TW201908094A - Casing transfer thermoforming heat-dissipating coating structure for portable electronic device forming a densely pressed heat-dissipating layer that improves the heat conduction performance - Google Patents

Abstract

A casing transfer thermoforming heat-dissipating coating structure for a portable electronic device comprises a front case or a rear case suitable for a portable electronic device, and is characterized in that a high heat dissipation material is transferred onto an unformed plasticized plate to form a printing plate having a heat dissipation coating; the printing plate is placed in a mold, and is subjected to hot press forming by being heated to a temperature of about 300-900 DEG C according to material and thickness, wherein the printing plate, after being softened, is thermoformed with a mold, and is pressed and shaped in a mold cavity to prevent rebound deformation. In this way, a 3D front or rear case is formed, and the heat-dissipating coating on the surface layer is heat-compressed, so that the heat-dissipating coating forms in the vertical orientation of the casing surface to form a densely pressed heat-dissipating layer, thereby improving the heat conduction performance.

Description

Shell transfer thermoforming heat-dissipating coating structure of portable electronic device

The invention relates to a structure of a portable electronic device, in particular to a hot-pressed, tissue-structured heat-dissipating coating structure on a casing.

According to the currently available portable electronic device, when it is used for a long time, the phenomenon of overheating occurs locally, which not only causes the performance of the electronic device to be degraded, but also causes the body to become hot or crash.

Sub-press, because the current shape of the portable electronic device requires too thin thickness, and there is no space reserved for the heat convection in the conventional heat transfer method (convection is obtained by the fan), only "heat conduction" and "thermal radiation" remain. Two methods can be applied. Currently, most commercially available portable electronic devices are attached with a high-heat-conducting material such as graphite sheets and copper foils for heat dissipation and temperature reduction. Judging from the large-screen mobile phones of Meiji, Xiaomi, Huawei and other brands, there is no significant heat-dissipating effect, and the local temperature is still high. This phenomenon not only causes this phenomenon to cause not only the performance of electronic equipment, but also the body's hot or crash problems. Even the consumer feels that the temperature is too high or even burns the user, and there are many complaints from consumers.

The above-mentioned lack of the currently available portable electronic devices is mainly due to the fact that the commercially available portable electronic device 10 is usually attached to a rear case 11 in combination with a front case 12, and thereafter. A circuit board 13 and a battery 15 are disposed between the casing 11 and the front casing 12. The circuit board 13 has a core component 14 and a display module 16 and a touch panel 17 are disposed on the front casing 12. After the long-term use, the portable electronic device 10 cannot pass the heat generated by the heat source of the electronic component (for example, the core component 14 and the battery 15), for example, the waste heat generated by the operation of the core component 14 (for example, a high-performance CPU). The effective way is transmitted, causing local overheating. This phenomenon not only brings consumers a bad feeling of using the touch temperature, but also limits the operation speed of the portable electronic device, even the phenomenon of slow down. It also happens from time to time.

In addition, most of the commercially available portable electronic devices are attached to the back shell 11 by adhesively attaching a high thermal conductive material such as a graphite sheet 20 or a copper foil, in an attempt to dissipate the heat source of the electronic component (for example, the core component 14 and the battery 15). The heat is dissipated by the rear shell 11 to achieve the purpose of heat dissipation; in fact, because the concept of heat conduction and uniform temperature is not considered, the waste heat cannot be evenly distributed on the casing of the portable electronic device, so there is no significant heat dissipation. The effect, for example, the local temperature around the core component 14 is still high, causing the body to become hot or down, and can only passively reduce the efficiency of the core component 14 by software, causing a poor user experience. Moreover, the method of attaching graphite sheets or copper foils, in addition to the problem of cutting waste, attaches high-heat-conducting materials such as graphite sheets 20 or copper foils by means of adhesive, because the casing is not a flat piece but has an arc edge or Irregular shape, so it is inconvenient to attach it, and the adhesion is not very stable, resulting in poor product reliability, which affects its heat dissipation efficiency and service life.

In addition, the inventors previously used a plating, coating or spray process to make a heat sink coating on the housing. However, in the case of electroplating, coating or spraying, the heat-dissipating coating is applied to the casing. In addition to the problem of sticking with adhesive, the process is complicated and environmental problems, yield problems, and cost problems. If there is no improvement, there is still room for improvement.

Therefore, the present inventors have actively conceived how to easily and effectively bond a heat-dissipating coating to a casing of a portable electronic device in view of the above problems, which is a problem to be solved by the present invention.

The main purpose of the present invention is to solve the problems of the prior art, and to provide a housing transfer heat-dissipating coating structure of a portable electronic device, which has a tissue-bonded heat-dissipating heat-dissipating layer, thereby improving thermal conductivity.

Another object of the present invention is to facilitate and effectively combine the heat-dissipating coating into the interior of the portable electronic device, to achieve automation of production and to improve the combined quality of the heat-dissipating coating.

Another object of the present invention is to have heat generated by the heat source generated by the portable electronic device, and the heat-dissipating coating structure is different from the way of attaching the heat-dissipating film to the market, thereby overcoming the maximum heat-dissipating area under complicated product structure, thereby enabling the wafer and The heat radiated by the heat source such as the battery is evenly distributed throughout the cavity through the heat-dissipating coating structure, and then exchanges heat with the outside, and the core temperature is clearly reduced, which does not cause local overheating of the casing, and can solve the heat dissipation of the portable electronic device. problem.

In order to achieve the above object, the technical means adopted by the present invention include: a front shell and a rear shell applicable to the portable electronic device, and the front shell and the rear shell shell are combined to form a component, and the rear shell and the front shell are combined a predetermined electronic component is disposed in the cavity and the top surface of the front case, wherein: a high heat dissipation material is transferred onto an unformed plasticized plate to form a printing plate having a heat dissipation coating; The printing plate is placed in a mold, hot-pressed, heated to about 300-900 degrees Celsius, soft-molded by a mold after the printing plate is softened, and pressure-fixed in the cavity to prevent rebound deformation; Forming a 3D front shell or a rear shell, and simultaneously forming a heat dissipating coating of the surface layer by heat pressing to form a heat dissipating coating structure bonded to the front shell or the rear shell, and the heat dissipating coating structure is on the surface of the shell Vertically, a densely bonded heat-dissipating layer is formed to enhance heat dissipation.

According to the foregoing feature, the plasticized flat plate comprises a plastic flat plate or a glass flat plate composed of one of plastic or glass materials.

According to the foregoing feature, the plasticized flat plate comprises: any one of: PC, PMMA, and plastic composite sheet, which is heated by a hot pressing method to about 300 degrees Celsius in the mold.

According to the foregoing feature, the glass plate is composed of a heat-mouldable glass plate which is heated in a mold by a hot pressing method to a temperature of about 600 to 900 degrees Celsius.

The working principle of the invention: the heat emitted by the heat source of the wafer is evenly distributed throughout the cavity through the heat-dissipating coating structure of the front shell, and the heat-dissipating coating structure of the back shell is heat-exchanged with the outside, so that the core temperature of the wafer can be relatively Clearly reduced, will not cause the body to become hot or crash, can relatively fully play the performance of electronic equipment, so that consumers have a better human-machine experience.

By means of the above-mentioned technical means, the invention overcomes the problem of the combination of the complicated structure of the product, and has a dense heat-dissipating coating structure (compression heat-dissipating layer), thereby improving the heat conduction performance and simultaneously achieving the maximum heat dissipation area, that is to say The effective heat dissipation area of the present invention is larger and more integrated than the existing attached graphite sheet on the same area of the casing; thereby solving the heat generated by the heat source generated by the portable electronic device, and the heat dissipation coating structure is adopted. Does not cause local overheating of the housing.

First, referring to FIG. 8, the housing transfer heat-pressing heat-dissipating coating structure of the portable electronic device 10A of the present invention comprises a rear case 11 coupled with a front case 12, and the front case 12 and the rear case 11 is correspondingly combined into a component 19, and a predetermined electronic component is disposed in the cavity 18 of the rear case 11 and the front case 12, and the top surface of the front case 12. In the embodiment, the electronic component includes a circuit board 13 disposed between the rear case 11 and the front case 12 and a battery 15 having a core component 14 thereon, the electronic component further comprising a display module 16 disposed on a top surface of the front case 12 Touch panel 17. However, the above-mentioned components are the main components of the portable electronic device, and belong to the prior art (Prior Art), which is not the subject matter of this patent, and is not described here.

2 to 8, the main feature of the present invention is: transferring a high heat dissipation material 22 onto an unformed plasticized plate 21 to form a printing plate 20A having a heat dissipation coating 22a; The flat 20A plate is placed in a mold 40 for hot pressing. The temperature is different according to the material and the thickness. The plastic plate is heated to about 300 degrees Celsius, and the glass plate is heated to about 300-900 degrees Celsius. After the printing plate 20A is softened. It is thermoformed through the mold 40, and is subjected to pressure setting and shaping in the cavity to prevent rebound deformation; thus forming a 3D front case 12 or rear case 11 while the surface heat dissipation coating 22a is formed by thermal compression bonding. The heat dissipation coating structure 30 of the front case 12 or the rear case 11 and the vertical direction of the heat dissipation coating structure 30 on the surface of the front case 12 or the rear case 11 form a dense dense density heat dissipation layer 30a having a structure The effect of thermal conductivity is enhanced.

In this embodiment, the high heat dissipation material 22 comprises: selected from the group consisting of bamboo charcoal, carbon tubes, various types of graphite, graphene microchips, graphene, carbon spheres, carbon fibers, tantalum nitride, aluminum nitride, mica, and dioxide. a combination of ruthenium, titanium dioxide, tantalum carbide, zinc oxide, ruthenium oxide, heat conductive metal particles (silver, copper, etc.); and selected from the group consisting of water, ethyl acetate, absolute ethanol, alcohols, ketones, esters or distilled water Or a combination of the foregoing mixed solvents to form a heat-dissipating paint.

In the present invention, a high heat dissipation material 22 is transferred onto the unshaped plasticized plate 21 to form a printing plate 20A having a heat dissipation coating 22a. In this embodiment, the high heat dissipation material 22 includes a screen printing. A technique such as gravure printing is printed on the plasticizing plate 21, so that the heat-dissipating coating 20a can be printed uniformly on the surface of the plasticizing plate 21 as shown in FIG.

In this embodiment, the hot press molding die 40 includes a first die 41 and a second die 42 , and a cavity 43 disposed between the first die 41 and the second die 42 , wherein the cavity 43 is matched with the front case 11 or the shape of the rear case 12 is set such that, as shown in Fig. 5A, the printing plate 20A is placed between the first mold 41 and the second mold 42, and then hot press forming is performed as shown in Fig. 5B.

In this embodiment, the plasticizing plate 21 comprises a plastic flat plate or a glass flat plate composed of one of plastic or glass materials. Wherein the plasticizing plate 21 is a plastic plate, which may be composed of: PC, PMMA, plastic composite plate, etc., according to the characteristics of the plastic plate material, it is heated by hot pressing in the mold 40. It is about 300 degrees Celsius. Further, the plasticized flat plate 21 is made of a hot press-formable glass plate, such as a glass plate, and is heated in a mold 40 by hot pressing to a temperature of about 600 to 900 degrees Celsius.

The present invention utilizes the process forming principle of transfer hot press forming techniques to form the heat dissipating coating structure 30. In the technical field of heat-dissipating coatings, it is necessary to overcome the technical difficulties of combining the "heat-dissipating coating" with the front shell 12 or the rear shell 11 of an extremely thin and irregularly-portable portable electronic device. The direct transfer or replacement of the usual means can be easily accomplished. Therefore, in the present invention, the "heat-dissipating coating" integrated transfer thermoforming is combined on the front case 12 or the rear case 11, as shown in FIG. 2, including at least several steps:

Step 1 (S1): An unformed plasticized plate 21 is provided; as shown in FIG.

Step 2 (S2): transferring a high heat dissipation material 22 onto the plasticizing plate 21 to form a printing plate 20A having a heat dissipation coating 22a; as shown in FIG.

Step 3 (S3): placing the printing plate 20A in a mold 40 for hot pressing, the temperature is different according to the material and the thickness, the plastic plate is heated to about 300 degrees Celsius, and the glass plate is heated to 600-900 degrees Celsius. Left and right, after the printing plate 20A is softened, it is thermoformed through the mold 40, and pressure-maintaining is performed in the cavity 43 to prevent rebound deformation; as shown in FIGS. 5A and 5B.

Step 4 (S4): forming a 3D front case 12 or a rear case 11 while the surface heat dissipation coating 22a is thermally pressed to form a heat dissipation coating structure 30 bonded to the front case 12 or the rear case 11, and The heat dissipation coating structure 30 is perpendicular to the surface of the front case 12 or the rear case 11 (Z-axis direction) to form a tissue-bonded heat-dissipating heat-dissipating layer 30a. As shown in Figure 6-7.

As described above, the present invention is intended to incorporate the "heat-dissipating coating" transfer thermoforming into the front case 12 or the rear case 11, and at least the above four steps are required. One of the most important steps is to perform hot press forming in the mold 40, to be thermoformed through the mold 40 after the printing plate 20A is softened, and to perform pressure setting and molding in the cavity 43 to prevent rebound deformation; 20A is formed into the shape of the front case 12 or the rear case 11, and at the same time as the hot press forming, as shown in FIGS. 6A-6B, the heat dissipating coating layer 22a is formed from the original high thickness (t1) to form a dense dense heat dissipating layer. 30a, that is, the originally transferred heat-dissipating coating 22a has a relatively high thickness (t1), and is hot pressed to form a lower thickness (t2) of the dense structure layer 30a. This is a heat-dissipating material 22a which is formed by the transfer of the high heat-dissipating material 22, and has characteristics and advantages of being uniformly distributed on the plasticized flat plate 21. However, due to the material properties of the heat-dissipating coating 22a, the structure is loose. Therefore, the present invention firstly forms a uniformly distributed heat dissipation coating 22a on the plasticizing plate 21 by using a transfer technique, and then, by using hot press molding, simultaneously forms the uniformly distributed heat dissipation coating 22a to form a dense structure pressure. The heat dissipation layer 30a is combined, so that the two components are complemented by each other and have a good heat conduction effect.

In the technical solution of the present invention, through the transfer molding of the heat dissipation coating 20a and the front case 12 or the rear case 11, a heat dissipation coating structure 30 (having a heat sealing layer 30a) is formed, as shown in FIG. 6 or 7. The heat-dissipating coating structure 30 is heat-pressed and transferred to the front shell 12 and the rear shell 11, so that the bonding property is superior to the prior art such as the attaching method or the spraying process, and is attached to the prior art. In the form of graphite sheet or copper foil, the invention overcomes the problem of combination of complicated product structure, and at the same time achieves the maximum heat dissipation area, that is, the effective heat dissipation area of the present invention on the same area of the shell, compared with the existing attachment. Graphite sheets or copper foils are larger and more conformable.

In the above-described hot press forming of the present invention, the rear case 11 is taken as an embodiment, and the formed structure is as shown in FIG. 6, but is not limited thereto; and the front case 12 is taken as an embodiment, and the front part is shown in FIG. The shape of the shell 12 is more irregular than that of the rear shell 11, but the transfer of the thermoformed heat-dissipating coating structure 30 is such that the edge or corner position can be perfect even at small angles and large depths. The effect of transfer hot press forming is better than that of the prior art such as the attaching method or the spraying process. Therefore, the present invention can be implemented in either of the front case 12 or the rear case 11, and of course, the front case 12 and the rear case 11 can be simultaneously implemented.

Based on the configuration, as shown in FIG. 8, the front case 12 and the rear case 11 form a heat dissipation system, and the heat dissipation coating structure 30 (having the pressure-receiving heat dissipation layer 30a) of the front case 12 heats evenly. Dispersed throughout the cavity 18, and then the heat-dissipating coating structure 30 of the rear case 11 exchanges heat with the outside, so that the waste heat generated by the operation of the electronic component heat source (for example, the core component 14, the battery 15) is provided by The heat-dissipating coating structure 30 of the rear case 11 is dissipated, and the heat-dissipating coating structure 30 of the front case 12 is evenly distributed on the casing composed of the rear case 11 and the front case 12 to allow the electronic component heat source (for example, the core component). 14, the battery 15) local temperature drop around, so that waste heat can be efficiently conducted outward, and has a significant effect of heat dissipation. Therefore, the present invention has an unexpected technical effect as compared with the prior art, and has inventive inventiveness.

In summary, the structure disclosed by the present invention is unprecedented, and can indeed achieve the improvement of efficacy, and has industrial availability, fully conforms to the patent requirements of the invention, and invites the bureau to grant a patent to encourage innovation. There is no sense of morality.

The drawings and the descriptions of the present invention are merely preferred embodiments of the present invention, and those skilled in the art, which are subject to the spirit of the present invention, should be included in the scope of the patent application.

10A‧‧‧ portable electronic device

11‧‧‧ Back shell

12‧‧‧ front shell

13‧‧‧Circuit board

14‧‧‧ core components

15‧‧‧Battery

16‧‧‧Display module

17‧‧‧Touch panel

18‧‧‧ cavity

19‧‧‧ components

20A‧‧‧Printing plate

21‧‧‧Plasticized tablets

22‧‧‧High heat dissipation materials

22a‧‧‧ Thermal coating

30‧‧‧ Heat-dissipating coating structure

30a‧‧‧Compression heat sink

40‧‧‧Mold

41‧‧‧First mould

42‧‧‧Second mold

43‧‧‧ cavity

1 is a structural exploded view of a conventional portable electronic device. Figure 2 is a flow chart of the present invention. Figure 3 is a perspective view of an unformed plasticized panel of the present invention. Figure 4 is a perspective view of the unformed plasticized plate transfer heat-dissipating coating of the present invention. Fig. 5A is a schematic view showing the printing plate of the present invention placed in a mold. Fig. 5B is a schematic view showing the hot press forming of the printing plate of the present invention in a mold. Figure 6 is a cross-sectional view showing the structure of a heat-transformed heat-dissipating coating structure for a rear shell transfer of the present invention. Fig. 6A is a schematic view showing the transfer of thermoforming to form a dense dense high-density heat-dissipating layer of the present invention. Figure 6B is an enlarged cross-sectional view taken along line 6B of Figure 6. Figure 7 is a cross-sectional view showing the front of the casing of the present invention. Fig. 7A is an enlarged cross-sectional view taken along line 7A of Fig. 7. Figure 8 is a cross-sectional view of a preferred embodiment of the present invention.

Claims (6)

A casing transfer thermoforming heat-dissipating coating structure for a portable electronic device, comprising: a casing and a rear casing suitable for a portable electronic device, wherein the front casing and the rear casing are combined into a component, and a predetermined electronic component is disposed in the cavity of the rear case and the front case, and the top surface of the front case, wherein: a high heat dissipation material is transferred onto an unformed plasticized plate to form a heat dissipation coating. a printing plate of the layer; the printing plate is placed in a mold, hot-pressed, heated to a temperature of about 300-900 degrees Celsius, softened by a mold after the printing plate is softened, and pressed and shaped in the cavity, Preventing a rebound deformation; thus forming a 3D front or rear shell, and simultaneously forming a heat-dissipating coating of the surface layer by thermal compression to form a heat-dissipating coating structure attached to the front or rear shell, and making the heat-dissipating coating The structure is perpendicular to the surface of the casing to form a dense compact heat-dissipating layer. The housing transfer heat dissipation coating structure of the portable electronic device of claim 1, wherein the mold comprises a first mold and a second mold, and is disposed between the first mold and the second mold. a cavity, the cavity being shaped to match the shape of the front or rear case. The shell transfer heat-dissipating coating structure of the portable electronic device according to claim 1 or 2, wherein the plasticized flat plate comprises a plastic flat plate or a glass plate composed of one of plastic or glass materials. . The shell transfer heat-dissipating coating structure of the portable electronic device according to claim 3, wherein the plasticized flat plate comprises: any one of: PC, PMMA, and plastic composite board, which is in the mold. Warm up to about 300 degrees Celsius by hot pressing. The shell transfer heat-dissipating coating structure of the portable electronic device according to claim 3, wherein the glass plate is composed of a heat-mouldable glass plate, which is hot-pressed in the mold. The temperature is around 600-900 degrees Celsius. The shell transfer heat dissipation coating structure of the portable electronic device according to claim 1, wherein the high heat dissipation material comprises: selected from the group consisting of bamboo charcoal, carbon tubes, various types of graphite, graphene microchips, Graphene, carbon sphere, carbon fiber, tantalum nitride, aluminum nitride, mica, cerium oxide, titanium dioxide, tantalum carbide, zinc oxide, cerium oxide, a combination of thermally conductive metal particles; and selected from the group of water, ethyl acetate, A heat-dissipating paint is prepared by mixing anhydrous ethanol, an alcohol, a ketone, an ester or distilled water or a combination of the foregoing mixed solvents.