TW201913027A - Heat dissipation structure and manufacturing method thereof - Google Patents

Abstract

A heat dissipation structure includes a metal housing. The metal housing includes a cavity and an opening. The heat dissipation structure further includes a heat conductive and heat storage composite, and a sealing portion. The heat conductive and heat storage composite fills in the cavity. The sealing portion is filled in the opening, to seal the opening, thus to seal the heat conductive and heat storage composite in the cavity. A method for making the heat dissipation structure is also provided.

Description

Radiating structure and manufacturing method thereof

The invention relates to a heat dissipation structure and a manufacturing method of the heat dissipation structure.

In the era of big data, with the miniaturization and high integration of electronic devices such as mobile phones and smart watches, the demand for cooling of electronic devices is also increasing. At present, graphite sheets are mostly used as heat dissipation structures to dissipate electronic devices. Although graphite sheets have high thermal conductivity, they cannot fully meet the heat dissipation requirements of electronic devices. Heat pipes are widely used for heat dissipation of computers or light emitting diodes (LEDs), but the thickness of heat pipes is not suitable for miniaturized electronic equipment. Phase change materials can also be used to dissipate heat from electronic devices. Phase change materials can overcome the above disadvantages of graphite sheets and heat pipes. However, it is well known that the thermal conductivity of phase change materials is too low, which seriously affects their use in electronic devices. application.

In view of this, it is necessary to provide a new heat-conducting and heat-storing composite material with a heat dissipation structure to solve the above problems.

In addition, it is necessary to provide a method for manufacturing the heat dissipation structure.

A heat dissipation structure includes a metal shell, the metal shell is formed with a cavity and an opening, the heat dissipation structure further comprises a thermally conductive heat storage composite material and a sealing portion, and the thermally conductive heat storage composite material is filled in the cavity, and the sealing portion It is arranged at the opening for sealing the opening to encapsulate the thermally conductive heat storage composite material in the cavity.

A method for manufacturing a heat dissipation structure includes the following steps:

Step S1, providing a metal sheet having a pair of folded surfaces;

Step S2: apply conductive adhesive to the periphery of the folded surface of the metal sheet;

Step S3, printing a thermally conductive heat storage composite material on an area of the metal sheet that is not coated with a conductive adhesive;

Step S4: baking the conductive adhesive and the heat-conducting heat-storing composite material combined on the folded surface of the metal sheet;

In step S5, the baked metal sheets are folded and pressed in half, so that the conductive adhesives on the folded sheets are correspondingly bonded together to form a sealing portion, and the heat-conducting heat storage composite materials on the folded sheets are pressed together, and the metal sheets are transformed. It is a metal shell with a cavity, and the thermally conductive heat storage composite material is sealed in the cavity by a sealing portion.

The heat dissipation structure of the present invention includes a thermally conductive heat storage composite material. The thermally conductive heat storage composite material includes a phase change thermal storage material, a high thermal conductivity material, and an auxiliary agent. The thermally conductive heat storage composite material has a higher thermal conductivity than a phase change material. The thermally conductive heat storage composite material also has high stability and leveling. The heat-conducting heat-storage composite material also has good printability and can be quickly mass-produced, and is especially suitable for small and thin electronic products. The heat dissipation structure made of the heat-conducting heat-storage composite material of the present invention has good heat dissipation effect, and can be used for heat dissipation of electronic components in electronic equipment.

In the following, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of them.

Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without making creative efforts fall within the protection scope of the present invention.

All technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the invention. The terms used herein in the description of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention.

Please refer to FIGS. 1-5 in combination. A preferred embodiment of the present invention provides a method for manufacturing a heat dissipation structure 100, which includes the following steps:

Step S1, referring to FIG. 1, a thin metal plate 110 is provided. The thin metal plate 110 has a pair of folded surfaces 111.

The metal sheet 110 may be a metal foil. The material of the thin metal plate 110 is a metal having good thermal conductivity such as copper.

In step S2, referring to FIG. 2, a conductive adhesive 120 is coated on the periphery of the folded surface 111 of the metal sheet 110.

In step S3, please refer to FIG. 3, and print a thermally conductive heat storage composite material 20 on the area of the folded surface 111 of the metal sheet 110 where the conductive adhesive 120 is not coated.

Preferably, the thickness of the thermally conductive heat storage composite material 20 is equal to or slightly smaller than the thickness of the conductive adhesive 120.

The heat-conducting heat-storage composite material includes a phase-change heat-storage material, a highly thermally-conductive material, and an auxiliary agent. The auxiliary agent is one or two of an anti-settling agent and a dispersant.

In the thermally conductive heat storage composite material, the content of the phase change heat storage material is 20 to 80 parts by weight, the content of the highly thermally conductive material is 0.5 to 20 parts by weight, and the content of the auxiliary agent is 0.2 to 10 parts by weight.

The phase change heat storage material may be an organic phase change material, an inorganic phase change material, or a composite phase change material. The inorganic phase change material may be one or more of crystalline hydrated salt phase change material, molten salt phase change material, metal phase change material, and alloy phase change material. The organic phase change material includes, but is not limited to, one or more of paraffin, acetic acid, polyethylene glycol (PEG), and fatty acids.

The highly thermally conductive material is carbon nanotubes or carbon fibers.

The anti-settling agent includes, but is not limited to, thickened hydrophobic silica (Japan Fuji SYL350), super hydrophobic silica (Japan Fuji SYL200), hydrophobic silica white powder (Japan Fuji SYLOMASK), gas phase method Hydrophobic silica white powder (anti-settling agent R 972), new organic bentonite gray-white micro powder (anti-settling agent Benathix), thickened hydrophobic silica (Japan Fuji SYL310 P), micro-hydrophilic silica (anti-settling Agent EH-5). The anti-settling agent can make the heat conductive heat storage composite material thixotropic, and can improve the viscosity of the heat conductive heat storage composite material.

The dispersant includes, but is not limited to, an inorganic thickener-based dispersant, a cellulose ether-based dispersant, a natural polymer and its derivative-based dispersant, a synthetic polymer-based dispersant, and a complex-type organometallic compound-based dispersion. One or more of the agents. The inorganic thickener-based dispersant includes one or more of fumed silica, sodium bentonite, organic bentonite, diatomaceous earth, attapulgite, molecular sieve, and silica gel. The cellulose ether dispersant includes, but is not limited to, one or more of methyl cellulose, hydroxypropyl methyl cellulose, sodium carboxymethyl cellulose, and hydroxyethyl cellulose. The natural polymer and its derivative dispersants include, but are not limited to, starch, gelatin, sodium alginate, casein, guar gum, chitin, acacia gum, xanthan gum, soybean protein gum, and natural rubber. One or more. The synthetic polymer-based dispersant includes, but is not limited to, polypropylene amide, polyvinyl alcohol, polyvinyl pyrrolidone, polyethylene oxide, modified paraffin resin, carbomer resin, polyacrylic acid, polyacrylate copolymer emulsion, and butadiene rubber. One or more of styrene-butadiene rubber, polyurethane, modified polyurea, low molecular polyethylene wax, dispersant 2155 and dispersant 9076. The complex-type organometallic compound-based dispersant may be an amino alcohol complex-type titanate. The dispersant can refine the particles of the heat conductive heat storage composite material and improve the dispersibility of the heat conductive heat storage composite material.

The thermally conductive heat storage composite material has a higher thermal conductivity than a phase change material. The addition of the dispersant and the anti-settling agent can make the thermally conductive heat storage composite material also have higher stability and leveling.

In step S4, the conductive adhesive 120 and the heat-conducting heat-storage composite material 20 combined on the folded surface 111 of the metal sheet 110 are baked.

Preferably, the baking temperature is 160 ° C. and the baking time is 10 min.

In step S5, please refer to FIGS. 4 to 5 further, fold and press the baked metal sheet 110 in half, so that the conductive adhesive 120 on the folded surface 111 is correspondingly bonded together to form a sealing portion 30, so that the heat conductive storage on the folded surface 111 is performed. The thermal composite material is pressed together correspondingly. The metal thin plate 110 is converted into a metal shell 10 having a cavity 11. The thermally conductive heat storage composite material 20 is sealed in the cavity 11 by a sealing portion 30 to obtain a heat dissipation structure 100.

A heat dissipation structure 100 is substantially flat. The heat dissipation structure 100 includes a metal case 10, a thermally conductive heat storage composite material 20, and a sealing portion 30. The metal casing 10 is formed with a cavity 11 and an opening 12. The thermally conductive heat storage composite material 20 is filled in the cavity 11. The sealing portion 30 is disposed at the opening 12 and is used to seal the opening 12 so as to encapsulate the thermally conductive heat storage composite material 20 in the cavity 11.

The metal casing 10 is formed by folding a metal foil in half. The material of the metal case 10 is a metal with good thermal conductivity such as copper.

The material of the sealing portion 30 is a conductive adhesive. The use of a conductive adhesive to seal the heat-conducting heat-storage composite material 20 can effectively reduce electromagnetic interference of the heat dissipation structure 100.

Hereinafter, the present invention will be specifically described by using examples.

Example 1

The heat-conducting heat-storage composite material in the heat dissipation structure 100 of this embodiment is prepared from CTA, carbon nanotubes, polyethylene glycol 1000, and dispersant 2155.

Among them, the mass of CTA is 44.42 g, the mass of carbon nanotubes is 2.94 g, the mass of polyethylene glycol 1000 is 50.69, and the mass of dispersant 2155 is 1.96 g.

The dispersibility test was performed on the thermally conductive heat storage composite material of this embodiment. The method of the dispersibility test is: the particle size of the thermally conductive heat storage composite material is measured by a fineness meter, and the smaller the particle size, the better the dispersion type. The test result is that the particle size of the thermally conductive heat storage composite material of this embodiment is less than 15 μm.

Example 2

The heat-conducting heat-storage composite material in the heat-dissipating structure 100 of this embodiment is prepared from CTA, carbon fiber, polyethylene glycol 1000, and anti-settling agent EH-5.

Among them, the mass of CTA is 45.3g, the mass of carbon fiber is 6.00g, the mass of polyethylene glycol 1000 is 46.7g, and the mass of anti-settling agent EH-5 is 2.00g.

The dispersibility test was performed on the thermally conductive heat storage composite material of this embodiment. The test result is that the particle size of the thermally conductive heat storage composite material of this embodiment is less than 10 μm.

Example 3

The heat-conducting heat-storage composite material in the heat-dissipating structure 100 of this embodiment is prepared from CTA, carbon fiber, polyethylene glycol 1000, and dispersant 9076.

Among them, the mass of CTA is 45.30 g, the mass of carbon fiber is 6.00 g, the mass of polyethylene glycol 1000 is 46.70, and the mass of dispersant 9076 is 2.00 g.

The dispersibility test was performed on the thermally conductive heat storage composite material of this embodiment. The test result is that the particle size of the thermally conductive heat storage composite material of this embodiment is less than 10 μm.

Example 4

The heat-conducting heat-storage composite material in the heat-dissipating structure 100 of this embodiment is prepared from CTA, carbon fiber, polyethylene glycol 1000, and dispersant 2155.

Among them, the mass of CTA is 44.42 g, the mass of carbon fiber is 5.88 g, the mass of polyethylene glycol 1000 is 45.79, and the mass of dispersant 2155 is 3.92 g.

The dispersibility test was performed on the thermally conductive heat storage composite material of this embodiment. The test result is that the particle size of the thermally conductive heat storage composite material of this embodiment is less than 7 μm.

Example 5

The heat-conducting heat-storage composite material in the heat-dissipating structure 100 of this embodiment is prepared from CTA, carbon fiber, polyethylene glycol 1000, and dispersant 2155.

Among them, the mass of CTA is 44.42 g, the mass of carbon fiber is 2.94 g, the mass of polyethylene glycol 1000 is 50.69, and the mass of dispersant 2155 is 1.96 g.

The dispersibility test was performed on the thermally conductive heat storage composite material of this embodiment. The test result is that the particle size of the thermally conductive heat storage composite material of this embodiment is less than 7 μm.

Comparative example

The metal case 10 in the heat dissipation structure in this comparative example is filled with a phase change material polyethylene glycol 1000.

Please refer to FIG. 6 further. The heat dissipation structure 100 of the fourth embodiment and the heat dissipation structure (not shown) of the comparative example are placed on the surface of the working battery 200 to dissipate the battery 200. The working voltage of the battery 200 is 1.92. V, working current is 0.80A. The temperatures of the four positions A, B, C, and D of the two heat dissipation structures are measured, and the temperatures T ₁ , T ₂ , T ₃ , and T _{4 of the} four positions of A, B, C, and D are obtained, respectively. The test results are shown in Table 1 below. Table I:

As can be seen from the above table, when the same electronic component is radiated, the surface temperature of the heat dissipation structure 100 made of the thermally conductive heat storage composite material of the present invention is lower than the surface temperature of the heat dissipation structure made of the phase change material polyethylene glycol. It can be seen that the heat dissipation structure 100 made of the thermally conductive heat storage composite material of the present invention has better heat dissipation effect.

The heat dissipation structure 100 of the present invention includes a thermally conductive heat storage composite material. The thermally conductive heat storage composite material includes a phase change thermal storage material, a highly thermally conductive material, and an auxiliary agent. The thermally conductive heat storage composite material has a higher thermal conductivity than a phase change material. The thermally conductive heat storage composite material also has high stability and leveling. The heat-conducting heat-storage composite material also has good printability and can be quickly mass-produced, and is especially suitable for small and thin electronic products. The heat dissipation structure 100 made of the heat-conducting and heat-storing composite material of the present invention has a good heat dissipation effect, and can be used for heat dissipation of electronic components in electronic equipment.

In addition, the above are only preferred embodiments of the present invention, and are not a limitation on the present invention in any form. Although the present invention has disclosed the preferred embodiments as above, it is not intended to limit the present invention and anyone familiar with the profession Without departing from the scope of the technical solution of the present invention, those skilled in the art can use the disclosed technical content to make a few changes or modify equivalent implementations of equivalent changes. Anyone who does not depart from the technical solution of the present invention, according to the present invention Any simple modifications, equivalent changes, and modifications made to the above embodiments by the technical essence of the invention still fall within the scope of the technical solution of the present invention.

100‧‧‧Heat dissipation structure

10‧‧‧ metal case

11‧‧‧ Cavity

12‧‧‧ opening

20‧‧‧ thermally conductive heat storage composite material

30‧‧‧Sealing Department

110‧‧‧Metal sheet

111‧‧‧ Half-Fold

120‧‧‧Conductive adhesive

200‧‧‧ battery

FIG. 1 is a plan view of a metal sheet according to the present invention.

FIG. 2 is a schematic diagram of applying a conductive adhesive on the periphery of the folded surface of the metal sheet shown in FIG. 1.

FIG. 3 is a schematic diagram of filling a region of the metal foil shown in FIG. 2 where the conductive adhesive is not applied to the area where the conductive adhesive is not applied, to fill the thermally conductive heat storage composite material.

FIG. 4 is a perspective view of a heat dissipation structure according to a preferred embodiment of the present invention.

5 is a schematic cross-sectional view of the heat dissipation structure shown in FIG. 4 along the V-V direction.

FIG. 6 is a schematic diagram of heat dissipation of a battery by a heat dissipation structure.

Claims (10)

A heat dissipation structure includes a metal shell formed with a cavity and an opening. The improvement is that the heat dissipation structure further includes a thermally conductive heat storage composite material and a sealing portion, and the thermally conductive heat storage composite material is filled in the cavity. The sealing portion is disposed at the opening, and is used for sealing the opening to encapsulate the heat-conducting heat-storage composite material in the cavity. The heat dissipation structure according to item 1 of the scope of patent application, wherein the metal casing is formed by folding a metal foil in half. The heat dissipation structure according to item 1 of the scope of patent application, wherein the material of the sealing portion is a conductive adhesive. The heat dissipation structure according to item 1 of the scope of the patent application, wherein the thermally conductive heat storage composite material includes a phase change heat storage material, a highly thermally conductive material, and an auxiliary agent, and the auxiliary agent is one of an anti-settling agent and a dispersant or Both. The heat dissipation structure according to item 4 of the scope of patent application, wherein the content of the phase change heat storage material in the thermally conductive heat storage composite material is 20 to 80 parts by weight, and the content of the high thermal conductivity material is 0.5 to 20 parts by weight. The content of the auxiliary is 0.2 to 10 parts by weight. The heat dissipation structure according to item 4 of the scope of the patent application, wherein the anti-settling agent includes thickened hydrophobic silicon dioxide, superhydrophobic silicon dioxide, hydrophobic silica white powder, and gas phase method hydrophobic two One or more of silica white powder, new organic bentonite gray white powder, thickened hydrophobic silica, and slightly hydrophilic silica; the dispersant includes inorganic thickener dispersant, cellulose ether dispersant One or more of a dispersant, a natural polymer and its derivative-based dispersant, a synthetic polymer-based dispersant, and a complex organic metal compound-based dispersant. A method for manufacturing a heat dissipation structure includes the following steps: Step S1, providing a metal sheet having a pair of folded surfaces; Step S2, applying conductive adhesive to the periphery of the folded surface of the metal sheet; Step S3, Step S4: baking the conductive adhesive and the heat-conductive heat storage composite material combined with the folded surface of the metal sheet; and step S5: After baking, the metal sheets are folded in half and pressed together, so that the conductive adhesives on the folded sides are correspondingly bonded together to form a sealed portion, and the heat-conducting heat storage composite material on the folded sides is pressed together accordingly. The metal sheet is converted into a cavity. Metal shell, the heat-conducting heat-storage composite material is sealed in the cavity by the sealing portion. The method for manufacturing a heat dissipation structure according to item 7 in the scope of the patent application, wherein the thermally conductive heat storage composite material includes a phase change heat storage material, a highly thermally conductive material, and an auxiliary agent, and the auxiliary agent is an anti-settling agent and a dispersant. One or two. The manufacturing method of the heat dissipation structure according to item 8 of the scope of the patent application, wherein the content of the phase-change heat storage material in the thermally conductive heat storage composite material is 20 to 80 parts by weight, and the content of the high heat conductive material is 0.5 to 20 The content of the auxiliary is 0.2 to 10 parts by weight. The method for manufacturing a heat dissipation structure according to item 8 of the scope of the patent application, wherein the anti-settling agent includes thickened hydrophobic silica, superhydrophobic silica, hydrophobic silica white powder, and gas phase method One or more of hydrophobic silica white powder, new organic bentonite off-white fine powder, thickened hydrophobic silica, and slightly hydrophilic silica; the dispersant includes inorganic thickener dispersant, cellulose One or more of an ether-based dispersant, a natural polymer and its derivative-based dispersant, a synthetic polymer-based dispersant, and a complex-type organometallic compound-based dispersant.