CN203851416U - Antistatic heat-radiation adhesive film - Google Patents
Antistatic heat-radiation adhesive film Download PDFInfo
- Publication number
- CN203851416U CN203851416U CN201420283691.6U CN201420283691U CN203851416U CN 203851416 U CN203851416 U CN 203851416U CN 201420283691 U CN201420283691 U CN 201420283691U CN 203851416 U CN203851416 U CN 203851416U
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- CN
- China
- Prior art keywords
- metal substrate
- adhesive
- layer
- adhesive film
- heat radiation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an antistatic heat-radiation adhesive film, which comprises a metal substrate. The cross-sectional profile of the metal substrate is wave-shaped. The two sides of the metal substrate are coated with viscose layers capable of covering wave crests. The release paper with a release layer is covered outside each viscose layer respectively. According to the technical scheme of the utility model, the influence of the static electricity on products is reduced. Meanwhile, the heat generated by heating elements inside a housing can be quickly conducted to the housing.
Description
Technical field
The utility model relates to adhesive film, especially relates to a kind of static that can reduce and also the heat of shell internal heat generation element can be conducted fast to the heat radiation adhesive film to the energy antistatic of shell to the impact of product.
Background technology
Along with the generally use of the electronic products such as mobile phone, panel computer, notebook computer, these products in use can be subject to the impact of static and disturb its working effect.Battery or the CPU of these products can generate heat at work simultaneously, if can not dispel the heat in time, will affect its working effect, further can cause the destruction of equipment, and these elements are generally arranged in product casing, this has more affected their radiating effect, and some product dispels the heat by adhesive film between heater element and device housings now, but bad because of the thermal conductivity of adhesive film material itself, still can not solve well heat dissipation problem.
Utility model content
For addressing the above problem, the purpose of this utility model is to provide a kind of and can reduces static to the impact of product and the heat of shell internal heat generation element can be conducted fast to the heat radiation adhesive film to the energy antistatic of shell.
The utility model is realized by following technical measures, a kind of heat radiation adhesive film of energy antistatic, comprise that cross section is corrugated metal substrate, two faces of described metal substrate are all coated with the adhesive-layer that can cover crest, and described adhesive-layer is also coated with the release liners with release layer outward.
As a kind of optimal way, two faces of described metal substrate are all provided with multiple projections upwards.
As a kind of optimal way, described metal substrate is copper metal substrate, aluminum metal substrate, ferrous metal substrate, silver metal substrate or Al-alloy metal substrate.
As a kind of optimal way, the thickness of described metal substrate is 0.05mm-0.5mm.
As a kind of optimal way, described adhesive-layer is acrylic compounds adhesive-layer or silicone based adhesive-layer.
As a kind of optimal way, wherein the outer surface of a release liners is also provided with one deck release layer, is coated with an adhesive paper on described release layer, and described adhesive paper is coated with adhesive-layer in the one side of release layer.
The utility model one side sticks on the shell of product, and another side sticks on element surface, utilizes corrugated metal substrate to reduce the impact of static on product; And utilize corrugated metal substrate as main heat exchange pattern, and can realize very strong radiating effect, can suppress the problems such as the damage of facilities causing because of the temperature rise of chip in housing or heater element.The utility model can reduce static to the impact of product and the heat of shell internal heat generation element can be conducted fast to shell.
Brief description of the drawings
Fig. 1 is the cross-sectional view of the utility model one embodiment;
Fig. 2 is the cross-sectional view of another embodiment of the utility model.
Embodiment
Below in conjunction with embodiment and contrast accompanying drawing the utility model is described in further detail.
The heat radiation adhesive film of a kind of energy antistatic of the present embodiment, please refer to Fig. 1, comprise that cross section is corrugated metal substrate 1, two faces of described metal substrate 1 are all coated with the adhesive-layer 2 that can cover crest, outside described adhesive-layer 2, are also coated with the release liners 4 with release layer 3.
The one side of this product sticks on the shell of product, and another side sticks on element surface, utilizes corrugated metal substrate 1 to reduce the impact of static on product; And utilize corrugated metal substrate 1 as main heat exchange pattern, and can realize very strong radiating effect, can suppress the problems such as the damage of facilities causing because of the temperature rise of chip in housing or heater element.
The heat radiation adhesive film of the energy antistatic of the present embodiment, please refer to Fig. 1, can also be specifically that metal substrate 1 is copper metal substrate, aluminum metal substrate, ferrous metal substrate, silver metal substrate or Al-alloy metal substrate on the basis of previous technique scheme.
The heat radiation adhesive film of the energy antistatic of the present embodiment, please refer to Fig. 1, can also be specifically that the thickness of metal substrate 1 is 0.05mm-0.5mm on the basis of previous technique scheme.
The heat radiation adhesive film of the energy antistatic of the present embodiment, please refer to Fig. 1, can also be specifically that adhesive-layer 3 is acrylic compounds adhesive-layer or silicone based adhesive-layer on the basis of previous technique scheme.
The heat radiation adhesive film of the energy antistatic of the present embodiment, please refer to Fig. 2, on the basis of previous technique scheme, can also be specifically, wherein the outer surface of a release liners 4 is also provided with one deck release layer 5, on described release layer 5, be coated with an adhesive paper 7, described adhesive paper 7 is coated with adhesive-layer 6 in the one side of release layer 5.In the time that the article surface that will paste has dust or particle, can first adhesive paper 7 be opened, utilize the adhesive-layer 6 on sticky adhesive paper 7 surfaces that dust or particle are sticked up.Thereby there is the effect of energy clean article surface dirt or particle, thereby increase the firm pasting degree of product.
More than that the heat radiation adhesive film of the utility model energy antistatic is set forth; be used for helping to understand the utility model; but execution mode of the present utility model is not restricted to the described embodiments; anyly do not deviate from the change done under the utility model principle, modification, substitute, combination, simplify; all should be equivalent substitute mode, be included in protection range of the present utility model in.
Claims (5)
1. a heat radiation adhesive film for energy antistatic, is characterized in that: comprise that cross section is corrugated metal substrate, two faces of described metal substrate are all coated with the adhesive-layer that can cover crest, and described adhesive-layer is also coated with the release liners with release layer outward.
2. the heat radiation adhesive film of energy antistatic according to claim 1, is characterized in that: described metal substrate is copper metal substrate, aluminum metal substrate, ferrous metal substrate, silver metal substrate or Al-alloy metal substrate.
3. the heat radiation adhesive film of energy antistatic according to claim 1, is characterized in that: the thickness of described metal substrate is 0.05mm-0.5mm.
4. the heat radiation adhesive film of energy antistatic according to claim 1, is characterized in that: described adhesive-layer is acrylic compounds adhesive-layer or silicone based adhesive-layer.
5. the heat radiation adhesive film of energy antistatic according to claim 1, it is characterized in that: wherein the outer surface of a release liners is also provided with one deck release layer, on described release layer, be coated with an adhesive paper, described adhesive paper is coated with adhesive-layer in the one side of release layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420283691.6U CN203851416U (en) | 2014-05-29 | 2014-05-29 | Antistatic heat-radiation adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420283691.6U CN203851416U (en) | 2014-05-29 | 2014-05-29 | Antistatic heat-radiation adhesive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203851416U true CN203851416U (en) | 2014-09-24 |
Family
ID=51564380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420283691.6U Expired - Fee Related CN203851416U (en) | 2014-05-29 | 2014-05-29 | Antistatic heat-radiation adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203851416U (en) |
-
2014
- 2014-05-29 CN CN201420283691.6U patent/CN203851416U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140924 Termination date: 20170529 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |