CN109362217B - Electronic device and electronic device processing method - Google Patents

Electronic device and electronic device processing method Download PDF

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Publication number
CN109362217B
CN109362217B CN201811161186.3A CN201811161186A CN109362217B CN 109362217 B CN109362217 B CN 109362217B CN 201811161186 A CN201811161186 A CN 201811161186A CN 109362217 B CN109362217 B CN 109362217B
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China
Prior art keywords
electronic device
rear cover
conductive layer
electronic
transparent
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CN201811161186.3A
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CN109362217A (en
Inventor
段志远
王伟
伍双杰
李向阳
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Lenovo Beijing Ltd
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Lenovo Beijing Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0045Casings being rigid plastic containers having a coating of shielding material

Abstract

According to the electronic equipment and the processing method thereof, for the transparent electronic equipment rear cover, in order to keep the characteristic of transparent visualization of the transparent electronic equipment rear cover, the shielding cover (non-transparent) of the traditional electronic equipment rear cover is not used any more in the embodiment, but the transparent conducting layer is directly coated on the inner surface of the rear cover body, so that the rear cover has the characteristic of electromagnetic shielding, and the problem that the rear cover of the transparent electronic equipment on the market cannot shield electromagnetic interference affecting antenna signals is solved.

Description

Electronic device and electronic device processing method
Technical Field
The present disclosure relates generally to the field of shield design, and more particularly to an electronic device and a method for processing the electronic device.
Background
With the improvement of the functional requirements of users on the electronic equipment, the requirements on the appearance design of the electronic equipment are higher and higher, and according to the requirements of users, electronic equipment with a rear cover with certain transparency is successively introduced by various large electronic equipment manufacturers.
At present, in order to realize the transparent visualization of the rear cover of the electronic equipment, manufacturers of various large electronic equipment do not perform other special processing on the rear cover of the electronic equipment, so that an antenna signal of the electronic equipment using the transparent rear cover is easily subjected to electromagnetic interference, and the working performance of the electronic equipment is reduced.
Disclosure of Invention
In view of this, the present invention provides an electronic device, a rear cover thereof, and a detection method, in which a transparent conductive layer is coated on a partial area of an inner surface of the rear cover of the transparent electronic device, so that interference of electromagnetic signals on antenna signals is shielded on the premise that a visualization effect of the rear cover of the electronic device is not affected, and communication quality of the electronic device is ensured.
In order to achieve the above object, the present application provides the following technical solutions:
an embodiment of the present invention provides an electronic device, including:
a rear cover made of a transparent material;
and a partial area of the inner surface of the rear cover is coated with a transparent conductive layer.
Optionally, the rear cover is fixed to a housing of the electronic device, and the housing includes a plurality of electronic components;
at least one electronic element is arranged in a projection area of the partial area with the transparent conductive layer on the shell, and a shielding device of the at least one electronic element is the transparent conductive layer, so that the at least one electronic element is directly exposed through the transparent conductive layer and the transparent rear cover.
Optionally, at least one electronic component arranged in the projection area is the electronic device main control chip.
Optionally, the electronic device further includes:
at least one antenna of the electronic device is arranged in a non-projection area of the partial area with the transparent conductive layer on the housing.
Optionally, the non-projection area on the inner surface of the back cover is coated with a transparent insulating layer.
Optionally, the transparent conductive layer is formed by coating a transparent liquid conductive material on the inner surface of the rear cover by using a specific manufacturing process.
Optionally, the transparent conductive layer is made of an Indium Tin Oxide (ITO) material.
Optionally, an induction electrode is disposed in the partial region of the rear cover coated with the transparent conductive layer, and the induction electrode can be up-down correspondingly induced with a touch point of an electronic device user on the outer surface of the rear cover, so that the electronic book device detects touch data of the electronic device user in a projection region of the conductive layer on the outer surface of the rear cover, and executes corresponding operations.
The embodiment of the invention also provides an electronic equipment processing method which is applied to manufacturing process equipment, and the method comprises the following steps:
acquiring position information of a shielding area of the inner surface of a rear cover of electronic equipment to be processed, wherein the shielding area is determined based on the position information of at least one shielding object in the electronic equipment;
and responding to a coating manufacturing instruction, and controlling the manufacturing process equipment to coat a transparent conductive layer on the shielding region based on the position information of the shielding region.
Optionally, the method further includes:
receiving a coating adjusting instruction, and acquiring position information of the electronic equipment after the shielding area of the inner surface of the rear cover of the electronic equipment is adjusted, wherein the coating adjusting instruction indicates that a conductive layer coated on the inner surface of the rear cover of the electronic equipment does not meet the shielding requirement;
and responding to the coating adjusting instruction, and adjusting the position of the transparent conducting layer coated on the inner surface of the back cover of the electronic equipment according to the position information of the adjusted shielding area.
Therefore, compared with the prior art, the application provides the electronic equipment and the processing method thereof, for the transparent electronic equipment rear cover, in order to keep the characteristic of transparent visualization, the shielding cover (non-transparent) of the traditional electronic equipment rear cover is not used any more in the embodiment, but the transparent conducting layer is directly coated on the inner surface of the rear cover body, so that the rear cover has the characteristic of electromagnetic shielding, and the problem that the transparent electronic equipment rear cover in the market cannot shield the electromagnetic interference affecting the antenna signal is solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1a illustrates a schematic view of the mounting of a shielding cage of an electronic device;
FIG. 1b shows a schematic view of the mounting of a shield for another electronic device;
fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another electronic device provided in an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another electronic device provided in an embodiment of the present invention;
fig. 5a is a schematic structural diagram of another electronic device provided in an embodiment of the present invention;
FIG. 5b is a schematic structural diagram of another electronic device provided in an embodiment of the invention;
fig. 6a is a schematic structural diagram of another electronic device provided in an embodiment of the present invention;
FIG. 6b is a schematic structural diagram of another electronic device provided in an embodiment of the invention;
fig. 7 is a flowchart illustrating an electronic device processing method according to an embodiment of the present invention;
fig. 8 is a flowchart illustrating another electronic device processing method according to an embodiment of the present invention.
Detailed Description
The inventors of the present invention found that: for the electronic device with a certain transparency shell which is popular in the market at present, the performance of transmitting and receiving signals of the antenna is often poor, so that the communication quality of the electronic device is influenced.
However, the electromagnetic shielding covers in the market currently adopt the arrangement of the dashed boxes in fig. 1a and 1b to shield the electromagnetic interference generated by the electronic components in the electronic device. As shown in fig. 1a and fig. 1b, the main structure of the electronic device may be schematically configured as a shielding case for each electronic component in the electronic device, that is, a plurality of dashed frames in fig. 1a, or as a shielding case for covering all the electronic components, that is, a dashed frame in fig. 1 b. This just needs to set up at least one shield cover in electronic equipment casing, occupies limited space on the electronic equipment mainboard, is unfavorable for the ultra-thin design theory of electronic equipment, and in electronic equipment use, the shield cover also receives extrusion deformation very easily, can make it lose electromagnetic shielding function even.
In addition, the electromagnetic shielding cover used in the electronic device on the market is often non-transparent, and when the electromagnetic shielding cover is used in the visual electronic device, the technological effect of the visual design of the electronic device is also affected, so that technicians cannot use the shielding cover described above in the electronic device with the transparent shell.
Based on the above-mentioned consideration, in order to solve visual electronic equipment because of electromagnetic interference, and influence its antenna performance, and then reduce its communication quality's problem, also avoid simultaneously occupying the finite space of electronic equipment mainboard, the inventor proposes at the direct coating shielding layer of electronic equipment transparent shell internal surface, no longer sets up the shield cover on the electronic equipment mainboard to make this shielding layer transparentization, accord with the design theory of electronic equipment transparentization, can not influence electronic equipment science and technology and feel.
When the inventor selects the material for manufacturing the shielding layer, the transparent liquid material which is convenient to spray or brush on the surfaces of materials with various shapes to form the electromagnetic shielding conducting layer can be selected through repeated screening tests.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 2, a schematic structural diagram of an electronic device according to an embodiment of the present invention is provided, where the electronic device may be a mobile phone, as shown in fig. 2, or other electronic devices such as a tablet computer, and the present invention does not limit a product type of the electronic device, and as shown in fig. 2, the electronic device may include: a rear cover 11, the rear cover 11 may be made of a transparent material, and a partial area of the inner surface of the rear cover 11 is coated with a transparent conductive layer 12, such as a dotted frame area of the inner surface of the rear case shown in fig. 1, but not limited to the position shown in fig. 1, the conductive layer 12 is coated.
Optionally, the transparent material for manufacturing the rear cover 11 may be a 100% transparent material such as glass, resin, or the like, or may have a certain transparency, but the material does not reach 100% transparency, and the material for manufacturing the rear cover in this embodiment is not limited.
Referring to fig. 2, the rear cover of the electronic device is made of transparent material, so that a user can visually see the internal structure of the electronic device, and compared with a traditional opaque electronic device shell, the electronic device with the transparent rear cover has more scientific and technological sense.
Since the conductive material is a good electromagnetic shield, in this embodiment, in consideration of the transparent characteristic of the rear cover of the electronic device, the transparent conductive material is selected to make the conductive layer, for example, the transparent liquid conductive material may be selected to be coated on the inner surface of the rear cover 11.
When the transparent conductive layer 12 is coated on the inner surface of the rear cover 11, a spraying method may be adopted to spray the transparent conductive material on the inner surface of the rear cover, or an adhesive layer may be firstly coated on the inner surface of the rear cover 11, and then the transparent conductive layer 12 is coated on the adhesive layer, so that the conductive layer 12 has good corrosion resistance and transparency at the same time.
Optionally, for the way of setting the conductive layer by using the adhesion layer on the inner surface of the rear cover 11, when the rear cover of the structure is processed in this embodiment, specifically, one surface of the conductive layer may be attached to a film, and the adhesion layer is attached to the other surface of the conductive layer, and then, the film is hot-pressed into the shape of the inner surface of the rear cover (which may be determined by setting the electromagnetic shielding region as needed), and after injection molding, the inner surface of the rear cover is on the adhesion layer, at this time, because the adhesion force between the conductive layer and the adhesion layer is greater than the adhesion force between the conductive layer and the film, the film is automatically peeled off during demolding, so that the conductive layer and the adhesion layer cover the inner surface of the rear cover, and this manufacturing way enables the conductive layer and the adhesion layer to have the characteristics of small thickness and good uniformity.
It should be noted that, the method for manufacturing the conductive layer is not limited to the above-described manner, and the implementation method for manufacturing the conductive layer 12 on the inner surface of the back cover 11 may be different for different transparent conductive materials, and the present invention is not described in detail herein.
In an alternative embodiment provided by the present invention, the conductive layer 12 may be made of metal oxide. Specifically, the transparent conductive material of the conductive layer may be an ITO (Indium tin oxide) material, i.e., an N-type oxide semiconductor-Indium tin oxide, and the conductive layer made of the ITO material may be referred to as an ITO layer in this embodiment, i.e., an ITO semiconductor transparent conductive film, which has good conductivity and transparency and no interference fringes.
Optionally, taking the back cover as a transparent glass as an example, in practical applications, before the ITO layer is coated on the inner surface of the back cover, a silica barrier layer may be coated to block sodium ion diffusion on the back cover glass, but the invention is not limited to this pretreatment manner.
In addition, in this embodiment, a layer of ITO film may be plated on the inner surface of the back cover by magnetron sputtering. The ITO layer may contain other components in addition to indium tin oxide, and may be determined according to the actual transmittance of the rear cover. If the back cover is made of 100% transparent material, only one layer of ITO material may be coated on the inner surface of the back cover to form a conductive layer for shielding electromagnetic interference.
Based on the electromagnetic shielding principle, the electromagnetic shielding effect of the conductive layer 12 is related to parameters such as absorption loss, reflection loss, multiple reflection loss, correction coefficient of the number of meshes in a unit area, low-frequency penetration correction coefficient, mutual coupling correction coefficient of adjacent meshes, and the like, and is also influenced by factors such as environment, installation conditions, installation mode, and the like, and repeated experiments determine that the higher the high magnetic conductivity and the higher the electric conductivity of the material forming the conductive layer, the better the electromagnetic shielding effect.
Therefore, when selecting the ITO layer material, a material with higher conductivity, such as ITO material with conductivity above 1000 siemens per meter (i.e. 1000s/m), may be selected, and the present embodiment does not limit the number of the material used to make ITO.
In addition, in the embodiment, when the material for manufacturing the conductive layer is selected, the characteristics of the transparent material for manufacturing the rear cover can be considered. If the rear cover 11 is made of rigid transparent materials such as ordinary glass and tempered glass, the rear cover has poor impact resistance and is easy to crack after being impacted, therefore, when the inner surface of the rear cover is coated with the conductive layer, materials with the shock absorption and protection functions can be added to form the conductive layer besides the transparent conductive materials, and the embodiment does not limit the types of the materials for forming the conductive layer and the manufacturing process of the conductive layer.
Therefore, according to market demands, the rear cover 11 may be made of a material with good light transmittance, such as acrylic, PC board, resin, etc., so that the rear cover has characteristics of impact resistance, vibration resistance, light weight, high light transmittance, etc. The invention does not limit the type of transparent material used for manufacturing the rear cover of the electronic equipment.
In another alternative embodiment of the present invention, as shown in fig. 3, the rear cover 11 of the present embodiment may be fixed to a housing 13 of the electronic device, and the housing 13 may include a plurality of electronic components 14 therein to implement various functions of the electronic device.
In practical applications, each electronic component in the electronic device may not all generate electromagnetic interference, or may not all generate relatively strong electromagnetic interference, and therefore, the embodiment may selectively determine the electronic components that need to be electromagnetically shielded, so as to determine the area position of the conductive layer coated on the inner surface of the back cover according to the installation position of the electronic components.
Thus, with reference to fig. 3, a transparent conductive layer is applied in a partial region of the inner surface of the rear cover 11, and at least one electronic component 14 may be disposed within the projected area on the housing such that it is directly exposed through the transparent conductive layer and the transparent rear cover. Therefore, the projection area of the conductive layer on the electronic device main board does not necessarily include all electronic components, one or more electronic components may be selected as the electromagnetic shielding object according to the electromagnetic interference condition of each electronic component, the shielding device of at least one electronic component as the electromagnetic shielding object is referred to as the transparent conductive layer 12, and the material and process for manufacturing the transparent conductive layer 12 may refer to the description of the above embodiments.
Optionally, referring to the schematic structural diagram of the electronic device shown in fig. 4, for a plurality of electronic components in the housing of the electronic device, in this embodiment, a main control chip that generates the largest electromagnetic interference may be selected to shield, as shown in fig. 4, a transparent conductive layer 12 may be coated in a projection area of the rear cover in an area where the main control chip is located, so that, after the rear cover 11 is fixed to the housing 13 of the electronic device, a user may visually see the main control chip with the larger interference through the transparent rear cover and the transparent conductive layer.
It should be noted that the area where the transparent conductive layer is coated on the inner surface of the back cover is not limited to the area where the dashed line frame in fig. 2, 3 and 4 is located, and the present invention may determine the shielding object according to the specific situation of the electromagnetic radiation generated by the electronic component in the electronic device, and then determine the area where the transparent conductive layer is to be coated on the inner surface of the back cover according to the shielding object. The position and shape of the partial region of the inner surface of the back cover coated with the transparent conductive layer are not described in detail herein.
In yet another alternative embodiment of the present invention, referring to fig. 5a and 5b, the electronic device further includes at least one set of antennas 15, and this embodiment does not limit the layout manner of the antennas in the electronic device, as shown in fig. 5a, a set of antennas is disposed on two short sides of the electronic device, and/or a set of antennas is disposed on two long sides of the electronic device, and so on, and the present invention is not described in detail herein.
Note that, when determining the partial area of the conductive layer 12 coated on the inner surface of the back cover, in order to avoid shielding the normal transmitting and receiving signals of the antenna, the projection area of the conductive layer 12 on the main board of the electronic device does not include all the antennas 15 of the electronic device.
In particular, when determining the layout of the electronic components in the electronic device, the technician may arrange at least one antenna 15 of the electronic device in a non-projected area of the partial area of the housing having the transparent conductive layer, that is, the at least one antenna 15 of the electronic device is not shielded by the conductive layer 12.
For the electronic device shown in fig. 5a, the group of antennas 15 located at two short sides of the electronic device are located in the non-projection area of the conductive layer 12 on the housing, so that neither antenna can be shielded by the conductive layer for transmitting and receiving signals, and the conductive layer 12 can shield the electromagnetic interference generated by the electronic components in the electronic device, thereby improving the performance of the antenna and not affecting the technological sense of the electronic device compared with an electronic device with a transparent rear cover without any shielding device.
For the electronic device shown in fig. 5b, that is, the electronic device may include two groups of antennas, a first group of antennas located on the short side of the electronic device, and a second group of antennas located on the long side of the electronic device, if the two groups of antennas operate in different states of the electronic device, for example, the second group of antennas operate in the landscape mode, and the first group of antennas operate in the portrait mode. In order to improve the performance of the antennas operating in various states of the electronic device, in this embodiment, at least one antenna belonging to the first group of antennas and at least one antenna belonging to the second group of antennas may be distributed in the non-projection area, that is, at least one antenna in each of the first group of antennas and the second group of antennas may not be provided with a shielding device.
As shown in fig. 5b, the first group of antennas are all disposed in the non-projection area of the conductive layer on the housing, one antenna of the second group of antennas is disposed in the non-projection area of the conductive layer on the housing, and the other antenna is disposed in the projection area of the conductive layer on the housing. Therefore, no matter the electronic equipment works in the transverse screen mode or in the vertical screen mode, the higher communication quality of the electronic equipment can be ensured.
Optionally, based on the structure of the electronic device described in the foregoing embodiment, referring to fig. 6a and 6b (fig. 6a and 6b are schematic diagrams of fixing the rear cover to the housing of the electronic device, and the figure does not show electronic components in the electronic device), the rear cover 11 may further be provided with sensing electrodes 16 in the partial area coated with the transparent conductive layer, and the structure and the number of the sensing electrodes are not limited in this embodiment.
In this embodiment, the sensing electrode can sense the touch points (which may be the entire projection area of the conductive layer or the touch buttons corresponding to the projection area) on the outer surface of the rear cover 11 corresponding to the user of the electronic device up and down, so that the electronic device detects the touch data of the user of the electronic device in the projection area of the conductive layer on the outer surface of the rear cover, and performs corresponding operations.
It can be seen that, for the electronic device having the structure as shown in fig. 6a and 6b, a user can perform a touch operation in the area corresponding to the conductive layer 12 on the rear cover 11 of the electronic device to control the electronic device to perform a corresponding operation.
Specifically, as shown in fig. 6a, the number of the sensing electrodes 16 is small, and the sensing electrodes 16 are not uniformly distributed in the area corresponding to the conductive layer 12 on the back cover, as shown in fig. 6a, in this embodiment, two touch points, such as touch buttons, may be arranged on the outer surface of the back cover, and the two touch points may vertically correspond to the two sensing electrodes, and each touch point is arranged to operate the function implemented by the electronic device, such as lighting a shield, turning on a camera, turning on a flashlight, starting other applications, and the like. Therefore, even if the rear cover of the current electronic device faces a user, the user can directly touch or press the touch point on the rear cover, so that the electronic device generates a corresponding control instruction by acquiring the voltage change of the induction electrode, executes the control instruction and realizes the preset operation.
In another alternative embodiment, referring to the electronic device shown in fig. 6b, the sensing electrodes 16 may be uniformly distributed in an area corresponding to the conductive layer of the back cover, in this case, the back cover corresponding to the area is equivalent to a touch screen with a touch sensing function, and a user may perform various touch operations in the area, so as to trigger the electronic device to perform corresponding preset operations.
In this case, in this embodiment, control instructions corresponding to gestures in different shapes may be preset for an area corresponding to the transparent conductive layer on the rear cover, when touch data of the user in the area is detected, a motion track (e.g., a hook shown in fig. 6 b) of a finger of the user currently in the area may be determined, a preset control instruction corresponding to the motion track is obtained, and in response to the preset control instruction, the electronic device will perform a corresponding operation.
It should be noted that, in this embodiment, there is no limitation on the types of gestures that can be set in the area corresponding to the conductive layer of the rear cover and the content of the corresponding control instruction, such as a zigzag gesture, a hook gesture, a circle gesture, and the like, and the corresponding control instruction may include an instruction for starting various application programs, and the details of this embodiment are not described herein.
In summary, for the electronic device with the transparent rear cover, the transparent conductive layer is coated on a partial region of the inner surface of the rear cover, so that the electromagnetic interference of the electronic components of the electronic device is shielded, the performance of the antenna in the electronic device is ensured, and the electronic device has good communication quality. In addition, in the embodiment, the induction electrodes are arranged in the corresponding areas of the conductive layer on the rear cover, so that the areas have the function of the touch layer, a user can perform touch operation on the display screen of the electronic equipment, and can perform touch operation on the corresponding areas of the conductive layer of the rear cover of the electronic equipment, the operation mode of the electronic equipment is enriched, and the use flexibility and diversity of the electronic equipment are improved.
With reference to the electronic device described in the foregoing embodiments, the present invention further provides an electronic device processing method, as shown in a schematic flow chart of the electronic device processing method shown in fig. 7, the method may be determined by a manufacturing process device, such as a spraying device, and may specifically be determined according to a manufacturing manner of the conductive layer with the determined transparency, and the specific structure of the manufacturing process device is not described in detail in this embodiment. Referring to fig. 7, the method may include, but is not limited to, the following steps:
step S11, obtaining the position information of the shielding area of the inner surface of the back cover of the electronic equipment;
the shielding area is determined based on the position information of at least one shielding object in the electronic device, and the specific position of the area, which is described in the above electronic device embodiment and in which the transparent conductive layer is coated on the inner surface of the back cover, may refer to the description of the above electronic device embodiments, and this embodiment is not described in detail here.
In practical application of this embodiment, the determination of the shielding area may be determined according to position information of a shielded object in the electronic device, where the shielded object may be an electronic element in a housing of the electronic device, and this embodiment may perform image acquisition on the electronic device exposing the shielded object, and calculate the position information of the shielded object according to the obtained image information, where a specific image analysis process is not limited.
After the position information of the shielded object is determined, the position information of the shielding area of the inner surface of the back cover to be coated with the transparent conductive layer can be determined accordingly, and the specific implementation mode is not limited. When the manufacturing processes for manufacturing the transparent conductive layer are different, the implementation method for determining the position information of the shielding region may be different, and may be specifically determined according to the flows of the manufacturing processes.
And step S21, responding to the coating making command, and controlling the making process equipment to coat the transparent conducting layer on the shielding region based on the position information of the shielding region.
When the position information of the shielding area of the inner surface of the back cover of the electronic equipment to be processed is determined to be acquired, namely the position of the electronic equipment to be processed is determined, the processing program of the electronic equipment can be automatically triggered, and the manufacturing process equipment is controlled to coat the transparent conducting layer on the shielding area in response to the coating manufacturing instruction.
Optionally, the manufacturing process equipment may include a display screen, which may display the acquired position information of the shielding region of the to-be-processed electronic equipment, at this time, the to-be-processed electronic equipment generally reaches the working region, and after the worker sees the position information of the shielding region, the worker may directly press the coating manufacturing instruction, so that after the manufacturing process equipment detects the coating manufacturing instruction, the manufacturing process equipment responds to the coating manufacturing instruction, and finishes the coating work on the conductive layer on the inner surface of the rear cover of the to-be-processed electronic equipment in the current working region.
In summary, in order to avoid the electromagnetic interference in the electronic device from affecting the performance of the antenna and further affecting the communication quality of the electronic device, and at the same time, in order to not affect the visual effect of the transparent back cover of the electronic device, it is proposed that a transparent conductive layer is coated on a partial area of the inner surface of the back cover of the electronic device, and the conductive layer is used as a shielding device for at least one electronic component in the projection area of the conductive layer on the housing, so as to shield the electromagnetic interference of the electronic component. Specifically, in the embodiment, the transparent conductive material is automatically coated on the shielding area on the inner surface of the rear cover by using the obtained position information of the shielding area through manufacturing process equipment, manual coating is not needed, and the working efficiency and the accuracy are improved.
Further, after the electronic device to be processed is processed, the coated conductive layer is usually detected, for example, whether the electromagnetic shielding effect meets a preset requirement is detected, for example, the rear cover is mounted on the electronic device shell, and antenna signal quality detection is performed on the electronic device, and if the antenna signal quality meets the preset requirement, the electronic device mounted with the rear cover has good communication quality; conversely, the quality of the electronic device communication may be compromised, which may require rework to recoat the transparent conductive layer.
It should be noted that the detection method of the conductive layer coated on the inner surface of the back cover is not limited to the above-described detection method of the antenna signal quality, and the coated conductive layer region may also be verified, that is, the actual coating position information of the conductive layer is compared with the position information of the shielding region calculated previously, if the error is within the allowable range, it may be considered that the position of the coated conductive layer meets the requirement, and other aspects of detection may also be performed at this time, and details of this embodiment are not described again.
Based on this, as shown in fig. 8, the method for processing by an electronic device may include the following steps:
step S21, obtaining the position information of the shielding area of the inner surface of the back cover of the electronic equipment to be processed;
step S22, responding to the coating making command, and controlling the making process equipment to coat a transparent conducting layer on the shielding area based on the position information of the shielding area;
step S23, receiving a coating adjusting instruction, and acquiring the position information of the electronic equipment after the shielding area on the inner surface of the back cover is adjusted;
the embodiment does not limit how to determine that the coated conductive layer on the inner surface of the rear cover of the electronic device does not meet the shielding requirement, for example, the error between the position information of the coated conductive layer and the calculated position information of the shielding region is greater than a threshold value, and/or the antenna quality data of the electronic device combined by using the rear cover of the coated conductive layer does not meet the preset requirement, that is, the antenna performance is not qualified, and the like.
Optionally, in this embodiment, when it is determined that the conductive layer coated on the inner surface of the rear cover of the electronic device does not meet the shielding requirement, a coating adjustment instruction may be generated; the detection result of the conductive layer coated on the inner surface of the rear cover of the electronic device may also be output, and after the detection result is seen by the user, the coating elimination button of the manufacturing process equipment is started to generate a coating adjustment instruction, and the like.
Generally, the coating adjustment instruction includes identification data of a rear cover of the electronic device that needs to be recoated with the conductive layer, so that a user or manufacturing process equipment can determine the rear cover of the electronic device that needs to be recoated with the conductive layer according to the identification data.
Step S24, in response to the coating adjustment command, adjusts the position of the transparent conductive layer coated on the inner surface of the back cover of the electronic device according to the position information after the shielding region adjustment.
In practical application of this embodiment, the electronic device back cover that needs to be recoated with the conductive layer may be determined based on the content included in the coating adjustment instruction, the conductive layer that has been coated on the back cover is removed, and then the manufacturing process equipment is controlled to coat the transparent conductive layer on the shielding region based on the position information obtained again after the shielding region adjustment on the inner surface of the back cover.
In another optional embodiment, after responding to the coating adjustment instruction, the embodiment may implement the position adjustment of the transparent coated conductive layer on the inner surface of the back cover based on the comparison result between the adjusted position information of the shielding region and the position information of the conductive layer coated on the shielding region, for example, based on the comparison result, the conductive layer in the redundant region (i.e., the region where the shielding region currently exists exceeds the adjusted shielding region) is removed, and for the lacking region (i.e., the region where the adjusted shielding region exceeds the shielding region currently exists), the fabrication process equipment may be controlled to continue coating the transparent conductive layer on the lacking region until the actually existing shielding layer meets the shielding requirement.
In the embodiment of the application, an ITO layer is coated on the inner surface of a transparent material rear cover (plastic and glass), the ITO layer (transparent effect) has the conductivity of more than 1000s/m, and the ITO layer is used as an electromagnetic shielding of an electronic component aiming at the projection area of the ITO layer. Therefore, the appearance of the electronic component can be really exposed, and the technological sense of the electronic equipment is improved.
Finally, it should be noted that, in the embodiments, relational terms such as first, second and the like may be used solely to distinguish one operation, unit or module from another operation, unit or module without necessarily requiring or implying any actual such relationship or order between such units, operations or modules. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method or system that comprises the element.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the method disclosed by the embodiment, since the method corresponds to the electronic device disclosed by the embodiment, the description is relatively simple, and the relevant points can be referred to the description of the structural application part of the electronic device.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (9)

1. An electronic device, comprising:
a rear cover made of a transparent material;
the part of the inner surface of the rear cover is coated with a transparent conductive layer playing a role in protection, and the part of the inner surface of the rear cover coated with the transparent conductive layer playing a role in protection is determined according to the electromagnetic radiation condition generated by electronic elements in the electronic equipment;
the electronic device further includes:
at least one antenna of the electronic device is arranged in a non-projected area of the partial area with the transparent conductive layer on the housing.
2. The electronic device of claim 1,
the rear cover is fixed to a housing of the electronic device, the housing including a plurality of electronic components;
at least one electronic element is arranged in a projection area of the partial area with the transparent conductive layer on the shell, and a shielding device of the at least one electronic element is the transparent conductive layer, so that the at least one electronic element is directly exposed through the transparent conductive layer and the transparent rear cover.
3. The electronic device of claim 2, wherein the at least one electronic component disposed within the projection area is the electronic device main control chip.
4. The electronic device of claim 1, wherein the non-projected area on the inner surface of the back cover is coated with a transparent insulating layer.
5. The electronic device according to any one of claims 1 to 3, wherein the transparent conductive layer is formed by coating a transparent liquid conductive material on the inner surface of the rear cover by using a specific manufacturing process.
6. The electronic device of claim 5, wherein the transparent conductive layer is made of an Indium Tin Oxide (ITO) material.
7. The electronic device according to any one of claims 1 to 3, wherein an inductive electrode is disposed in the partial region of the rear cover coated with the transparent conductive layer, and the inductive electrode can be correspondingly inductive up and down with a touch point of an electronic device user on the outer surface of the rear cover, so that the electronic device detects touch data of the electronic device user in a projection region of the conductive layer on the outer surface of the rear cover and performs corresponding operations.
8. An electronic device processing method is applied to manufacturing process equipment, and the method comprises the following steps:
acquiring position information of a shielding area of the inner surface of a rear cover of electronic equipment to be processed, wherein the shielding area is determined based on the position information of at least one shielding object in the electronic equipment, the at least one shielding object in the electronic equipment is determined according to the electromagnetic radiation condition generated by an electronic element in the electronic equipment, and the rear cover is made of a transparent material;
responding to a coating manufacturing instruction, and controlling the manufacturing process equipment to coat a transparent conductive layer playing a protection role on the shielding area based on the position information of the shielding area;
at least one antenna of the electronic equipment is arranged in a non-projection area of a partial area with a transparent conducting layer on the electronic equipment shell.
9. The method of claim 8, further comprising:
receiving a coating adjusting instruction, and acquiring position information of the electronic equipment after the shielding area of the inner surface of the rear cover of the electronic equipment is adjusted, wherein the coating adjusting instruction indicates that a conductive layer coated on the inner surface of the rear cover of the electronic equipment does not meet the shielding requirement;
and responding to the coating adjusting instruction, and adjusting the position of the transparent conducting layer coated on the inner surface of the back cover of the electronic equipment according to the position information of the adjusted shielding area.
CN201811161186.3A 2018-09-30 2018-09-30 Electronic device and electronic device processing method Active CN109362217B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111031175B (en) * 2019-12-02 2022-06-28 维沃移动通信有限公司 Electronic device and control method of electronic device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101415318A (en) * 2007-10-19 2009-04-22 鸿富锦精密工业(深圳)有限公司 Wireless communication apparatus and electromagnetic shielding device thereof
CN103606443A (en) * 2013-11-29 2014-02-26 华北电力大学 Method for shielding electric reactor magnetic field by additionally assembling shielding plate
CN105578811A (en) * 2014-10-17 2016-05-11 小米科技有限责任公司 Electronic equipment and using method thereof
CN106455411A (en) * 2015-08-13 2017-02-22 东莞钱锋特殊胶粘制品有限公司 Heat dissipation buffering conductive composite forming structure of mobile electronic device
CN206282179U (en) * 2016-09-29 2017-06-27 珠海市魅族科技有限公司 A kind of mobile terminal
CN107704146A (en) * 2017-09-29 2018-02-16 广东欧珀移动通信有限公司 Electrostatic protection component and electronic equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101464769A (en) * 2009-01-07 2009-06-24 朱中伟 Electromagnetic induction type touch screen
PT2380234T (en) * 2009-01-16 2018-10-18 Saint Gobain Transparent plane antenna, manufacturing method for the antenna, and use of the antenna
KR101146623B1 (en) * 2010-08-13 2012-05-16 주식회사 제이앤티에스 A touch screen and its manufacturing method
CN201945987U (en) * 2011-01-19 2011-08-24 漳州市百昱工贸有限公司 Approach induction touch-screen
CN103905095B (en) * 2012-12-28 2016-03-02 联想(北京)有限公司 Electronic equipment and the method for arranging short-range communication antenna
CN203434165U (en) * 2013-02-28 2014-02-12 宏大中源太阳能股份有限公司 Solar battery sheet with electrode blocking-free front surface

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101415318A (en) * 2007-10-19 2009-04-22 鸿富锦精密工业(深圳)有限公司 Wireless communication apparatus and electromagnetic shielding device thereof
CN103606443A (en) * 2013-11-29 2014-02-26 华北电力大学 Method for shielding electric reactor magnetic field by additionally assembling shielding plate
CN105578811A (en) * 2014-10-17 2016-05-11 小米科技有限责任公司 Electronic equipment and using method thereof
CN106455411A (en) * 2015-08-13 2017-02-22 东莞钱锋特殊胶粘制品有限公司 Heat dissipation buffering conductive composite forming structure of mobile electronic device
CN206282179U (en) * 2016-09-29 2017-06-27 珠海市魅族科技有限公司 A kind of mobile terminal
CN107704146A (en) * 2017-09-29 2018-02-16 广东欧珀移动通信有限公司 Electrostatic protection component and electronic equipment

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