CN109913145A - It can heat accumulation and highly-safe insulation shielding composite membrane - Google Patents
It can heat accumulation and highly-safe insulation shielding composite membrane Download PDFInfo
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- CN109913145A CN109913145A CN201910078050.4A CN201910078050A CN109913145A CN 109913145 A CN109913145 A CN 109913145A CN 201910078050 A CN201910078050 A CN 201910078050A CN 109913145 A CN109913145 A CN 109913145A
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- heat
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- conductive insulating
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- kapton
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
It is a kind of can heat accumulation and highly-safe insulation shielding composite membrane, it is combined by upper layer heat conductive insulating Kapton, nanometer energy storage graphite flake and lower layer's heat conductive insulating Kapton, nanometer energy storage graphite flake is coated between upper layer heat conductive insulating Kapton and lower layer's heat conductive insulating Kapton, upper layer heat conductive insulating Kapton, lower layer's heat conductive insulating Kapton are compound by upper heat-conducting glue layer, middle heat-conducting glue layer and nanometer energy storage graphite flake respectively, and nanometer energy storage graphite flake is formed by electrically conductive graphite piece and nano phase change Material cladding.Composite membrane of the invention has good thermally conductive and insulation performance, good shielding and heat storage function, can effectively reduce the temperature of electronic equipment, extends the service life of electronic equipment.In addition, nanometer energy storage graphite flake forms " sandwich " structure between heat conductive insulating Kapton, the safety of composite membrane can be improved.The present invention also has structure simple, feature easy to use.
Description
[technical field]
The present invention relates to a kind of conductive and heat-conductive composite materials to have screen more particularly to a kind of thermally conductive and good insulation preformance
It covers and heat storage function, can avoid use process short circuit can heat accumulation and highly-safe insulation shielding composite membrane.
[background technique]
With the fast development of electronics industry, the families such as electronic equipment such as PC, mobile phone, server, GPS navigation device
With the increasing crowdization of electronic device, meanwhile, the volume of electronic equipment is increasingly looked down upon, and function is also more and more and increasingly stronger
Greatly.This requires the inside chip of electronic equipment or electronic module are powerful, and the speed of service is getting faster, and is thus brought
Electromagnetic Interference possibility it is bigger and generate heat it is also more and more, be collected in the heat of chip point or electronic module point
It can be also more and more.And short thin light and small space can not or be difficult merely to go out heat transfer by setting fan in electronic equipment
It goes, and the unwanted electromagnetic wave generated is also gone around in the place for having gap.When chip or electronic module can reduce under high temperature environment
Working performance shortens working life；And unwanted electromagnetic wave can interfere with the normal operation of electronic module, also be possible to make environment
At unnecessary puzzlement.Therefore, how quickly and efficiently the heat transfer in electronic equipment to be gone out, and shields useless electricity
Magnetic wave just becomes a kind of objective demand.
[summary of the invention]
Present invention seek to address that the above problem, and a kind of heat storage that can quickly give out electronic equipment is provided
Come and send out, while maskable useless electromagnetic wave, and can avoid short circuit can heat accumulation and highly-safe insulation shielding
Composite membrane.
To achieve the purpose of the present invention, the present invention provides it is a kind of can heat accumulation and highly-safe insulation shielding composite membrane,
The composite membrane is answered by upper layer heat conductive insulating Kapton, nanometer energy storage graphite flake and lower layer's heat conductive insulating Kapton
It closes, the nanometer energy storage graphite flake is coated on upper layer heat conductive insulating Kapton and lower layer's heat conductive insulating polyimides
Between film, the lower surface of the upper layer heat conductive insulating Kapton, lower layer's heat conductive insulating Kapton upper table
Face is compound by upper heat-conducting glue layer, middle heat-conducting glue layer and upper surface, the lower surface of nanometer energy storage graphite flake respectively, the nanometer storage
Energy graphite flake is formed by electrically conductive graphite piece and nano phase change Material cladding.
The nano phase change material is one of paraffin, crystalline hydrate salt or fuse salt.
The upper layer heat conductive insulating Kapton with a thickness of 0.0125~0.025 millimeter, Outside Dimensions are greater than
The Outside Dimensions of nanometer energy storage graphite flake.
The Outside Dimensions of the upper layer heat conductive insulating Kapton are bigger by 0.3 than the Outside Dimensions of nanometer energy storage graphite flake
~0.5 millimeter.
The nanometer energy storage graphite flake with a thickness of 0.1~0.2 millimeter.
Lower layer's heat conductive insulating Kapton with a thickness of 0.025~0.05 millimeter, Outside Dimensions are thermally conductive with upper layer
The Outside Dimensions of dielectric polyimide film are identical.
The upper heat-conducting glue layer and middle heat-conducting glue layer are combined by high-temperature resistant silicone pressure sensitive adhesive and boron nitride, it is described on
The thickness of heat-conducting glue layer and middle heat-conducting glue layer is 0.005 millimeter.
The composite membrane is pasted with release film, and the release film is attached at lower layer's heat conductive insulating polyamides Asia by lower heat-conducting glue layer
The lower surface of amine film.
Release film is made of poly terephthalic acid class material, and the off-type force of the release film is 3~8 grams, with a thickness of
0.05~0.1 millimeter.
The lower heat-conducting glue layer is prepared by high-temperature resistant silicone pressure sensitive adhesive and boron nitride, with a thickness of 0.01 millimeter.
Contribution of the invention is, it is poor and reliable to efficiently solve existing Heat Conduction Material curing time length, adhesive strength
The low problem of property.It is of the invention can heat accumulation and highly-safe insulation shielding composite membrane it is thin by upper layer heat conductive insulating polyimides
Film, nanometer energy storage graphite flake and lower layer's heat conductive insulating Kapton are combined, while respectively will be upper by heat-conducting glue layer
Layer heat conductive insulating Kapton, nanometer energy storage graphite flake and lower layer's heat conductive insulating Kapton bond together,
In, heat conductive insulating Kapton has good thermally conductive and insulation performance, and passes through conductive stone in nanometer energy storage graphite flake
Ink sheet is formed with nano phase change Material cladding, and the heat that can be given out electronic equipment is stored and sent out, and is had
Good shielding and heat storage function can effectively reduce the temperature of electronic equipment, extend the service life of electronic equipment.In addition, receiving
Rice energy storage graphite flake, which is coated between upper layer heat conductive insulating Kapton and lower layer's heat conductive insulating Kapton, to be formed
" sandwich " structure, it is ensured that composite membrane, which is used for a long time, causes short circuit because of the leakage of crystal clast, improves the safety of composite membrane.
In addition, the present invention also has structure simple, feature easy to use.
[Detailed description of the invention]
Fig. 1 is structural schematic diagram of the invention.
[specific embodiment]
Refering to fig. 1, it is of the invention can heat accumulation and highly-safe insulation shielding composite membrane it is thin by heat conductive insulating polyimides
Film, nanometer energy storage graphite flake, heat-conducting glue layer and release film are combined.It successively includes upper layer heat conductive insulating polyamides from top to bottom
Imines film 10, upper heat-conducting glue layer 40, nanometer energy storage graphite flake 20, middle heat-conducting glue layer 50, lower layer's heat conductive insulating polyimides are thin
Film 30, lower heat-conducting glue layer 70 and release film 60.The composite membrane is as chip in electronic equipment or the radiating element of electronic module.
As shown in Figure 1, upper layer heat conductive insulating Kapton 10 has excellent heating conduction and stronger insulating properties
Energy.The upper layer heat conductive insulating Kapton 10 with a thickness of 0.0125~0.025 millimeter, Outside Dimensions are stored up greater than nanometer
The Outside Dimensions of energy graphite flake 20, in order to coat a nanometer energy storage graphite flake 20.Wherein, upper layer heat conductive insulating Kapton
10 Outside Dimensions are 0.3~0.5 millimeter bigger than the Outside Dimensions of nanometer energy storage graphite flake 20, and in the present embodiment, upper layer is thermally conductive absolutely
The Outside Dimensions of edge Kapton 10 are 0.5 millimeter bigger than the Outside Dimensions of nanometer energy storage graphite flake 20, in order to by nanometer
The cladding completely of energy storage graphite flake 20 is wherein.On upper layer, the lower surface of heat conductive insulating Kapton 10 is equipped with nanometer energy storage graphite
Piece 20, this nanometer of energy storage graphite flake 20 are formed by electrically conductive graphite piece and nano phase change Material cladding, with a thickness of 0.1~0.2 milli
Rice.This nanometer of energy storage graphite flake 20 has good function of shielding, and due to the addition of nano phase change material, makes composite membrane
It can be absorbed heat and be undergone phase transition with nano phase change material in the process, to absorb the heat that electronic equipment comes out, and will be absorbed
Heat transmit outward, thus make nanometer energy storage graphite flake 20 have heat storage function, make composite membrane have shielding properties while
There is good thermal storage performance again, the variation range of electronic equipment temperature can be reduced, mitigate electronic equipment temperature changing trend, prolong
The service life of long electronic equipment.Wherein, nano phase change material can be paraffin, crystalline hydrate salt or fuse salt, can also be with
For other nano phase change materials.
As shown in Figure 1, it is equipped with lower layer's heat conductive insulating Kapton 30 in the lower surface of nanometer energy storage graphite flake 20,
With excellent heating conduction and stronger insulation performance.Lower layer's heat conductive insulating Kapton 30 with a thickness of 0.025
~0.05 millimeter, Outside Dimensions are greater than the Outside Dimensions of nanometer energy storage graphite flake 20, in order to coat a nanometer energy storage graphite flake
20.Wherein, the Outside Dimensions of lower layer's heat conductive insulating Kapton 30 are bigger by 0.3 than the Outside Dimensions of nanometer energy storage graphite flake 20
~0.5 millimeter, in the present embodiment, the Outside Dimensions of lower layer's heat conductive insulating Kapton 30 are than nanometer energy storage graphite flake 20
Outside Dimensions are 0.5 millimeter big, in order to coat nanometer energy storage graphite flake 20 wherein, to make upper layer heat conductive insulating polyamides completely
Imines film 10, nanometer energy storage graphite flake 20 and lower layer's heat conductive insulating Kapton 30 form " sandwich " structure, can keep away
Exempt from long-term use process nanometer energy storage graphite flake because of short circuit caused by the leakage of crystal clast, makes composite membrane insulating properties with higher
Energy and excellent security performance.As shown in Figure 1, being pasted with release film in the lower surface of lower layer's heat conductive insulating Kapton 30
60, which is made of poly terephthalic acid class material, and off-type force is 3~8 grams, with a thickness of 0.05~0.1 millimeter.With true
The characteristic of composite membrane is protected, while composite membrane being avoided to influence its service performance using being preceding contaminated.
It is above led as shown in Figure 1, being equipped between upper layer heat conductive insulating Kapton 10 and nanometer energy storage graphite flake 20
Hot glue layer 40 makes upper layer heat conductive insulating Kapton 10 bond together with nanometer energy storage graphite flake 20.Specifically, on this
The upper surface of heat-conducting glue layer 40 is connect with the lower surface of upper layer heat conductive insulating Kapton 10, the following table of upper heat-conducting glue layer 40
The upper surface connection of face nanometer energy storage graphite flake 20.In the present embodiment, heat-conducting glue layer 40 is by high-temperature resistant silicone pressure sensitive adhesive on this
And heat filling is prepared, wherein heat filling is boron nitride, and with high thermal conductivity, adding boron nitride can maximum journey
Degree ground reduces its influence to composite membrane heating conduction.Thinner influence to heating conduction of thickness of heat-conducting glue layer 40 is more on this
It is low, in the present embodiment with a thickness of 0.005 millimeter, not only guaranteed good adhesive property, but also can reduce to composite membrane thermal conductivity
The influence of energy.The Outside Dimensions of upper heat-conducting glue layer 40 are identical as the Outside Dimensions of upper layer heat conductive insulating Kapton 10, with
Coat upper layer heat conductive insulating Kapton 10 top of nanometer energy storage graphite flake 20 all wherein.In nanometer energy storage stone
It is equipped with middle heat-conducting glue layer 50 between ink sheet 20 and lower layer's heat conductive insulating Kapton 30, makes nanometer energy storage graphite flake 20 under
Layer heat conductive insulating Kapton 30 bonds together.Specifically, the upper surface of heat-conducting glue layer 50 and nanometer energy storage stone in this
The lower surface of ink sheet 20 connects, and the lower surface of middle heat-conducting glue layer 50 and the upper surface of lower layer's heat conductive insulating Kapton 30 connect
It connects.In the present embodiment, heat-conducting glue layer 50 is prepared by high-temperature resistant silicone pressure sensitive adhesive and heat filling in this, wherein thermally conductive
Filler is boron nitride, and with high thermal conductivity, it can farthest be reduced to composite membrane heating conduction by adding boron nitride
It influences.Thinner influence to heating conduction of 50 thickness of heat-conducting glue layer is lower in this, in the present embodiment with a thickness of 0.005 millimeter,
It had not only guaranteed good adhesive property, but also can reduce the influence to composite membrane heating conduction.The thickness is thinner to heating conduction
It influences lower.The Outside Dimensions of middle heat-conducting glue layer 50 are identical as the Outside Dimensions of lower layer heat conductive insulating Kapton 30, with
Coat lower layer's heat conductive insulating Kapton 30 lower part of nanometer energy storage graphite flake 20 all wherein.It is thermally conductive absolutely in lower layer
Lower heat-conducting glue layer 70 is equipped between edge Kapton 30 and release film 60, by lower heat-conducting glue layer 70 by lower layer's heat conductive insulating
Kapton 30 bonds together with release film 60.Specifically, the upper surface of lower heat-conducting glue layer 70 and lower layer's heat conductive insulating
The upper surface of Kapton 30 connects, and the lower surface of lower heat-conducting glue layer 70 is connect with the upper surface of release film 60.This implementation
In example, which is prepared by high-temperature resistant silicone pressure sensitive adhesive and heat filling, wherein heat filling is nitridation
Boron, with high thermal conductivity, its influence to composite membrane heating conduction can farthest be reduced by adding boron nitride.It is led under this
The Outside Dimensions of hot glue layer 70 are identical as the Outside Dimensions of lower layer heat conductive insulating Kapton 30, with a thickness of 0.01 milli
Rice, with ensure using when composite membrane can secure fit pyrotoxin surface, while reducing influence to composite membrane heating conduction.
Take this, it is of the invention can heat accumulation and highly-safe insulation shielding composite membrane pass through upper layer heat conductive insulating polyimides
Film 10, nanometer energy storage graphite flake 20 and lower layer's heat conductive insulating Kapton 30 are combined, while passing through heat-conducting glue layer
Respectively by upper layer heat conductive insulating Kapton 10, nanometer energy storage graphite flake 20 and lower layer's heat conductive insulating Kapton 30
It bonds together, wherein heat conductive insulating Kapton has good thermally conductive and insulation performance, and nanometer energy storage graphite flake
In formed by electrically conductive graphite piece and nano phase change Material cladding, the heat that can be given out electronic equipment is stored and is passed
It sees off, there is good shielding and heat storage function, can effectively reduce the temperature of electronic equipment, extend electronic equipment uses the longevity
Life.In addition, nanometer energy storage graphite flake 20 is coated on upper layer heat conductive insulating Kapton 10 and lower layer's heat conductive insulating polyamides is sub-
" sandwich " structure is formed between amine film 30, it is ensured that composite membrane, which is used for a long time, causes short circuit because of the leakage of crystal clast, mentions
The safety of high composite membrane.In addition, the present invention also has structure simple, feature easy to use.
Although being disclosed by above embodiments to the present invention, scope of protection of the present invention is not limited thereto,
Under conditions of without departing from present inventive concept, deformation, the replacement etc. done to above each component will fall into right of the invention
In claimed range.
Claims (10)
1. one kind can heat accumulation and highly-safe insulation shielding composite membrane, which is characterized in that the composite membrane is by upper layer heat conductive insulating
Kapton (10), nanometer energy storage graphite flake (20) and lower layer's heat conductive insulating Kapton (30) are combined, institute
It states a nanometer energy storage graphite flake (20) and is coated on upper layer heat conductive insulating Kapton (10) and lower layer's heat conductive insulating polyimides
Between film (30), the lower surface of the upper layer heat conductive insulating Kapton (10), lower layer's heat conductive insulating polyimides are thin
The upper surface of film (30) passes through the upper table of upper heat-conducting glue layer (40), middle heat-conducting glue layer (50) and nanometer energy storage graphite flake (20) respectively
Face, lower surface are compound, and the nanometer energy storage graphite flake (20) is formed by electrically conductive graphite piece and nano phase change Material cladding.
2. as described in claim 1 can heat accumulation and highly-safe insulation shielding composite membrane, which is characterized in that the nanometer phase
Change material is one of paraffin, crystalline hydrate salt or fuse salt.
3. as described in claim 1 can heat accumulation and highly-safe insulation shielding composite membrane, which is characterized in that lead on the upper layer
Thermal insulation Kapton (10) with a thickness of 0.0125~0.025 millimeter, Outside Dimensions are greater than nanometer energy storage graphite flake
(20) Outside Dimensions.
4. as claimed in claim 3 can heat accumulation and highly-safe insulation shielding composite membrane, which is characterized in that lead on the upper layer
The Outside Dimensions of thermal insulation Kapton (10) are 0.3~0.5 millimeter bigger than the Outside Dimensions of nanometer energy storage graphite flake (20).
5. as described in claim 1 can heat accumulation and highly-safe insulation shielding composite membrane, which is characterized in that the nanometer storage
Can graphite flake (20) with a thickness of 0.1~0.2 millimeter.
6. as described in claim 1 can heat accumulation and highly-safe insulation shielding composite membrane, which is characterized in that lower layer is thermally conductive absolutely
Edge Kapton (30) with a thickness of 0.025~0.05 millimeter, Outside Dimensions and upper layer heat conductive insulating polyimides are thin
The Outside Dimensions of film (10) are identical.
7. as described in claim 1 can heat accumulation and highly-safe insulation shielding composite membrane, which is characterized in that described thermally conductive
Glue-line (40) and middle heat-conducting glue layer (50) are combined by high-temperature resistant silicone pressure sensitive adhesive and boron nitride, the upper heat-conducting glue layer
(40) and the thickness of middle heat-conducting glue layer (50) is 0.005 millimeter.
8. as described in claim 1 can heat accumulation and highly-safe insulation shielding composite membrane, which is characterized in that composite membrane patch
It is covered with release film (60), the release film (60) is attached at lower layer's heat conductive insulating Kapton by lower heat-conducting glue layer (70)
(30) lower surface.
9. as claimed in claim 8 can heat accumulation and highly-safe insulation shielding composite membrane, which is characterized in that release film (60)
It is made of poly terephthalic acid class material, the off-type force of the release film (60) is 3~8 grams, with a thickness of 0.05~0.1 milli
Rice.
10. as claimed in claim 8 can heat accumulation and highly-safe insulation shielding composite membrane, which is characterized in that led under described
Hot glue layer (70) is prepared by high-temperature resistant silicone pressure sensitive adhesive and boron nitride, with a thickness of 0.01 millimeter.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910078050.4A CN109913145A (en) | 2019-01-28 | 2019-01-28 | It can heat accumulation and highly-safe insulation shielding composite membrane |
| CN202111420943.6A CN114106723A (en) | 2019-01-28 | 2019-01-28 | Insulation shielding composite film capable of storing heat and having high safety and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910078050.4A CN109913145A (en) | 2019-01-28 | 2019-01-28 | It can heat accumulation and highly-safe insulation shielding composite membrane |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111420943.6A Division CN114106723A (en) | 2019-01-28 | 2019-01-28 | Insulation shielding composite film capable of storing heat and having high safety and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109913145A true CN109913145A (en) | 2019-06-21 |
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ID=66960879
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|---|---|---|---|
| CN201910078050.4A Pending CN109913145A (en) | 2019-01-28 | 2019-01-28 | It can heat accumulation and highly-safe insulation shielding composite membrane |
| CN202111420943.6A Pending CN114106723A (en) | 2019-01-28 | 2019-01-28 | Insulation shielding composite film capable of storing heat and having high safety and application thereof |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202111420943.6A Pending CN114106723A (en) | 2019-01-28 | 2019-01-28 | Insulation shielding composite film capable of storing heat and having high safety and application thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112175538A (en) * | 2020-10-14 | 2021-01-05 | 深圳市飞荣达科技股份有限公司 | Film and preparation method thereof |
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| CN102029752A (en) * | 2009-10-08 | 2011-04-27 | 信越化学工业株式会社 | Thermal conductive silicone rubber composite sheet |
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| CN107424967A (en) * | 2016-05-23 | 2017-12-01 | 比亚迪股份有限公司 | A kind of mobile phone thermal component and module and method |
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| 覃小红 等: "《纳米技术与纳米纺织品》", 31 December 2011, 东华大学出版社 * |
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| CN112175538A (en) * | 2020-10-14 | 2021-01-05 | 深圳市飞荣达科技股份有限公司 | Film and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN114106723A (en) | 2022-03-01 |
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Application publication date: 20190621 |