CN112898929A - Instant-curing liquid metal composite thermal interface material and preparation method thereof - Google Patents
Instant-curing liquid metal composite thermal interface material and preparation method thereof Download PDFInfo
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- CN112898929A CN112898929A CN202110178186.XA CN202110178186A CN112898929A CN 112898929 A CN112898929 A CN 112898929A CN 202110178186 A CN202110178186 A CN 202110178186A CN 112898929 A CN112898929 A CN 112898929A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Abstract
The invention provides a liquid metal composite thermal interface material capable of being cured immediately and a preparation method thereof, wherein the liquid metal composite thermal interface material capable of being cured immediately comprises the following components: liquid metal, a coupling agent, a toughening agent, epoxy resin and a curing agent. According to the invention, the liquid metal micro-nano liquid drop subjected to surface treatment and the toughening agent are filled into the epoxy resin matrix to prepare the heat conducting paste, and finally the curing agent is added to prepare the instantly-cured liquid metal heat conducting gasket, so that the liquid metal heat conducting gasket can prevent the liquid metal drop from being leaked in the using process, and the stability and reliability of the thermal interface material are ensured. The instantly-cured liquid metal composite thermal interface material is high in thermal conductivity and strong in adhesion, a complete gasket is formed after curing, separation or falling is avoided, and the ultrahigh heat dissipation requirement of high-power electronic equipment in a liquid environment can be met.
Description
Technical Field
The invention belongs to the technical field of electronic equipment heat dissipation, and particularly relates to an instant-curing liquid metal composite thermal interface material applicable to heat dissipation equipment working in a liquid environment and a preparation method thereof.
Background
Very large-scale data center can produce a large amount of heats at the course of the work, and the immersion liquid cooling dispels the heat through soaking electronic equipment and components and parts in insulating liquid environment, and the heat conductivity of insulating coolant liquid is 6 times the air, and the heat that electronic component produced directly transmits the liquid that flows high-efficiently, can help improving its heat dissipation design and effectively transmit the heat to the demand to initiative cooling module such as radiator and fan has been reduced. Heating element and radiating element can't adopt traditional heat conduction silicone grease and heat conduction gasket among the immersion liquid cooling equipment, because the liquid environment washes down heat conduction silicone grease probably takes place to break and drop, can cause the pollution to the liquid environment, and ordinary heat conduction gasket heat conductivity is lower simultaneously, can't give off the heat high-efficiently. At present, solid metal sheets are mostly adopted as thermal interface materials between a heating element and a radiating element in an immersed liquid cooling device, on one hand, the thermal conductivity of metal is high, and on the other hand, the solid materials cannot be separated or fall off under the flushing of a liquid environment, so that the liquid environment is prevented from being polluted. However, the selection of the solid metal sheet as the thermal interface material leads to a large thermal contact resistance with the heat generating and dissipating device, and the material itself has a high thermal conductivity and cannot effectively help dissipating heat.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the instantly solidified liquid metal composite thermal interface material and the preparation method thereof, the instantly solidified liquid metal thermal interface material has higher thermal conductivity, can be tightly bonded with heating and radiating components, greatly reduces the contact thermal resistance, can effectively improve the radiating efficiency of the whole system, does not separate or fall off under the washing of a liquid environment, and can ensure the stable operation of the system.
In order to achieve the purpose, the invention adopts the following technical scheme:
an instant solidified liquid metal composite thermal interface material, which comprises the following raw materials: liquid metal, coupling agent, toughening agent, epoxy resin and curing agent;
the liquid metal is gallium-based N-element alloy or bismuth-based N-element alloy, and N is an integer more than or equal to 2;
the coupling agent is selected from one or more of KH-550, KH-560, KH-570, KH-792, KH-580, KH-590, DL-602, DL-171, Span-80, Span-85, 1-dodecyl mercaptan or mercapto-undecylamine hydrochloride;
the toughening agent is selected from one or more of polyamide, polyvinyl acetal, glass fiber, asbestos fiber, dibutyl phthalate or dioctyl phthalate.
The epoxy resin is selected from one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin and bisphenol S type epoxy resin;
the curing agent is selected from one or more of ethylenediamine, triethylamine, triethanolamine and diethylenetriamine.
Further, the gallium-based N-element alloy is selected from one or more of gallium-indium alloy, gallium-indium-tin-zinc alloy or gallium-indium-tin-zinc-silver.
Further, the bismuth-based N-element alloy is selected from one or more of bismuth indium alloy, bismuth indium tin zinc alloy or bismuth indium tin zinc silver alloy.
Further, the melting point of the liquid metal is less than 100 ℃, and the thermal conductivity is more than 15W/m.K.
Further, the thermal interface material comprises the following raw materials in percentage by mass: 85-97% of liquid metal, 3-15% of epoxy resin and curing agent, 100% of the sum of the mass fractions of the liquid metal, the epoxy resin and the curing agent, and 0.1-1:1 of the mass ratio of the curing agent to the epoxy resin; the dosage of the coupling agent is 0.1-5% of the mass of the liquid metal, and the dosage of the toughening agent is 0.1-10% of the mass of the liquid metal.
Further, the liquid metal has a droplet size of 100nm to 500 μm.
The preparation method of the thermal interface material comprises the following steps:
and 4, when in use, adding the curing agent into the paste composite material, uniformly stirring, smearing the mixture between the heating element and the radiating element before curing, and forming the thermal interface material after curing.
The thermal interface material is a heat-conducting gasket material with high thermal conductivity and good mechanical property, can effectively help heat dissipation between the heating element and the radiating element, is applied to radiating equipment working in a flowing liquid environment, and cannot cause separation or falling of the thermal interface material due to scouring of the liquid environment.
In the invention, the thermal conductivity and stability of the thermal interface material can be further improved by designing parameters such as the type and filling amount of the material.
Has the advantages that: the invention creatively designs the type of the material, treats the surface of the metal liquid drop by adding the coupling agent, adds the epoxy resin and the toughening agent to obtain a paste composite material which is uniformly mixed, adds the curing agent into the paste when in use, uniformly stirs the curing agent, coats the curing agent between the heating element and the radiating element, and obtains the heat-conducting gasket material with high heat conductivity and good bonding property after curing, thereby greatly reducing the contact thermal resistance between the thermal interface material and the chip or the radiator, having the radiating effect far higher than that of a solid metal sheet, and being capable of meeting the ultrahigh radiating requirement of high-power electronic equipment in an immersed liquid cooling environment.
Drawings
FIG. 1 is a block diagram of an embodiment of an instant solidified liquid metal composite thermal interface material; wherein: 1-metal liquid drop, 2-coupling agent, 3-toughening agent, 4-epoxy resin and curing agent.
Fig. 2 is a flowchart of a method for preparing an instant solidified liquid metal composite thermal interface material according to an embodiment of the present invention.
Detailed Description
In order to effectively improve the heat dissipation efficiency of electronic components in an immersed liquid cooling environment, the invention provides an instant-curing liquid metal composite thermal interface material. This compound thermal interface material of liquid metal of instant solidification heat conductivity is higher, simultaneously can with generate heat, the radiating component closely bonds together, greatly reduced thermal contact resistance, can effectively promote entire system's radiating efficiency to also do not take place to separate or drop under the washing away of liquid environment, can guarantee the steady operation of system.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. It is to be understood that such description is merely illustrative and not intended to limit the scope of the present invention. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the invention. It may be evident, however, that one or more embodiments may be practiced without these specific details. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
Based on the problems in the prior art, the embodiment of the invention designs an instant-curing liquid metal composite thermal interface material based on a liquid heat conduction material and a solid heat conduction material, so as to overcome the defect that the contact thermal resistance of a solid metal sheet heat conduction material used by electronic equipment in the existing immersion type liquid cooling environment is high, and the following specific embodiment is introduced.
FIG. 1 schematically illustrates a block diagram of an instant solidification liquid metal composite thermal interface material, in accordance with an embodiment of the present invention.
As shown in fig. 1, the instant solidified liquid metal composite thermal interface material provided in this embodiment may include:
In the embodiment of the present invention, the liquid metal may include, for example, one of a gallium-based N-member alloy or a bismuth-based N-member alloy, where N is an integer greater than or equal to 2, where the gallium-based N-member alloy includes at least one of a gallium-indium alloy, a gallium-indium-tin-zinc alloy, and a gallium-indium-tin-zinc-silver alloy, and the bismuth-based N-member alloy includes at least one of a bismuth-indium alloy, a bismuth-indium-tin-zinc alloy, and a bismuth-indium-tin-zinc-silver; the coupling agent can comprise one or more of KH-550, KH-560, KH-570, KH-792, KH-580, KH-590, DL-602, DL-171, Span-80, Span-85, 1-dodecanethiol, and mercapto-undecanamine hydrochloride; the toughening agent can comprise one or more of polyamide, polyvinyl acetal, glass fiber, asbestos fiber, dibutyl phthalate and dioctyl phthalate; the epoxy resin can comprise one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin and bisphenol S type epoxy resin; the curing agent can comprise one or more of ethylenediamine, triethylamine, triethanolamine and diethylenetriamine, for example.
According to the embodiment of the invention, through the design of the structure and the material type of the instantly-cured liquid metal composite thermal interface material, the composite thermal interface material has good heat conducting performance and bonding performance, the contact thermal resistance of the material can be greatly reduced, the separation or falling-off of the material under the washing of a liquid environment can be avoided, the heat dissipation effect is far higher than that of a solid metal sheet, and the ultrahigh heat dissipation requirement of high-power electronic equipment in the liquid environment can be met. The immersion liquid cooling becomes the main development direction of heat dissipation of a large-scale data center in the future, so that the liquid metal composite thermal interface material capable of being solidified immediately has wide application prospect.
In order to further improve the heat dissipation effect of the instantly solidified liquid metal composite thermal interface material, the embodiment of the invention designs the relevant parameters of the composite material.
In embodiments of the invention, the liquid metal may have a melting point of less than 30 ℃ and a thermal conductivity of greater than 15W/m.K. The filling mass fraction of the liquid metal is, for example, 85% to 97%. The metal droplet size is, for example, from 100nm to 500. mu.m, preferably from 500nm to 100. mu.m. By reasonably designing the filling volume fraction and the size of the metal liquid drop, a heat conduction path can be effectively established and the heat conductivity of the composite material is improved. The mass fraction of the epoxy resin and the curing agent may be, for example, 3% to 15%, and the mass ratio of the curing agent to the epoxy resin is 0.1 to 1: 1. The coupling agent is a liquid metal mass fraction which may be, for example, from 0.1% to 5%, preferably from 0.3% to 3%; the mass fraction of the liquid metal in the toughening agent may be, for example, 0.1% to 10%, preferably 0.5% to 5%. The surface of the metal liquid drop is treated by reasonably selecting the type and the content of the coupling agent, so that the effective combination between the metal liquid drop and the epoxy resin matrix can be assisted. By reasonably selecting the type and the content of the toughening agent, the mechanical strength of the composite material can be effectively enhanced, and in the range, the solid material is moderate in hardness and not easy to tear, and is more favorable for being used in a liquid environment.
The embodiment of the invention can further improve the heat dissipation effect of the composite thermal interface material by optimally designing each parameter of the instantly solidified liquid metal composite thermal interface material.
Based on the embodiment, the embodiment of the invention also provides a preparation method of the instantly-cured liquid metal composite thermal interface material, which comprises the steps of adding the metal micro-nano droplets and the toughening agent with the surfaces treated by the coupling agent into the epoxy resin matrix material, finally adding the curing agent, and uniformly stirring to obtain the uncured liquid metal composite material, thereby finally obtaining the instantly-cured liquid metal composite thermal interface material. The composite material is coated between the heating device and the heat dissipation device, and the heating device and the heat dissipation device can be effectively bonded after being cured, so that the air gap between the heating device and the heat dissipation device is eliminated, the thermal contact resistance is reduced, and the heat dissipation performance is improved.
FIG. 2 schematically illustrates a flow chart of a method for preparing an instant solidified liquid metal composite thermal interface material, according to an embodiment of the invention.
As shown in fig. 2, the method may include, for example, operations S201-S204.
In operation S201, adding a liquid metal and a coupling agent into the dispersion liquid to perform magnetic stirring or ultrasonic pulverization, so as to form a micro-nano metal droplet suspension liquid after surface treatment;
and forming a layer of self-adaptive film on the surface of the metal micro-nano liquid drop to obtain the metal micro-nano liquid drop after surface treatment.
In the embodiment of the invention, the surface of the metal liquid drop can be treated by adding a coupling agent, wherein the coupling agent can comprise one or more of KH-550, KH-560, KH-570, KH-792, KH-580, KH-590, DL-602, DL-171, Span-80, Span-85, 1-dodecyl mercaptan and mercapto-undecylamine hydrochloride. By processing the surface of the metal liquid drop, the liquid drops can be prevented from being fused with each other, and meanwhile, the combination of the metal liquid drop and the epoxy resin matrix can be effectively promoted.
In operation S202, the suspension is placed in a high-speed centrifuge for centrifugal rotation, and then the supernatant is removed to obtain a precipitate, which is then placed in a drying oven for drying;
in the embodiment of the present invention, the centrifugation method may be, for example: and stirring the mixture for 5-10min at 3500 plus 5000rpm by adopting a high-speed centrifuge so as to ensure that the micro-nano metal droplets and the dispersion liquid are layered. And finally, placing the micro-nano metal drops with the supernatant removed into a vacuum drying chamber, and drying for 1h at the temperature of 60 ℃.
In operation S203, adding epoxy resin and a toughening agent to the dried metal droplets, and stirring at a high speed under a vacuum condition to obtain a uniformly mixed paste composite material;
the paste composite material can be prepared, for example, by the following steps: stirring at 50-500rpm by using a planetary stirrer, and carrying out vacuum pumping treatment at the pressure of 1Pa in the process, so that micro-nano metal droplets, a toughening agent and epoxy resin are preliminarily mixed; stirring at 1000 plus 1500rpm to fully mix the micro-nano metal droplets, the toughening agent and the epoxy resin; and finally stirring at 1800 plus 2800rpm to uniformly mix the micro-nano metal droplets, the toughening agent and the epoxy resin.
In operation S204, when in use, the curing agent is added into the paste composite material and uniformly stirred, and is applied between the heating element and the heat dissipation element before being cured, and a gasket material with higher thermal conductivity and better mechanical property is formed after curing, so that heat dissipation between the heating element and the heat dissipation element can be effectively assisted.
The paste composite material can be applied by, for example: uniformly coating the prepared paste composite material on the surface of a heating device by adopting a screen printing method, wherein the thickness is 30-100 mu m, and preferably 50-80 mu m; uniformly coating the prepared paste composite material on the surface of a heat dissipation device by adopting a screen printing method, wherein the thickness is 30-100 mu m, and preferably 50-80 mu m; and finally, tightly fixing the heat dissipation device and the heating device together, and curing the composite material between the heat dissipation device and the heating device to form the heat conduction gasket.
In order to more clearly illustrate the above-mentioned preparation method, specific examples are described below.
Example 1
The embodiment provides a preparation method of an instant solidified liquid metal composite thermal interface material, which comprises the following steps:
And 2, putting the dispersed mixed solution into a high-speed centrifuge, rotating at the speed of 5000rpm for 10min, separating the metal droplets from the dispersed solution, removing the upper-layer dispersed solution, and putting the metal droplets subjected to surface treatment into a drying box to be dried for 1h at the temperature of 80 ℃.
And 4, adding 0.25g of ethylenediamine into the paste composite material, and uniformly stirring to obtain the instantly-cured liquid metal composite thermal interface material. Therefore, the multilayer thermal interface material with good heat conductivity and stability can be prepared by the method.
Coating the uncured composite material on the surface of a copper heating block and the surface of a soaking plate with the size of 4cm x 4cm by adopting a screen printing method, wherein the sum of the thicknesses is 100 mu m, forming an opening close to the top of a heat source, arranging a thermocouple, measuring the temperature of the heat source, and measuring the temperature of the thermocouple with the temperature measuring precision of +/-0.5 ℃. After the soaking plate and the copper heating block are tightly fixed by the fastener, the whole soaking plate and copper heating block system is placed in an environment filled with a fluorinated liquid after the thermal interface material is completely cured, a heat source is started, the environment of the fluorinated liquid is constant at 25 ℃, the heating is carried out at a fixed power of 100W, and the value is read after the temperature of a thermocouple is stable and is 38.2 ℃.
Example 2
The embodiment provides a method for preparing an instant solidified liquid metal composite thermal interface material, which is different from the embodiment 1 in that:
the content of liquid metal is increased to 23g, the epoxy resin is replaced by 0.6g of bisphenol F epoxy resin, the curing agent is replaced by 0.3g of diethylenetriamine, and the rest conditions are unchanged.
After detection, the fixed power of 100W is heated in the environment of the fluorizated liquid, and the value is read to be 37.1 ℃ after the temperature of the thermocouple is stable.
Example 3
The embodiment provides a method for preparing an instant solidified liquid metal composite thermal interface material, which is different from the embodiment 1 in that:
the liquid metal is replaced by bismuth indium tin alloy, the coupling agent is replaced by 0.15g of Span-85, and the rest conditions are unchanged.
After detection, the fixed power of 100W is heated in the environment of the fluorizated liquid, and the value is read to be 40.3 ℃ after the temperature of the thermocouple is stable.
Example 4
The embodiment provides a method for preparing an instant solidified liquid metal composite thermal interface material, which is different from the embodiment 1 in that:
the toughening agent is replaced by 1.0g of dibutyl phthalate, the contents of the epoxy resin and the curing agent are replaced by 1.6g and 0.4g, and the rest conditions are unchanged.
After detection, the fixed power of 100W is heated in the environment of the fluorizated liquid, and the value is read after the temperature of the thermocouple is stable and is 42.6 ℃.
Comparative example 1
Placing a metal indium sheet with the thickness of 100 mu m between the copper heating block and the soaking plate, tightly fixing the metal indium sheet by using a fastener, forming a hole on the heat source close to the top, arranging a thermocouple, measuring the temperature of the heat source, and measuring the temperature of the thermocouple with the temperature measuring precision of +/-0.5 ℃. The whole soaking plate and copper heating block system is placed in an environment full of a fluorinated liquid, a heat source is started, the environment of the fluorinated liquid is constant at 25 ℃, the heating is carried out at a fixed power of 100W, and a value is read after the temperature of a thermocouple is stable and is 96.2 ℃.
The comparison shows that the liquid metal composite thermal interface material which is solidified immediately has a better heat dissipation effect than the solid metal material, and the liquid metal composite thermal interface material which is solidified immediately does not separate or fall off under the flushing of the environment of the fluorinated liquid and does not react with the fluorinated liquid, so that the liquid metal composite thermal interface material which is solidified immediately is selected as the thermal interface material in the liquid environment, and the application prospect is wide.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. An instant solidified liquid metal composite thermal interface material, which is characterized in that: the raw materials comprise: liquid metal, coupling agent, toughening agent, epoxy resin and curing agent;
the liquid metal is gallium-based N-element alloy or bismuth-based N-element alloy, and N is an integer more than or equal to 2;
the coupling agent is selected from one or more of KH-550, KH-560, KH-570, KH-792, KH-580, KH-590, DL-602, DL-171, Span-80, Span-85, 1-dodecyl mercaptan or mercapto-undecylamine hydrochloride;
the toughening agent is selected from one or more of polyamide, polyvinyl acetal, glass fiber, asbestos fiber, dibutyl phthalate or dioctyl phthalate;
the epoxy resin is selected from one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin and bisphenol S type epoxy resin;
the curing agent is selected from one or more of ethylenediamine, triethylamine, triethanolamine and diethylenetriamine.
2. A thermal interface material as defined in claim 1, wherein: the gallium-based N-element alloy is selected from one or more of gallium-indium alloy, gallium-indium-tin-zinc alloy or gallium-indium-tin-zinc-silver.
3. A thermal interface material as defined in claim 1, wherein: the bismuth-based N-element alloy is selected from one or more of bismuth-indium alloy, bismuth-indium-tin-zinc alloy or bismuth-indium-tin-zinc-silver alloy.
4. A thermal interface material as defined in claim 1, wherein: the melting point of the liquid metal is less than 100 ℃, and the thermal conductivity is more than 15W/m.K.
5. A thermal interface material as defined in claim 1, wherein: the thermal interface material comprises the following raw materials in parts by mass: 85-97% of liquid metal, 3-15% of epoxy resin and curing agent, 100% of the sum of the mass fractions of the liquid metal, the epoxy resin and the curing agent, and 0.1-1:1 of the mass ratio of the curing agent to the epoxy resin; the dosage of the coupling agent is 0.1-5% of the mass of the liquid metal, and the dosage of the toughening agent is 0.1-10% of the mass of the liquid metal.
6. A thermal interface material as defined in claim 1, wherein: the liquid metal has a droplet size of 100nm to 500 μm.
7. A method of making a thermal interface material as defined in claim 1, wherein: the method comprises the following steps:
step 1, adding liquid metal and a coupling agent into a dispersion liquid for dispersion to form a micro-nano metal droplet suspension liquid after surface treatment;
step 2, centrifuging the suspension, removing supernatant after stabilization to obtain a precipitate, and drying the precipitate in a drying box;
step 3, adding epoxy resin and a toughening agent into the dried metal droplets, and stirring at a high speed under the condition of vacuumizing to obtain a uniformly mixed paste composite material;
and 4, when in use, adding the curing agent into the paste composite material, uniformly stirring, smearing the mixture between the heating element and the radiating element before curing, and forming the thermal interface material after curing.
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| CN115232603A (en) * | 2022-05-20 | 2022-10-25 | 桂林电子科技大学 | Gallium-based liquid metal thermal interface material capable of being solidified at low temperature and preparation method thereof |
| CN113789159B (en) * | 2021-08-02 | 2024-05-07 | 中国科学院工程热物理研究所 | Liquid metal silicon-free thermal interface material and preparation method thereof |
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