CN207706619U - A kind of set-top box PCBA of optimizing thermal solution - Google Patents
A kind of set-top box PCBA of optimizing thermal solution Download PDFInfo
- Publication number
- CN207706619U CN207706619U CN201820038935.2U CN201820038935U CN207706619U CN 207706619 U CN207706619 U CN 207706619U CN 201820038935 U CN201820038935 U CN 201820038935U CN 207706619 U CN207706619 U CN 207706619U
- Authority
- CN
- China
- Prior art keywords
- heat
- cooling fin
- top box
- chip
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a kind of set-top box PCBA of optimizing thermal solution, including circuit board body, it is welded with several chips at the top of circuit board body, it is provided with heat sink above circuit board body, heat sink side is provided with several cooling fins, it is fixedly connected with several heat conduction items between cooling fin and heat sink, heat conduction item is fixedly connected between adjacent two cooling fin, cooling fin is abutted with chip.Chip running will generate heat, and cooling fin will be transmitted to from chip surface draw heat and by heat conduction item in heat sink, then heat is distributed to cooling into air from heat sink.Heat between adjacent two cooling fin is mutually conducted by heat conduction item, realizes the heat transfer network of net like, accelerates heat conduction velocity.Its is simple in structure, easy to use, can effectively reduce the temperature of chip on set-top box PCBA, promotes PCBA radiating efficiencys.
Description
Technical field
The utility model is related to circuit board technology fields, specifically disclose a kind of set-top box PCBA of optimizing thermal solution.
Background technology
Digital video switching box, commonly referred to as set-top box are the equipment of connection a television set and outside source.It can
The digital signal of compression is changed into television content, and show on a television set.In order to reach information processing, conversion, control
The function of system is provided with PCBA (circuit board for being assembled with electronic component) in set-top box.
In order to realize various functions, need to use various high-power, strong functional chips on set-top box PCBA, it is this kind of
The fever of chip is especially high.Set-top box is the relatively closed equipment of an internal structure, if inside chip heat can not obtain
To Quick diffusing, the running stability of set-top box will be influenced, and reduce the service life of set-top box.The PCBA of present set-top box
Interior, general only to carry out radiating treatment to central processing unit, heat dissipation effect is limited.
Utility model content
Based on this, it is necessary to be directed to prior art problem, provide a kind of set-top box PCBA of optimizing thermal solution, setting is unique
Structure, the heat generated to the running of each chip is individually collected, and the heat being collected into is carried out the heat dissipation that transmission distributes
The set-top box PCBA of optimization.
To solve prior art problem, the utility model discloses a kind of set-top box PCBA of optimizing thermal solution, including circuit board
Ontology, circuit board body top are welded with several chips, are provided with heat sink above circuit board body, heat sink side is provided with
Several cooling fins are fixedly connected with several heat conduction items, are fixedly connected between adjacent two cooling fin between cooling fin and heat sink
Heat conduction item, cooling fin are abutted with chip.
Preferably, adjoining has thermal grease layer between cooling fin and chip.
Preferably, cooling fin is heat-conducting silica gel sheet.
Preferably, heat conduction item is copper coin.
Preferably, heat sink side is provided through several guide holes, and circuit board body side is fixedly connected with and guide hole
The guide post matched, guide post are slidably connected with guide hole.
The beneficial effects of the utility model are：The utility model discloses a kind of set-top box PCBA of optimizing thermal solution, and setting is only
Special structure, chip running will generate heat, and cooling fin will be transmitted to heat dissipation from chip surface draw heat and by heat conduction item
On frame, then from heat sink heat is distributed to cooling into air.Heat between adjacent two cooling fin is mutually passed by heat conduction item
It leads, realizes the heat transfer network of net like, accelerate heat conduction velocity.Its is simple in structure, easy to use, can effectively reduce machine
The temperature of chip on top box PCBA promotes PCBA radiating efficiencys.Thermal grease layer is set between cooling fin and chip, using leading
The hot good thermal conductivity of silicone grease promotes heat conducts between chip and cooling fin efficiency and stability.Heat-conducting silica gel sheet quality
Softness, thermal conductivity is good, sets cooling fin to heat-conducting silica gel sheet, is bonded effect between heat radiation piece and chip, is promoted and dissipated
Heat-conducting effect between backing and chip.Copper coin has excellent heat-conducting effect, using copper coin as heat conduction item, promotes heat conduction item
To the rate of heat sink heat transfer, accelerate the cooling of PCBA.The guide hole and guide post being equipped with, realize circuit board body with
Fixation between heat sink prevents from detaching with circuit board body during heat sink use and influencing heat dissipation effect.
Description of the drawings
Fig. 1 is the outline structural diagram of the utility model PCBA.
Reference numeral is：Circuit board body 1, chip 2, heat sink 3, cooling fin 4, heat conduction item 5, thermal grease layer 6, guide hole
7, guide post 8.
Specific implementation mode
For that can further appreciate that the feature, technological means and the specific purposes reached, function of the utility model, below
The utility model is described in further detail with specific implementation mode in conjunction with attached drawing.
With reference to figure 1.
The utility model embodiment discloses a kind of set-top box PCBA of optimizing thermal solution, including circuit board body 1, circuit board sheet
1 top of body is welded with several chips 2, and 1 top of circuit board body is provided with heat sink 3, and 3 side of heat sink is provided with several heat dissipations
Piece 4 is fixedly connected with several heat conduction items 5, heat conduction is fixedly connected between adjacent two cooling fin 4 between cooling fin 4 and heat sink 3
Item 5, cooling fin 4 are abutted with chip 2.
Concrete principle is that chip 2 can generate heat when using, and each cooling fin 4 will be from 2 surface draw heat of its corresponding chip
And conducted in heat sink 3 by heat conduction item 5, it is connected also by heat conduction item 5 between adjacent two cooling fin 4, realizes the phase of heat
Mutually conduction forms the heat conduction network of net like, accelerates heat conduction velocity.The heat collected in heat sink 3 will be dissipated into air
Hair realizes the cooling to PCBA.
It is adjacent between cooling fin 4 and chip 2 to have thermal grease layer 6 based on above-described embodiment.Heat-conducting silicone grease is a kind of high leads
Thermal insulation organosilicon material, almost never cures, fat when can keep using for a long time at a temperature of -50 DEG C~+230 DEG C
State.Not only there is excellent electrical insulating property, but also have excellent thermal conductivity.Thermal grease layer is set between cooling fin 4 and chip 2
6, promote the efficiency and stability that heat conducts between chip 2 and cooling fin 4 using the good thermal conductivity of heat-conducting silicone grease.
Based on above-described embodiment, cooling fin 4 is heat-conducting silica gel sheet.Heat-conducting silica gel sheet soft texture, thermal conductivity is good, will radiate
Piece 4 is set as heat-conducting silica gel sheet, effect is bonded between heat radiation piece 4 and chip 2, between heat radiation piece 4 and chip 2
Heat-conducting effect.
Based on above-described embodiment, heat conduction item 5 is copper coin.Copper coin has excellent heat-conducting effect, using copper coin as heat conduction
Item 5 promotes rate of the heat conduction item 5 to 3 heat transfer of heat sink, accelerates the cooling of PCBA.
Based on above-described embodiment, 3 side of heat sink is provided through several guide holes 7, and 1 side of circuit board body is fixedly connected
Have and is slidably connected with guide hole 7 with 7 matched guide post 8 of guide hole, guide post 8.When combination, guide post 8 is directed at its corresponding guide hole 7 simultaneously
Group enters, until cooling fin 4 is contacted with 2 surface of chip.The guide hole 7 being equipped with and guide post 8, realize circuit board body 1 and dissipate
Fixation between hot frame 3 prevents from detaching with circuit board body 1 during 3 use of heat sink and influencing heat dissipation effect.
Above example only expresses a kind of embodiment of the utility model, the description thereof is more specific and detailed, but not
Can the limitation to the utility model patent range therefore be interpreted as.It should be pointed out that for the ordinary skill people of this field
For member, without departing from the concept of the premise utility, various modifications and improvements can be made, these belong to this reality
With novel protection domain.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (5)
1. a kind of set-top box PCBA of optimizing thermal solution, including circuit board body (1), which is characterized in that the circuit board body (1)
Top is welded with several chips (2), and heat sink (3), heat sink (3) side are provided with above the circuit board body (1)
Several cooling fins (4) are provided with, several heat conduction items (5) are fixedly connected between the cooling fin (4) and the heat sink (3),
The heat conduction item (5) is fixedly connected between adjacent two cooling fin (4), the cooling fin (4) is adjacent with the chip (2)
It connects.
2. a kind of set-top box PCBA of optimizing thermal solution according to claim 1, which is characterized in that the cooling fin (4) with
Adjoining has thermal grease layer (6) between the chip (2).
3. a kind of set-top box PCBA of optimizing thermal solution according to claim 1, which is characterized in that the cooling fin (4) is
Heat-conducting silica gel sheet.
4. a kind of set-top box PCBA of optimizing thermal solution according to claim 1, which is characterized in that the heat conduction item (5) is
Copper coin.
5. a kind of set-top box PCBA of optimizing thermal solution according to claim 1, which is characterized in that the heat sink (3) one
Side is provided through several guide holes (7), and circuit board body (1) side is fixedly connected with and the guide hole (7) is matched leads
Column (8), the guide post (8) are slidably connected with the guide hole (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820038935.2U CN207706619U (en) | 2018-01-10 | 2018-01-10 | A kind of set-top box PCBA of optimizing thermal solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820038935.2U CN207706619U (en) | 2018-01-10 | 2018-01-10 | A kind of set-top box PCBA of optimizing thermal solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207706619U true CN207706619U (en) | 2018-08-07 |
Family
ID=63034908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820038935.2U Expired - Fee Related CN207706619U (en) | 2018-01-10 | 2018-01-10 | A kind of set-top box PCBA of optimizing thermal solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207706619U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113890557A (en) * | 2021-09-30 | 2022-01-04 | 深圳盛必达通信有限公司 | Miniaturized communication module |
-
2018
- 2018-01-10 CN CN201820038935.2U patent/CN207706619U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113890557A (en) * | 2021-09-30 | 2022-01-04 | 深圳盛必达通信有限公司 | Miniaturized communication module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180807 Termination date: 20210110 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |