CN209845587U - Phase-change heat dissipation type microwave power amplifier - Google Patents
Phase-change heat dissipation type microwave power amplifier Download PDFInfo
- Publication number
- CN209845587U CN209845587U CN201822195988.8U CN201822195988U CN209845587U CN 209845587 U CN209845587 U CN 209845587U CN 201822195988 U CN201822195988 U CN 201822195988U CN 209845587 U CN209845587 U CN 209845587U
- Authority
- CN
- China
- Prior art keywords
- heat
- power amplifier
- microwave power
- plate
- conducting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 230000007704 transition Effects 0.000 claims abstract description 7
- 239000012782 phase change material Substances 0.000 claims abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 2
- 239000012071 phase Substances 0.000 description 8
- 239000012530 fluid Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a phase transition heat dissipation formula microwave power amplifier, including the radiator body, the radiator body comprises heat-conducting plate and heating panel, the lower surface of heat-conducting plate is provided with the mounting groove, the inside of mounting groove is provided with heat-conducting layer and microwave power amplifier body, and the inboard at the heat-conducting layer is installed to the microwave power amplifier body, the inside of heat-conducting layer is provided with the through-hole, be provided with phase change material in the through-hole, the lower surface mounting of microwave power amplifier body has the elasticity preforming, the inside of heat-conducting plate is provided with the liquid groove, the upper surface of heat-conducting plate is provided with heating panel and mounting panel, and the mounting panel setting is in the both sides of heating panel, the inside of heating panel. The utility model provides a not good problem that influences microwave power amplifier work because of the radiating effect, have convenient to use's benefit.
Description
Technical Field
The utility model relates to a microwave power amplifier technical field specifically is a phase transition heat dissipation formula microwave power amplifier.
Background
A power amplifier (abbreviated as "power amplifier") is an amplifier that can generate maximum power output to drive a certain load under a given distortion factor condition. The power amplifier is an important component of microwave equipment, and if the amplifier fails, the single channel of a circuit is blocked, so that the reliability of microwave communication is affected.
Microwave circuit failures are typically due to excessive temperatures that damage the integrated circuit and cause interruption of the signaling signal. The traditional amplifier radiator generally adopts air cooling heat dissipation, so that the heat dissipation efficiency is low, the utilization rate of the radiator is not high, and the stability of the power amplifier is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a phase transition heat dissipation formula microwave power amplifier to solve the problem among the prior art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a phase transition heat dissipation formula microwave power amplifier, includes the radiator body, the radiator body comprises heat-conducting plate and heating panel, the lower surface of heat-conducting plate is provided with the mounting groove, the inside of mounting groove is provided with heat-conducting layer and microwave power amplifier body, and the microwave power amplifier body installs the inboard at the heat-conducting layer, the inside of heat-conducting layer is provided with the through-hole, be provided with phase change material in the through-hole, the lower surface mounting of microwave power amplifier body has the elasticity preforming, the inside of heat-conducting plate is provided with the liquid tank, the upper surface of heat-conducting plate is provided with heating panel and mounting panel, and the mounting panel setting is in the both sides of heating panel, the inside.
Preferably, the liquid tank is connected with the phase change cavity through a connecting channel.
Preferably, the heat dissipation plates are equidistantly mounted on the upper surface of the heat conduction plate.
Preferably, the heat conducting layer is made of a heat conducting silica gel sheet.
Preferably, the elastic pressing piece is connected with the heat conducting plate through a screw.
Compared with the prior art, the beneficial effects of the utility model are that: through the elastic pressing sheet of the surface mounting under the heat conducting plate, the microwave power amplifier and the heat conducting layer can be tightly mounted, the heat dissipation effect is effectively guaranteed, the mounting and the dismounting are convenient, the phase-change material arranged in the through hole can guarantee that the temperature of a heat source in the heat dissipation process cannot exceed the heat-resisting temperature of the heat source, the working stability of the microwave power amplifier is guaranteed, and the lug mounted at the top of the phase-change cavity is beneficial to the phase-change heat dissipation, so that the heat dissipation efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a cross-sectional view of the present invention.
Fig. 3 is an enlarged schematic view of a portion a in fig. 2 according to the present invention.
In the figure: 1. a phase change cavity; 2. a heat dissipation plate; 3. a connecting channel; 4. a liquid tank; 5. a heat conductive layer; 6. a phase change material; 7. a heat conducting plate; 8. a bump; 9. mounting a plate; 10. mounting grooves; 11. a microwave power amplifier body; 12. a through hole; 13. a heat sink body; 14. and (4) elastic tabletting.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 3, in an embodiment of the present invention, a phase change heat dissipation type microwave power amplifier includes a heat sink body 13, the heat sink body 13 is composed of a heat conducting plate 7 and a heat dissipating plate 2, a mounting groove 10 is formed on a lower surface of the heat conducting plate 7, a heat conducting layer 5 and a microwave power amplifier body 11 are disposed inside the mounting groove 10, the microwave power amplifier body 11 is mounted inside the heat conducting layer 5, a through hole 12 is formed inside the heat conducting layer 5, a phase change material 6 is disposed inside the through hole 12, an elastic pressing sheet 14 is mounted on a lower surface of the microwave power amplifier body 11, a liquid tank 4 is disposed inside the heat conducting plate 7, the heat dissipating plate 2 and a mounting plate 9 are disposed on an upper surface of the heat conducting plate 7, the mounting plates 9 are disposed on two sides of the heat dissipating, the liquid groove 4 is connected with the phase change cavity 1 through the connecting channel 3, the heat dissipation plate 2 is equidistantly arranged on the upper surface of the heat conduction plate 7, the heat conduction layer 5 is made of a heat conduction silica gel sheet, and the elastic pressing sheet 14 is connected with the heat conduction plate 7 through screws.
The utility model discloses a theory of operation is: during operation, the heat of microwave power amplifier body 11 passes through heat-conducting layer 5 and transmits to the inside liquid groove 4 that sets up of heat-conducting plate 7, because there is heat-conducting fluid in liquid groove 4 department, and be the vacuum state, heat-conducting fluid is heated and can be become gaseous from liquid phase transition fast, when gaseous state heat-conducting fluid through connecting channel 3 to phase transition cavity 1 in, when meetting colder heating panel 2, gaseous state heat-conducting fluid can release heat energy and condense into liquid again, flow back to in the liquid groove 4.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (5)
1. The utility model provides a phase transition heat dissipation formula microwave power amplifier, includes radiator body (13), its characterized in that: the heat radiator body (13) comprises a heat conducting plate (7) and a heat radiating plate (2), the lower surface of the heat conducting plate (7) is provided with a mounting groove (10), the inside of the mounting groove (10) is provided with a heat conducting layer (5) and a microwave power amplifier body (11), the microwave power amplifier body (11) is mounted on the inner side of the heat conducting layer (5), the inside of the heat conducting layer (5) is provided with a through hole (12), a phase-change material (6) is arranged in the through hole (12), the lower surface of the microwave power amplifier body (11) is provided with an elastic pressing sheet (14), the inside of the heat conducting plate (7) is provided with a liquid groove (4), the upper surface of the heat conducting plate (7) is provided with the heat radiating plate (2) and a mounting plate (9), the mounting plate (9) is arranged on two sides of the heat radiating plate, and a lug (8) is arranged at the top of the phase change cavity (1).
2. The phase change heat dissipating microwave power amplifier of claim 1, wherein: the liquid groove (4) is connected with the phase change cavity (1) through a connecting channel (3).
3. The phase change heat dissipating microwave power amplifier of claim 1, wherein: the heat dissipation plates (2) are equidistantly arranged on the upper surface of the heat conduction plate (7).
4. The phase change heat dissipating microwave power amplifier of claim 1, wherein: the heat conduction layer (5) is made of a heat conduction silica gel sheet.
5. The phase change heat dissipating microwave power amplifier of claim 1, wherein: the elastic pressing sheet (14) is connected with the heat conducting plate (7) through a screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822195988.8U CN209845587U (en) | 2018-12-26 | 2018-12-26 | Phase-change heat dissipation type microwave power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822195988.8U CN209845587U (en) | 2018-12-26 | 2018-12-26 | Phase-change heat dissipation type microwave power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209845587U true CN209845587U (en) | 2019-12-24 |
Family
ID=68900497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822195988.8U Expired - Fee Related CN209845587U (en) | 2018-12-26 | 2018-12-26 | Phase-change heat dissipation type microwave power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209845587U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022073466A1 (en) * | 2020-10-08 | 2022-04-14 | 周哲明 | Uniform temperature plate having built-in water-cooling plate for heat dissipation |
-
2018
- 2018-12-26 CN CN201822195988.8U patent/CN209845587U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022073466A1 (en) * | 2020-10-08 | 2022-04-14 | 周哲明 | Uniform temperature plate having built-in water-cooling plate for heat dissipation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191224 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |