CN106752516A - A kind of heat radiation coating of electronic device and preparation method thereof - Google Patents
A kind of heat radiation coating of electronic device and preparation method thereof Download PDFInfo
- Publication number
- CN106752516A CN106752516A CN201611149968.6A CN201611149968A CN106752516A CN 106752516 A CN106752516 A CN 106752516A CN 201611149968 A CN201611149968 A CN 201611149968A CN 106752516 A CN106752516 A CN 106752516A
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- CN
- China
- Prior art keywords
- heat radiation
- electronic device
- radiation coating
- coating
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/447—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from acrylic compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
Abstract
The invention discloses a kind of heat radiation coating of electronic device and preparation method thereof, the coating by resin, color stuffing, auxiliary agent, curing agent, the component composition such as solvent.The present invention, as film forming agent, is respectively provided with good adhesive force from Hydroxylated acrylic resin on metal and non-metallic substrate, can be applied to the common various radiator base materials of in the market, and ageing-resistant performance is excellent.With the silicon nitride of different-grain diameter, on the one hand aluminum oxide can reduce the cost of raw material as filler, on the other hand can improve the high temperature resistant and insulating properties of coating.Heat radiation coating of the invention has insulation, heat conduction, the functional coating of heat loss through radiation characteristic concurrently, meet new demand of the heat radiation coating for the compatible integration of high IR emissivity, high thermal conductivity coefficient and specific insulation high, and there are good film forming and bond strength, high comprehensive performance for the various metals and non-metallic substrate in the market electronic product radiating interface.
Description
Technical field
The present invention relates to paint field, and in particular to a kind of heat radiation coating of electronic device.
Background technology
With the development of science and technology electronic industry is developed rapidly, LED, cpu pcb and high-power electronic device radiator
Deng the new demand for proposing to electro-heat equipment interface coating multifunction, in some electric insulation occasions, heat conducting coating is sometimes also
Must possess good electrical insulating property, the cooling requirements of insulation situations could be met.
Traditional scattered coating relies primarily on and adds the filler of various high heat conductance and realize high thermal conductivity, general using gold
Category (such as Au, Ag, Cu, Al, Mg) or nonmetallic materials (such as graphite, carbon black) are used as filler, although with higher
Thermal conductivity, but there is also some shortcomings：Electrical insulating property and resistant to chemical media are poor, high expensive.
The content of the invention
Present invention aim at, there is provided a kind of good heat dissipation effect, function admirable, lower-cost electronic device heat-radiation coating
Material, the technical solution adopted by the present invention is as follows：
A kind of heat radiation coating of electronic device, it is characterised in that be mixed with by weight percentage by following components and formed：
Resin 30-50 parts
Color stuffing 30-50 parts
Auxiliary agent 2-8 parts
Curing agent 3-8 parts
Solvent 10-30 parts.
Preferably, described resin is Hydroxylated acrylic resin.
Preferably, it by silicon nitride and aluminum oxide according to weight ratio is 2 that described color stuffing is:1 mixing composition.
Preferably, it by mesh number in 200 mesh and mesh number is 1 according to weight ratio in the silicon nitride of 500 mesh that described silicon nitride is:
2 mixing compositions.
Preferably, described auxiliary agent includes dispersant, defoamer, levelling agent, anti-settling agent.
Wherein, the method for preparing the heat radiation coating of described electronic device is as follows：
（1）Appropriate resin is weighed, dispersant, defoamer, color stuffing and solvent low speed are uniformly dispersed, and are subsequently adding levelling agent,
Defoamer and anti-settling agent, ball milling dispersion 2-3h, 40um is less than to fineness, is filtered with 120 mesh copper mesh, obtains component A.
（2）Appropriate curing agent component is weighed, step is added（1）In component A stir, add appropriate solvent
It is adjusted to suitable viscosity, even application.
The present invention is relative to the beneficial effect of prior art：The present invention selects Hydroxylated acrylic resin as film forming agent,
Good adhesive force is respectively provided with metal and non-metallic substrate, the common various radiator base materials of in the market are can be applied to, and
And ageing-resistant performance is excellent.With the silicon nitride of different-grain diameter, on the one hand aluminum oxide can reduce the cost of raw material as filler,
On the other hand the high temperature resistant and insulating properties of coating can be improved.Heat radiation coating of the invention has insulation, heat conduction, heat loss through radiation spy concurrently
Property functional coating, meet heat radiation coating for high IR emissivity, the compatible integration of high thermal conductivity coefficient and specific insulation high
New demand, and have good film forming for the various metals and non-metallic substrate in the market electronic product radiating interface
And bond strength, high comprehensive performance.
Specific embodiment
Design of the invention and the technique effect for producing are clearly and completely described below with reference to embodiment, with
It is completely understood by the purpose of the present invention, feature and effect.Obviously, described embodiment is that a part of the invention is implemented
Example, rather than whole embodiments, based on embodiments of the invention, those skilled in the art is not before creative work is paid
Obtained other embodiment is put, the scope of protection of the invention is belonged to.
Embodiment 1：A kind of heat radiation coating of electronic device, it is characterised in that mixed by weight percentage by following components
Conjunction is prepared from：
40 parts of resin
35 parts of color stuffing
5 parts of auxiliary agent
5 parts of curing agent
15 parts of solvent.
Embodiment 2：A kind of heat radiation coating of electronic device, is mixed with and formed by weight percentage by following components：
35 parts of Hydroxylated acrylic resin
200 10 parts of mesh silicon nitrides
500 20 parts of mesh silicon nitrides
15 parts of aluminum oxide
2 parts of dispersant
0.5 part of defoamer
1 part of levelling agent
0.5 part of anti-settling agent
4 parts of curing agent
12 parts of solvent.
The method for preparing the heat radiation coating of above-mentioned electronic device is as follows：
（1）Resin is weighed, dispersant, defoamer, color stuffing and solvent low speed are uniformly dispersed, and are subsequently adding levelling agent, defoamer
And anti-settling agent, ball milling dispersion 2-3h, 40um is less than to fineness, filtered with 120 mesh copper mesh, obtain component A.
（2）Curing agent component is weighed, step is added（1）In component A stir, add appropriate solvent to be adjusted to close
Suitable viscosity, even application.
Better embodiment of the invention is illustrated above, but the invention is not limited to the implementation
Example, those of ordinary skill in the art can also make a variety of equivalent modifications or replace on the premise of without prejudice to spirit of the invention
Change, these equivalent modifications or replacement are all contained in the application claim limited range.
Claims (6)
1. a kind of heat radiation coating of electronic device, it is characterised in that be mixed with by weight percentage by following components and
Into：
Resin 30-50 parts
Color stuffing 30-50 parts
Auxiliary agent 2-8 parts
Curing agent 3-8 parts
Solvent 10-30 parts.
2. the heat radiation coating of electronic device according to claim 1, it is characterised in that described resin is hydroxy
Acid resin.
3. the heat radiation coating of electronic device according to claim 1, it is characterised in that described color stuffing is by nitrogenizing
Silicon is 2 according to weight ratio with aluminum oxide:1 mixing composition.
4. the heat radiation coating of electronic device according to claim 3, described silicon nitride is in 200 mesh and mesh by mesh number
Number is 1 according to weight ratio in the silicon nitride of 500 mesh:2 mixing compositions.
5. the heat radiation coating of electronic device according to claim 1, described auxiliary agent includes dispersant, defoamer, stream
Flat agent, anti-settling agent.
6. the method for the heat radiation coating of the electronic device described in preparation claim 1 is as follows：
（1）Appropriate resin is weighed, dispersant, defoamer, color stuffing and solvent low speed are uniformly dispersed, and are subsequently adding levelling agent,
Defoamer and anti-settling agent, ball milling dispersion 2-3h, 40um is less than to fineness, is filtered with 120 mesh copper mesh, obtains component A.
（2）Appropriate curing agent component is weighed, step is added（1）In component A stir, add appropriate solvent to be adjusted to
Suitable viscosity, even application.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611149968.6A CN106752516A (en) | 2016-12-14 | 2016-12-14 | A kind of heat radiation coating of electronic device and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611149968.6A CN106752516A (en) | 2016-12-14 | 2016-12-14 | A kind of heat radiation coating of electronic device and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106752516A true CN106752516A (en) | 2017-05-31 |
Family
ID=58880895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611149968.6A Pending CN106752516A (en) | 2016-12-14 | 2016-12-14 | A kind of heat radiation coating of electronic device and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106752516A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108359379A (en) * | 2018-04-02 | 2018-08-03 | 合肥励仙电力工程有限公司 | A kind of electronic component insulated enclosure paint that thermal diffusivity is good |
| CN108517142A (en) * | 2018-04-24 | 2018-09-11 | 滁州瑞能电力科技有限公司 | A kind of coatings compounding method for power equipment |
| CN109355030A (en) * | 2018-11-06 | 2019-02-19 | 苏州环明电子科技有限公司 | Flexible heat-insulated laminated film and its preparation process |
| CN110734676A (en) * | 2019-10-12 | 2020-01-31 | 苏州同舟包装有限公司 | coating material for improving wet and heat aging resistance of polyester sheet and preparation method thereof |
| CN111718584A (en) * | 2020-06-18 | 2020-09-29 | 上海交通大学 | Radiation cooling film, preparation method and application thereof |
| CN117186719A (en) * | 2023-11-06 | 2023-12-08 | 宁德时代新能源科技股份有限公司 | Heat radiation paint, preparation method, battery and electricity utilization device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104046218A (en) * | 2014-06-17 | 2014-09-17 | 无锡卡秀堡辉涂料有限公司 | Heat radiation coating for 3C (Computer, Communication and Consumption) electronic products and preparation method thereof |
| CN104087093A (en) * | 2014-06-30 | 2014-10-08 | 华南理工大学 | Cooling coating for light-emitting diode (LED) lamp and preparation method thereof |
| CN104877509A (en) * | 2015-06-02 | 2015-09-02 | 柳州龙溪化工有限公司 | Heat reflection and dissipation type automotive clear top finish |
| CN105778743A (en) * | 2014-12-22 | 2016-07-20 | 深圳市志邦科技有限公司 | Preparation method of LED white electrophoretic paint capable of dissipating heat and cooling through radiation |
-
2016
- 2016-12-14 CN CN201611149968.6A patent/CN106752516A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104046218A (en) * | 2014-06-17 | 2014-09-17 | 无锡卡秀堡辉涂料有限公司 | Heat radiation coating for 3C (Computer, Communication and Consumption) electronic products and preparation method thereof |
| CN104087093A (en) * | 2014-06-30 | 2014-10-08 | 华南理工大学 | Cooling coating for light-emitting diode (LED) lamp and preparation method thereof |
| CN105778743A (en) * | 2014-12-22 | 2016-07-20 | 深圳市志邦科技有限公司 | Preparation method of LED white electrophoretic paint capable of dissipating heat and cooling through radiation |
| CN104877509A (en) * | 2015-06-02 | 2015-09-02 | 柳州龙溪化工有限公司 | Heat reflection and dissipation type automotive clear top finish |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108359379A (en) * | 2018-04-02 | 2018-08-03 | 合肥励仙电力工程有限公司 | A kind of electronic component insulated enclosure paint that thermal diffusivity is good |
| CN108517142A (en) * | 2018-04-24 | 2018-09-11 | 滁州瑞能电力科技有限公司 | A kind of coatings compounding method for power equipment |
| CN109355030A (en) * | 2018-11-06 | 2019-02-19 | 苏州环明电子科技有限公司 | Flexible heat-insulated laminated film and its preparation process |
| CN110734676A (en) * | 2019-10-12 | 2020-01-31 | 苏州同舟包装有限公司 | coating material for improving wet and heat aging resistance of polyester sheet and preparation method thereof |
| CN111718584A (en) * | 2020-06-18 | 2020-09-29 | 上海交通大学 | Radiation cooling film, preparation method and application thereof |
| CN117186719A (en) * | 2023-11-06 | 2023-12-08 | 宁德时代新能源科技股份有限公司 | Heat radiation paint, preparation method, battery and electricity utilization device |
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| PB01 | Publication | ||
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Application publication date: 20170531 |