CN114106723A - Insulation shielding composite film capable of storing heat and having high safety and application thereof - Google Patents
Insulation shielding composite film capable of storing heat and having high safety and application thereof Download PDFInfo
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- CN114106723A CN114106723A CN202111420943.6A CN202111420943A CN114106723A CN 114106723 A CN114106723 A CN 114106723A CN 202111420943 A CN202111420943 A CN 202111420943A CN 114106723 A CN114106723 A CN 114106723A
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- 238000009413 insulation Methods 0.000 title claims abstract description 43
- 239000002131 composite material Substances 0.000 title claims abstract description 38
- 229920001721 polyimide Polymers 0.000 claims abstract description 74
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 56
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 56
- 239000010439 graphite Substances 0.000 claims abstract description 56
- 239000012790 adhesive layer Substances 0.000 claims abstract description 50
- 238000004146 energy storage Methods 0.000 claims abstract description 50
- 239000010410 layer Substances 0.000 claims abstract description 21
- 239000012782 phase change material Substances 0.000 claims abstract description 12
- 238000013329 compounding Methods 0.000 claims abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims description 22
- 229910052582 BN Inorganic materials 0.000 claims description 13
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 13
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 150000003839 salts Chemical class 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 239000012188 paraffin wax Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims 1
- 238000005338 heat storage Methods 0.000 abstract description 6
- 239000011231 conductive filler Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003366 poly(p-phenylene terephthalamide) Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
Abstract
An insulation shielding composite film capable of storing heat and having high safety sequentially comprises an upper heat conduction and insulation polyimide film (10), an upper heat conduction adhesive layer (40), a nano energy storage graphite sheet (20), a middle heat conduction adhesive layer (50), a lower heat conduction and insulation polyimide film (30), a lower heat conduction adhesive layer (70) and a release film (60) from top to bottom; the nano energy storage graphite sheet (20) is coated between the upper layer of heat-conducting insulating polyimide film (10) and the lower layer of heat-conducting insulating polyimide film (30); the nano energy storage graphite sheet (20) is formed by compounding a conductive graphite sheet and a nano phase change material. The composite film has good heat conduction and insulation performance and good shielding and heat storage functions, can effectively reduce the temperature of electronic equipment, and prolongs the service life of the electronic equipment.
Description
The application is a divisional application of an invention patent with application date of 2019, month 01 and 28, application number of 201910078050.4 and name of insulating shielding composite film capable of storing heat and high in safety.
Technical Field
The invention relates to an electric conduction and heat conduction composite material, in particular to an insulation shielding composite film which has good heat conduction and insulation performance, has shielding and heat storage functions, can avoid short circuit in the using process, can store heat and has high safety.
Background
With the rapid development of the electronic industry, electronic devices such as personal computers, mobile phones, servers, GPS navigation devices, and other household electronic devices are becoming more popular, and meanwhile, the electronic devices are becoming smaller and smaller, and are becoming more and more powerful. This requires that the internal chip or electronic module of the electronic device has a powerful function and operates at a faster and faster speed, and the more possible the electromagnetic interference and the more heat generated thereby, the more heat energy is concentrated at a certain point of the chip or the electronic module. The short, thin and light space in the electronic equipment can not or hardly conduct heat by simply arranging a fan, and the generated useless electromagnetic waves are also wandered in the place with gaps. When the chip or the electronic module is in a high-temperature environment, the working performance is reduced, and the service life is shortened; the unwanted electromagnetic waves interfere with the normal operation of the electronic module, and may cause unnecessary trouble to the environment.
Therefore, it is an objective requirement to rapidly and effectively transfer heat from the electronic device and shield the unwanted electromagnetic waves.
Disclosure of Invention
The present invention has been made to solve the above problems, and an object of the present invention is to provide an insulation and shielding composite film capable of rapidly storing and transmitting heat emitted from electronic equipment, shielding useless electromagnetic waves, and preventing short circuits, and having high safety and heat storage capability.
In order to realize the purpose of the invention, the invention provides an insulation shielding composite film which can store heat and has high safety,
the composite film sequentially comprises an upper heat-conducting insulating polyimide film 10, an upper heat-conducting adhesive layer 40, a nano energy storage graphite sheet 20, a middle heat-conducting adhesive layer 50, a lower heat-conducting insulating polyimide film 30, a lower heat-conducting adhesive layer 70 and a release film 60 from top to bottom;
the nano energy storage graphite sheet 20 is coated between the upper heat-conducting insulating polyimide film 10 and the lower heat-conducting insulating polyimide film 30;
the nano energy storage graphite sheet 20 is formed by compounding a conductive graphite sheet and a nano phase change material;
the nano phase change material is one of paraffin, crystalline hydrated salt or molten salt;
the peripheral size of the upper layer of heat-conducting and insulating polyimide film 10 is 0.3-0.5 mm larger than that of the nano energy storage graphite sheet 20;
the peripheral sizes of the lower layer heat conduction and insulation polyimide film 30 and the upper layer heat conduction and insulation polyimide film 10 are the same;
the peripheral size of the upper heat-conducting adhesive layer 40 is the same as that of the upper heat-conducting insulating polyimide film 10;
the peripheral dimension of the middle thermal conductive adhesive layer 50 is the same as the peripheral dimension of the lower thermal conductive insulating polyimide film 30.
Preferably, the thickness of the upper layer of heat-conducting and insulating polyimide film 10 is 0.0125-0.025 mm.
Preferably, the thickness of the nano energy storage graphite sheet 20 is 0.1-0.2 mm.
Preferably, the thickness of the lower thermal conductive and insulating polyimide film 30 is 0.025 to 0.05 mm.
Preferably, the upper heat-conducting adhesive layer 40 and the middle heat-conducting adhesive layer 50 are formed by compounding high-temperature-resistant organic silicon pressure-sensitive adhesive and boron nitride, and the thicknesses of the upper heat-conducting adhesive layer 40 and the middle heat-conducting adhesive layer 50 are both 0.005 mm.
Preferably, the release film 60 is made of a poly-p-phthalic acid material, and the release film 60 has a release force of 3-8 g and a thickness of 0.05-0.1 mm.
Preferably, the lower thermal conductive adhesive layer 70 is made of a high temperature resistant silicone pressure sensitive adhesive and boron nitride, and has a thickness of 0.01 mm.
The invention effectively solves the problems of long curing time, poor bonding strength and low reliability of the existing heat-conducting material. The insulation shielding composite film capable of storing heat and having high safety is formed by compounding the upper heat conduction insulation polyimide film 10, the nanometer energy storage graphite sheet 20 and the lower heat conduction insulation polyimide film 30, and simultaneously the upper heat conduction insulation polyimide film 10, the nanometer energy storage graphite sheet 20 and the lower heat conduction insulation polyimide film 30 are respectively bonded together through the heat conduction adhesive layer, wherein the heat conduction insulation polyimide film 10 has good heat conduction and insulation performance, and the nanometer energy storage graphite sheet 20 is formed by compounding the electric conduction graphite sheet and the nanometer phase change material, so that heat emitted by electronic equipment can be stored and transmitted, the insulation shielding composite film has good shielding and heat storage functions, the temperature of the electronic equipment can be effectively reduced, and the service life of the electronic equipment is prolonged. In addition, the nano energy storage graphite sheet 20 is coated between the upper heat-conducting insulating polyimide film 10 and the lower heat-conducting insulating polyimide film 30 to form a sandwich structure, so that the composite film is ensured to be short-circuited due to the leakage of crystal scraps in long-term use, and the safety of the composite film is improved.
In addition, the invention also has the characteristics of simple structure and convenient use.
Drawings
FIG. 1 is a schematic structural view of a heat-storable and highly safe insulation shielding composite film according to the present invention; 10-an upper layer of heat-conducting insulating polyimide film, 20-a nano energy storage graphite sheet, 30-a lower layer of heat-conducting insulating polyimide film, 40-an upper heat-conducting adhesive layer, 50-a middle heat-conducting adhesive layer, 60-a release film and 70-a lower heat-conducting adhesive layer.
Detailed Description
Referring to fig. 1, the insulation shielding composite film capable of storing heat and having high safety of the present invention is formed by compounding a heat conductive insulation polyimide film, a nano energy storage graphite sheet, a heat conductive adhesive layer and a release film. The heat-conducting and insulating polyimide film comprises an upper heat-conducting and insulating polyimide film 10, an upper heat-conducting adhesive layer 40, a nano energy storage graphite sheet 20, a middle heat-conducting adhesive layer 50, a lower heat-conducting and insulating polyimide film 30, a lower heat-conducting adhesive layer 70 and a release film 60 from top to bottom in sequence. The composite film is used as a heat dissipation device of a chip or an electronic module in electronic equipment.
As shown in fig. 1, the upper thermally conductive and insulating polyimide film 10 has excellent thermal conductivity and strong insulating property. The thickness of the upper layer heat-conducting insulating polyimide film 10 is 0.0125-0.025 mm, and the peripheral size of the upper layer heat-conducting insulating polyimide film is larger than that of the nano energy storage graphite sheet 20, so that the nano energy storage graphite sheet 20 can be coated conveniently. The peripheral size of the upper layer of heat-conducting and insulating polyimide film 10 is 0.3-0.5 mm larger than that of the nano energy storage graphite sheet 20, and in this embodiment, the peripheral size of the upper layer of heat-conducting and insulating polyimide film 10 is 0.5 mm larger than that of the nano energy storage graphite sheet 20, so that the nano energy storage graphite sheet 20 is completely wrapped therein. The lower surface of the upper-layer heat-conducting insulating polyimide film 10 is provided with a nano energy storage graphite sheet 20, the nano energy storage graphite sheet 20 is formed by compounding a conductive graphite sheet and a nano phase change material, and the thickness of the nano energy storage graphite sheet is 0.1-0.2 mm. This nanometer energy storage graphite flake 20 has good shielding function, and because nanometer phase change material's addition, make the complex film nanometer phase change material can absorb heat and take place the phase transition in the use, with the heat that absorbs electronic equipment and give out, and outwards transmit the absorbed heat, thereby make nanometer energy storage graphite flake 20 have the heat-retaining function, have good heat storage ability again when making the complex film have shielding property, can reduce the range of change of electronic equipment temperature, alleviate electronic equipment temperature variation trend, extension electronic equipment's life. The nano phase change material can be paraffin, crystalline hydrated salt or molten salt, and can also be other nano phase change materials.
As shown in fig. 1, a lower thermal conductive and insulating polyimide film 30 is disposed on the lower surface of the nano energy storage graphite sheet 20, and has excellent thermal conductivity and strong insulating property. The thickness of the lower layer heat-conducting insulating polyimide film 30 is 0.025-0.05 mm, and the peripheral dimension of the lower layer heat-conducting insulating polyimide film is larger than that of the nano energy storage graphite sheet 20, so that the nano energy storage graphite sheet 20 can be coated conveniently. Wherein, the peripheral dimension of lower floor's heat conduction insulating polyimide film 30 is bigger than the peripheral dimension of nanometer energy storage graphite flake 20 by 0.3 ~ 0.5 millimeter, in this embodiment, the peripheral dimension of lower floor's heat conduction insulating polyimide film 30 is bigger than the peripheral dimension of nanometer energy storage graphite flake 20 by 0.5 millimeter, so that wrap nanometer energy storage graphite flake 20 wherein completely, thereby make upper heat conduction insulating polyimide film 10, nanometer energy storage graphite flake 20 and lower floor's heat conduction insulating polyimide film 30 form "sandwich" structure, can avoid long-term use in-process nanometer energy storage graphite flake to leak outward because of the crystal piece and cause the short circuit, make the complex film have higher insulating properties and excellent security performance.
As shown in fig. 1, a release film 60 made of a poly (p-phenylene terephthalamide) material with a release force of 3 to 8 g and a thickness of 0.05 to 0.1 mm is attached to the lower surface of the lower thermal conductive and insulating polyimide film 30. So as to ensure the characteristics of the composite membrane and simultaneously avoid the influence of pollution on the use performance of the composite membrane before use.
As shown in fig. 1, an upper thermal conductive adhesive layer 40 is disposed between the upper thermal conductive and insulating polyimide film 10 and the nano energy storage graphite sheet 20, so that the upper thermal conductive and insulating polyimide film 10 and the nano energy storage graphite sheet 20 are bonded together. Specifically, the upper surface of the upper thermal conductive adhesive layer 40 is connected to the lower surface of the upper thermal conductive insulating polyimide film 10, and the lower surface of the upper thermal conductive adhesive layer 40 is connected to the upper surface of the nano energy storage graphite sheet 20. In this embodiment, the upper thermal conductive adhesive layer 40 is prepared from a high temperature resistant silicone pressure sensitive adhesive and a thermal conductive filler, wherein the thermal conductive filler is boron nitride, which has high thermal conductivity, and the addition of boron nitride can reduce the influence of boron nitride on the thermal conductivity of the composite film to the greatest extent. The thinner the thickness of the upper thermal conductive adhesive layer 40 is, the lower the influence on the thermal conductivity is, the thickness in this embodiment is 0.005 mm, which not only ensures good adhesion performance, but also can reduce the influence on the thermal conductivity of the composite film. The peripheral dimension of the upper thermal conductive adhesive layer 40 is the same as the peripheral dimension of the upper thermal conductive insulating polyimide film 10, so that the upper thermal conductive insulating polyimide film 10 completely covers the upper portion of the nano energy storage graphite sheet 20.
And a middle heat-conducting adhesive layer 50 is arranged between the nano energy storage graphite sheet 20 and the lower heat-conducting insulating polyimide film 30, so that the nano energy storage graphite sheet 20 and the lower heat-conducting insulating polyimide film 30 are bonded together. Specifically, the upper surface of the middle thermal conductive adhesive layer 50 is connected to the lower surface of the nano energy storage graphite sheet 20, and the lower surface of the middle thermal conductive adhesive layer 50 is connected to the upper surface of the lower thermal conductive insulating polyimide film 30. In this embodiment, the middle thermal conductive adhesive layer 50 is prepared from a high temperature resistant silicone pressure sensitive adhesive and a thermal conductive filler, wherein the thermal conductive filler is boron nitride, which has high thermal conductivity, and the influence of the boron nitride on the thermal conductivity of the composite film can be reduced to the greatest extent by adding the boron nitride. The thinner the thickness of the middle thermal adhesive layer 50 is, the lower the influence on the thermal conductivity is, the thickness in the embodiment is 0.005 mm, which not only ensures good adhesion performance, but also can reduce the influence on the thermal conductivity of the composite film. The thinner the thickness, the lower the influence on the thermal conductivity. The peripheral dimension of the middle thermal conductive adhesive layer 50 is the same as that of the lower thermal conductive insulating polyimide film 30, so that the lower thermal conductive insulating polyimide film 30 completely covers the lower portion of the nano energy storage graphite sheet 20.
A lower heat-conducting adhesive layer 70 is arranged between the lower heat-conducting insulating polyimide film 30 and the release film 60, and the lower heat-conducting insulating polyimide film 30 is bonded with the release film 60 through the lower heat-conducting adhesive layer 70. Specifically, the upper surface of the lower thermal conductive adhesive layer 70 is connected to the upper surface of the lower thermal conductive insulating polyimide film 30, and the lower surface of the lower thermal conductive adhesive layer 70 is connected to the upper surface of the release film 60. In this embodiment, the lower thermal conductive adhesive layer 70 is prepared from a high temperature resistant silicone pressure sensitive adhesive and a thermal conductive filler, wherein the thermal conductive filler is boron nitride, which has high thermal conductivity, and the influence of the boron nitride on the thermal conductivity of the composite film can be reduced to the greatest extent by adding the boron nitride. The peripheral dimension of this lower heat-conducting adhesive layer 70 is the same with the peripheral dimension of lower floor's heat conduction insulating polyimide film 30, and its thickness is 0.01 millimeter to ensure that the composite film can firmly laminate the heating source surface when using, reduce the influence to the complex film thermal conductivity simultaneously.
Therefore, the insulation shielding composite film capable of storing heat and having high safety is formed by compounding the upper heat conduction and insulation polyimide film 10, the nanometer energy storage graphite sheet 20 and the lower heat conduction and insulation polyimide film 30, and simultaneously the upper heat conduction and insulation polyimide film 10, the nanometer energy storage graphite sheet 20 and the lower heat conduction and insulation polyimide film 30 are respectively bonded together through the heat conduction adhesive layer, wherein the heat conduction and insulation polyimide film has good heat conduction and insulation performance, and the nanometer energy storage graphite sheet is formed by compounding the electric conduction graphite sheet and the nanometer phase change material, so that heat emitted by electronic equipment can be stored and transmitted, the insulation shielding composite film has good shielding and heat storage functions, the temperature of the electronic equipment can be effectively reduced, and the service life of the electronic equipment is prolonged. In addition, the nano energy storage graphite sheet 20 is coated between the upper heat-conducting insulating polyimide film 10 and the lower heat-conducting insulating polyimide film 30 to form a sandwich structure, so that the composite film is ensured to be short-circuited due to the leakage of crystal scraps in long-term use, and the safety of the composite film is improved. In addition, the invention also has the characteristics of simple structure and convenient use.
Although the present invention has been described with reference to the above embodiments, the scope of the present invention is not limited thereto, and modifications, substitutions and the like of the above members are intended to fall within the scope of the claims of the present invention without departing from the spirit of the present invention.
Claims (8)
1. An insulation shielding composite film capable of storing heat and having high safety is characterized in that the composite film sequentially comprises an upper heat conduction and insulation polyimide film (10), an upper heat conduction adhesive layer (40), a nano energy storage graphite sheet (20), a middle heat conduction adhesive layer (50), a lower heat conduction and insulation polyimide film (30), a lower heat conduction adhesive layer (70) and a release film (60) from top to bottom;
the nano energy storage graphite sheet (20) is coated between the upper layer of heat-conducting insulating polyimide film (10) and the lower layer of heat-conducting insulating polyimide film (30);
the nano energy storage graphite sheet (20) is formed by compounding a conductive graphite sheet and a nano phase change material;
the nano phase change material is one of paraffin, crystalline hydrated salt or molten salt;
the peripheral size of the upper heat-conducting insulating polyimide film (10) is 0.3-0.5 mm larger than that of the nano energy storage graphite sheet (20);
the peripheral sizes of the lower layer heat conduction and insulation polyimide film (30) and the upper layer heat conduction and insulation polyimide film (10) are the same;
the peripheral size of the upper heat-conducting adhesive layer (40) is the same as that of the upper heat-conducting insulating polyimide film (10);
the peripheral size of the middle heat-conducting adhesive layer (50) is the same as that of the lower heat-conducting insulating polyimide film (30).
2. The insulation shielding composite film capable of storing heat and having high safety according to claim 1, wherein the thickness of the upper layer heat-conducting and insulating polyimide film (10) is 0.0125 mm to 0.025 mm.
3. The insulation shielding composite film capable of storing heat and having high safety according to claim 1, wherein the thickness of the nano energy storage graphite sheet (20) is 0.1-0.2 mm.
4. The insulation shielding composite film capable of storing heat and having high safety according to claim 1, wherein the thickness of the lower layer heat conductive and insulating polyimide film (30) is 0.025 to 0.05 mm.
5. The insulation shielding composite film capable of storing heat and having high safety according to claim 1, wherein the upper heat conductive adhesive layer (40) and the middle heat conductive adhesive layer (50) are formed by compounding high temperature resistant silicone pressure sensitive adhesive and boron nitride, and the thickness of the upper heat conductive adhesive layer (40) and the thickness of the middle heat conductive adhesive layer (50) are both 0.005 mm.
6. The insulation shielding composite film capable of storing heat and having high safety according to claim 1, wherein the release film (60) is made of a poly (p-phenylene terephthamide) material, and the release film (60) has a release force of 3 to 8 g and a thickness of 0.05 to 0.1 mm.
7. The insulation shielding composite film capable of storing heat and having high safety according to claim 1, wherein the lower thermal conductive adhesive layer (70) is made of a high temperature resistant silicone pressure sensitive adhesive and boron nitride, and has a thickness of 0.01 mm.
8. The use of the heat-storable and highly safe insulation shielding composite film according to any one of claims 1 to 7 for the preparation of heat dissipation devices for chips or electronic modules in electronic devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111420943.6A CN114106723A (en) | 2019-01-28 | 2019-01-28 | Insulation shielding composite film capable of storing heat and having high safety and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111420943.6A CN114106723A (en) | 2019-01-28 | 2019-01-28 | Insulation shielding composite film capable of storing heat and having high safety and application thereof |
| CN201910078050.4A CN109913145A (en) | 2019-01-28 | 2019-01-28 | It can heat accumulation and highly-safe insulation shielding composite membrane |
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| CN201910078050.4A Division CN109913145A (en) | 2019-01-28 | 2019-01-28 | It can heat accumulation and highly-safe insulation shielding composite membrane |
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| CN201910078050.4A Pending CN109913145A (en) | 2019-01-28 | 2019-01-28 | It can heat accumulation and highly-safe insulation shielding composite membrane |
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| JP5574532B2 (en) * | 2009-10-08 | 2014-08-20 | 信越化学工業株式会社 | Thermally conductive silicone rubber composite sheet |
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| CN109913145A (en) | 2019-06-21 |
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