CN213485478U

CN213485478U - Electronic equipment heat radiation structure suitable for passive heat radiation

Info

Publication number: CN213485478U
Application number: CN202022664859.6U
Authority: CN
Inventors: 石庆; 胡晓波; 林军
Original assignee: Shenzhen Yijing Virtual Reality Technology Co ltd
Current assignee: Shenzhen Yijing Virtual Reality Technology Co ltd
Priority date: 2020-11-17
Filing date: 2020-11-17
Publication date: 2021-06-18
Anticipated expiration: 2030-11-17

Abstract

The utility model relates to an electronic equipment heat dissipation field, in particular to electronic equipment heat radiation structure suitable for passive heat dissipation. The electronic equipment heat dissipation structure comprises an electronic equipment shell, an electronic equipment internal heating source and a heat dissipation sheet, wherein a heat dissipation gap is formed in the shell, one end of the heat dissipation sheet is connected with the heating source, and the other end of the heat dissipation sheet outwards extends to the outside of the shell from the heat dissipation gap. The electronic equipment heat dissipation structure can directly conduct heat emitted by equipment to the outside of the equipment, so that the heat dissipation speed of the equipment is accelerated, and the normal use of the equipment is ensured; the problem of current fin be located the inside radiating capacity that leads to of equipment shell and be less than calorific capacity is solved.

Description

Electronic equipment heat radiation structure suitable for passive heat radiation

Technical Field

The utility model relates to an electronic equipment heat dissipation field, in particular to electronic equipment heat radiation structure suitable for passive heat dissipation.

Background

When the electronic element works, part of electric energy is converted into heat energy. If the electronic element works in a high-temperature environment and does not have good heat dissipation, the efficiency of the electronic element is reduced, and the service life of the electronic element is shortened.

At present, the heat dissipation of electronic products mainly depends on heat dissipation fins, and the working principle of the heat dissipation device lies in that a heat source is in contact with the heat dissipation fins through silica gel, then the heat dissipation fins are attached to an inner shell of the device, and the heat of the device is dissipated out through heat conduction.

However, inside the limited space of the equipment, when the amount of heat emitted is smaller than the amount of heat emitted from the heat source, the heat will be accumulated inside the equipment, so that the temperature of the equipment will be higher and higher, and the electronic components of the equipment will be aged more and more quickly, and even the equipment will burn out.

SUMMERY OF THE UTILITY MODEL

The utility model provides an electronic equipment heat radiation structure suitable for passive radiating, when aiming at solving the heat dissipation of email electronic equipment, calorific capacity is greater than the problem of heat dissipation capacity.

The utility model provides an electronic equipment heat radiation structure suitable for passive radiating, including the inside source that generates heat of electronic equipment's shell, electronic equipment, still include the fin, be equipped with the heat dissipation gap on the shell, the source that generates heat is connected to fin one end, and the outside of shell is outwards extended to from the heat dissipation gap to its other end.

As a further improvement of the present invention, the heat sink includes an inner heat sink and an outer heat sink, the inner heat sink is connected to the heat source, the outer heat sink is attached to the outer surface of the housing, and the inner heat sink is connected to the outer heat sink.

As a further improvement, the outer surface of the housing is provided with a heat dissipation groove matched with the thickness and the shape of the external heat dissipation fin, and the external heat dissipation fin is connected in the heat dissipation groove.

As a further improvement of the present invention, the shape of the external heat sink is set to a shape corresponding to an icon or a symbol of the electronic device.

As a further improvement of the present invention, the color of the external heat sink matches the color of the housing.

As a further improvement of the present invention, the heat dissipating structure of the electronic device includes a heat conducting pad made of a high thermal conductivity material, and the internal heat dissipating fins are connected to the heat source through the heat conducting pad.

As a further improvement, the heat conducting pad is a silica gel pad.

As a further improvement of the utility model, be equipped with one or more thermovents on the shell, the thermovent sets up in the position corresponding with the source that generates heat.

As a further improvement of the utility model, this electronic equipment heat radiation structure includes a plurality of fin, a plurality of fin are the inside one or more of jointing equipment source that generates heat respectively, it sets up a plurality of heat dissipation gaps to correspond on the shell, a plurality of fin extend to the shell outside through a plurality of heat dissipation gaps respectively.

As a further improvement of the present invention, the heat dissipation gap is located on the electronic device housing, and the user contacts the front portion of the housing, the bottom portion of the housing, and the side portion of the housing, which have low probability.

The utility model has the advantages that: the electronic equipment heat dissipation structure can directly conduct heat emitted by equipment to the outside of the equipment, so that the heat dissipation speed of the equipment is accelerated, and the normal use of the equipment is ensured; the problem of current fin be located the inside radiating capacity that leads to of equipment shell and be less than calorific capacity is solved.

Drawings

Fig. 1 is a schematic view of an internal structure of a heat dissipation structure of an electronic device according to the present invention;

fig. 2 is a schematic view of an external structure of the heat dissipation structure of the electronic device of the present invention;

fig. 3 is a schematic view of a three-dimensional external structure of the heat dissipation structure of the electronic device of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

As shown in fig. 1 to fig. 3, the utility model discloses an electronic equipment heat radiation structure suitable for passive heat dissipation, including the inside source 2 that generates heat of electronic equipment's shell 1, electronic equipment, still include fin 3, be equipped with the heat dissipation gap on the shell, the source 2 that generates heat is connected to fin one end, and its other end outwards extends to the outside of shell 1 from the heat dissipation gap. The structure needs to be introduced when the structure of the equipment product is designed, a heat dissipation gap of the heat dissipation fins 3 extending from the inside to the outside of the electronic equipment is reserved on the structure, and the extending position needs to be a position with low probability of being contacted by an equipment user, such as the front part, the bottom part, a side edge which can not be contacted by hands and the like.

The radiating fins 3 comprise inner radiating fins and outer radiating fins 4, the inner radiating fins are connected with the heating source 2, the outer radiating fins 4 are attached to the outer surface of the shell, the outer radiating fins can also be attached to an outer cover plate 5 of the equipment, and the inner radiating fins are connected with the outer radiating fins 4.

The outer surface of the shell 1 is provided with a heat dissipation groove matched with the thickness and the shape of the external heat dissipation fin 4, and the external heat dissipation fin 4 is connected in the heat dissipation groove. The thickness of the external heat sink 4 attached to the outside may be larger than that of the device case 1, and in the design of the external appearance, the external heat sink 4 and the device case 1 are integrated into an appearance characteristic by designing a corresponding groove shape in the device case 1 in accordance with the shape and thickness of the external heat sink 4.

The shape of the external heat sink 4 is set to a shape corresponding to an icon or symbol of the electronic device. The external heat sink 4 can be designed to be a logo or a specific shape or symbol, so that the external heat sink 4 and the device are perfectly combined into a complete whole to be displayed to a user.

The color of the external heat sink 4 matches the color of the housing 1. The color of the external cooling fins 4 can be adjusted according to the color of the device shell 1, so that the integrity of the appearance design of the device is ensured.

The electronic equipment heat radiation structure comprises a heat conduction pad made of high-heat-conductivity materials, the internal heat radiation fins are connected with the heating source 2 through the heat conduction pad, and the heat conduction pad is preferably a silica gel pad. The internal heat sink is connected to the heat source 2 through a material having high thermal conductivity such as silica gel, thereby accelerating heat dissipation efficiency.

One or more heat dissipation ports are arranged on the shell 1, and the heat dissipation ports are arranged at positions corresponding to the heating source. One or more external heat sinks may be designed depending on the device design and the location of the internal heat generating source 2(CPU chip, PMU unit, EMMC/UFS, battery, etc.).

The electronic equipment heat radiation structure comprises a plurality of heat radiation fins, wherein the heat radiation fins are respectively connected with one or more heating sources 2 inside the equipment, a plurality of heat radiation gaps are correspondingly arranged on the shell 1, and the heat radiation fins 3 respectively extend to the outside of the shell 1 through the heat radiation gaps. The structure can be provided with one or more radiating fins extending to the outside of the equipment, particularly according to the heat productivity of the equipment and the design requirement of the structure, and when the structure allows, and when the heat productivity of the equipment is large, two or more radiating fins 3 can be arranged to extend from the heat source 2 to the outside of the equipment.

The utility model discloses an electronic equipment heat radiation structure suitable for passive radiating, with the inside source 2 that generates heat of equipment directly couple together with fin 3 with silica gel, the heat dissipation gap that the rethread structure was reserved extends to the equipment outside with fin 3, pastes in the equipment outside, forms an inside heat conduction, and outside radiating effect is under the effect of outside air current, the equipment radiating effect with higher speed.

When parts such as CPU, PMU, EMMC generate heat easily when equipment moves, at limited equipment inner space, if calorific capacity is greater than the heat dissipation capacity, will lead to the machine more and more hot to make equipment life subtract weak point, this technique is for solving this problem, directly derives equipment outside to dispel the heat the inside heat of equipment, takes away the heat that equipment gave out through outside air current, improves the radiating effect, thereby protective apparatus can normal use.

The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.

Claims

1. The utility model provides an electronic equipment heat radiation structure suitable for passive heat dissipation, includes the inside source that generates heat of electronic equipment's shell, electronic equipment, its characterized in that still includes the fin, be equipped with the heat dissipation gap on the shell, the source that generates heat is connected to fin one end, and its other end outwards extends to the outside of shell from the heat dissipation gap.

2. The electronic device heat dissipation structure suitable for passive heat dissipation of claim 1, wherein the heat dissipation fins comprise an inner heat dissipation fin and an outer heat dissipation fin, the inner heat dissipation fin is connected to the heat generation source, the outer heat dissipation fin is attached to an outer surface of the housing, and the inner heat dissipation fin is connected to the outer heat dissipation fin.

3. The heat dissipation structure of electronic equipment adapted for passive heat dissipation according to claim 2, wherein the outer surface of the housing has a heat dissipation groove matching with the thickness and shape of the external heat sink, and the external heat sink is connected in the heat dissipation groove.

4. The heat dissipating structure of an electronic device adapted to passively dissipate heat as claimed in claim 2, wherein the external heat sink has a shape corresponding to an icon or symbol of the electronic device.

5. The heat dissipating structure of an electronic device adapted to passively dissipate heat as recited in claim 2, wherein the exterior fins are colored to match a color of the housing.

6. The heat dissipating structure of an electronic device adapted to passively dissipate heat as claimed in claim 2, comprising a thermal pad made of a material with high thermal conductivity, wherein the internal heat sink is connected to the heat source through the thermal pad.

7. The electronic device heat dissipation structure adapted to passively dissipate heat according to claim 6, wherein the thermal pad is a silicone pad.

8. The electronic device heat dissipation structure suitable for passive heat dissipation of claim 1, wherein the housing has one or more heat dissipation openings, and the heat dissipation openings are disposed at positions corresponding to heat sources.

9. The electronic device heat dissipation structure suitable for passive heat dissipation of claim 1, comprising a plurality of heat dissipation fins, wherein the plurality of heat dissipation fins are respectively connected to one or more heat sources inside the device, the housing is correspondingly provided with a plurality of heat dissipation slits, and the plurality of heat dissipation fins respectively extend to the outside of the housing through the plurality of heat dissipation slits.

10. The electronic device heat dissipation structure suitable for passive heat dissipation of any one of claims 1 to 9, wherein the heat dissipation gap is located at a front portion of the electronic device housing, a bottom portion of the housing, and a side portion of the housing where a user has a low probability of touching the electronic device housing.