TWM555625U - Heat dissipation coating structure for transfer-printing and thermoforming of housing of portable electronic device - Google Patents

Description

Shell transfer thermoforming heat-dissipating coating structure of portable electronic device

The present invention relates to a structure for a portable electronic device, and more particularly to a heat-sealable heat-shrinkable coating structure on a housing.

According to the currently available portable electronic device, when it is used for a long time, the phenomenon of overheating occurs locally, which not only causes the performance of the electronic device to be degraded, but also causes the body to become hot or crash.

Sub-press, because the current shape of the portable electronic device requires too thin thickness, and there is no space reserved for the heat convection in the conventional heat transfer method (convection is obtained by the fan), only "heat conduction" and "thermal radiation" remain. Two methods can be applied. Currently, most commercially available portable electronic devices are attached with a high-heat-conducting material such as graphite sheets and copper foils for heat dissipation and temperature reduction. Judging from the large-screen mobile phones of Meiji, Xiaomi, Huawei and other brands, there is no significant heat-dissipating effect, and the local temperature is still high. This phenomenon not only causes this phenomenon to cause not only the performance of electronic equipment, but also the body's hot or crash problems. Even the consumer feels that the temperature is too high or even burns the user, and there are many complaints from consumers.

The above-mentioned lack of the currently available portable electronic devices is mainly due to the fact that the commercially available portable electronic device 10 is usually attached to a rear case 11 in combination with a front case 12, and thereafter. A circuit board 13 and a battery 15 are disposed between the casing 11 and the front casing 12. The circuit board 13 has a core component 14 and a display module 16 and a touch panel 17 are disposed on the front casing 12. After the long-term use, the portable electronic device 10 cannot pass the heat generated by the heat source of the electronic component (for example, the core component 14 and the battery 15), for example, the waste heat generated by the operation of the core component 14 (for example, a high-performance CPU). Effective way to pass out, causing local Overheating occurs. This phenomenon not only brings consumers a bad feeling of using the touch temperature, but also limits the operation speed of the portable electronic device, and even the phenomenon of too slow down occurs.

In addition, most of the commercially available portable electronic devices are attached to the back shell 11 by adhesively attaching a high thermal conductive material such as a graphite sheet 20 or a copper foil, in an attempt to dissipate the heat source of the electronic component (for example, the core component 14 and the battery 15). The heat is dissipated by the rear shell 11 to achieve the purpose of heat dissipation; in fact, because the concept of heat conduction and uniform temperature is not considered, the waste heat cannot be evenly distributed on the casing of the portable electronic device, so there is no significant heat dissipation. The effect, for example, the local temperature around the core component 14 is still high, causing the body to become hot or down, and can only passively reduce the efficiency of the core component 14 by software, causing a poor user experience. Moreover, the method of attaching graphite sheets or copper foils, in addition to the problem of cutting waste, attaches high-heat-conducting materials such as graphite sheets 20 or copper foils by means of adhesive, because the casing is not a flat piece but has an arc edge or Irregular shape, so it is inconvenient to attach it, and the adhesion is not very stable, resulting in poor product reliability, which affects its heat dissipation efficiency and service life.

In addition, the creator previously used a plating, coating or spray process to create a thermal coating on the housing. However, in the case of electroplating, coating or spraying, the heat-dissipating coating is applied to the casing. In addition to the problem of sticking with adhesive, the process is complicated and environmental problems, yield problems, and cost problems. If there is no improvement, there is still room for improvement.

Therefore, in view of the above problems, the present creator actively contemplates how to conveniently and effectively combine the heat-dissipating coating on the casing of the portable electronic device, which is a problem to be solved by the author.

The reason is that the main purpose of this creation is to solve the problems of the prior art, and to provide a housing transfer heat-dissipating coating structure with a portable electronic device, which has a dense tissue pressure. The heat dissipation layer is combined to improve the thermal conductivity.

A further object of the present invention is that it has a convenient and effective combination of a heat-dissipating coating in the interior of a portable electronic device, achieving automation of production and a combination of good quality of the heat-dissipating coating.

Another object of the present invention is to have heat generated by the heat source generated by the portable electronic device, and the heat dissipation coating structure does not cause local overheating of the casing, thereby solving the heat dissipation problem of the portable electronic device.

In order to achieve the above purposes, the technical means adopted by the present invention include: one for the front and rear shells of the portable electronic device, and the front shell and the rear shell are combined to form a component, and the rear shell and the front shell a predetermined electronic component is disposed in the cavity and the top surface of the front case, wherein: a high heat dissipation material is transferred onto an unformed plastic plate to form a printing plate having a heat dissipation coating; The printing plate is placed in a mold for hot press forming; a 3D front shell or a rear shell is formed, and the heat dissipating coating of the surface layer is thermally pressed to form a heat dissipating coating structure combined with the front shell or the rear shell. And the heat dissipating coating structure is vertically oriented on the surface of the casing to form a dense compact heat-dissipating layer, thereby improving heat dissipation performance.

The working principle of the creation: the heat emitted by the heat source of the wafer is evenly distributed throughout the cavity through the heat-dissipating coating structure of the front shell, and then the heat-dissipating coating structure of the rear shell is heat-exchanged with the outside, so that the core temperature of the wafer can be relatively Clearly reduced, will not cause the body to become hot or crash, can relatively fully play the performance of electronic equipment, so that consumers have a better human-machine experience.

With the help of the above-mentioned technical means, this creation overcomes the problem of the combination of complex product structure, which has a dense heat-dissipating coating structure (pressing heat-dissipating layer), thereby improving the heat-conducting efficiency and at the same time achieving the maximum heat-dissipating area, that is to say On the same area of the shell, the effective heat dissipation area of the present invention is larger and more integrated than the existing attached graphite sheet method; thereby solving the heat generated by the heat source generated by the portable electronic device, through the heat dissipation coating structure ,Do not This can cause local overheating of the housing.

10A‧‧‧ portable electronic device

11‧‧‧ Back shell

12‧‧‧ front shell

13‧‧‧Circuit board

14‧‧‧ core components

15‧‧‧Battery

16‧‧‧Display module

17‧‧‧Touch panel

18‧‧‧ cavity

19‧‧‧ components

20A‧‧‧Printing plate

21‧‧‧Plasticized tablets

22‧‧‧High heat dissipation materials

22a‧‧‧ Thermal coating

30‧‧‧ Heat-dissipating coating structure

30a‧‧‧Compression heat sink

40‧‧‧Mold

41‧‧‧First mould

42‧‧‧Second mold

43‧‧‧ cavity

1 is a structural exploded view of a conventional portable electronic device.

Figure 2 is a perspective view of the unformed plastic plate of the present invention.

Figure 3 is a perspective view of the unformed plastic flat transfer heat-dissipating coating of the present invention.

Figure 4 is a schematic view of the creation of the printing plate into the mold.

Fig. 5 is a schematic view showing the hot stamping of the printing plate in the mold.

Fig. 6 is a cross-sectional view showing the structure of the heat-transformed heat-dissipating coating structure of the rear shell transfer of the present invention.

Fig. 6A is a schematic view showing the formation of a dense, high-density pressure-bonding layer formed by heat transfer molding.

Figure 6B is an enlarged cross-sectional view taken along line 6B of Figure 6.

Figure 7 is a cross-sectional view of the shell before the creation.

Fig. 7A is an enlarged cross-sectional view taken along line 7A of Fig. 7.

Figure 8 is a cross-sectional view of a preferred embodiment of the present invention.

First, referring to FIG. 8 , the housing transfer heat-pressing heat-dissipating coating structure of the portable electronic device 10A includes a rear case 11 coupled with a front case 12 , and the front case 12 and the rear case 11 is correspondingly combined into a component 19, and a predetermined electronic component is disposed in the cavity 18 of the rear case 11 and the front case 12, and the top surface of the front case 12. In the embodiment, the electronic component includes a circuit board 13 disposed between the rear case 11 and the front case 12 and a battery 15 having a core component 14 thereon, the electronic component further comprising a display module 16 disposed on a top surface of the front case 12 Touch panel 17. However, the above-mentioned components are the main components of the portable electronic device, and belong to the prior art (Prior Art), which is not the subject matter of this patent, and is not described here.

Then, as shown in Figure 2-8, the main feature of this creation is: an unformed plasticization A high heat dissipation material 22 is transferred onto the flat plate 21 to form a printing flat plate 20A having a heat dissipating coating layer 22a; the printing flat 20A plate is placed in a mold 40 for hot press forming; a 3D front case 12 is formed or The rear case 11 and the surface heat dissipation coating 22a are thermally pressed to form a heat dissipation coating structure 30 bonded to the front case 12 or the rear case 11, and the heat dissipation coating structure 30 is in the front case 12 or the back case. 11 The vertical direction of the surface forms a dense, high-density pressure-bonding layer 30a, which has an enhanced effect of improving thermal conductivity.

In this embodiment, the high heat dissipation material 22 comprises: selected from the group consisting of bamboo charcoal, carbon tubes, various types of graphite, graphene microchips, graphene, carbon spheres, carbon fibers, tantalum nitride, aluminum nitride, mica, and dioxide. a combination of ruthenium, titanium dioxide, tantalum carbide, zinc oxide, ruthenium oxide, heat conductive metal particles (silver, copper, etc.); and selected from the group consisting of water, ethyl acetate, absolute ethanol, alcohols, ketones, esters or distilled water Or a combination of the foregoing mixed solvents to form a heat-dissipating paint.

The present invention transfers a high heat dissipation material 22 on the unformed plasticized plate 21 to form a printing plate 20A having a heat dissipation coating 22a. In this embodiment, the high heat dissipation material 22 includes screen printing. The technique such as gravure printing is printed on the plasticizing plate 21, so that the heat-dissipating coating 20a can be printed uniformly on the surface of the plasticizing plate 21 as shown in FIG.

In this embodiment, the hot press molding die 40 includes a first die 41 and a second die 42 , and a cavity 43 disposed between the first die 41 and the second die 42 , wherein the cavity 43 is coupled to the front case 11 Or the shape of the rear case 12 is set such that, as shown in FIG. 5A, the printing plate 20A is placed between the first mold 41 and the second mold 42, and then hot press forming is performed as shown in FIG. 5B.

In this embodiment, the plasticizing plate 21 comprises a plastic flat plate or a glass flat plate composed of one of plastic or glass materials. Wherein the plasticizing plate 21 is a plastic plate, which may be composed of: PC, PMMA, plastic composite plate, etc., according to the characteristics of the plastic plate material, it is heated by hot pressing in the mold 40. It is about 300 degrees Celsius. Furthermore, the plasticized flat plate 21 is made of a heat-stable glass plate, such as a glass plate. It is heated in the mold 40 by hot pressing to about 600-900 degrees Celsius.

This creation uses the process forming principle of transfer hot press forming technology to form the heat dissipation coating structure 30. In the technical field of heat-dissipating coatings, it is necessary to overcome the technical difficulties of combining the "heat-dissipating coating" with the front shell 12 or the rear shell 11 of an extremely thin and irregularly-portable portable electronic device. The direct transfer or replacement of the usual means can be easily accomplished.

In the present invention, a "heat-dissipating coating" transfer thermoforming is incorporated in the front case 12 or the rear case 11, and one of the most important steps is that not only the printing plate 20A is formed into a front when hot-pressing is performed in the mold 40. The shape of the shell 12 or the rear shell 11 and, at the same time of hot press forming, as shown in FIGS. 6A-6B, the heat dissipating coating layer 22a is formed from the original high thickness (t1) to form a dense dense heat dissipating layer 30a, which is about to The originally transferred heat-dissipating coating layer 22a has a relatively high thickness (t1), and the heat-pressing forms a lower thickness (t2) of the densely-bonded heat-dissipating heat-dissipating layer 30a. This is a heat-dissipating material 22a which is formed by the transfer of the high heat-dissipating material 22, and has characteristics and advantages of being uniformly distributed on the plasticized flat plate 21. However, due to the material properties of the heat-dissipating coating 22a, the structure is loose. Therefore, the present invention first uses a transfer technique to form a uniformly distributed heat-dissipating coating layer 22a on the plasticizing plate 21, and then, by hot pressing, simultaneously, the uniformly distributed heat-dissipating coating layer 22a is formed into a dense structure. The heat dissipation layer 30a is combined, so that the two components are complemented by each other and have a good heat conduction effect.

In the technical solution of the present invention, through the transfer molding of the heat dissipation coating 20a and the front case 12 or the rear case 11, a heat dissipation coating structure 30 (having a heat sealing layer 30a) is formed, as shown in FIG. 6 or 7. The heat-dissipating coating structure 30 and the front shell 12 and the rear shell 11 are transferred to the hot-press type, so that the bonding property is superior to the prior art such as the attaching method or the spraying process, and is attached to the prior art. Graphite sheet or copper foil method, this creation overcomes the problem of complex combination of product structure, and at the same time achieves the maximum heat dissipation area, that is, the effective heat dissipation area of the creation on the same area of the shell, compared with the existing attachment Graphite or copper foil is more and more conformable plus.

In the above-described hot press forming, the rear case 11 is taken as an embodiment, and the formed structure is as shown in FIG. 6, but is not limited thereto; and the front case 12 is taken as an embodiment, and the front part is shown in FIG. The shape of the shell 12 is more irregular than that of the rear shell 11, but the transfer of the thermoformed heat-dissipating coating structure 30 is such that the edge or corner position can be perfect even at small angles and large depths. The effect of transfer hot press forming is better than that of the prior art such as the attaching method or the spraying process.

Based on the configuration, as shown in FIG. 8, the front case 12 and the rear case 11 form a heat dissipation system, and the heat dissipation coating structure 30 (having the pressure-receiving heat dissipation layer 30a) of the front case 12 heats evenly. Dispersed throughout the cavity 18, and then the heat-dissipating coating structure 30 of the rear case 11 exchanges heat with the outside, so that the waste heat generated by the operation of the electronic component heat source (for example, the core component 14, the battery 15) is provided by The heat-dissipating coating structure 30 of the rear case 11 is dissipated, and the heat-dissipating coating structure 30 of the front case 12 is evenly distributed on the casing composed of the rear case 11 and the front case 12 to allow the electronic component heat source (for example, the core component). 14, the battery 15) local temperature drop around, so that waste heat can be efficiently conducted outward, and has a significant effect of heat dissipation. Therefore, compared with the existing technology, this creation has unexpected technical effects and creative creativity.

In summary, the structure revealed by this creation is unprecedented, and it can achieve the improvement of efficacy, and it can be used for industrial utilization. It fully meets the requirements for creating patents, and invites the bureau to grant patents to encourage innovation. There is no sense of morality.

However, the drawings and descriptions disclosed above are only preferred embodiments of the present invention, and modifications or equivalent changes made by those skilled in the art in accordance with the spirit of the present invention should still be included in the scope of the patent application.

10A‧‧‧ portable electronic device

11‧‧‧ Back shell

12‧‧‧ front shell

13‧‧‧Circuit board

14‧‧‧ core components

15‧‧‧Battery

16‧‧‧Display module

17‧‧‧Touch panel

18‧‧‧ cavity

19‧‧‧ components

30‧‧‧ Heat-dissipating coating structure

Claims (3)

A casing transfer thermoforming heat-dissipating coating structure for a portable electronic device, comprising: a casing and a rear casing suitable for a portable electronic device, wherein the front casing and the rear casing are combined into a component, and a predetermined electronic component is disposed in the cavity of the rear case and the front case, and the top surface of the front case, wherein: a high heat dissipation material is transferred onto an unformed plasticized plate to form a heat dissipation coating. a printing plate of the layer; placing the printing plate in a mold for hot press forming; forming a 3D front or back shell, and simultaneously forming a heat dissipating coating on the surface layer to be attached to the front shell or The heat-dissipating coating structure of the rear shell and the vertical direction of the heat-dissipating coating structure on the surface of the front shell or the rear shell, thereby forming a dense compact heat-dissipating layer. The shell transfer heat dissipation coating structure of the portable electronic device according to claim 1, wherein the mold comprises a first mold and a second mold, and a mold disposed between the first mold and the second mold a cavity, the cavity being shaped to match the shape of the front or rear case. The shell transfer heat-dissipating coating structure of the portable electronic device according to claim 1, wherein the plasticized flat plate comprises a plastic flat plate or a glass flat plate composed of one of plastic or glass materials.