CN201623918U - Circuit heat dissipation structure - Google Patents
Circuit heat dissipation structure Download PDFInfo
- Publication number
- CN201623918U CN201623918U CN2010200004141U CN201020000414U CN201623918U CN 201623918 U CN201623918 U CN 201623918U CN 2010200004141 U CN2010200004141 U CN 2010200004141U CN 201020000414 U CN201020000414 U CN 201020000414U CN 201623918 U CN201623918 U CN 201623918U
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- CN
- China
- Prior art keywords
- heat dissipation
- dissipation element
- circuit board
- electronic component
- circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a circuit heat dissipation structure; a circuit board is defined to be provided with a first surface and a second surface arranged correspondingly to the other side of the first surface, wherein the second surface is provided with at least one electronic component; the circuit board is provided with at least one through hole which penetrates through from the first surface to the second surface; and at least one heat dissipation component is arranged on the circuit board, wherein the first heat dissipation component comprises a main body and a convex part extending from the main body, wherein the convex part penetrates through the through hole from the first surface and is contacted with the electronic component arranged on the second surface, so that the heat of the electronic component is conducted onto the main body on the first surface, and heat dissipation is accelerated by utilizing the larger heat dissipation area of the main body.
Description
Technical field
The utility model relates to a kind of circuit radiator structure, relates in particular to the configuration structure of a kind of heat dissipation element on circuit board.
Background technology
In order to allow electronic installation obtain excellent usefulness, the use power and the operating frequency of electronic installation constantly promote, and cause the used heat problem of electronic installation inside more and more thorny, if do not manage used heat is discharged, gently then cause electronic installation usefulness variation, heavy then cause electronic installation to burn.Heat abstractor is even more important for microelectronic element, microelectronic element such as integrated circuit for example, all a large amount of transistors or electronic semi-conductor are packaged together, again along with the increase of integrated circuit density and the progress of encapsulation technology, make the area of integrated circuit constantly dwindle, the heat that unit are produced is along with increase, and the area of dissipation deficiency of ingress of air, very likely burns or reduces its useful life if work under the bad environment in heat radiation.
Since electronic equipment generally require multi-functional, volume is little, therefore many electronic components and heat abstractor gather on the circuit board in the electronic component, and small-sized electronic component is also laid at the back side of circuit board, for example resistance, diode or surface stuck element (Surfacemount device, SMD).Be subject to the distribution in space, existing circuit arrangement all is with main electronic component arrangements therein simultaneously, comprises heat dissipation element and also is installed in identical one side with most of electronic component.Shown in the available circuit structural representation as shown in Figure 1, circuit board 91 shown in Fig. 1 has two broad surfaces up and down, and this circuit board 91 can use wherein be provided with a plurality of main electronic components 93 in a surface usually, and a plurality of electronic components 93 with an insulating barrier 94 as separating, locking is on a heat dissipation element 92.These circuit board 91 relative opposite sides then can only be provided with more small-sized micro element 95 because of narrow space.Because the volume of heat dissipation element 92 is bigger, and needs the area of big ingress of air and the space of circulation of air, moreover the bigger main electronic component 93 of power hungry all is provided with same surface, therefore is difficult in circuit board 91 both sides heat dissipation element 92 is set all.Be positioned at these circuit board 91 another surperficial micro elements 95 and can only rely on the heat conduction of self and air and lower the temperature, the power consumption of perhaps trying every possible means to reduce micro element 95 is burnt avoiding.Therefore, if can improve the problem of heat radiation, just can further improve service efficiency, the raising circuit overall efficiency of circuit board 91 areas, thereby demand urgently improving.
The utility model content
Because electronic installation needs continuous miniaturization, multifunction, make circuit board need along with improving area utilization rate and power density.The purpose of this utility model promptly is to provide a kind of structure of improvement, must make heat dissipation element contact polyelectron element more under the prerequisite that does not take up room and derives the heat of electronic component.
The utility model is a kind of circuit radiator structure, define that a circuit board has a first surface and with respect to a second surface of this first surface opposite side, wherein this second surface is provided with at least one electronic component, and this circuit board has at least one through hole and connected to this second surface by this first surface.And at least one first heat dissipation element is installed on this circuit board, wherein this first heat dissipation element comprises the protuberance that a main body and goes out from this Subject Extension, and protuberance passes this through hole and contacts with the electronic component that is arranged at this second surface from this first surface,, utilize the bigger area of dissipation of this main body and accelerate heat radiation to the main body that is positioned on this first surface with the heat that conducts this electronic component.
Description of drawings
Fig. 1 is the schematic diagram of prior art.
Fig. 2 is the schematic diagram one of the utility model first embodiment.
Fig. 3 is the schematic diagram two of the utility model first embodiment.
Fig. 4 is the schematic diagram of the utility model second embodiment.
Fig. 5 is the schematic diagram of the utility model the 3rd embodiment.
Embodiment
The utility model is a kind of circuit radiator structure, first execution mode of the present utility model sees also Fig. 2 and shown in Figure 3, a circuit board 1 shown in Fig. 2 and Fig. 3 has a first surface 11 and a second surface 12 with respect to these first surface 11 opposite sides, and has at least one through hole 13 on this circuit board 1 and connected to this second surface 12 by this first surface 11.At least one first heat dissipation element 2 of installing on this circuit board 1, this first heat dissipation element 2 comprises the wider main body of a surface area 21 and this main body 21 extended protuberances 22 certainly, this main body 21 protruded on this first surface 11 when this first heat dissipation element 2 was assemblied on this circuit board 1, the protuberance 22 of this first heat dissipation element 2 then passes the through hole 13 of this circuit board 1, and at least one electronic component 3 contacted on this protuberance 22 was crossing to this second surface 12 and is arranged at this second surface 12, to conduct the heat of this electronic component 3.Wherein this electronic component 3 can be the surface stuck element (Surface mountdevice, SMD).Thus, the electronic component 3 on the second surface 12 can be transmitted to heat on the main body 21 that is positioned on the first surface 11 by this protuberance 22, accelerate to reduce temperature by these main body 21 bigger area of dissipations.Moreover, on this first surface 11 a plurality of electronic components are set also, in order to dispose more multicomponent, vacate a plane on this main body 21, selectively, this plane can be fixed on this plane by an insulating barrier 7 for an electronic component 6, this insulating barrier 7 is for fear of electronic component 3,6 are fixed in on a slice first heat conducting element 2 and the danger of conduction is arranged, and this insulating barrier 7 can utilize materials such as heat-conducting plastic, this insulating barrier 7 can have the capacity of heat transmission and be well known to those skilled in the art, so its material is not to be used to limit claim of the present utility model, repeats no more yet.In sum, this first heat dissipation element 2 is except the heat by body 21 these electronic components 6 of conduction, also can the heat of electronic component 3 on the second surface 12 be directed on this main body 21 by this protuberance 22, the radiating efficiency of electronic component 3 on this second surface 12 is improved, thereby can increase the service life, improve stability of a circuit, perhaps can select for use performance is better, operating power is bigger element so that better performance to be provided.
Consult Fig. 4 and Fig. 5 again, on this circuit board 1 except installing this first heat dissipation element 2, at least one second heat dissipation element 4 also can be set, this second heat dissipation element 4 can have bigger volume and area of dissipation, and one or more first heat dissipation elements 2 can respectively be connected with this second heat dissipation element 4 by separating of an insulating barrier 5, by the bigger area of dissipation of this second heat dissipation element 4, can further accelerate the dissipation of these first heat dissipation element, 2 heats.And this first heat dissipation element 2 can utilize the mode (as shown in Figure 4) of screw bolt-lock maybe can utilize a heat conduction adhesion layer 51 (as shown in Figure 5) to stick together both modes with this second heat dissipation element 4.And the utility model does not limit the mode of both combinations, and the thinkable variation of those skilled in the art all should be included in the claim of the present utility model.
Though the utility model discloses as above with preferred embodiment, so it is not in order to limit the utility model.Any those skilled in the art, in not breaking away from spirit and scope of the present utility model, the change of being made and change all should be encompassed in the utility model, and therefore protection range of the present utility model is when looking being as the criterion that accompanying Claim defines.
Claims (8)
1. a circuit radiator structure is characterized in that, described circuit radiator structure comprises:
One circuit board, described circuit board (1) has a first surface (11) and with respect to the second surface (12) of described first surface (11) opposite side, wherein said second surface (12) is provided with at least one electronic component (3), and described circuit board (1) has at least one through hole (13) and connected to described second surface (12) by described first surface (11);
At least one first heat dissipation element (2), described first heat dissipation element (2) has a protuberance (22) and passes described through hole (13) and contact with the electronic component that is arranged at described second surface (12) (3) from described first surface (11), to conduct the heat of described electronic component (3).
2. circuit radiator structure according to claim 1 is characterized in that, described first heat dissipation element (2) comprises the main body (21) of extending described protuberance (22), and wherein said main body (21) is positioned on the described first surface (11).
3. circuit radiator structure according to claim 2 is characterized in that, a plurality of electronic components (3) are set on the described first surface (11), and at least one electronic component (3) is fixed on the main body (21) of described first heat dissipation element (2).
4. circuit radiator structure according to claim 1 is characterized in that, described circuit board (1) is provided with at least one second heat dissipation element (4), and one or more first heat dissipation element (2) is connected with described second heat dissipation element (4).
5. circuit radiator structure according to claim 4 is characterized in that, has an insulating barrier (5) between described first heat dissipation element (2) and described second heat dissipation element (4).
6. circuit radiator structure according to claim 5 is characterized in that, has a heat conduction adhesion layer (51) to be connected both between described first heat dissipation element (2) and described second heat dissipation element (4).
7. circuit radiator structure according to claim 5 is characterized in that, a bolting element passes described first heat dissipation element (2) and is connected on described second heat dissipation element (4).
8. circuit radiator structure according to claim 1 is characterized in that, be arranged at described second surface (12) and with described first heat dissipation element (2) contacting electronic element (3) be the surface stuck element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200004141U CN201623918U (en) | 2010-01-08 | 2010-01-08 | Circuit heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200004141U CN201623918U (en) | 2010-01-08 | 2010-01-08 | Circuit heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201623918U true CN201623918U (en) | 2010-11-03 |
Family
ID=43027370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010200004141U Expired - Lifetime CN201623918U (en) | 2010-01-08 | 2010-01-08 | Circuit heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201623918U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307457A (en) * | 2011-08-31 | 2012-01-04 | 昆山锦泰电子器材有限公司 | Assembled radiating fin with electronic component |
-
2010
- 2010-01-08 CN CN2010200004141U patent/CN201623918U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307457A (en) * | 2011-08-31 | 2012-01-04 | 昆山锦泰电子器材有限公司 | Assembled radiating fin with electronic component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101103 |