TWM521549U - Multilayered heat dissipation substrate - Google Patents

Multilayered heat dissipation substrate Download PDF

Info

Publication number
TWM521549U
TWM521549U TW104218581U TW104218581U TWM521549U TW M521549 U TWM521549 U TW M521549U TW 104218581 U TW104218581 U TW 104218581U TW 104218581 U TW104218581 U TW 104218581U TW M521549 U TWM521549 U TW M521549U
Authority
TW
Taiwan
Prior art keywords
layer
heat
coating
surface treatment
thickness
Prior art date
Application number
TW104218581U
Other languages
Chinese (zh)
Inventor
Cheng-Yen Chen
Pin-Hao Chen
Original Assignee
Zheng Bo Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zheng Bo Ind Co Ltd filed Critical Zheng Bo Ind Co Ltd
Priority to TW104218581U priority Critical patent/TWM521549U/en
Publication of TWM521549U publication Critical patent/TWM521549U/en

Links

Description

多層之散熱基材Multi-layer heat sink substrate

本創作係為一種散熱基材,尤指一種多層之散熱基材。This creation is a heat-dissipating substrate, especially a multi-layer heat-dissipating substrate.

中國實用新型專利授權公告第CN203289824U號之「一種手機散熱貼」,該創作用於手機散熱,包括銅片,還包括一矽膠散熱膏及矽膠貼片,所述銅片用矽膠散熱膏均勻塗蓋後與矽膠貼片相連,所述矽膠貼片面積大於所述銅片,所述矽膠貼片利用自身黏性固定在手機電池蓋上。將手機產生的熱量導至銅片加快散熱速度,矽膠散熱膏可用來將矽膠貼片黏在銅片和後蓋上,矽膠貼片起固定作用,經過三層導熱,原先發燙的手機後蓋便可恢復常溫。散熱貼可製作成各種規格大小,貼附於手機電池蓋上,有效降低手機工作時的溫度。China Utility Model Patent Authorization Announcement No. CN203289824U "A mobile phone heat sink sticker", which is used for heat dissipation of mobile phones, including copper sheets, and also includes a silicone heat-dissipating paste and a silicone patch, which is uniformly coated with a silicone heat-dissipating paste. After being connected with the silicone patch, the silicone patch has a larger area than the copper sheet, and the silicone patch is fixed on the battery cover of the mobile phone by self-adhesiveness. The heat generated by the mobile phone is guided to the copper sheet to accelerate the heat dissipation speed. The silicone thermal grease can be used to stick the silicone adhesive patch on the copper sheet and the back cover, and the silicone adhesive patch is used for fixing. After three layers of heat conduction, the original hot-pressed mobile phone back cover You can restore normal temperature. The heat-dissipating stickers can be made into various sizes and attached to the battery cover of the mobile phone, which effectively reduces the temperature of the mobile phone during operation.

上述前案之貼片雖亦可藉由散熱膏將手機產生的熱量導至銅片加快散熱速度,但散熱膏散熱效果有限,且不易均勻散熱。Although the patch of the above case can also guide the heat generated by the mobile phone to the copper piece by the thermal grease to accelerate the heat dissipation speed, the heat dissipation effect of the thermal grease is limited, and it is not easy to uniformly dissipate heat.

爰此,為改善上述之缺失,本創作提出一種多層之散熱基材,包含:Therefore, in order to improve the above-mentioned deficiency, the present invention proposes a multi-layer heat-dissipating substrate comprising:

一散熱層,該散熱層厚度為0.1至2釐米;一表面處理層,包覆該散熱層,該表面處理層包括一第一側及一第二側相對該第一側,該表面處理層厚度為0.5至50微米;一遠紅外線塗層,塗佈於該表面處理層之第一側表面,該遠紅外線塗層厚度小於500微米;及一黏貼層,設於該表面處理層之第二側表面。a heat dissipation layer having a thickness of 0.1 to 2 cm; a surface treatment layer covering the heat dissipation layer, the surface treatment layer comprising a first side and a second side opposite to the first side, the surface treatment layer thickness a 0.5 to 50 micrometer; a far infrared coating applied to the first side surface of the surface treatment layer, the far infrared coating layer having a thickness of less than 500 micrometers; and an adhesive layer disposed on the second side of the surface treatment layer surface.

其中,該散熱層係為銀、銅、石墨、石墨烯、陶瓷、陶瓷或其混合之材質所製成。The heat dissipation layer is made of silver, copper, graphite, graphene, ceramic, ceramic or a mixture thereof.

其中,該表面處理層係為一金屬材質所製成。Wherein, the surface treatment layer is made of a metal material.

進一步,該遠紅外線塗層設有一感溫變色層,該感溫變色層係為一感溫油墨,該感溫變色層之厚度為5至200微米。Further, the far infrared ray coating layer is provided with a thermochromic layer, and the thermochromic layer is a temperature sensitive ink having a thickness of 5 to 200 micrometers.

進一步,該遠紅外線塗層設有一夜光層,該夜光層係為一夜光塗料,該夜光層之厚度為5至200微米。Further, the far-infrared coating is provided with a luminous layer, which is a luminous coating having a thickness of 5 to 200 micrometers.

進一步,該遠紅外線塗層混合一感溫油墨及一夜光塗料。Further, the far infrared ray coating is mixed with a temperature sensitive ink and a luminescent coating.

一散熱層,該散熱層厚度為0.1至2釐米;一遠紅外線塗層,塗佈於該散熱層,該遠紅外線塗層厚度小於500微米;一表面處理層,包覆該遠紅外線塗層,該表面處理層包括一第一側及一第二側相對該第一側,厚度為0.5至50微米;及一黏貼層,設於該表面處理層之第二側表面。a heat dissipation layer having a thickness of 0.1 to 2 cm; a far infrared ray coating layer coated on the heat dissipation layer, the far infrared ray coating layer having a thickness of less than 500 μm; and a surface treatment layer covering the far infrared ray coating layer The surface treatment layer comprises a first side and a second side opposite to the first side and having a thickness of 0.5 to 50 microns; and an adhesive layer disposed on the second side surface of the surface treatment layer.

其中,該散熱層係為銀、銅、石墨、石墨烯、陶瓷、鋁或其混合之材質所製成。The heat dissipation layer is made of silver, copper, graphite, graphene, ceramic, aluminum or a mixture thereof.

進一步,該表面處理層之第一側設有一感溫變色層,該感溫變色層係為一感溫油墨,該感溫變色層之厚度為5至200微米。Further, the first side of the surface treatment layer is provided with a thermochromic layer, and the thermochromic layer is a temperature sensitive ink having a thickness of 5 to 200 micrometers.

進一步,該表面處理層之第一側設有一夜光層,該夜光層係為一夜光塗料,該夜光層之厚度為5至200微米。Further, the first side of the surface treatment layer is provided with a luminous layer, and the luminous layer is a luminous coating having a thickness of 5 to 200 micrometers.

根據上述技術特徵可達成以下功效:According to the above technical features, the following effects can be achieved:

1.藉由該黏貼層可順應不同物件之曲面形狀緊密貼合,並可自行貼附於各種待散熱物之表面,不須運送至工廠進行遠紅外線噴塗,且可重覆使用,故具方便性、重複性及立即性,更為環保。1. The adhesive layer can conform to the curved shape of different objects and can be attached to the surface of various heat sinks without being transported to the factory for far infrared spraying, and can be reused, so it is convenient. Sex, repetitive and immediate, more environmentally friendly.

2.透過遠紅外線塗層輻射出遠紅外線,迅速將待散熱物之熱能導出,藉以降低工作溫度,進而避免熱能累積使內部電子元件因過熱受損而導致使用壽命縮短。2. The far infrared ray is radiated through the far infrared ray coating, and the heat energy of the heat sink is quickly led out, thereby lowering the working temperature, thereby avoiding the accumulation of heat energy and shortening the service life of the internal electronic components due to overheating.

3.透過該遠紅外線塗層將熱能以遠紅外線輻射方式進行散熱,過程中不需介質且輻射散熱效率高於傳統固體熱傳導或流體熱對流的散熱方式,而具有減少重量、體積,以及輕量化的優勢和降低製作成本等效益。3. The far-infrared coating is used to dissipate thermal energy by far-infrared radiation, and no medium is required in the process, and the radiation heat dissipation efficiency is higher than that of the conventional solid heat conduction or fluid heat convection, and the weight, the volume, and the weight reduction are reduced. Benefits and lower production costs.

4.藉由該感溫油墨受熱產生顏色變化,提醒使用者需停止使用以提高散熱效率;當該感溫變色層之變色情形消失時,表示已完成降溫,可繼續使用確保安全。4. The color change of the temperature sensitive ink is heated to remind the user to stop using to improve the heat dissipation efficiency; when the color change of the thermochromic layer disappears, it indicates that the temperature has been cooled, and the use can be continued to ensure safety.

5.藉由該夜光塗料發散之光源以供照明,亦可透過該夜光塗料發散之光源以便尋找基材所貼附之物品。5. A light source that is diverged by the luminous paint for illumination, or a light source that is diverged by the luminous paint to find an item to which the substrate is attached.

綜合上述技術特徵,本創作多層之散熱基材的主要功效將可於下述實施例清楚呈現。In combination with the above technical features, the main effects of the multilayer heat-dissipating substrate of the present invention will be clearly shown in the following embodiments.

請先參閱第一圖及第二圖所示,本創作之較佳實施例,為一種多層之散熱基材,包含:Please refer to the first embodiment and the second figure. The preferred embodiment of the present invention is a multi-layer heat dissipation substrate comprising:

一散熱層(1),該散熱層(1)厚度為0.1至2釐米,該散熱層(1)係為銀、銅、石墨、石墨烯、陶瓷、鋁或其混合之材質所製成。A heat dissipation layer (1) having a thickness of 0.1 to 2 cm, and the heat dissipation layer (1) is made of silver, copper, graphite, graphene, ceramic, aluminum or a mixture thereof.

一表面處理層(2),包括一第一側(21)及一第二側(22)相對該第一側(21),該表面處理層(2)包覆該散熱層(1),該表面處理層(2)厚度為0.5至50微米,該表面處理層(2)係為一金屬材質所製成,如:金、銀、銅、鎳、鋁等,該表面處理層(2)係電鍍、陽極處理、染色或物理氣相沉積等表面處理方法製成。a surface treatment layer (2) comprising a first side (21) and a second side (22) opposite to the first side (21), the surface treatment layer (2) coating the heat dissipation layer (1), The surface treatment layer (2) has a thickness of 0.5 to 50 μm, and the surface treatment layer (2) is made of a metal material such as gold, silver, copper, nickel, aluminum, etc., and the surface treatment layer (2) is It is made by surface treatment methods such as electroplating, anodizing, dyeing or physical vapor deposition.

一遠紅外線塗層(3),塗佈於該表面處理層(2)之第一側(21)表面,該遠紅外線塗層(3)厚度小於500微米。A far infrared coating (3) is applied to the surface of the first side (21) of the surface treatment layer (2), the far infrared ray coating (3) having a thickness of less than 500 microns.

一感溫變色層(4),設於該遠紅外線塗層(3)表面,該感溫變色層(4)係為一感溫油墨,該感溫變色層之厚度為5至200微米。A thermochromic layer (4) is disposed on the surface of the far infrared ray coating (3), and the thermochromic layer (4) is a temperature sensitive ink having a thickness of 5 to 200 micrometers.

一夜光層(5),設於該感溫變色層(4)表面,係為一夜光塗料,該夜光層(5)之厚度為5至200微米。A luminous layer (5) is disposed on the surface of the thermochromic layer (4) as a luminous coating, and the luminous layer (5) has a thickness of 5 to 200 micrometers.

需特別說明的是,該夜光層(5)不限於設於該感溫變色層(4)上方,亦可為該夜光層(5)設於該遠紅外線塗層(3)表面而該感溫變色層(4)設於該夜光層(5)表面,或該遠紅外線塗層(3)直接混合該感溫油墨及該夜光塗料後再進行塗佈;該遠紅外線塗層(3)亦不限於塗佈於該表面處理層(2)表面,該遠紅外線塗層(3)可先塗佈於該散熱基材後,該表面處理層(2)再包覆該遠紅外線塗層(3)。It should be particularly noted that the luminous layer (5) is not limited to being disposed above the thermochromic layer (4), and the luminous layer (5) may be disposed on the surface of the far infrared coating (3). The color changing layer (4) is disposed on the surface of the luminous layer (5), or the far infrared ray coating (3) directly mixes the temperature sensitive ink and the luminescent coating, and then coating; the far infrared ray coating (3) is not Limited to the surface of the surface treatment layer (2), the far infrared ray coating (3) may be applied to the heat dissipation substrate, and the surface treatment layer (2) is coated with the far infrared ray coating (3). .

一黏貼層(6),設於該表面處理層(2)之第二側(22),該黏貼層(6)係為一黏劑、一黏膠或一雙面貼紙,該黏貼層(6)可順應不同物件之曲面形狀緊密貼合。An adhesive layer (6) is disposed on the second side (22) of the surface treatment layer (2), and the adhesive layer (6) is an adhesive, a glue or a double-sided sticker, and the adhesive layer (6) ) It can conform to the curved shape of different objects.

請再搭配參閱第三圖所示,於本實施例中,本創作多層之散熱基材係為一貼片,藉由該黏貼層(6)貼附於一可攜式電子裝置(A)的外殼背蓋上,但不限於此,該散熱層(1)亦可直接貼附於該可攜式電子裝置(A)的電池表面上,或貼附於電視、電腦等任何使用時會發熱的待散熱物表面,或直接將本創作製成手機背蓋或待散熱物之外殼。Referring to the third figure, in the present embodiment, the heat dissipation substrate of the present invention is a patch, and the adhesive layer (6) is attached to a portable electronic device (A). The heat dissipation layer (1) may be directly attached to the surface of the battery of the portable electronic device (A), or attached to a television, a computer, etc., which may be heated when used. Wait for the surface of the heat sink, or directly make the creation of the back cover of the phone or the outer casing of the heat sink.

將工作之熱能該遠紅外線塗層(3)以輻射出遠紅外線方式釋放,降低該可攜式電子裝置(A)的溫度,防止過熱而故障或燙傷使用者,藉以使該待該可攜式電子裝置(A)可以快速散熱,避免因高溫而損壞,延長該可攜式電子裝置(A)的使用壽命。The working heat energy of the far-infrared coating (3) is released by radiating far-infrared rays, reducing the temperature of the portable electronic device (A), preventing overheating and malfunctioning or scalding the user, thereby making the portable type The electronic device (A) can quickly dissipate heat, avoid damage due to high temperature, and prolong the service life of the portable electronic device (A).

請再搭配參閱第四圖所示,該感溫變色層(4)於本實施中係為一具驚嘆號的注意標誌,僅為本創作較佳實施例之一,但不以此為限,該感溫變色層(4)亦可滿佈該遠紅外線塗層(3)表面,或其他等效警示符號,藉由該感溫油墨受熱產生顏色變化而浮現該具驚嘆號的注意標誌,提醒使用者該可攜式電子裝置(A)已過熱,需停止使用,以供該遠紅外線塗層(3)提高散熱效率;當該感溫變色層(4)之變色情形消失時,表示該可攜式電子裝置(A)已完成降溫,可繼續使用該可攜式電子裝置(A),亦可確保使用上的安全。Please refer to the fourth figure, the temperature-sensitive color-changing layer (4) is an attention mark of the exclamation mark in this embodiment, which is only one of the preferred embodiments of the present invention, but not limited thereto. The thermochromic layer (4) may also be filled with the surface of the far-infrared coating (3), or other equivalent warning symbol, and the temperature sign of the temperature-sensitive ink is heated to generate the attention mark of the exclamation mark to remind the user The portable electronic device (A) has been overheated and needs to be stopped for the far infrared ray coating (3) to improve heat dissipation efficiency; when the color change layer of the thermochromic layer (4) disappears, the portable type is indicated The electronic device (A) has been cooled down, and the portable electronic device (A) can be continuously used, and the safety in use can be ensured.

請再搭配參閱第四圖所示,該夜光層(5)於本實施例中係為一星星圖案,但不以此為限,該夜光層(5)亦可滿佈該感溫變色層(4)表面。當該可攜式電子裝置(A)位於光線不足的環境時,藉由該夜光塗料發散之光源以供照明,或當忘記該可攜式電子裝置(A)置放於何處時,可透過該夜光塗料發散之光源以便尋找。In addition, as shown in the fourth figure, the luminous layer (5) is a star pattern in this embodiment, but not limited thereto, the luminous layer (5) may also be filled with the thermochromic layer ( 4) Surface. When the portable electronic device (A) is in a low-light environment, the light source that is diverged by the luminous paint is used for illumination, or when the portable electronic device (A) is forgotten, The luminous paint diverges the light source for searching.

綜合上述實施例之說明,當可充分瞭解本創作之操作、使用及本 創作產生之功效,惟以上所述實施例僅係為本創作之較佳實施例,當不能以此限定本創作實施之範圍,即依本創作申請專利範圍及創作說明內容所作簡單的等效變化與修飾,皆屬本創作涵蓋之範圍內。In view of the above description of the embodiments, the above-described embodiments are merely a preferred embodiment of the present invention, and the implementation of the present invention is not limited thereto. The scope, that is, the simple equivalent changes and modifications made in accordance with the scope of the patent application and the content of the creation of the creation, are within the scope of this creation.

(1)‧‧‧散熱層
(2)‧‧‧表面處理層
(21)‧‧‧表面處理層之第一側
(22)‧‧‧表面處理層之第二側
(3)‧‧‧遠紅外線塗層
(4)‧‧‧感溫變色層
(5)‧‧‧夜光層
(6)‧‧‧黏貼層
(A)‧‧‧可攜式電子裝置
(1) ‧‧ ‧Dissipation layer (2)‧‧‧Surface treatment layer (21) ‧‧‧First side of surface treatment layer (22) ‧‧‧Second side of surface treatment layer (3)‧‧‧ far Infrared coating (4) ‧ ‧ thermochromic layer (5) ‧ ‧ luminous layer (6) ‧ ‧ adhesive layer (A) ‧ ‧ portable electronic device

[第一圖]係為本創作實施例之立體示意圖。[First figure] is a perspective view of the present embodiment.

[第二圖]係為本創作實施例之剖視示意圖。[Second figure] is a schematic cross-sectional view of the present embodiment.

[第三圖]係為本創作實施例之示意圖使用示意圖。[Third Figure] is a schematic diagram showing the use of the schematic embodiment of the present invention.

[第四圖]係為本創作實施例之感溫變色層使用示意圖。[Fourth figure] is a schematic view showing the use of the thermochromic layer of the present embodiment.

[第五圖]係為本創作實施例之夜光層使用示意圖。[Fifth Figure] is a schematic diagram of the use of the luminous layer of the present embodiment.

(1)‧‧‧散熱層 (1) ‧‧‧heat layer

(2)‧‧‧表面處理層 (2) ‧‧‧ surface treatment layer

(3)‧‧‧遠紅外線塗層 (3) ‧‧‧ far infrared coating

(4)‧‧‧感溫變色層 (4) ‧ ‧ thermochromic layer

(5)‧‧‧夜光層 (5) ‧‧‧ luminous layer

(6)‧‧‧黏貼層 (6) ‧‧‧Adhesive layer

Claims (10)

一種多層之散熱基材,包含: 一散熱層,該散熱基材厚度為0.1至2釐米; 一表面處理層,包覆該散熱層,該表面處理層包括一第一側及一第二側相對該第一側,該表面處理層厚度為0.5至50微米; 一遠紅外線塗層,塗佈於該表面處理層之第一側表面,該遠紅外線塗層厚度小於500微米;及 一黏貼層,設於該表面處理層之第二側表面。A multi-layer heat dissipation substrate comprising: a heat dissipation layer having a thickness of 0.1 to 2 cm; a surface treatment layer covering the heat dissipation layer, the surface treatment layer comprising a first side and a second side opposite The first side, the surface treatment layer has a thickness of 0.5 to 50 micrometers; a far infrared ray coating layer coated on the first side surface of the surface treatment layer, the far infrared ray coating layer has a thickness of less than 500 micrometers; and an adhesive layer, Provided on the second side surface of the surface treatment layer. 如申請專利範圍第1項所述之多層之散熱基材,其中,該散熱層係為銀、銅、石墨、石墨烯、陶瓷、鋁或其混合之材質所製成。The multi-layer heat-dissipating substrate according to claim 1, wherein the heat-dissipating layer is made of silver, copper, graphite, graphene, ceramic, aluminum or a mixture thereof. 如申請專利範圍第1項所述之多層之散熱基材,其中,該表面處理層係為一金屬材質所製成。The multi-layer heat-dissipating substrate of claim 1, wherein the surface treatment layer is made of a metal material. 如申請專利範圍第1項所述之多層之散熱基材,進一步,該遠紅外線塗層設有一感溫變色層,該感溫變色層係為一感溫油墨,該感溫變色層之厚度為5至200微米。The multi-layer heat-dissipating substrate according to claim 1, wherein the far-infrared coating layer is provided with a thermochromic layer, wherein the thermo-chromic layer is a temperature-sensitive ink, and the thickness of the thermo-sensitive layer is 5 to 200 microns. 如申請專利範圍第1項所述之多層之散熱基材,進一步,該遠紅外線塗層設有一夜光層,該夜光層係為一夜光塗料,該夜光層之厚度為5至200微米。The multi-layer heat-dissipating substrate according to claim 1, wherein the far-infrared coating layer is provided with a luminous layer, and the luminous layer is a luminous coating, and the luminous layer has a thickness of 5 to 200 μm. 如申請專利範圍第1項所述之多層之散熱基材,進一步,該遠紅外線塗層混合一感溫油墨及一夜光塗料。The multi-layer heat-dissipating substrate according to claim 1, wherein the far-infrared coating is mixed with a temperature-sensitive ink and a luminous coating. 一種多層之散熱基材,包含: 一散熱層,該散熱層厚度為0.1至2釐米; 一遠紅外線塗層,塗佈於該散熱層,該遠紅外線塗層厚度小於500微米; 一表面處理層,包覆該遠紅外線塗層,該表面處理層包括一第一側及一第二側相對該第一側,厚度為0.5至50微米;及 一黏貼層,設於該表面處理層之第二側表面。A multi-layer heat-dissipating substrate comprising: a heat-dissipating layer having a thickness of 0.1 to 2 cm; a far-infrared coating applied to the heat-dissipating layer, the far-infrared coating layer having a thickness of less than 500 μm; Coating the far infrared ray coating, the surface treatment layer includes a first side and a second side opposite to the first side, the thickness is 0.5 to 50 micrometers; and an adhesive layer disposed on the second surface treatment layer Side surface. 如申請專利範圍第7項所述之多層之散熱基材,其中,該散熱層係為銀、銅、石墨、石墨烯、陶瓷、鋁或其混合之材質所製成。The multi-layer heat-dissipating substrate according to claim 7, wherein the heat-dissipating layer is made of silver, copper, graphite, graphene, ceramic, aluminum or a mixture thereof. 如申請專利範圍第7項所述之多層之散熱基材,進一步,該表面處理層之第一側設有一感溫變色層,該感溫變色層係為一感溫油墨,該感溫變色層之厚度為5至200微米。The multi-layer heat-dissipating substrate of claim 7, wherein the first side of the surface treatment layer is provided with a thermochromic layer, and the thermochromic layer is a temperature-sensitive ink layer. The thickness is 5 to 200 microns. 如申請專利範圍第7項所述之多層之散熱基材,進一步,該表面處理層之第一側設有一夜光層,該夜光層係為一夜光塗料,該夜光層之厚度為5至200微米。The multi-layer heat-dissipating substrate of claim 7, further comprising a luminous layer on the first side of the surface treatment layer, the luminous layer being a luminous coating, the luminous layer having a thickness of 5 to 200 μm .
TW104218581U 2015-11-19 2015-11-19 Multilayered heat dissipation substrate TWM521549U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104218581U TWM521549U (en) 2015-11-19 2015-11-19 Multilayered heat dissipation substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104218581U TWM521549U (en) 2015-11-19 2015-11-19 Multilayered heat dissipation substrate

Publications (1)

Publication Number Publication Date
TWM521549U true TWM521549U (en) 2016-05-11

Family

ID=56510152

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104218581U TWM521549U (en) 2015-11-19 2015-11-19 Multilayered heat dissipation substrate

Country Status (1)

Country Link
TW (1) TWM521549U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI745774B (en) * 2019-11-01 2021-11-11 宏碁股份有限公司 Remote heat exchanging module and composite thin-layered heat conduction structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI745774B (en) * 2019-11-01 2021-11-11 宏碁股份有限公司 Remote heat exchanging module and composite thin-layered heat conduction structure

Similar Documents

Publication Publication Date Title
TW201404287A (en) Heat dissipation composite and the uses thereof
KR100953857B1 (en) A pcb unified with soft silicon pad for high speed heat dissipation of led and the method thereof
TWM521549U (en) Multilayered heat dissipation substrate
TWI573521B (en) Heat dissipation structure of handheld electronic device
ATE457121T1 (en) ELECTRONIC DEVICE HAVING AN EXTERNAL SURFACE WITH DUAL FUNCTIONS
TWI637012B (en) Method for preparing heat-dissipating coating and metal heat-dissipating composite film made
CN203968557U (en) High conductive graphite film
CN109429444A (en) The shell of portable electronic devices transfers thermal dispersant coatings structure
CN203340509U (en) Novel heat radiation fin
CN108384478A (en) A kind of heat dissipation double faced adhesive tape
TWI735612B (en) Shell transfer heat dissipation coating structure of portable electronic device
CN207252049U (en) The housing transfer thermal dispersant coatings structure of portable electronic devices
TWI678143B (en) Temperature-dependent color-changed multilayer and thermal module including the same
CN205674588U (en) A kind of Graphene heat dissipation film
TW201715937A (en) Far-infrared heat dissipating tape
TW201420742A (en) Thermal conductive material
KR20090000113U (en) Heat Absorbing Tape
TWM575148U (en) Radiative heat dissipation label and thermal conduction dissipation label
WO2015192425A1 (en) Circuit board capable of dissipating heat from two sides, for light-emitting diode (led) display screen
TWI460832B (en) Packaging structure of semiconducting component and method for packaging semicoducting component
TW201521559A (en) Heat conduction coating
CN203851415U (en) Metallic pasting film capable of accelerating heat dissipation
KR20110002555U (en) Heatsink for led module and led lamp having thereof
CN203851416U (en) Antistatic heat-radiation adhesive film
US20180299111A1 (en) Composite structure and method for producing the same and electronic device

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees