CN100551989C - A kind of phase-change heat conductive material and preparation method thereof - Google Patents
A kind of phase-change heat conductive material and preparation method thereof Download PDFInfo
- Publication number
- CN100551989C CN100551989C CNB2008100189323A CN200810018932A CN100551989C CN 100551989 C CN100551989 C CN 100551989C CN B2008100189323 A CNB2008100189323 A CN B2008100189323A CN 200810018932 A CN200810018932 A CN 200810018932A CN 100551989 C CN100551989 C CN 100551989C
- Authority
- CN
- China
- Prior art keywords
- conductive material
- phase
- heat conductive
- change heat
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of phase-change heat conductive material and preparation method thereof, this phase-change heat conductive material is mainly by silicone resin 10～40wt%, terpolymer EP rubber 2～20wt%, heat conduction powder 40～70wt%, paraffin 5～25wt%, tackifier 5～35wt%, coupling agent 0.1～1.5wt% forms, and this phase-change heat conductive material can be coated under solution state and form composite membrane on Copper Foil, aluminium foil, polyethylene naphthalate film or the Kapton to gain in strength.Under this thermally conductive material room temperature is solid, easily is clamped between electron device, GPU, CPU etc. and the scatterer, when device non-stop run temperature is elevated to 40～70 ℃, thermally conductive material begins to soften, flows, air gap between can fine filling interface, thus thermal resistance, accelerated heat transmission reduced; This material can intactly take off when device maintenance or replacing, and can reuse.
Description
Technical field
The invention belongs to the organic silicon chemical field, relate under a kind of heating state can soften, mobile heat conduction phase change material and preparation method thereof.
Background technology
The circuit layout of modern electronic equipment equipment becomes increasingly complex, and integrated level is more and more higher.The design engineer makes every effort to install more device on littler area, to realize the plant and instrument miniaturization.Guarantee that these highly integrated devices can steady running, the heat that each electronic component produced must be delivered in the surrounding environment effectively, in time and go.Usual method is the metal heat sink that high thermal conductivities such as copper, aluminium are installed at device surface, increases area of dissipation simultaneously.Fan further is installed above scatterer, is made Forced Air Convection, quicken heat passage.Yet the surface of electron device and scatterer all can not be definitely smooth, produces air gap when both contact inevitably.Because the thermal conductivity of air has only 2.3 * 10
-2W/mK, ten thousand of not enough metal heat-conducting rate/, the existence of air gap reduces the efficient of scatterer greatly.Expedited the emergence of the interface thermally conductive material in order to address this problem.
The heat-conducting silicone grease of employing surface wettability, the good property that flows is filled the air gap between device and the scatterer during beginning.But heat-conducting silicone grease uses inconvenient, pollutes circuit card easily and causes faults such as short circuit, and through repeatedly running off, become dry after the cold cycling, increases thermal resistance on the contrary.Though easy to use by cross-linking vulcanized silicon rubber heat conductivity gap filling material and heat-conducting insulation material, thermal resistance is bigger, can not satisfy the requirement of high thermal conductivity, for example application of aspect such as graphic process unit chip, central processing unit chip.
Summary of the invention
The objective of the invention is for avoiding above-mentioned weak point that a kind of phase-change heat conductive material of high efficiency and heat radiation is provided.This phase-change heat conductive material is used between heating electronic component and the scatterer, reduces thermal contact resistance, the enhance heat transfer effect.
Another object of the present invention provides the method for producing this phase-change heat conductive material.
As tackiness agent, paraffin is as the regulation and control substance of softening temperature with heat-staple silicone resin in the present invention, and the powder filler of heat conduction is combined, and makes the thermally conductive material of specified shape behind the tackifier tackify.In order to increase the intensity of phase change material, can add film again and strengthen.Be that the mixture of above-mentioned composition also can be coated under solution state on Copper Foil, aluminium foil, PEN (PEN) film or polyimide (Kapton) film and forms composite membrane.
Purpose of the present invention is specifically realized by following technology path:
A kind of phase-change heat conductive material is characterized in that this phase-change heat conductive material is mainly made by following component by mass percent:
Silicone resin 10～40wt%
Terpolymer EP rubber 2～20wt%
Heat conduction powder 40～70wt%
Paraffin 5～25wt%
Tackifier 5～35wt%
Coupling agent 0.1～1.5wt%.
Above-mentioned phase-change heat conductive material also can be compound with enhanced film again.Described enhanced film is PEN or Kapton, Copper Foil or aluminium foil.The present invention adds PEN (PEN) or polyimide (Kapton) film that E.I.Du Pont Company produces in silicone layer, can cross and significantly improve phase-change heat conductive material intensity, compare with the glass fibre of routine, reinforced effects is more obvious, and product thickness can be thinner.The more important thing is that high insulating film enhancing makes phase change material of the present invention need can be used to the occasion of electrical isolation.An other class enhanced film is Copper Foil or aluminium foil, and they itself have very high thermal conductivity, not only can play the enhanced purpose, and can make thermally conductive material have certain anisotropic thermal conductivity, can promote the temperature uniform distribution of heat dissipation interface.According to the different requirements of product to thermal conductivity and intensity, the thickness of enhanced film is 0.013～0.102mm.
Paraffin is the important component of decision softening temperature, can obtain needed softening temperature by the aliphatic hydrocarbon of selection different lengths carbochain or the fat hydrocarbon mixture of several different carbon chains, the softening temperature of above-mentioned phase-change heat conductive material is controlled at 40～70 ℃ usually.
Except playing the adherent effect, he itself also has certain fluidity, stretchiness to silicone resin in prescription, can control the compliance and the viscosity of product by adding the silicone resin of different qualities.According to the different requirements of product to thermal conductivity and kindliness, it accounts for the ratio difference of phase-change heat conductive material.Viscosity 50～the 5000cps of the silicone resin that the present invention is used.
The component that another one improves the phase change material kindliness is terpolymer EP rubber (EPDM).Terpolymer EP rubber is to be formed by ethylene-propylene-Di three monomer non-conjugated diene copolymerization, and its molecular backbone chain is saturated, but contains a spot of unsaturated double-bond on the side chain.Because of the nonpolarity substituting group of terpolymer EP rubber intramolecularly exists, intermolecular internal cohesive energy is lower, so he can keep the kindliness of molecular chain in wide temperature range.
The heat conduction powder itself has higher heat conductivity, and its kind, content, size and degree of scatter are the important factors that influences the product thermal conductivity.The used heat conduction powder of the present invention is one or several combinations in aluminum oxide, magnesium oxide, aluminium nitride, the boron nitride, or the combination of the different-grain diameter of one or more heat conduction powders.
In order to improve the degree of scatter of heat conductive filler in resin, can handle (powder floods with the coupling agent ethanolic soln) with coupling agent to powder surface.Coupling agent is molecule R-Si-with following structural formula (OR ')
3, wherein R is the above alkyl of 6 carbon, R ' is methyl or ethyl.As: n-hexyl Trimethoxy silane, n-octyl triethoxyl silane, positive decyl triethoxyl silane.
In order to be transferred to the flowability of hot phase change material, avoid arbitrarily flowing in softening back, add tackifier again, as polyborosiloxane class tackifier.
The preparation method of above-mentioned phase-change heat conductive material comprises:
A, take by weighing terpolymer EP rubber, tackifier, paraffin, silicone resin, heating stirs evenly;
B, add heat conduction powder again, under vacuum condition, stir and make raw mix through the coupling agent dip treating;
C, with the raw mix cooling forming.
The preparation method who adds the phase-change heat conductive material of enhanced film comprises:
A, take by weighing terpolymer EP rubber, tackifier, paraffin, silicone resin, heating stirs evenly;
B, add heat conduction powder again, under vacuum condition, stir and make raw mix through the coupling agent dip treating;
C, raw mix is coated on the moulding of enhanced film postcooling.
Mixing process is carried out under room temperature is dustless, and process time is decided by the amount and the stirring efficiency of raw material.
Raw mix can be coated on the one side or the two sides of enhanced film by methods such as roller coat, blade coating, printings.
Through surface treatment, described surface treatment comprises corona discharge, coating bonding reinforcing agent before coating for enhanced PEN and Kapton film.
Beneficial effect of the present invention:
Under the thermally conductive material room temperature of the present invention is solid, easily be clamped between electron device, GPU, CPU etc. and the scatterer, when device non-stop run temperature is elevated to 40～70 ℃, thermally conductive material begins to soften, flows, air gap between can fine filling interface, thereby the reduction thermal resistance, the accelerated heat transmission.This material can intactly take off when device maintenance or replacing, and can cross repeated use.
Phase-change heat conductive material of the present invention can be used for the occasion that heat conduction is had relatively high expectations, and it not only has the high thermal conductivity that is similar to heat-conducting silicone grease, and dismounting easily at room temperature, reuses.The present invention also can be used to have the occasion of insulating requirements through film enhanced phase-change heat conductive material, and the thermal conductivity that is better than common heat-conducting insulation material is provided.
Embodiment
The following examples just are used for describing in detail superiority of the present invention, and the manufacturing and the application of phase-change heat conductive material of the present invention are not limited to this.
The performance test methods of heat conduction phase change material is as follows among the embodiment:
Phase-change heat conductive material is clipped in the middle of hot plate and the scatterer, with thermosensitive resistance measurement hot-plate, phase-change heat conductive material and radiator temperature changing conditions.
Embodiment 1:
(1) with 20gEPDM, 10g paraffin, 18.5g polyborosiloxane class tackifier, the silicone resin 10g of viscosity 60cps puts into the heated and stirred pond and stirs, and with its mixing, temperature is 150 ℃.
(2) take by weighing after the 40g median size is ethanolic soln dip treating through containing n-hexyl Trimethoxy silane 1.5g of 40 microns aluminum oxide, oven dry, the agitated pool of putting into step (1) vacuumizes to stir made raw mix in 1 hour.
(3) raw mix is applied to the thick Kapton MT film of 0.025mm at 80 ℃ of lower rolls, the cooling back is a phase-change heat conductive material.
(4) phase-change heat conductive material of step (3) is put into detected the device that hardness uses and test.
(5) phase-change heat conductive material of step (3) is put into detected the device that heat conduction uses and detect thermal conductivity.
The data presentation of test, thickness is 0.1mm, the thermal conductivity of this phase-change heat conductive material is 3.1W/mK.When pressure was 50psi, during electronic component power 30w, the temperature of chip was 70 ℃, and the temperature of phase-change heat conductive material is 63 ℃.
Embodiment 2:
(1) with 2gEPDM, 18g paraffin, 5g polyborosiloxane class tackifier, the silicone resin 10g of viscosity 3000cps puts into the heated and stirred pond and stirs, and with its mixing, temperature is 150 ℃.
(2) taking by weighing median size is the magnesium oxide altogether after the ethanolic soln dip treating of 64g through containing positive decyl triethoxyl silane 1g, the oven dry that 40 microns aluminium nitride and median size are 60 microns, and the agitated pool of putting into step (1) vacuumizes to stir made raw mix in 1 hour.
(3) raw mix is applied to the thick PEN film of 0.013mm at 80 ℃ of lower rolls, the cooling back is a phase-change heat conductive material.
(4) phase-change heat conductive material of step (3) is put into detected the device that hardness uses and test.
(5) phase-change heat conductive material of step (3) is put into detected the device that heat conduction uses and detect thermal conductivity.
The data presentation of test, thickness is 0.1mm, the thermal conductivity of this phase-change heat conductive material is 4.2W/mK.When pressure was 50psi, electronic component was under 30w, and the temperature of chip is 70 ℃, and the temperature of phase-change heat conductive material is 61.5 ℃.
Embodiment 3:
(1) with 10gEPDM, 5g paraffin, 5g polyborosiloxane class tackifier, the silicone resin 39g of viscosity 5000cps puts into the heated and stirred pond and stirs, and with its mixing, temperature is 150 ℃.
(2) take by weighing after the 40g median size is ethanolic soln dip treating through containing n-octyl triethoxyl silane 1g of 80 microns boron nitride, oven dry, put into the agitated pool vacuum stirring of step (1) and made raw mix in 1 hour.
(3) be phase-change heat conductive material after the cooling of raw mix compressing tablet.
(4) phase-change heat conductive material of step (3) is put into detected the device that hardness uses and test.
(5) phase-change heat conductive material of step (3) is put into detected the device that heat conduction uses and detect thermal conductivity.
The data presentation of test, thickness is 0.1mm, the thermal conductivity of this phase-change heat conductive material is 5W/mK.When pressure was 50psi, during electronic component power 30w, the temperature of chip was 70 ℃, and the temperature of phase-change heat conductive material is 59.8 ℃.
Embodiment 4:
(1) with 5gEPDM, 5g paraffin, 35g polyborosiloxane class tackifier, the silicone resin 14g of viscosity 1000cps puts into the heated and stirred pond and stirs, and with its mixing, temperature is 150 ℃.
(2) taking by weighing median size is the magnesium oxide altogether after the ethanolic soln dip treating of 40g through containing positive decyl triethoxyl silane 1g, the oven dry that 40 microns aluminium nitride and median size are 60 microns, and the agitated pool of putting into step (1) vacuumizes to stir made raw mix in 1 hour.
(3) the thick aluminium foil of the 0.102mm that raw mix is applied to coated bonding reinforcing agent at 80 ℃ of lower rolls, the cooling back is a phase-change heat conductive material.
(4) phase-change heat conductive material of step (3) is put into detected the device that hardness uses and test.
(5) phase-change heat conductive material of step (3) is put into detected the device that heat conduction uses and detect thermal conductivity.
The data presentation of test, thickness is 0.1mm, the thermal conductivity of this phase-change heat conductive material is 4.0W/mK.When pressure was 50psi, electronic component was under 30w, and the temperature of chip is 70 ℃, and the temperature of phase-change heat conductive material is 60 ℃.
Claims (12)
1, a kind of phase-change heat conductive material is characterized in that this phase-change heat conductive material is mainly made by following component by mass percent:
Silicone resin 10～40wt%
Terpolymer EP rubber 2～20wt%
Heat conduction powder 40～70wt%
Paraffin 5～25wt%
Tackifier 5～35wt%
Coupling agent 0.1～1.5wt%.
2, phase-change heat conductive material according to claim 1 is characterized in that also compoundly with enhanced film, and described enhanced film is PEN or Kapton, and Copper Foil or aluminium foil, thickness are 0.013～0.102mm.
3, phase-change heat conductive material according to claim 1, the softening temperature that it is characterized in that phase-change heat conductive material is 40～70 ℃.
4, phase-change heat conductive material according to claim 1 is characterized in that the viscosity 50～5000cps of described silicone resin.
5, phase-change heat conductive material according to claim 1 is characterized in that described heat conduction powder is one or several combinations in aluminum oxide, magnesium oxide, aluminium nitride, the boron nitride.
6, phase-change heat conductive material according to claim 5 is characterized in that described heat conduction powder is the combination of the different-grain diameter of one or more heat conduction powders in aluminum oxide, magnesium oxide, aluminium nitride, the boron nitride.
7, phase-change heat conductive material according to claim 1 is characterized in that described coupling agent is to have formula R-Si-(OR ')
3Molecule; Wherein, R is the above alkyl of six carbon, and R ' is methyl or ethyl.
8, the preparation method of the described phase-change heat conductive material of claim 1 comprises:
A, take by weighing terpolymer EP rubber, tackifier, paraffin, silicone resin, heating stirs evenly;
B, add heat conduction powder again, under vacuum condition, stir and make raw mix through the coupling agent dip treating;
C, with the raw mix cooling forming.
9, the preparation method of phase-change heat conductive material according to claim 2 comprises:
A, take by weighing terpolymer EP rubber, tackifier, paraffin, silicone resin, heating stirs evenly;
B, add heat conduction powder again, under vacuum condition, stir and make raw mix through the coupling agent dip treating;
C, raw mix is coated on the moulding of enhanced film postcooling.
10, preparation method according to claim 9 is characterized in that raw mix is coated on the one side or the two sides of enhanced film by roller coat, blade coating or printing.
11, preparation method according to claim 10 is characterized in that PEN and Kapton process surface treatment before coating in the enhanced film.
12, preparation method according to claim 11 is characterized in that described surface treatment is corona discharge or coating bonding reinforcing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008100189323A CN100551989C (en) | 2008-02-01 | 2008-02-01 | A kind of phase-change heat conductive material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008100189323A CN100551989C (en) | 2008-02-01 | 2008-02-01 | A kind of phase-change heat conductive material and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101225293A CN101225293A (en) | 2008-07-23 |
| CN100551989C true CN100551989C (en) | 2009-10-21 |
Family
ID=39857503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2008100189323A Expired - Fee Related CN100551989C (en) | 2008-02-01 | 2008-02-01 | A kind of phase-change heat conductive material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100551989C (en) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102372925B (en) * | 2010-08-05 | 2013-07-31 | 天津莱尔德电子材料有限公司 | Heat conduction insulating material, heat conduction insulating strip and preparation method thereof |
| CN102286153B (en) * | 2011-05-23 | 2012-08-08 | 天津大学 | Small-molecule siloxane phase transformation material and preparation method thereof |
| CN103044784B (en) * | 2012-12-26 | 2015-07-15 | 青岛华仁技术孵化器有限公司 | High-heat-conductivity ternary rubber |
| CN104789151B (en) * | 2014-01-22 | 2017-07-28 | 浙江三元电子科技有限公司 | Hot-melt adhesive composition and preparation method thereof, PUR thermally conductive sheet and preparation method thereof |
| CN103965529B (en) * | 2014-05-07 | 2016-04-13 | 深圳市安品有机硅材料有限公司 | Heat conduction with phase change composition, heat conduction with phase change film and preparation method thereof |
| CN106356588B (en) * | 2015-07-15 | 2019-06-11 | 广东万锦科技股份有限公司 | A kind of preparation method of battery thermal management system heat conductive silica gel composite phase-change material |
| CN105315968A (en) * | 2015-10-28 | 2016-02-10 | 苏州天脉导热科技有限公司 | Silicon-free phase-change heat transfer paste and preparation method thereof |
| CN105315970B (en) * | 2015-11-16 | 2019-01-22 | 华中科技大学 | A kind of thermal interfacial material and preparation method thereof for chip detection |
| CN106893561A (en) * | 2015-12-17 | 2017-06-27 | 比亚迪股份有限公司 | Phase change composite material and electronic equipment |
| CN109804038A (en) * | 2016-10-07 | 2019-05-24 | 日立化成株式会社 | Resin component and sheet material and heat-storing material and the thermal control film-making for having used the heat-storing material for having used the resin component |
| CN109844057A (en) * | 2016-10-07 | 2019-06-04 | 日立化成株式会社 | Resin component and using its sheet material, the manufacturing method of resin component and heat-storing material and use its thermal control film-making |
| CN106817881A (en) * | 2017-01-22 | 2017-06-09 | 嘉兴斯达半导体股份有限公司 | A kind of power semiconductor modular and preparation method thereof |
| CN107043541A (en) * | 2017-02-22 | 2017-08-15 | 厦门安耐伟业新材料有限公司 | Thermal conductive silicon gel combination and preparation method thereof |
| CN107033851B (en) * | 2017-05-11 | 2020-09-22 | 中国科学院山西煤炭化学研究所 | Method for treating surface of phase change composite particle |
| CN107216858B (en) * | 2017-05-18 | 2022-09-09 | 平湖阿莱德实业有限公司 | Preparation method of heat-conducting phase-change energy-storage interface composition |
| CN107722942A (en) * | 2017-11-10 | 2018-02-23 | 苏州环明电子科技有限公司 | Phase transformation high heat conduction boundary material and preparation method thereof |
| CN108102376A (en) * | 2017-12-20 | 2018-06-01 | 深圳德邦界面材料有限公司 | A kind of removable heat conduction phase-change material and preparation method thereof |
| CN108003406A (en) * | 2017-12-20 | 2018-05-08 | 深圳德邦界面材料有限公司 | A kind of heatproof heat conduction phase-change material and preparation method thereof |
| CN108530768B (en) * | 2018-04-27 | 2021-05-07 | 西南科技大学 | Phase-change latex and preparation method thereof |
| CN109278384B (en) * | 2018-08-01 | 2021-04-09 | 苏州矽美科导热科技有限公司 | Heat-conducting sealing material for new energy battery pack and preparation method of heat-conducting sealing material |
| CN109679535B (en) * | 2018-12-26 | 2020-09-29 | 深圳德邦界面材料有限公司 | Curable phase change heat conduction paste for optical module and preparation method thereof |
| CN109913183A (en) * | 2019-04-12 | 2019-06-21 | 哈尔滨理工大学 | A kind of insulating heat-conductive preparation of sections method with phase-change characteristic |
| CN112194898A (en) * | 2020-09-30 | 2021-01-08 | 深圳市飞荣达科技股份有限公司 | Low-thermal-resistance phase-change heat-conducting soft sheet and preparation method thereof |
| CN114805887A (en) * | 2022-03-24 | 2022-07-29 | 深圳市飞荣达科技股份有限公司 | Insulating phase-change heat-conducting film and preparation method thereof |
| CN114892307B (en) * | 2022-07-13 | 2022-09-30 | 北京金羽新能科技有限公司 | Temperature-adjusting bonding layer for aluminum plastic film of lithium battery |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1675302A (en) * | 2002-07-19 | 2005-09-28 | 国际壳牌研究有限公司 | Composition comprising epdm and a paraffinic oil |
-
2008
- 2008-02-01 CN CNB2008100189323A patent/CN100551989C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1675302A (en) * | 2002-07-19 | 2005-09-28 | 国际壳牌研究有限公司 | Composition comprising epdm and a paraffinic oil |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101225293A (en) | 2008-07-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100551989C (en) | A kind of phase-change heat conductive material and preparation method thereof | |
| CN101225234B (en) | Heat conductive insulating material and preparation method thereof | |
| JP6375140B2 (en) | Thermally conductive polymer composition and thermally conductive molded body | |
| CN103804942B (en) | Insulating radiation composition containing Graphene and Synthesis and applications thereof | |
| CN110713742B (en) | Preparation and application method of intelligent conductive paint based on liquid metal-polymer | |
| CN109705804B (en) | High enthalpy value phase-change silica gel gasket and preparation method thereof | |
| CN101012369A (en) | Thermal interface material | |
| CN112552688B (en) | High-thermal-conductivity organic silicon gel sheet and preparation method thereof | |
| Cui et al. | Novel flexible electrically conductive adhesives from functional epoxy, flexibilizers, micro‐silver flakes and nano‐silver spheres for electronic packaging | |
| CN110204903A (en) | A kind of high thermal conductivity coefficient heat-conducting silicone grease and preparation method thereof | |
| CN107793763A (en) | A kind of thermostable heat-conductive silicone grease and preparation method thereof | |
| WO2021142752A1 (en) | Organic silicon resin conductive adhesive, and preparation method therefor and application thereof | |
| CN106188903A (en) | Phase-change heat conductive material and preparation method thereof | |
| CN104610849A (en) | Heat-conducting insulating coating for electronic components and preparation method thereof | |
| CN106752516A (en) | A kind of heat radiation coating of electronic device and preparation method thereof | |
| CN105713527B (en) | Heat-conducting film, preparation method thereof, electronic component and household appliance | |
| CN108753261A (en) | A kind of high-k heat conduction with phase change piece and preparation method thereof | |
| CN109021786A (en) | High thermal conductivity compound resin and preparation method thereof | |
| CN106118066B (en) | A kind of zigzag heat conductive rubber piece and preparation method thereof | |
| CN115595125A (en) | Graphite insulation heat conduction composite material and preparation method thereof | |
| JP4419382B2 (en) | Adhesive composition, adhesive film using the same, and semiconductor device | |
| CN112898929A (en) | Instant-curing liquid metal composite thermal interface material and preparation method thereof | |
| JP2022537537A (en) | Thermal conductive-electrically insulating coating composition and solar cell exterior steel plate containing the same | |
| CN114874656B (en) | Composite powder, preparation method thereof and application thereof in heat dissipation coating | |
| CN114395254B (en) | High-thermal-conductivity-coefficient heat-conducting silicone grease and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091021 Termination date: 20130201 |