CN107452436A - A kind of liquid metal electric slurry and preparation method thereof - Google Patents
A kind of liquid metal electric slurry and preparation method thereof Download PDFInfo
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- CN107452436A CN107452436A CN201710538731.5A CN201710538731A CN107452436A CN 107452436 A CN107452436 A CN 107452436A CN 201710538731 A CN201710538731 A CN 201710538731A CN 107452436 A CN107452436 A CN 107452436A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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Abstract
The present invention proposes a kind of liquid metal electric slurry, is made up of organic carrier and liquid metal, and the liquid metal is dispersed in organic carrier, and the organic carrier includes organic solvent, binding agent, functional additive；The liquid metal is elemental metals or alloy of the fusing point at 78.2~232 DEG C.The present invention also provides the preparation method of the liquid metal electric slurry.Electric slurry proposed by the present invention, it is to form homogeneous phase with the low melting point elemental metals or alloy of liquid and organic carrier, binding agent, without preparing alloying pellet, cost of sizing agent is low；Activator, thixotropic agent, resin etc. are added in organic carrier, reduces the surface tension of liquid metal, improves the adhesiveness of slurry and matrix；After sintering curing, organic solvent volatilizees after being heated, low melting point elemental metals or alloy melted by heat, and the bonding that contacted with each other between particle reduces the formation in gap between metallic particles, improve the electric conductivity of slurry into line.
Description
Technical field
The invention belongs to electronic technology field, and in particular to a kind of electric slurry containing metal and preparation method thereof.
Background technology
With the fast development of microelectric technique, electronic component is increasingly to miniaturization, integrated and high frequency direction
Development.Critical material of the electric slurry as electronic component, plays more and more important effect.In recent years, electrocondution slurry
As a kind of base electronic material with specific function, printed circuit board, solar panel front and backplate,
The various fields such as RFID, antenna for mobile phone, Contactless IC card antenna circuit are used widely.
Electrocondution slurry is the uniform paste or paint formed by solid conduction powder, cohesive body and organic carrier mixing rolling
Shape thing.At present, the conducting process of electrocondution slurry is that the free electron carrier provided by the conducting metal particles mixed is realized
, the mainly metal dust of micro/nano level.Under identical preparation condition, the particle diameter of metal dust is smaller, after sintering curing
Gap between metallic is just smaller, and the caused conductive channel in unit volume is more, and the conductive network electric conductivity of formation is just got over
It is good.High-purity, the fine granularity demand of metallic particles, the preparation to metal dust propose higher technical requirements, and this can extend
The preparation time of powder, the loss for increasing equipment, greatly increase the cost of input needed for production, virtually also considerably increase slurry
The cost of manufacture of material.
To solve the problems, such as in this respect, the present invention proposes a kind of liquid metal electric slurry, and the slurry utilizes low melting point list
The characteristic that matter metal or alloy fusing point is low, electric conductivity is high, under normal temperature or relatively low heating-up temperature, the metal liquid is uniform
It is scattered in organic solution, forms the functional conductive phase of particle diameter very little.Its typical advantages is as follows：(1) low-melting-point metal of liquid
Homogeneous phase is formed with organic carrier, bonding agent, without preparing alloying pellet, cost of sizing agent is low；(2) surface is added in organic carrier
Activator, thixotropic agent, resin etc., the surface tension of low liquid metal is reduced, improve the adhesiveness of slurry and matrix；(3) sinter
After solidification, volatilized after organic solvent is heated, low melting point elemental metals or alloy melted by heat, the bonding that contacts with each other between particle into
Line, the formation in gap between metallic particles is reduced, improve the electric conductivity of slurry.
The content of the invention
It is an object of the invention to provide a kind of liquid metal electric slurry, metal in the electrocondution slurry of prior art is overcome
The technical problems such as powder process is complicated, cost is high, contact resistance is big, the low-melting alloy of liquid are directly scattered in organic
In solvent, melt the preparation of metallic particles, be scattered in the method acquisition all mixed uniformly electrocondution slurry of each component of a step.The conductor
Slurry has the advantages that printing precision is high, adhesive force is good, outage is low, contact resistance is small, at the same also have preparation method it is simple,
The advantages of cost is low.
It is another object of the present invention to propose the preparation method of the electric slurry.
To realize that the technical scheme of above-mentioned purpose of the present invention is：
A kind of liquid metal electric slurry, is made up of organic carrier and liquid metal, and the liquid metal is dispersed in organic
In carrier, the organic carrier includes organic solvent, binding agent, functional additive；The liquid metal be fusing point -78.2~
232 DEG C of elemental metals or alloy.
Further, the parts by weight of the electric slurry each component are：Low-melting alloy 45-95 parts, bonding agent 5-30
Part, organic solvent 2-80 parts, functional additive 2-30 parts.
Wherein, the liquid metal be elemental metals be bianry alloy or be ternary alloy three-partalloy or be quaternary alloy or
For multicomponent alloy, the one kind of the elemental metals in gallium, indium, tin, zinc, bismuth, lead, chromium, mercury, sodium, potassium, caesium；The binary
The one kind of alloy in gallium indium, gallium tin, gallium mercury, gallium sodium, gallium potassium, gallium caesium, bismuth indium bianry alloy, the ternary alloy three-partalloy are selected from gallium
Indium tin, gallium indium mercury, gallium indium sodium, gallium indium potassium, gallium indium caesium, gallium tin mercury, gallium tin sodium, gallium tin potassium, gallium tin caesium, gallium mercury sodium, gallium mercury potassium, gallium
One kind in mercury caesium, gallium sodium potassium, bismuth indium tin ternary alloy three-partalloy；The quaternary alloy is selected from gallium indium tin mercury, gallium indium tin sodium, gallium indium tin
Potassium, gallium indium tin caesium, gallium indium mercury sodium, gallium indium mercury potassium, gallium indium mercury caesium, gallium tin mercury sodium, gallium tin mercury potassium, gallium tin mercury caesium, gallium indium sodium potassium, gallium
One kind in tin sodium potassium, gallium mercury sodium potassium, gallium caesium sodium potassium, bismuth indium tin zinc quaternary alloy；The multicomponent alloy be by lead, bismuth, tin,
One kind in the middle low temperature multicomponent alloy that the one or more and alloy preparation in silver, copper, aluminium or chromium forms.
Wherein, the binding agent is the one or more in resin matrix, lead-free glass powder or metal oxide；
Wherein, the resin matrix is polybutadiene, polyvinyl alcohol resin, polyvinylpyrrolidone, polybutadiene
Resin, Kynoar, polystyrene, polytetrafluoroethylene (PTFE), epoxy resin, polyacrylic resin, polyester resin, alkyd resin,
Polyurethane, silicones, organosilicon acrylic resin, vinyl chloride-vinyl acetate resin, phenolic resin, polyamide, aldehyde ketone resin, celluosic resin, fluorine carbon
One or more in resin, vinylite, Arabic gum；
The metal oxide is CdO, Bi2O3、CuO、TiO2In one or more；
The particle diameter of the lead-free glass powder is 1~900nm, and the particle diameter of metal oxide is 0.9~10 μm；
The organic solvent be 1-METHYLPYRROLIDONE, 2-Pyrrolidone, 1- methyl pyrrolidones, N-METHYLFORMAMIDE,
N,N-dimethylformamide, acetamide, N- methylacetamides, DMAC N,N' dimethyl acetamide, N- methyl propanamides, tetrahydrofuran,
Tetramethylurea, formamide, pyrroles, pyridine, 2- picolines, 3- picolines, 4- picolines, tween solution, silicone oil, silicone
Glycol monoethyl ether, polyoxyethylene ethereal solution, APES solution, polyglycol solution, butyl acetate, isopropyl
Alcohol, dibasic acid ester mixture, ethyl carbitol acetate, butyl carbitol, butyl carbitol acetate, butyl cellosolve acetic acid
Ester, absolute ethyl alcohol, terpinol, dimethyl succinate, propylene glycol methyl ether acetate, dimethyl glutarate, butyl glycol ether, second two
Alcohol ethyl ether acetate ester, butanol, toluene, dimethylbenzene, neck phthalic acid tributyl, formic acid, acetic acid, propionic acid, butyric acid, valeric acid, acid,
Succinic acid, glutaric acid, hexanedioic acid, succinic acid diisobutyl ester, ethylene glycol ether acetate, one kind in ATBC or more
Kind.
Wherein, the functional additive include surfactant, coupling agent, thixotropic agent, thickener, curing agent, defoamer,
At least one of levelling agent, sagging inhibitor；
Wherein, the surfactant is toluene, ethanol, tween solution, stearic acid, odium stearate, oleic acid, polyoxyethylene
One or more in ethereal solution, APES solution, polyethylene glycol；
The coupling agent is VTES, vinyltrimethoxy silane, (the β alkene methoxyl groups of vinyl three
Ethyoxyl) silane, gamma-aminopropyl-triethoxy-silane, titanate esters, Aluminate, one in the mercaptopropyltriethoxysilanes of γ tri-
Kind is a variety of；
The thixotropic agent is the one or more in bentonite, calcium silicates, colloidal alumina or silica；
The thickener is starch, gelatin, carboxyethyl cellulose, nitrocellulose, polyisobutene, ethyl cellulose, hydroxyl
Propyl methocel, sodium carboxymethylcellulose, organobentonite, diatomite, fume colloidal silica, sodium bentonite, silicon coagulate
One or more in glue；
The curing agent is ethylenediamine, diamines, diethylenetriamine, triethylene tetramine, diethylaminopropylamine, isophthalic two
One or more in amine, maleic anhydride, phenolic aldehyde amine (T-31)；
The defoamer be silicone emulsion, the fatty acid ester compounded thing of higher alcohols, polyoxyethylene polyoxypropylene pentaerythrite ether,
In polyoxyethylene polyoxy propyl alcohol amidogen ether, polypropylene glycerol aether and polyoxyethylene polyoxypropylene glycerin ether, dimethyl silicone polymer
One or more；
The levelling agent is one in the organosilicon of terephthalic acid (TPA), furancarboxylic acid, silicone oil, dimethyl silicone polymer terminal groups modification
Kind is a variety of；
The sagging inhibitor be one kind in sodium methylene bis-naphthalene sulfonate, Nekal BX, polycarboxylic acid salt's dispersant etc. or
It is a variety of.
Preferably, the adding proportion of the organic solvent is adjusted according to the fusing point of liquid metal, and liquid metal fusing point is 10
Rise in the range of~80 DEG C, then the mass fraction of organic solvent gradually decreases in the range of 12~2 parts.
One of the preferred technical solution of the present invention is that the liquid metal is elemental metals or conjunction of the fusing point below 50 DEG C
Gold, the functional additive is by surfactant 1-2 parts of mass fraction, coupling agent 0.1-2 parts, curing agent 0.2-2 parts, levelling
Agent 1-5 parts form.
The another optimal technical scheme of the present invention is, the liquid metal be fusing point in the elemental metals of 50 DEG C and the above or
Alloy, the functional additive is by surfactant 1-3 parts of mass fraction, coupling agent 0.1-2 parts, thickener 1-3 parts, solidification
Agent 0.2-2 parts, levelling agent 2-5 parts composition.
The preparation method of liquid metal electric slurry of the present invention, including step：
1) liquid metal is weighed respectively by proportioning (metal is that solid-state or liquid are likely to, when room temperature is relatively low or liquid is golden
Category fusing point need to be heated to more than fusing point when being higher than room temperature), binding agent, organic solvent, functional additive；
2) binding agent, functional additive are sequentially added in organic solvent, heated while stirring, its dissolving is mixed into
Even solution, it is stand-by to be cooled to room temperature；The heating-up temperature is maintained at 20-90 DEG C, and the mixing time is 0.5-4h.
3) liquid metal is placed in air, inert gas or vacuum and makees constant temperature processing, to low-melting-point metal simple substance
Or alloy is changed into liquid condition；
4) by the homogeneous solution obtained by step 2), under stirring, the low melting point being in a liquid state that step 3) obtains is added
In alloy, in heating, high-speed stirred is disperseed, and forms it into paste or paint-like substance.
Further, in the step 3), constant temperature processing time is 1-4h；Constant temperature treatment temperature is closed higher than the low melting point
1-10 DEG C of golden fusing point；
Step 4) the stirring means include one kind or more in mechanical agitation, electromagnetic agitation, ultrasonic agitation, vibrations stirring
Kind；The mixing time is 0.5-4h.
The present invention compared with prior art, has the following advantages that：
(1) electric slurry proposed by the present invention, formed uniformly with the low-melting-point metal of liquid and organic carrier, bonding agent
Phase, without preparing alloying pellet, cost of sizing agent is low；
(2) activator, thixotropic agent, resin etc. are added in organic carrier, reduces the surface tension of low-melting-point metal, improves slurry
The adhesiveness of material and matrix；
(3) after sintering curing, organic solvent volatilizees after being heated, low-melting-point metal melted by heat, is contacted with each other between particle
Line is bonded into, reduces the formation in gap between metallic particles, improves the electric conductivity of slurry.
Embodiment
In order that the purpose of the present invention, technical advantage, feature become apparent from, the present invention is done with reference to specific embodiment
Further illustrate, but present invention is not limited to embodiment.
Unless otherwise instructed, the means used in embodiment are the conventional means in this area.
Embodiment 1
A kind of liquid metal electric slurry, the formula of each composition are shown in Table 1, and its preparation method is
1) low-melting alloy or elemental metals, binding agent, organic solvent, functional additive are weighed respectively by proportioning；
2) binding agent, functional additive are sequentially added in organic solvent, heated while stirring, its dissolving is mixed into
Even solution, it is stand-by to be cooled to room temperature；The heating-up temperature is maintained at 60 DEG C, mixing time 1h.
3) low-melting alloy or elemental metals are placed in vacuum (vacuum -0.1MPa) and make constant temperature processing, to its transformation
For liquid condition；Constant temperature processing time is 4h；Constant temperature treatment temperature is higher than 10 DEG C of the low-melting alloy fusing point；
4) by the homogeneous solution obtained by step 2), under stirring, add in the liquid metals that step 3) obtains, Bian Jia
Hot side high speed electromagnetic is dispersed with stirring 2h, forms paste or paint-like substance.
The sheet resistance of the electric slurry of embodiment 1 is 0.045 Ω/.Reduce wherein bisphenol A type epoxy resin and amine curing agent
Percentage from 5 to 0.5 (amine curing agent also proportionally reduces), then sheet resistance is 0.045 Ω/ and 0.023 Ω/.Though
Right electric conductivity improves, but viscosity diminishes, and is not suitable for printing.Determine that the proportioning of table 1 is suitable proportion through overtesting.
Embodiment 2-5
Liquid metal electric slurry, the formula of each composition are shown in Table 1, and its preparation method is the same as embodiment 1.
Table 1：Liquid metal electric slurry composition
The method that direct mechanical dispersion prepares electric slurry in organic carrier when above-described embodiment is low-melting-point metal liquid
And formula, from example 1 to example 5, the fusing point of low-melting-point metal gradually rises, and mass ratio is all 80%, also can be according to actual need
Ask and adjusted between 45% to 90%.In actual production, alloy ratio structure can be adjusted according to demand, reaches demand melting point values.
For example the one or more therein such as cadmium, lead, zinc, silver, gallium, copper, bag are added or changed to the bismuth in embodiment, indium, tin metal
Include gallium indium, gallium tin, gallium mercury, gallium sodium, gallium potassium, gallium caesium, bismuth indium bianry alloy；Gallium indium tin, gallium indium mercury, gallium indium sodium, gallium indium potassium, gallium indium
Caesium, gallium tin mercury, gallium tin sodium, gallium tin potassium, gallium tin caesium, gallium mercury sodium, gallium mercury potassium, gallium mercury caesium, gallium sodium potassium, bismuth indium tin ternary alloy three-partalloy；Gallium
Indium tin mercury, gallium indium tin sodium, gallium indium tin potassium, gallium indium tin caesium, gallium indium mercury sodium, gallium indium mercury potassium, gallium indium mercury caesium, gallium tin mercury sodium, gallium tin mercury
Potassium, gallium tin mercury caesium, gallium indium sodium potassium, gallium tin sodium potassium, gallium mercury sodium potassium, gallium caesium sodium potassium, bismuth indium tin zinc quaternary alloy；And by lead, bismuth,
The middle low temperature multicomponent alloy that one or more and above-mentioned alloy preparation in tin, copper, aluminium or chromium forms.Fusing point can be from -78.2 DEG C
~232 DEG C.
In above-described embodiment, bisphenol A type epoxy resin and amine curing agent can be according to electric conductivity and the difference of conjunctiva intensity
Demand increases and decreases mass ratio, and terpinol and ethyl cellulose then will determine mass ratio according to the fusing point of metal, and the fusing point of metal is got over
Height, the mass ratio of ethyl cellulose require higher, and the amount of terpinol is fewer, because higher temperature can cause carrier thinning, shadow
Ring scattered.The amount of silane coupler is then determined by amount of metal.Polyethylene glycol and furancarboxylic acid influence the printing and levelability of slurry.
The sheet resistance of embodiment 1-5 electric slurries is 0.01-0.1 Ω/.The viscosity of embodiment 1-5 electric slurries is 100-
250Pas, flow time 30min.
In above-described embodiment, from example 1 to example 4, melting point metal is relatively low, and organic carrier need not add thickener, also may be used
To there is good dispersiveness.Because gallium and gallium Base Metal have surfusion, freezing point is more much lower than fusing point, scattered in order to increase
Property, can also environment temperature drop near the freezing point of metal, to increase the viscosity of organic carrier.And in example 5, bismuthino gold
It is slightly higher to belong to fusing point, to ensure that metal is in a liquid state, it is necessary to which heating operation, heating can cause carrier thinning in dispersion process, influence divides
Performance is dissipated, we add thickener ethyl cellulose and solve this problem.
Embodiment 1-5 electric slurries, PI plastic substrates are coated on, solidification temperature is 150-250 DEG C, adhesive force 3-5N.
Although above the present invention has made detailed description, on the basis of the present invention, some can be made to it and repaiied
Change or improve, this will be apparent to those skilled in the art.Therefore, institute without departing from theon the basis of the spirit of the present invention
The these modifications or improvements done, belong to the scope of protection of present invention.
Claims (11)
1. a kind of liquid metal electric slurry, it is characterised in that be made up of organic carrier and liquid metal, the liquid metal point
It is dispersed in organic carrier, the organic carrier includes organic solvent, binding agent, functional additive；The liquid metal is fusing point
In -78.2~232 DEG C of elemental metals or alloy.
2. liquid metal electric slurry according to claim 1, it is characterised in that the weight of the electric slurry each component
Number is：45~95 parts of liquid metal, 5~30 parts of binding agent, 2~80 parts of organic solvent, 2~30 parts of functional additive.
3. liquid metal electric slurry according to claim 1, it is characterised in that the liquid metal be elemental metals,
Or be bianry alloy or be ternary alloy three-partalloy or be quaternary alloy or be multicomponent alloy, the elemental metals be selected from gallium, indium, tin,
One kind in zinc, bismuth, lead, chromium, mercury, sodium, potassium, caesium；The bianry alloy is selected from gallium indium, gallium tin, gallium mercury, gallium sodium, gallium potassium, gallium
One kind in caesium, bismuth indium bianry alloy, the ternary alloy three-partalloy are selected from gallium indium tin, gallium indium mercury, gallium indium sodium, gallium indium potassium, gallium indium caesium, gallium
One kind in tin mercury, gallium tin sodium, gallium tin potassium, gallium tin caesium, gallium mercury sodium, gallium mercury potassium, gallium mercury caesium, gallium sodium potassium, bismuth indium tin ternary alloy three-partalloy；
The quaternary alloy is selected from gallium indium tin mercury, gallium indium tin sodium, gallium indium tin potassium, gallium indium tin caesium, gallium indium mercury sodium, gallium indium mercury potassium, gallium indium mercury
Caesium, gallium tin mercury sodium, gallium tin mercury potassium, gallium tin mercury caesium, gallium indium sodium potassium, gallium tin sodium potassium, gallium mercury sodium potassium, gallium caesium sodium potassium, bismuth indium tin zinc four
One kind in first alloy；The multicomponent alloy is by the one or more and alloy in lead, bismuth, tin, silver, copper, aluminium or chromium
One kind in the middle low temperature multicomponent alloy being formulated.
4. liquid metal electric slurry according to claim 1, it is characterised in that the binding agent is resin matrix, nothing
One or more in lead glass powder or metal oxide；
Wherein, the resin matrix be polybutadiene, polyvinyl alcohol resin, polyvinylpyrrolidone, polybutadiene,
Kynoar, polystyrene, polytetrafluoroethylene (PTFE), epoxy resin, polyacrylic resin, polyester resin, alkyd resin, poly- ammonia
Ester, silicones, organosilicon acrylic resin, vinyl chloride-vinyl acetate resin, phenolic resin, polyamide, aldehyde ketone resin, celluosic resin, fluorocarbon resin,
One or more in vinylite, Arabic gum；
The metal oxide is CdO, Bi2O3、CuO、TiO2In one or more；
The particle diameter of the lead-free glass powder is 1~900nm, and the particle diameter of metal oxide is 0.9~10 μm.
5. liquid metal electric slurry according to claim 1, it is characterised in that the organic solvent is N- methylpyrroles
Alkanone, 2-Pyrrolidone, 1- methyl pyrrolidones, N-METHYLFORMAMIDE, N,N-dimethylformamide, acetamide, N- methyl second
Acid amides, DMAC N,N' dimethyl acetamide, N- methyl propanamides, tetrahydrofuran, tetramethylurea, formamide, pyrroles, pyridine, 2- methyl
Pyridine, 3- picolines, 4- picolines, tween solution, silicone oil, silicone glycol monoethyl ether, polyoxyethylene ethereal solution, alkyl
Phenol polyethenoxy ethereal solution, polyglycol solution, butyl acetate, isopropanol, dibasic acid ester mixture, ethyl carbitol acetic acid
Ester, butyl carbitol, butyl carbitol acetate, butyl cellosolve acetate, absolute ethyl alcohol, terpinol, dimethyl succinate,
Propylene glycol methyl ether acetate, dimethyl glutarate, butyl glycol ether, ethylene glycol ether acetate, butanol, toluene, dimethylbenzene, neck
Phthalic acid tributyl, formic acid, acetic acid, propionic acid, butyric acid, valeric acid, acid, succinic acid, glutaric acid, hexanedioic acid, succinic acid two are different
One or more in butyl ester, ethylene glycol ether acetate, ATBC.
6. liquid metal electric slurry according to claim 1, it is characterised in that the functional additive is lived including surface
At least one of property agent, coupling agent, thixotropic agent, thickener, curing agent, defoamer, levelling agent, sagging inhibitor；
Wherein, the surfactant is that toluene, ethanol, tween solution, stearic acid, odium stearate, oleic acid, APEO are molten
One or more in liquid, APES solution, polyethylene glycol；
The coupling agent is VTES, vinyltrimethoxy silane, (the β alkene methoxyl group ethoxies of vinyl three
Base) silane, gamma-aminopropyl-triethoxy-silane, titanate esters, Aluminate, one kind in the mercaptopropyltriethoxysilanes of γ tri- or
It is a variety of；
The thixotropic agent is the one or more in bentonite, calcium silicates, colloidal alumina or silica；
The thickener is starch, gelatin, carboxyethyl cellulose, nitrocellulose, polyisobutene, ethyl cellulose, hydroxypropyl
In methylcellulose, sodium carboxymethylcellulose, organobentonite, diatomite, fume colloidal silica, sodium bentonite, Silica hydrogel
One or more；
The curing agent is ethylenediamine, diamines, diethylenetriamine, triethylene tetramine, diethylaminopropylamine, m-phenylene diamine (MPD), suitable
One or more in anhydride maleique, phenolic aldehyde amine (T-31)；
The defoamer is silicone emulsion, the fatty acid ester compounded thing of higher alcohols, polyoxyethylene polyoxypropylene pentaerythrite ether, polyoxy
One in ethene polyoxy propyl alcohol amidogen ether, polypropylene glycerol aether and polyoxyethylene polyoxypropylene glycerin ether, dimethyl silicone polymer
Kind is a variety of；
The levelling agent be terephthalic acid (TPA), furancarboxylic acid, silicone oil, dimethyl silicone polymer terminal groups modification organosilicon in one kind or
It is a variety of；
The sagging inhibitor is the one or more in sodium methylene bis-naphthalene sulfonate, Nekal BX, polycarboxylic acid salt's dispersant etc..
7. liquid metal electric slurry according to claim 1, it is characterised in that the adding proportion root of the organic solvent
Adjusted according to the fusing point of liquid metal, liquid metal fusing point rises in the range of 10~80 DEG C, then the mass fraction of organic solvent exists
Gradually decreased in the range of 12~2 parts.
8. the liquid metal electric slurry according to any one of claim 1~7, it is characterised in that the liquid metal is
Elemental metals or alloy of the fusing point below 50 DEG C, the functional additive by mass fraction 1~2 part of surfactant, even
Join 1~5 part of 0.1~2 part of agent, 0.2~2 part of curing agent, levelling agent composition.
9. the liquid metal electric slurry according to any one of claim 1~7, it is characterised in that the liquid metal is
Fusing point is in 50 DEG C and the elemental metals or alloy of the above, surfactant 1-3 parts by mass parts of the functional additive, coupling
Agent 0.1-2 parts, thickener 1-3 parts, curing agent 0.2-2 parts, levelling agent 2-5 parts composition.
10. the preparation method of any one of the claim 1~9 liquid metal electric slurry, it is characterised in that including step：
1) liquid metal, binding agent, organic solvent, functional additive are weighed respectively by proportioning；
2) binding agent, functional additive are sequentially added in organic solvent, heated while stirring, be mixed into its dissolving uniform
Solution, it is stand-by to be cooled to room temperature；The heating-up temperature is maintained at 20-90 DEG C, and the mixing time is 0.5-4h；
3) liquid metal is placed in air, inert gas or vacuum and makees constant temperature processing, be changed into liquid to low-melting alloy
Body state；
4) by the homogeneous solution obtained by step 2), under stirring, the low-melting-point metal being in a liquid state that step 3) obtains is added
In simple substance or alloy, in heating, high-speed stirred is disperseed, and forms it into paste or paint-like substance.
11. preparation method according to claim 10, it is characterised in that in the step 3), constant temperature processing time is 1-
4h；Constant temperature treatment temperature is higher than 1-10 DEG C of the liquid metal fusing point；
Step 4) the stirring means include the one or more in mechanical agitation, electromagnetic agitation, ultrasonic agitation, vibrations stirring；
The mixing time is 0.5-4h.
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