates to a heat-dissipating coating structure of a portable electronic device, in particular, a heat-transmissive coating through a front shell is diffused, evenly dispersed throughout the cavity, and then exchanged heat with the outside through a heat-dissipating coating of the rear case.

According to the currently available portable electronic device, when it is used for a long time, the phenomenon of overheating occurs locally, which not only causes the performance of the electronic device to be degraded, but also causes the body to become hot or crash.

Sub-press, because the current shape of the portable electronic device requires too thin thickness, and there is no space reserved for the heat convection in the traditional heat transfer method (convection is obtained by the fan), only the heat conduction and the heat radiation are left. Can be applied, currently commercially available portable electronic devices are mostly attached to the heat source, such as graphite sheets, copper foil and other high thermal conductivity materials to achieve heat dissipation and cooling purposes, from the market for Meizu, Xiaomi, Huawei and other brands of large-screen mobile phones In view of this, there is no significant cooling and cooling effect, and the local temperature is still high. This phenomenon not only causes the phenomenon not only to degrade the performance of the electronic equipment, but also causes the user to feel hot or even burn the user if the body is hot or crashed. There are many complaints from consumers.

As shown in FIG. 1 , a commercially available portable electronic device 10 is generally connected to a rear case 11 and a front case 12 , and a circuit board 13 and a battery 14 are disposed between the rear case 11 and the front case 12 . The circuit board 13 has a core component 14 and a front panel 12 is provided with a display module 16 and a touch panel 17; however, after long-term use of the portable electronic device, due to the heat source of the electronic component (for example) The heat radiated by the core component 14, the battery 15), such as the waste heat generated during the operation of the core component 14 (for example, a high-performance CPU), cannot pass the effective side. The phenomenon is transmitted, causing local overheating. This phenomenon not only brings consumers a bad feeling of using the touch temperature, but also limits the operation speed of the portable electronic device, even when the phenomenon is too slow. Something happened.

In addition, at present, most commercially available portable electronic devices are attached with high thermal conductive materials such as graphite sheets 20 or copper foils in the rear case 11, in an attempt to dissipate the heat generated by the heat source of the electronic components (for example, the core element 14, the battery 15), for example. The waste heat generated in the operation of the core component 14 (for example, a high-performance CPU) is dissipated by the rear case 11 to achieve heat dissipation; in fact, since the concept of heat conduction temperature is not considered, the waste heat cannot be uniformly distributed. The electronic device is carried on the casing, so there is no significant heat dissipation effect. For example, the local temperature of the core component 14 is still high, causing the body to become hot or crash, and can only passively reduce the efficiency of the core component 14 by software. Consumers experience a bad experience.

Therefore, in view of the above problems, the present creator conceived a heat-dissipating coating structure of a portable electronic device, which is a problem to be solved by the creative creation.

Therefore, the main purpose of the present invention is to provide a heat-dissipating coating structure for a portable electronic device, which is used to solve the problem that the heat of the main heat source generated by the wafer of the portable electronic device during operation causes the performance of the electronic device to be degraded. Point, so that the core temperature is clearly reduced, will not cause the body to become hot or crash, can relatively fully play the performance of electronic equipment, so that consumers have a better human-machine experience.

Another object of the present invention is to provide a heat-dissipating coating structure for a portable electronic device, which is different from the way of attaching a heat-dissipating film to the market, and overcomes the maximum heat-dissipating area under complicated product structure, and is convenient to manufacture and can avoid cutting. The effectiveness of waste.

In order to achieve the above objectives, the technical means adopted by the present invention include: one is applicable to the front shell and the rear shell of the portable electronic device, and the front shell and the rear shell are combined correspondingly And a predetermined electronic component is disposed in the cavity of the rear case and the front case, and the top surface of the front case, wherein the front case is coated with a heat conductive coating, and the rear case is provided with a heat dissipation Coating, according to the heat generated by the heat source of the electronic component, diffused through the thermal conductive coating of the front shell, uniformly dispersed throughout the cavity, and then exchange heat with the outside through the heat-dissipating coating of the back shell, So that the front shell and the rear shell system correspond to form a heat dissipation system.

According to the foregoing feature, the thermally conductive coating is coated, sprayed or electroplated with a highly thermally conductive material to form a thermally conductive structural layer simultaneously formed on either or both of the top and bottom surfaces of the front shell.

According to the foregoing feature, the heat dissipating coating is coated, sprayed or electroplated with a high heat dissipating material to form a heat dissipating structural layer formed on the top surface of the back shell.

According to the foregoing feature, the electronic component includes a circuit board and a battery disposed between the rear case and the front case, the circuit board has a core component, and the electronic component further includes a display module disposed on a top surface of the front case With a touch panel.

By means of the above-mentioned technical means, the present invention forms an effective heat dissipation system corresponding to the front shell and the rear shell system, and solves the heat generated by the heat source generated by the portable electronic device, and does not cause the shell through the heat conduction and heat dissipation coating structure. The problem of local overheating of the body solves the problem that the heat of the main heat source generated by the chip of the portable electronic device is burned through the casing, so that the consumer has a better human-machine experience.

10A‧‧‧ portable electronic device

11‧‧‧ Back shell

12‧‧‧ front shell

13‧‧‧Circuit board

14‧‧‧ core components

15‧‧‧Battery

16‧‧‧Display module

17‧‧‧Touch panel

18‧‧‧ cavity

19‧‧‧ components

30‧‧‧ Thermal coating

40‧‧‧ Thermal coating

1 is a structural exploded view of a conventional portable electronic device.

Figure 2 is a structural exploded view of the present creation.

Figure 3 is a cross-sectional view showing the structure of the present creation.

First, referring to FIG. 2 to FIG. 3, the heat-dissipating coating structure of the portable electronic device 10A includes a rear case 11 coupled with a front case 12, and the front case 11 corresponds to the rear case 12 Combined with a component 19, and a predetermined electronic component is disposed in the cavity 18 of the rear case 11 and the front case 12, and the top surface of the front case 12. In this embodiment, the electronic component is disposed behind the device The circuit board 13 and the battery 15 between the case 11 and the front case 12 have a core component 14 on the circuit board 13. The electronic component further includes a display module 16 and a touch panel 17 disposed on the top surface of the front case 12. .

The main feature of the present invention is that the front case 12 is coated with a heat conductive coating 30, and the rear case 11 is provided with a heat dissipation coating 40, so that the heat emitted by the heat source of the electronic component is transmitted through the heat conduction of the front case 12. The coating layer 30 is diffused, uniformly dispersed in the entire cavity 18, and then exchanged heat with the outside by the heat-dissipating coating 40 of the back shell 11, so that the front shell 12 and the rear shell 11 are formed correspondingly. cooling system.

In this embodiment, the heat conductive coating 30 is coated, sprayed or electroplated with a highly thermally conductive material to form a thermally conductive structural layer simultaneously formed on either or both sides of the top surface and the bottom surface of the front shell 12. The heat conductive coating 30 mainly functions as a heat conduction function, and a possible embodiment of the heat conductive coating includes, but is not limited to, coating, spraying or electroplating a heat dissipation structure layer formed on the top surface of the front case 12 with a high heat dissipation material. The coating composition of the thermal conductive coating 30 comprises: bamboo charcoal, carbon tube, various types of graphite, graphene microchip, graphene, carbon sphere, carbon fiber, tantalum nitride, aluminum nitride, mica, ceria, titanium dioxide, carbonization A combination of cerium, zinc oxide, cerium oxide, or the like; and a thermal conductive coating mixed with a combination selected from the group consisting of Tina water, ethyl acetate, absolute ethanol, alcohols, ketones, esters or distilled water or a combination of the foregoing.

The heat dissipation coating 40 is coated, sprayed or electroplated with a high heat dissipation material to form a heat dissipation structure layer formed on the top surface of the rear case 11. The coating composition of the heat dissipation coating 40 includes: Bamboo charcoal, carbon tube, various types of graphite, graphene microchip, graphene, carbon sphere, carbon fiber, tantalum nitride, aluminum nitride, mica, cerium oxide, titanium dioxide, tantalum carbide, zinc oxide, cerium oxide, etc.; A heat-dissipating paint is mixed with a combination selected from the group consisting of Tina water, ethyl acetate, absolute ethanol, alcohols, ketones, esters or distilled water or the aforementioned mixed solvent.

Based on the configuration, the front case 12 and the rear case 11 form a heat dissipation system, and the heat conductive coating 30 of the front case 12 is evenly dispersed throughout the cavity 18, and then the heat dissipation coating of the rear case 11 is performed. The heat exchange between the 40 structure and the outside world can relatively reduce the core temperature of the wafer, and will not cause the body to become hot or crash, and can fully exert the performance of the electronic device, so that the consumer has a better human-machine experience.

The present invention allows the top surface or/and the bottom surface of the shell 11 to have a heat-dissipating coating 40 after the portable electronic device 10A, and the top surface of the front shell 12 or/and the bottom surface has a heat-conductive coating 30; therefore, the electronic component heat source (such as the core) The waste heat generated in the operation of the element 14 and the battery 15), except for being dissipated by the heat-dissipating coating 40 located in the rear case 11, is evenly dispersed in the rear case 11 and the front case 12 by the heat-conductive coating 30 located in the front case 12. On the assembled casing, the local temperature around the heat source of the electronic component (for example, the core component 14, the battery 15) is lowered, so that the waste heat can be efficiently conducted outward, and the heat dissipation effect is remarkable.

Furthermore, the thermal conductive coating 30 and the heat dissipation coating 40 are fabricated by electroplating, coating or spraying processes, and can be fabricated for portable electronic devices of different sizes or specifications, and attached to graphite sheets or copper compared to the prior art. The method of foil is also convenient to manufacture and can avoid the effect of cutting waste.

In summary, the structure revealed by this creation is unprecedented, and it can achieve the improvement of efficacy, and it can be used for industrial utilization. It fully meets the requirements for creating patents, and invites the bureau to grant patents to encourage innovation. There is no sense of morality.

However, the drawings and descriptions disclosed above are only preferred embodiments of the present invention, Any modification or equivalent change made by a person familiar with this skill in the spirit of the case shall still be included in the scope of the patent application in this case.

10A‧‧‧ portable electronic device

11‧‧‧ Back shell

12‧‧‧ front shell

13‧‧‧Circuit board

14‧‧‧ core components

15‧‧‧Battery

16‧‧‧Display module

17‧‧‧Touch panel

30‧‧‧ Thermal coating

40‧‧‧ Thermal coating

Claims (4)

A heat dissipating coating structure for a portable electronic device, comprising: a front shell and a rear shell suitable for a portable electronic device, wherein the front shell and the rear shell are combined to form an assembly, and the rear shell and the front shell are combined a predetermined electronic component is disposed in the cavity and the top surface of the front case, wherein the front case is coated with a heat conductive coating, and the rear case is provided with a heat dissipation coating, so that the heat source of the electronic component is distributed The heat is diffused through the thermal conductive coating of the front shell, evenly distributed throughout the cavity, and then exchanged heat with the outside through the heat-dissipating coating of the back shell, so that the front shell corresponds to the rear shell Form a heat dissipation system. The heat-dissipating coating structure of the portable electronic device according to claim 1, wherein the heat-conductive coating is coated, sprayed or plated with a high thermal conductive material on the top surface and the bottom surface of the front shell. A thermally conductive structural layer formed on one or both sides at the same time. The heat-dissipating coating structure of the portable electronic device of claim 1, wherein the heat-dissipating coating is coated with a high heat-dissipating material, sprayed or electroplated to form a heat dissipation on a top surface of the rear case. Structural layer. The heat-dissipating coating structure of the portable electronic device of any one of claims 1 to 3, wherein the electronic component comprises a circuit board and a battery disposed between the rear case and the front case, The circuit board has a core component, and the electronic component further includes a display module and a touch panel disposed on the top surface of the front case.