CN101588707A - Heat abstractor and electric device using same - Google Patents
Heat abstractor and electric device using same Download PDFInfo
- Publication number
- CN101588707A CN101588707A CN 200810098140 CN200810098140A CN101588707A CN 101588707 A CN101588707 A CN 101588707A CN 200810098140 CN200810098140 CN 200810098140 CN 200810098140 A CN200810098140 A CN 200810098140A CN 101588707 A CN101588707 A CN 101588707A
- Authority
- CN
- China
- Prior art keywords
- heat
- phase change
- housing
- change medium
- heat abstractor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
Abstract
The invention relates to a heat abstractor and an electric device using the same. The heat abstractor comprises a shell and phase-change heat-conducting media, wherein the phase-change heat-conducting media are filled into the shell, and an electric subassembly is coated into the phase-change heat-conducting media of the shell. The heat abstractor has the implementation mode that the phase-change heat-conducting media are filled into the shell, and a circuit board or an assembly waiting for abstracting heat is dipped into the phase-change heat-conducting media for abstracting heat. The heat abstractor directly covers all parts of a circuit, has large heat abstraction area and strong heat transmission capacity, effectively eliminates a local overheating phenomenon, reduces energy consumption, avoids dust and corrosion and is convenient to store and transport.
Description
Technical field
The present invention relates to a kind of heat dissipation technology, relate in particular to a kind of clad type heat abstractor and use its electronic equipment.
Background technology
Because the power consumption and the packaging density of electronic product improve day by day, requirements at the higher level have been proposed in heat radiation at present.The radiating mode of electronic product progressively develops into air blast cooling, liquid cooling and forced refrigeration etc. from the free convection in past.
The radiating mode of free convection is usually used in the electronic equipment that power consumption is less, the natural heat dissipation condition is good, and the heat that each electronic device work is sent relies on device shell or the special radiator of installing to be discharged in the surrounding air, and heat conducting media is an air.
Air blast cooling is on the basis of natural heat dissipation, and certain device or the whole machine installation fan big to caloric value are taken away more heats more rapidly by strengthening cross-ventilation; The air blast cooling technology adopts fan to strengthen radiating effect more, and fan can load on the fin of certain device, such as common computer CPU fan and radiator; Also can be added on the entire equipment cabinet, such as common computer housing fan.But air blast cooling still mainly uses air as heat transfer medium, and the capacity of heat transmission of air is low, cause radiating effect bad, can't solve the heat dissipation problem of the bigger electronic equipment of caloric value, and use fan also can bring a lot of harmful effects to electronic equipment:, operating noise not high as fan life greatly, easily by the dust influence etc.
The mode of liquid cooling is to adopt the cooling fluid of liquid as heat transfer medium, takes away the heat of device by the continuous circulation of cooling fluid, because the capacity of heat transmission of liquid is generally far above air, radiating effect is more a lot of than air-cooled raising; The liquid cooling technology generally is made up of cooling fluid, pump, fluid reservoir, radiator, refrigerating head, pipeline etc.Rely on circulating pump to flow through device surface to be cooled by cooling fluid, cooling fluid absorbs the rising of heat temperature and takes away heat, and these heats arrive surrounding environment by heat sink again, and the cooling fluid after temperature reduces is recycled to the heater members surface, so constantly circulates.Be illustrated in figure 1 as the liquid cooling apparatus that is used in the computer, mainly constitute, utilize liquid to be under the effect of water pump, the circulate device of heat radiation of heat eliminating medium by CPU heat conduction 1, liquid reserve tank 2, water pump 3 and radiator 4.But problems such as the electronic equipment that uses in actual applications, liquid cooling system should not store, inconvenience transportation; The refrigerating head of liquid cooling system is limited, can only cool off the highest critical component of heating in the system, and other devices still will lean on air cooling, occur the situation of local overheating easily.
From above-mentioned introduction to the various radiating modes that use the existing electronic equipment and pairing concrete technology, the inventor finds that there is following problem at least in above-mentioned prior art:
(1) because air blast cooling mainly uses air as heat transfer medium, and the capacity of heat transmission of air is low, causes radiating effect bad, can't solve the heat dissipation problem of the bigger electronic equipment of caloric value;
And owing to use fan to bring a lot of harmful effects to electronic equipment:, operating noise not high as fan life greatly, easily by the dust influence etc.;
(2) liquid-cooling system that uses in the liquid cooling radiating mode constitutes complicated, and reliability is lower;
The refrigerating head of liquid cooling system is limited, can only cool off the highest critical component of heating in the system, and other devices still will lean on air cooling, occur the situation of local overheating easily; And be difficult to use in occasion narrow and small in the space, that use flexible PCB;
(3) and all there is common shortcoming in above-mentioned several forced refrigeration heat dissipation technologys: increased energy consumption, system complex, be prone to problems such as dewfall, frosting, can only cool off the highest critical component of heating in the system, other devices still will lean on air cooling, occur the situation of local overheating easily; And occasion narrow and small in the space, that use flexible PCB is difficult to use.
Summary of the invention
Embodiment of the present invention provides a kind of heat abstractor and uses its electronic equipment, this heat abstractor passes through to use the heat conduction with phase change medium of good heat conduction effect as transmitting medium, can all devices that cover be dispelled the heat, solved shortcomings such as existing radiating mode can only dispel the heat to certain device, inconvenience transportation storage.
A kind of heat abstractor, this device comprises:
Housing and heat conduction with phase change medium, the heat conduction with phase change medium is filled with in housing, and described electronic building brick is wrapped in the interior heat conduction with phase change medium of described housing.
A kind of electronic equipment of using above-mentioned heat abstractor is characterized in that this electronic equipment is provided with above-mentioned heat abstractor.
The technical scheme that provides by the invention described above embodiment as can be seen, embodiment of the present invention is by being provided with the heat conduction with phase change medium in housing, and circuit board that will be to be dispelled the heat or parts are wrapped to be arranged in the heat conduction with phase change medium and dispel the heat.This heat abstractor directly covers all devices on the circuit, and area of dissipation is big, and the capacity of heat transmission is strong, effectively eliminates the phenomenon of local overheating; Cut down the consumption of energy, avoid dust, corrosion, be convenient to store transportation.
Description of drawings
The structural representation of the liquid-cooling heat radiator that Fig. 1 provides for prior art;
Fig. 2 is the structural representation of the heat abstractor of the embodiment of the invention one;
Fig. 3 is the structural representation of the heat abstractor of the embodiment of the invention two.
Embodiment
Embodiment of the present invention provides a kind of heat abstractor, can be used on the various electronic equipments electronic building bricks such as wherein circuit board or device are dispelled the heat, this heat abstractor mainly is that the heat conduction with phase change medium is set in housing, electronic building bricks such as circuit board to be dispelled the heat or device are wrapped in dispel the heat in the heat conduction with phase change medium, if the heat conduction with phase change medium is conduction phase transformation heat-conducting medium, then the insulating heat-conductive coating is set, when guaranteeing heat radiation, also guarantees the electric property safety of each parts at circuit board to be dispelled the heat or device surface covering.This heat abstractor uses the high liquid of the capacity of heat transmission as the heat radiation media, and can all cover circuit board to be dispelled the heat or device, and it is dispelled the heat, can reach better radiating effect, and simple in structure, cut down the consumption of energy, occasion narrow and small in the space, that use flexible PCB also can normally be used.
For ease of understanding, describe below in conjunction with the drawings and specific embodiments.
Embodiment one
Present embodiment provides a kind of heat abstractor 20, can be used for various electronic equipments circuit board in it or device are dispelled the heat.
As shown in Figure 2, this heat abstractor 20 comprises a housing 24, described housing 24 and its inner receiving space that forms.This receiving space is to be used to accommodate electronic building brick to be dispelled the heat 23.Also be filled with heat conduction with phase change medium 21 in the described housing 24.Wherein, described electronic building brick 23 can be circuit board or other electronic device.Housing 24 can adopt the material preparation of good heat conductivity such as metal.In actual applications, when described heat conduction with phase change medium 21 was conductive material, the surface of described electronic building brick 23 need coat one deck insulating heat-conductive coating 22, when both guaranteeing electronic building brick 23 heat radiations, had guaranteed the operate as normal of electronic building brick 23 again.
In an embodiment, above-mentioned heat conduction with phase change medium 21 employing fusing points are in the liquid metal between general environment temperature and the equipment normal working temperature.That is to say that described at normal temperatures heat conduction with phase change medium 21 is solid-state.And when the temperature of electronic building brick to be dispelled the heat 23 rose and reaches the fusing point of described heat conduction with phase change medium, the heat conduction with phase change medium 21 around the described electronic building brick 23 became liquid state.In actual applications, need to select different heat conduction with phase change media 21 for use according to the need of work of electronic building brick 23 to be dispelled the heat, as selecting the bismuth tin-indium alloy for use, its fusing point is 62 ℃, or wood metal, and its fusing point is 70 ℃.Certainly, as required, described heat conduction with phase change medium 21 can be selected under the normal temperature material for solid or liquid for use, and the maximum operating temperature that can bear that only needs fusing point, boiling point or the gasification point of the material of described solid or liquid to be lower than electronic building brick described to be dispelled the heat 23 gets final product.Certainly, when filling heat conduction with phase change medium 21 in housing 24, described heat conduction with phase change medium 21 needs to fill with the form of liquid state or gaseous state, and considers that the volume that curing or liquefaction can cause increases, so also need reserve enough spaces in the housing 24.Become liquid state and fill as the heat conduction with phase change medium being heated to 70 ℃, 70 ℃ to general electronic device without any influence, the SMT hot air reflux weldering of generally welding each electronic device can be heated to more than 200 ℃, electronic device all can tolerate.
During use, electronic building brick 23 to be dispelled the heat is wrapped in the housing heat conduction with phase change medium 21 in the housing 24, when the temperature of electronic building brick to be dispelled the heat 23 rises and reaches the fusing point of heat conduction with phase change medium 21, distribute after by heat conduction with phase change medium 21 the circuit heat being directly transferred to housing.Wherein, housing 24 also can be to be used to accommodate the housing of electronic building brick 23 in the housing of electronic equipment or the equipment, as long as can storE the heat conduction with phase change medium of the liquid state of heat radiation.
Wherein, the insulating heat-conductive coating can adopt insulating heat-conductive layer of silica gel or the similar coating that is sprayed by insulation and the strong material of thermal conductivity.In the present embodiment, heat conduction with phase change medium 21 also can adopt the suitable phase-change material of other fusing points or boiling point (PCM) to substitute, as: the inorganic hydrated salt material that fusing point is suitable, when adopting the phase-change material of good insulation preformance, can remove from above-mentioned in the process for the treatment of cooling circuit board or parts surface coating insulating heat-conductive layer, can between housing 24 and electronic building brick 23, directly fill the phase-change material that insulate and finish heat radiation as heat-conducting medium.Other structure of this heat abstractor is with embodiment one.In the present embodiment, the heat conduction with phase change medium still adopts liquid metal, guaranteeing not cause under the prerequisite of short circuit, only the current-carrying part on electronic building brick surface to be dispelled the heat applies the insulating heat-conductive layer, be formed on the mode of electronic building brick surface uplifting window, liquid metal is directly contacted with the insulated part of device, improve thermal conduction effect.Other structure of this heat abstractor is with embodiment one.
In sum, fill the heat conduction with phase change medium between electronic building brick to be dispelled the heat in the housing and the housing by being arranged in the embodiment of the invention, make the electronic building brick in the housing be wrapped in heat conduction with phase change medium formation heat abstractor.Because this heat abstractor adopts electronic building brick to be wrapped in the interior mode of heat conduction with phase change medium, thereby has very big area of dissipation, guarantees radiating effect.And all electronic building bricks that need dispel the heat are all wrapped up by the heat conduction with phase change medium on the circuit, can effectively eliminate the phenomenon of local overheating if select the heat conduction with phase change medium of suitable fusing point, and then this heat conduction with phase change medium can be convenient to store transportation for solid-state under the normal temperature; And this heat abstractor makes electronic building brick to be dispelled the heat and outside air thoroughly isolated, can avoid problems such as dust, corrosion; This heat abstractor is whole to be constituted simply, does not need complicated mechanism.
Embodiment two
As shown in Figure 3, the embodiment of the invention two also provides a kind of heat abstractor 30, and described heat abstractor 30 comprises housing 34 and is contained in electronic building brick 33 in the described housing 34; Be filled with heat conduction with phase change medium 31 in the described housing 24; The surface of described electronic building brick 33 is provided with insulating heat-conductive coating 32, something in common among this heat abstractor and the embodiment one is omitted explanation, and the heat abstractor 30 of the embodiment of the invention two is with the difference of the foregoing description one: described heat abstractor 30 comprises that also one is installed in coupling assembling 35 on the housing 34, an and interconnecting part 36 that is installed on the housing 34.The described electronic building brick 33 that is contained in the described housing 34 electrically connects with described coupling assembling 35, and electrically connects by the external circuit or the electronic component of described coupling assembling 35 with heat abstractor 30.Described interconnecting part 36 seals in the normal state, but and the described housing 34 of conducting inside and outside in use, thereby be used for injecting heat conduction with phase change medium 31 to described housing 34, and when needed, described heat conduction with phase change medium 31 also can be discharged by interconnecting part 36, and in the present embodiment, described interconnecting part 36 is a valve, in other alternate embodiments, described interconnecting part 36 also can be air valve, piston or is installed in valve on the housing 34 etc.In embodiments of the present invention, but described coupling assembling 35 can be plug-in connector spares such as slot.Thereby in actual applications, only need heat conduction with phase change medium 31 gasifications in the housing 34 or liquefaction can to realize replacing and maintenance after after interconnecting part 36 discharges, housing 34 is opened for electronic building brick 33.
In the present embodiment, described interconnecting part 36 can be used for injecting or discharging heat conduction with phase change medium 31, and in other embodiments, heat abstractor 30 of the present invention also can comprise a plurality of interconnecting parts 36, thereby described a plurality of interconnecting part 36 can be arranged at certain location as required on housing 34, such as the top and the bottom of housing 34, so that be used for respectively injecting or discharge heat conduction with phase change medium 31.
To sum up, the embodiment of the invention two has common technical characterictic with embodiment one, can reach similar technique effect.
What easily full of beard reached is, the housing of heat abstractor of the present invention can be regarded as a housing of having used the electronic equipment of heat abstractor of the present invention, and the electronic building brick of described electronic equipment internal is set in the described housing, and be filled with the heat conduction with phase change medium in the heat abstractor of the present invention in the described housing, be used to the electronic building brick of electronic equipment internal that heat radiation is provided.And the housing of described electronic equipment also can be equiped with coupling assembling and interconnecting part on the housing of heat abstractor of the present invention, under the prerequisite that guarantees electronic equipment dissipating heat, is convenient to use, debugging and the maintenance of electronic equipment again.
Above-described each embodiment is for technical scheme of the present invention is described, the orbution before and after not having between each embodiment, and do not cause restriction because of the sequence number of each embodiment.And each embodiment only is the preferable embodiment of the present invention; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses, the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of claim.
Claims (9)
1, a kind of heat abstractor is used to electronic building brick that heat radiation is provided, and it is characterized in that, this device comprises:
Housing and heat conduction with phase change medium, the heat conduction with phase change medium is filled with in housing, and described electronic building brick is wrapped in the interior heat conduction with phase change medium of described housing.
2, heat abstractor according to claim 1 is characterized in that, described heat conduction with phase change medium is to be solid-state liquid metal under the normal temperature, and the electronic building brick to be dispelled the heat of surface coverage insulating heat-conductive coating is wrapped and is arranged in the interior liquid metal of housing.
3, heat abstractor according to claim 2 is characterized in that, described heat conduction with phase change medium is bismuth tin-indium alloy or wood metal.
4, heat abstractor according to claim 1 and 2 is characterized in that, the electronic building brick to be dispelled the heat of described surface coverage insulating heat-conductive coating covers the insulating heat-conductive coating for the current-carrying part on electronic building brick surface to be dispelled the heat.
5, heat abstractor according to claim 4 is characterized in that, described insulating heat-conductive coating is the insulating heat-conductive layer of silica gel.
6, heat abstractor according to claim 1 is characterized in that, described heat conduction with phase change medium is insulation heat conduction with phase change medium, and electronic building brick to be dispelled the heat is wrapped in the interior insulation heat conduction with phase change medium of housing.
7, heat abstractor according to claim 1, it is characterized in that, described heat abstractor also comprises the coupling assembling that is arranged on the described housing, described coupling assembling is used to be provided with the described electronic building brick in the described housing, and electrically connects with described electronic building brick and external circuit or electronic component respectively;
Be communicated with enclosure interior under the described interconnecting part opening, the described housing of conducting inside and outside is used for injecting in the described housing or deriving the heat conduction with phase change medium.
8, heat abstractor according to claim 1 is characterized in that, described heat abstractor also comprises interconnecting part, is used for the inside and outside of under the opening described housing of conducting, is convenient to the injection and the derivation of heat conduction with phase change medium.
9, a kind of electronic equipment of using above-mentioned heat abstractor is characterized in that, this electronic equipment is provided with each described heat abstractor in the aforesaid right requirement 1～8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810098140 CN101588707A (en) | 2008-05-19 | 2008-05-19 | Heat abstractor and electric device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810098140 CN101588707A (en) | 2008-05-19 | 2008-05-19 | Heat abstractor and electric device using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101588707A true CN101588707A (en) | 2009-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810098140 Pending CN101588707A (en) | 2008-05-19 | 2008-05-19 | Heat abstractor and electric device using same |
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| Country | Link |
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| CN (1) | CN101588707A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169856A (en) * | 2010-01-29 | 2011-08-31 | 日东电工株式会社 | Heat dissipation structure body |
| CN102440090A (en) * | 2011-09-23 | 2012-05-02 | 华为技术有限公司 | Immersion type cooling system and method |
| CN105338788A (en) * | 2015-10-30 | 2016-02-17 | 重庆帕特龙智通电子科技有限公司 | High-power electronic equipment heat radiation structure |
| CN105674781A (en) * | 2016-01-14 | 2016-06-15 | 南京净环热冶金工程有限公司 | Novel low temperature heat accumulator element |
| CN106413371A (en) * | 2016-11-30 | 2017-02-15 | 依偎科技（南昌）有限公司 | Mobile terminal and preparation method thereof |
| CN106931382A (en) * | 2017-03-29 | 2017-07-07 | 华南理工大学 | A kind of heat dissipation element for LED car lamp and preparation method thereof |
| JP2017163012A (en) * | 2016-03-10 | 2017-09-14 | 富士通株式会社 | Electronic device |
| CN108336047A (en) * | 2018-01-18 | 2018-07-27 | 上海理工大学 | A kind of device carrying out electronic element radiating using phase change heat storage material |
| CN109074140A (en) * | 2016-04-14 | 2018-12-21 | 微软技术许可有限责任公司 | Passive heat pipe with phase-change material manages system |
| CN111234781A (en) * | 2020-01-19 | 2020-06-05 | 广州视源电子科技股份有限公司 | Heat-conducting and heat-storing phase change plate and preparation method thereof |
| CN113644384A (en) * | 2020-04-27 | 2021-11-12 | 比亚迪股份有限公司 | Copper bar protection structure, battery package and electric automobile |
| CN116449927A (en) * | 2023-03-24 | 2023-07-18 | 南方电网大数据服务有限公司 | Liquid cooling radiator of server |
-
2008
- 2008-05-19 CN CN 200810098140 patent/CN101588707A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169856A (en) * | 2010-01-29 | 2011-08-31 | 日东电工株式会社 | Heat dissipation structure body |
| CN102169856B (en) * | 2010-01-29 | 2015-06-24 | 日东电工株式会社 | Heat dissipation structure body |
| CN102440090A (en) * | 2011-09-23 | 2012-05-02 | 华为技术有限公司 | Immersion type cooling system and method |
| WO2012149768A1 (en) * | 2011-09-23 | 2012-11-08 | 华为技术有限公司 | Submerged cooling system and method |
| CN105338788A (en) * | 2015-10-30 | 2016-02-17 | 重庆帕特龙智通电子科技有限公司 | High-power electronic equipment heat radiation structure |
| CN105674781A (en) * | 2016-01-14 | 2016-06-15 | 南京净环热冶金工程有限公司 | Novel low temperature heat accumulator element |
| JP2017163012A (en) * | 2016-03-10 | 2017-09-14 | 富士通株式会社 | Electronic device |
| CN109074140A (en) * | 2016-04-14 | 2018-12-21 | 微软技术许可有限责任公司 | Passive heat pipe with phase-change material manages system |
| CN109074140B (en) * | 2016-04-14 | 2021-09-14 | 微软技术许可有限责任公司 | Passive thermal management system with phase change material |
| CN106413371A (en) * | 2016-11-30 | 2017-02-15 | 依偎科技（南昌）有限公司 | Mobile terminal and preparation method thereof |
| CN106931382A (en) * | 2017-03-29 | 2017-07-07 | 华南理工大学 | A kind of heat dissipation element for LED car lamp and preparation method thereof |
| CN108336047A (en) * | 2018-01-18 | 2018-07-27 | 上海理工大学 | A kind of device carrying out electronic element radiating using phase change heat storage material |
| CN111234781A (en) * | 2020-01-19 | 2020-06-05 | 广州视源电子科技股份有限公司 | Heat-conducting and heat-storing phase change plate and preparation method thereof |
| CN113644384A (en) * | 2020-04-27 | 2021-11-12 | 比亚迪股份有限公司 | Copper bar protection structure, battery package and electric automobile |
| CN116449927A (en) * | 2023-03-24 | 2023-07-18 | 南方电网大数据服务有限公司 | Liquid cooling radiator of server |
| CN116449927B (en) * | 2023-03-24 | 2024-03-22 | 南方电网大数据服务有限公司 | Liquid cooling radiator of server |
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