TW201008458A - Wind-guiding cover - Google Patents

Wind-guiding cover Download PDF

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Publication number
TW201008458A
TW201008458A TW097130002A TW97130002A TW201008458A TW 201008458 A TW201008458 A TW 201008458A TW 097130002 A TW097130002 A TW 097130002A TW 97130002 A TW97130002 A TW 97130002A TW 201008458 A TW201008458 A TW 201008458A
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TW
Taiwan
Prior art keywords
air
airflow
heat exchange
air inlet
slope
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TW097130002A
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Chinese (zh)
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TWI359635B (en
Inventor
Wen-Bin Tian
Tsai-Kuei Cheng
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Inventec Corp
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Priority to TW097130002A priority Critical patent/TWI359635B/en
Priority to US12/425,863 priority patent/US20100032139A1/en
Publication of TW201008458A publication Critical patent/TW201008458A/en
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Publication of TWI359635B publication Critical patent/TWI359635B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20154Heat dissipaters coupled to components
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A wind guiding cover is disclosed, comprising an inlet portion having an inlet, a corresponding outlet portion having an outlet, and a heat-changing zone disposed between the inlet and the outlet and having an air flow disturbing portion adjacent to the inlet portion. When a heat-generating element is covered by the wind-guiding cover, a wind channel is formed by the wind-guiding cover and the main board, and the heat-changing zone is posited on top of the heat-generating element, thereby air flow passing through the flow disturbing portion is stirred up to increase coefficient of heat convection as a result.

Description

201008458 九、發明說明: 【發明所屬之技術領域】 本發明係有關於一種散熱技術,更詳而言之,係為 種應用於電子裝置中之導風罩。 ’τ'… 【先前技術】 *。現行市場上使用之電子裝置’常由於使用次數頻繁及 ^操作時間過久而導致電子裝置内部之溫度升高,易影響# 子裝置之正常運作。同時,由於電子裝置内部所含:;: ❹元件’如中央處理單元(c;entral prQGessing _、,、 CPU)、圮憶體、北橋晶片、及電源供應器等,可達成之 運算速度愈來愈快,資料處理量亦呈倍數增加,因此,常 -因工作溫度過高而導致故障的情形發生。為了避免發熱元 件因過熱而導致故障,現行業界之解決手段係於電子裝、置 中設置散熱風扇,以將發熱元件所產生之熱能導出電子裝 置和而避免發熱元件因溫度過高而損壞,進而造成電^ 眷裝置運作不穩定之情況發生。 然,於實際散熱過程中,㈣由散熱風扇導出熱能之 方法亦存在散熱過慢之問題,而無法達到最佳散熱效果, 進而導致發熱元件因溫度過高而損壞;故設計人員於該發 熱兀件上增設散熱導風罩以產生流動空間,俾使氣流可 中流動,以使散熱風扇旋轉產生之氣流密集通過該導風罩 而將熱氣排出,而有效提昇散熱風扇對發熱元件的散熱效 果’因此,導風罩已成為散熱系统中的必備之物件。 請參閲第以及1B圖’習知導風罩i係為一中空罩 110879 5 201008458 體’其係包括-頂蓋10以及沿該頂蓋1〇兩對邊向下延伸 、之二㈣1卜且導風罩1二端則分別具有一入風口 12及 -出風口 13。使用時,可將該導風罩“免置於電子裝置 之主板14上,以罩蓋電子裝置之發熱元件15,使發敎元 件15位於該導風罩1内,且配合該散熱風扇16產生氣 ,流職該入風口12進入而由該出風口 13散出,以達到 - 散熱效果。 惟,對該發熱元件15而言,習知導風罩i之頂蓋1〇 ❹:二侧壁11係形成一直線流道’當氣流16〇通過該導風 罩1内時,僅藉由流道散熱,其散熱逮度有限,令該發敎 =件之溫度超過可控制之範圍,以致使該發熱元件^ 處於危險之工作狀態。 因此,如何找到一種散熱效率更高之導風罩,以避 件處於危險狀態下工作之情況發生,實為目前 解決的問題。 付 ❹ 【發明内容】 —雲於士述習知技術之缺點,本發明之一目的在於提供 種可提局散熱效率之導風罩。 本發明之另-目的在於提供—種增加換熱係數,以提 尚對流換熱效率之導風罩。 本發明之又—目的在於提供一種減小風阻之導風罩。 =達上述及其他目的,本發明提供一種導風罩,係應 ;设有發熱元件之主板,且導風罩蓋住發熱元件而盘主 反形成風道’該導風罩包括:入風部,具有位於風道-側 110879 6 k 201008458 之入風口;出風部,具有位於風道相對入風口之一側之出 風口;以及換熱區,設於該入風口及出風口之間,且位於 發熱元件上方,並且該換熱區具有鄰近入風部之氣流紊流 部° 前述之導風罩中,該入風部復可具有氣流下壓部,設 ^ 於該入風口與換熱區之間,以使氣流下壓集中至換熱區; . 且該換熱區復可具有氣流擴散部,設於該氣流紊流部及出 風部之間,以降低氣流的風阻;又該氣流紊流部可具有V ❿型折邊結構。 前述之導風罩中,該氣流紊流部可具有第一斜面及第 二斜面,該第一斜面連接該入風部,為該換熱區頂部内壁 沿氣流方向向下延伸之斜面,該第二斜面沿氣流方向設置 於該第一斜面之後側,為該換熱區頂部内壁沿氣流方向向 上傾斜之斜面,較佳地,該第一及第二斜面可形成V型折 邊結構。 _ 依上述結構,以氣流紊流部具有第一斜面為基本需 Ο 求,該入風部復可具有氣流下壓部,為設於該入風口與氣 流紊流部之間的向下傾斜面,較佳地,可連結該第一斜 面,且與第一斜面的傾斜角度相同。 依上述結構,以氣流紊流部具有第二斜面為基本需 求,該換熱區復可具有氣流擴散部,設於該第二斜面及出 風部之間,且該氣流擴散部可為該換熱區之頂部内壁沿氣 流方向向上傾斜之斜面,並與第二斜面的傾斜角度相同, 較佳地,該氣流擴散部與水平面的夾角可小於三十度。 7 110879 201008458 流部ti:二藉由在換熱區上形成氣流蒼 ,與發執元件开^ 發熱元件時,該氣流|流部 •流通過該狹窄in之:窄風道;相較於習知技術’當氣 , 俾藉由該導風罩得以強化熱對流效 纟1 %加對流㈣係數’讀高對祕熱效率之目 可控制發熱元件之溫度,而達到提高散熱效率之目 ' 另外/藉由換熱區之氣流擴散部的設計,以使氣流的 ❹ *出風運之空間增大,而達到減小風阻之目的。 【實施方式】 一以下係藉由特定的具體實例說明本發明之實施方 式,熟悉此技藝之人士可ώ太%日含 〜八士 j由本5兑明書所揭示之内容輕易地 瞭解本發明之其他優點與功效。 第一實施例 明參閱第2A及第2B圖,係為本發明之導風罩一實施 例之示意圖。於本實施例及其他實施例中所示之導風罩結 ❹構僅為例示性說明,只要應用於具有發熱元件之電子裝= 中,包括換熱區、相對之入風部及出風部,於該換熱區設 有氣流紊流部,以使氣流通過氣流紊流部形成擾動,均適 用於本發明。 如第2A圖所示,於本實施例中,該導風罩2由頂蓋 2a以及沿該頂蓋2a二相對邊向下延伸之二侧壁2b所= 成的無底蓋罩體’各該側壁2b可為一體成型於項蓋2a。 所述之導風罩2包括:換熱區20、相對之入風部21 及出風部22 ;該入風部21具有入風口 21〇,該出風部22 110879 8 201008458 八有相對入風口 2i〇之出風口 22〇,該換熱區2〇設於入 ,風σ 210及出風口 22〇之間,且具有鄰近入風部之氣 流紊流部200。 如第2Β圖所示,將該導風罩2應用於具有發熱元件 .3^電子裝置中,該電子裝置包括一主板4及一風扇模組 .5,该發熱兀件3設於主板4上,且該導風罩2罩蓋發熱 '元件3而與主板4形成一風道6。 所述之入風口 位於該風道6 —侧,且連接該風扇 模組5’使該風扇模組5所產生的冷氣流5〇由入風口 進入風道6,而所述之出風口 22〇位於風道6相對入風口 210之一側,且所述之換熱區2〇位於發熱元件3上方, 乂供由入風口 210進入的冷氣流在換熱區2〇以與發熱 元件3進行熱交換,並在換熱區2〇形成熱氣流而由'出風 口 220排出。 所述之氣流紊流部200具有第一斜面2〇〇a及第二斜 •面200b’該第一斜面200a連接該入風部21,為該換熱區 20頂部内壁沿氣流方向向下延伸之斜面,而該第二斜面 200b沿氣流方向設置於該第一斜面2〇〇&之後側’為該換 熱區20頂部内壁沿氣流向上傾斜之斜面,且該第一及第 二斜面20〇a,200b相連結以使氣流紊流部2〇〇具有單一 v 型折邊結構。當然,於其他實施例中,亦可為多個v型折 邊結構或其他形狀及數目之凹折結構,並非侷限於此;換 言之,只要於該換熱區20設有朝發熱元件3 (容後陳述) 彎折之結構,以供進入換熱區20之冷氣流5〇通過而增^加 110879 9 201008458 氣流擾動’以提高換熱係數,且增加對流換熱效率,即適 用於本發明之氣流紊流部2 〇 〇。 ."較佳地,該氣流紊流部2〇〇臨近該入風部21設置, 使氣流在剛進入換熱區20時,就使氣流擾動增強,換熱 係數增加’而使換熱效果更佳。 .。再者,應注意的是,於本實施例中,該電子裝置為伺 '服器,但並非以此為限,而該導風罩2罩設於係為例如記 憶體之發熱元件3’但並非以此為限,該發熱元件3亦可 為中央處理單元、北橋晶片、電源供應器、積體電路 (integrated circuit,IC)元件、或其他發熱元件。由於 •該發熱元件3及風扇模組5係屬習知,且其結構與作用原 .理皆為公知者,故應知本實施例中所示者僅為例示性說明 之用。 本實施例之導風罩2藉由該氣流紊流部2〇〇之設計, 相較於習知技術,於該風扇模組5提供相同的冷氣流5〇 ❹之下,當該冷氣流50通過換熱區20時,依靠氣流紊流部 2 〇 〇增加氣流擾動,而提尚換熱係數,進而増加換熱區2 〇 之對流換熱效率。 ^ —貫施例 請參閱第3圖,本實施例與第一實施例之差異在於換 熱區20之結構,而其餘相關導風罩2之設計則大致相同, 因此’相同之元件與對應說明將予以省略,而不再贅述, 特此述明。 如圖所示’該換熱區20之氣流紊流部200,具有兩個 10 110879 201008458 V,運結構時,以提升冷氣流5G形成紊流之程度,而 •增加散熱效果(容後陳述),·且可令兩個第-斜面 2_,2_,之長度及傾斜角度為不同或相同、及/或 .個第:斜面2_鳥,之長度及傾斜角度為不同‘相 然’於其他實施例中,各該v型折邊結構之凹折長 .度、斜面傾斜角度、及凹折深度均可加以改變。 - 5亥換熱區2〇復具有一氣流擴散部201,設於♦亥氣、、ά 奮流部200’及出風部22之間,以藉由擴大風道6之空; ❹有足夠的空間流動,俾達到降低氣流的風 :夕:由出風口22。流出,進而將熱能散出;於本實施 :散部2〇1為該換熱區2〇之頂部内壁沿氣 :方向向上傾斜之斜面且連結該第:斜面鳩,,較佳 也=流擴散部2()1與該第二斜面綱b,的傾斜角度相 ^,另外,該氣流擴散部201與水平面的夹角0小於 度。 一 | J三實施例 ❹風二參本實施例與第二實施例之差… 同,因此,相同之元件計則大致相 述,特此述明。對應說明將予以省略,而不再資 導風in斤示,當風扇模組5相對於熱源高度較高時,該 集 入^口训之高度亦相對較高’為了使氣流更 "Γ “入風部2Γ復具有-氣流下壓部2”,設於該入 風口 21°與換熱區20之間,以供由風扇模組5所產生的 ]]〇879 11 201008458 冷乳流50下壓集中在換熱區20,而使冷氣流50的流速 .增加;於本實施例中,該氣流下壓部211為向下傾斜面且 與該氣流紊流部200,之第一斜面2〇〇a相連,較佳地,該 亂流下壓部211 #該第一斜面2〇〇a的傾斜角度相同。 第一及第二實施例之氣流紊流部200,具有兩處V型 .折邊結構,而各該V型折邊結構與該發熱元件3之間係形 .成狹窄處。因此,通過各該狹窄處之冷氣流5〇可形成奢 流而提高換熱係數’進”加對流換熱效率。 此^為了驗證本發明之導風罩與習知導風罩 效果,申請人針對習知塞前s …201008458 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a heat dissipation technique, and more particularly to an air hood for use in an electronic device. 'τ'... [Prior Art] *. The electronic devices used in the current market often have a high temperature inside the electronic device due to frequent use and excessive operation time, which easily affects the normal operation of the #子装置. At the same time, due to the internal components of the electronic device:: ❹ components such as central processing unit (c; entral prQGessing _,,, CPU), memory, Northbridge chip, and power supply, etc., the speed of operation can be achieved The faster the data processing capacity is multiplied, therefore, often - the failure occurs due to the high operating temperature. In order to avoid the failure of the heating element due to overheating, the current solution in the industry is to provide a heat dissipating fan in the electronic device and the device to derive the thermal energy generated by the heating element from the electronic device and prevent the heating element from being damaged due to excessive temperature. This caused the unstable operation of the electric device. However, in the actual heat dissipation process, (4) the method of deriving thermal energy from the cooling fan also has the problem of slow heat dissipation, and the optimal heat dissipation effect cannot be achieved, thereby causing the heating element to be damaged due to excessive temperature; therefore, the designer is in the heat. A heat-dissipating air hood is added to the device to generate a flow space, so that the airflow can flow therein, so that the airflow generated by the rotation of the heat-dissipating fan is densely discharged through the air hood to effectively remove the heat-dissipating effect of the heat-dissipating fan on the heating element. Therefore, the air hood has become an essential item in the heat dissipation system. Please refer to FIG. 1B and FIG. 1B's conventional air hood i is a hollow cover 110879 5 201008458. The body includes a top cover 10 and two (four) ones extending downward along the two sides of the top cover 1 and The air guiding hood 1 has an air inlet 12 and an air outlet 13 at two ends. In use, the air hood can be “disposed on the main board 14 of the electronic device to cover the heating element 15 of the electronic device, so that the hair unit 15 is located in the air hood 1 and is generated by the cooling fan 16 . The air inlet 12 enters and is vented by the air outlet 13 to achieve a heat dissipation effect. However, for the heating element 15, the top cover of the conventional air hood i: two side walls The 11 series forms a straight flow path 'When the air flow 16 〇 passes through the air hood 1 , the heat dissipation is limited only by the flow path, and the heat dissipation is limited, so that the temperature of the hair piece exceeds a controllable range, so that The heating element ^ is in a dangerous working state. Therefore, how to find a windshield with higher heat dissipation efficiency to avoid the fact that the piece is working under dangerous conditions is a problem currently solved. 付❹ [Summary] - Cloud In view of the shortcomings of the prior art, one of the objects of the present invention is to provide an air hood that can provide heat dissipation efficiency. Another object of the present invention is to provide an increase in heat transfer coefficient to improve convective heat transfer efficiency. Air hood. The present invention provides an air hood for reducing wind resistance. For the above and other purposes, the present invention provides an air hood, which is provided with a main board provided with a heating element, and the air hood covers the heating element and the main body of the disk is formed. The air duct 'the air duct includes: an air inlet portion having an air inlet at a wind tunnel side 110879 6 k 201008458; an air outlet portion having an air outlet at a side of the air duct opposite to the air inlet; and a heat exchange area, The air inlet portion is disposed between the air inlet and the air outlet, and is located above the heat generating component, and the heat exchange region has a gas flow turbulence portion adjacent to the air inlet portion, and the air inlet portion has a gas flow pressure The portion is disposed between the air inlet and the heat exchange zone to concentrate the airflow to the heat exchange zone; and the heat exchange zone has a gas flow diffusion portion disposed in the airflow turbulence portion and the air outlet portion In order to reduce the wind resistance of the air flow, the air flow turbulence portion may have a V ❿ type hemming structure. In the air hood, the air flow turbulence portion may have a first slope and a second slope, the first slope Connecting the inlet portion to the inner wall of the top of the heat exchange zone along the airflow side a slope extending downwardly, wherein the second slope is disposed on a rear side of the first slope along the airflow direction, and is a slope of the top inner wall of the heat exchange zone inclined upward in the airflow direction. Preferably, the first and second slopes are formed. V-folded structure. _ According to the above structure, the airflow turbulence portion has a first inclined surface as a basic requirement, and the air inlet portion may have a gas flow lower pressing portion, which is provided at the air inlet and the airflow turbulence portion. Preferably, the first inclined surface is coupled to the first inclined surface and has the same inclination angle as the first inclined surface. According to the above structure, the air flow turbulence portion has a second inclined surface as a basic requirement, and the heat exchange region is complex. The airflow diffusing portion may be disposed between the second inclined surface and the air outlet portion, and the airflow diffusing portion may be a sloped surface of the top inner wall of the heat exchange region that is inclined upward in the airflow direction, and has the same inclination angle as the second inclined surface Preferably, the airflow diffusing portion and the horizontal plane may be less than thirty degrees. 7 110879 201008458 Stream ti: two by forming a gas flow on the heat exchange zone, and when the heating element is opened, the gas flow|flow part flows through the narrow in: narrow air duct; Knowing the technology 'When the air, 俾 by the air hood to enhance the heat convection effect 纟 1% plus convection (four) coefficient 'read high to the heat of the efficiency of the purpose of controlling the temperature of the heating element, to achieve the purpose of improving heat dissipation' By the design of the airflow diffusing portion of the heat exchange zone, the space of the airflow of the airflow is increased, and the wind resistance is reduced. [Embodiment] Hereinafter, embodiments of the present invention will be described by way of specific specific examples, and those skilled in the art can easily understand the present invention by the contents disclosed in the Japanese Patent Application. Other advantages and effects. First Embodiment Referring to Figures 2A and 2B, there is shown a schematic view of an embodiment of an air duct of the present invention. The hood structure shown in this embodiment and other embodiments is merely illustrative, as long as it is applied to an electronic device having a heating element, including a heat exchange area, a corresponding air inlet portion, and an air outlet portion. A gas flow turbulence portion is provided in the heat exchange zone to cause the gas flow to be disturbed by the gas flow turbulence portion, and is suitable for use in the present invention. As shown in FIG. 2A, in the present embodiment, the air hood 2 is composed of a top cover 2a and a bottomless cover body defined by two side walls 2b extending downward along opposite sides of the top cover 2a. The side wall 2b may be integrally formed on the cover 2a. The air hood 2 includes a heat exchange area 20, an opposite air inlet portion 21 and an air outlet portion 22; the air inlet portion 21 has an air inlet 21 〇, and the air outlet portion 22 110879 8 201008458 has a relative air inlet The air outlet 22 of the 2i 〇 is disposed between the wind σ 210 and the air outlet 22〇, and has a flow turbulence portion 200 adjacent to the air inlet portion. As shown in FIG. 2, the air hood 2 is applied to an electronic device having a heating element. The electronic device includes a main board 4 and a fan module .5. The heating element 3 is disposed on the main board 4. And the air hood 2 covers the heat element 3 to form a duct 6 with the main board 4. The air inlet is located at the side of the air duct 6 and is connected to the fan module 5 ′ so that the cold air flow 5 产生 generated by the fan module 5 enters the air duct 6 through the air inlet, and the air outlet 22 〇 Located on one side of the air duct 6 opposite to the air inlet 210, and the heat exchange area 2 is located above the heating element 3, and the cold airflow entering through the air inlet 210 is in the heat exchange area 2 to be heated with the heat generating element 3. Exchanging, and forming a hot gas flow in the heat exchange zone 2, is discharged by the 'air outlet 220. The airflow turbulence portion 200 has a first inclined surface 2a and a second inclined surface 200b'. The first inclined surface 200a is connected to the air inlet portion 21, and the top inner wall of the heat exchange region 20 extends downward in the airflow direction. a sloped surface, wherein the second slope 200b is disposed along the airflow direction on the first slope 2〇〇& the rear side is a slope of the top inner wall of the heat exchange zone 20 inclined upward along the airflow, and the first and second slopes 20 The 〇a, 200b are joined such that the airflow turbulence portion 2 has a single v-shaped hem structure. Of course, in other embodiments, a plurality of v-shaped hemming structures or other shapes and numbers of concave-concave structures may be used, and is not limited thereto; in other words, as long as the heat-exchange area 20 is provided with the heating element 3 The following is a description of the structure of the present invention for the passage of the cold air flow 5 into the heat exchange zone 20 to increase the heat transfer coefficient and increase the convective heat transfer efficiency, which is suitable for the present invention. Airflow turbulence section 2 〇〇. Preferably, the airflow turbulence portion 2 is disposed adjacent to the air inlet portion 21, so that when the airflow enters the heat exchange region 20, the airflow disturbance is enhanced, and the heat transfer coefficient is increased, and the heat exchange effect is increased. Better. . . . In addition, in this embodiment, the electronic device is a servo device, but not limited thereto, and the air guiding cover 2 is covered by a heating element 3' such as a memory. The heat generating component 3 may be a central processing unit, a north bridge wafer, a power supply, an integrated circuit (IC) component, or other heat generating component. Since the heating element 3 and the fan module 5 are well-known, and their structures and functions are well known, it should be understood that the embodiments shown in the present embodiment are for illustrative purposes only. The air hood 2 of the present embodiment is designed by the airflow turbulence unit 2, and the fan module 5 provides the same cold air flow 5 , when compared with the prior art, when the cold air flow 50 When passing through the heat exchange zone 20, the airflow turbulence section 2 is used to increase the airflow disturbance, and the heat transfer coefficient is increased, thereby increasing the convective heat transfer efficiency of the heat exchange zone 2 〇. ^ - For example, please refer to FIG. 3, the difference between this embodiment and the first embodiment lies in the structure of the heat exchange zone 20, and the design of the remaining related air hoods 2 is substantially the same, so the same components and corresponding descriptions It will be omitted, and will not be described again, and is hereby described. As shown in the figure, the airflow turbulence section 200 of the heat exchange zone 20 has two 10 110879 201008458 V. When the structure is transported, the degree of turbulence is increased by 5G of the cold airflow, and the heat dissipation effect is increased (reported later) , and the length and inclination angle of the two first-inclined faces 2_, 2_ may be different or the same, and/or. The first: the inclined surface 2_bird, the length and the inclination angle are different 'consistent' in other implementations In the example, the concave length, the inclined angle of the inclined surface, and the depth of the concave fold of each of the v-shaped hemming structures may be changed. - 5 换热 heat exchange zone 2 〇 具有 has a gas flow diffusion part 201, is arranged between ♦ hai gas, ά 流 flow part 200 ′ and the air outlet part 22, by expanding the air passage 6 empty; The space flows, and the wind reaches the wind that reduces the airflow: Xi: by the air outlet 22. Flowing out, and then dissipating heat energy; in the present embodiment, the bulk portion 2〇1 is a slope of the top inner wall of the heat exchange zone 2〇 which is inclined upward in the direction of the gas: and is connected to the first slope: 斜, preferably also = flow diffusion The angle of inclination of the portion 2 () 1 and the second bevel b, and the angle 0 between the airflow diffusing portion 201 and the horizontal plane is less than a degree. I. J. Three Embodiments The difference between the embodiment of the present invention and the second embodiment is the same as that of the second embodiment, and therefore, the same components are generally described, and the description is hereby made. The corresponding description will be omitted, and the wind guide will not be used. When the height of the fan module 5 relative to the heat source is high, the height of the integrated training is relatively high 'in order to make the air flow more quot; The air inlet portion 2 has a gas flow lower pressing portion 2" disposed between the air inlet 21 and the heat exchange region 20 for being generated by the fan module 5]] 〇 879 11 201008458 cold milk flow 50 The pressure is concentrated in the heat exchange zone 20, and the flow rate of the cold gas flow 50 is increased. In the present embodiment, the gas flow lower pressing portion 211 is a downward inclined surface and the first inclined surface of the airflow turbulence portion 200 〇a is connected, preferably, the turbulent lower pressing portion 211 # has the same inclination angle of the first inclined surface 2〇〇a. The airflow turbulence portion 200 of the first and second embodiments has two V-shaped hem structures, and each of the V-shaped hem structures and the heat generating component 3 is formed into a narrow portion. Therefore, the cold flow of each of the narrow portions can form a luxury flow to improve the heat transfer coefficient 'in" plus convective heat transfer efficiency. In order to verify the effect of the air hood and the conventional air hood of the present invention, the applicant For the customary pre-s...

型折妹it & $ 導几罩、以及本發明中設計一個V 進行了^、風罩與設計兩個V型折邊結構的導風罩 订了相關之测試實驗’經測試實驗可得到下表,盆中 • DIMM 1至12代表不π夕双也 竹q卜衣具中, 正面進行測試,B表;在㈣兀件’ F表示在發熱元件的 溫度等於85表-X "、、兀件的背面進行測試,標準 寻肋表不不能超過85度。 110879 12 201008458 參 測試位置 無凹折部 j:導風罩 具有兩個凹折 部之婁風罩The model of the folding and it<<>> and the design of a V in the present invention, the windshield and the design of the two V-shaped hemming structure of the windshield are related to the test experiment 'tested by the test The following table, in the basin • DIMM 1 to 12 represents not π 双 也 也 q q q 衣 衣 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Test the back of the piece, the standard ribbed table should not exceed 85 degrees. 110879 12 201008458 Reference Test position No concave fold j: Air hood Hood hood with two concave folds

具有一個凹折 部之導風罩Air hood with a concave fold

由上表可知,加了兩個?型折邊結構之後,可增加通 過該發熱7G# 3的氣流擾動,溫度之降幅亦普遍較大; 然,亚非增加愈多V型折邊結構,該發熱元件3的溫度降 110879 13 201008458 ’在本實驗中,三個v型折邊結構的降溫效果與兩 . V!折邊結構的降溫效果相似。 •、首综上所述,本發明導風罩藉由氣流紊流部之設計,者 =7蓋_熱元件時’通過該氣流奮流部改變風道: 冑冷乳流通過該氣流紊流部時增加氣流擾動而強 料=效果,有效增加對流換熱係數,而有效達到提高 • 政熱效率之目的。 口 由換熱區之氣流擴散部的設計,以使氣流的 快散=曰大’而達到減小風阻之目的,進而使熱氣流較 上述實施例僅例示性說明本發明之 .非用於限制本發明。任何熟習此項技藝之人士及均可力在效 本㈣之精神及範訂’對上述實施例進行修錦‘ 變。因此,本發明之權利保護範圍,應 範圍所列。 甲”月專利 ❹【圖式簡單說明】 第1Α及1Β圖係為習知導風罩之應用示意圖; ί 2Β = 明導風罩之第-實施例之立體圖; 裝置之第示3意圖圖係^本及發明導風罩之第二實施例應用於電子 第4圖係為本發明導風罩之第三實 子裝置之示意圖。 應用於電 ]10879 14 201008458 【主要元件符號說明】 1、2 導風罩 10、2a 頂蓋 11、2b 側壁 12, 210 入風口 13,220 出風口 .14, 4 主板 15 ' 3 發熱元件 Ο 16 散熱風扇 160 氣流 20 換熱區 200 、 200, 氣流紊流部 201 氣流擴散部 200a 、 200a, 第一斜面 200b、200b’ 第二斜面 ^ 21,2V 翁 入風部 211 氣流下壓部 22 出風部 5 風扇模組 50 冷氣流 6 風道 Θ 夾角As can be seen from the above table, two more were added? After the hemming structure, the airflow disturbance through the heat generation 7G#3 can be increased, and the temperature drop is generally large; however, the more the V-fold structure is added, the temperature drop of the heating element 3 is 110879 13 201008458 ' In this experiment, the cooling effect of the three V-shaped hemming structures is similar to that of the two V-folded structures. • In summary, the air deflector of the present invention is designed by the airflow turbulence portion, and when the cover is replaced by the airflow portion, the air passage is changed by the airflow turbulence: When the Ministry increases the airflow disturbance and the strong material=effect, it effectively increases the convective heat transfer coefficient, and effectively achieves the purpose of improving the political efficiency. The airflow diffusing portion of the heat exchange zone is designed to reduce the airflow by the fast flow of the airflow, so that the hot airflow is merely illustrative of the present invention than the above embodiments. this invention. Anyone who is familiar with the art can use the spirit of the (4) and the formula to make a change to the above embodiment. Therefore, the scope of the invention should be construed as being within the scope of the invention. A "monthly patent" [simplified description of the drawings] The first and second diagrams are schematic diagrams of the application of the conventional air hood; ί 2Β = the perspective view of the first embodiment of the hood; the third diagram of the apparatus The second embodiment of the invention and the invention air hood is applied to the electronic fourth diagram which is a schematic diagram of the third real sub-assembly of the air duct of the present invention. Application to electricity] 10879 14 201008458 [Description of main component symbols] 1, 2 Air hood 10, 2a Top cover 11, 2b Side wall 12, 210 Air inlet 13, 220 Air outlet. 14, 4 Main board 15 ' 3 Heating element Ο 16 Cooling fan 160 Air flow 20 Heat exchange area 200, 200, Air flow turbulence part 201 Air flow Diffusion portion 200a, 200a, first inclined surface 200b, 200b' second inclined surface ^ 21, 2V Weng inlet portion 211 air flow lowering portion 22 air outlet portion 5 fan module 50 cold air flow 6 air passage 夹 angle

Claims (1)

201008458 * 十、申請專利範圍: ,1· 種‘風罩,係應用於具有發熱元件之電子裝置中, , 該電子裝置包括-主板及-風扇模組,該發熱元件設 於該主板上’且該導風罩罩蓋該發熱元件而與該主板 形成一風道,該導風罩包括: - 一入風部,具有位於該風道一側之入風口,該入 • 風口連接該風扇模組,使該風扇模組所產生的冷氣流 由該入風口進入該風道; β 一出風部,具有位於該風道相對該入風口之一侧 之出風口;以及 換熱區,設於該入風口及出風口之間,且位於 该發熱7C件上方,使由該入風口進入的冷氣流在該換 熱區以與該發熱元件進行熱交換,且在該換熱區形成 熱氣流而由該出風部之出風口排出,該換熱區具有一 氣流紊流部,且該氣流紊流部鄰近該入風部,以藉該 Φ 氣流紊流部使進入該換熱區之冷氣流增加氣流擾 動’而提高換熱係數。 2. 如申請專利範圍第丨項之導風罩,其_,該入風部復 具有一氣流下壓部,設於該入風口與該換熱區之間, 以使由該風扇模組所產生的冷氣流下壓集中至該換 熱區,而使冷氣流的流速增加。 3. 如申凊專利範圍第1項之導風罩,其中,該換熱區復 具有一氣流擴散部,設於該氣流紊流部及該出風部之 間’以降低氣流的風阻。 110879 16 201008458 4.如申請專利範圍第i項之 5· 冑具有至少-V型折邊結構。 流 如申》月專利範圍第1項之導風直 士 料有第-斜面及第二斜面,該第二斜面 6· :,該第二斜面沿氣流方向設置於該第一斜面之: 侧,為該換熱區頂部内壁沿氣流方向向 ❸ 7. 1請專㈣圍第5項之導風罩,其中,;^斜及面第 一斜面形成V型折邊結構。 如申明專利範圍第5項之導風罩,其中,該 :乱机擴政部,設於該氣流奈流部之第 該出風部之間。 久 8. 如申請專利範圍第7項之導 部為今施劫「. 罩其中’該氣流擴散 而為該換熱區之頂部内壁沿氣流方向向上傾斜之斜 9. ,並與該氣流棄·流部之第_ ' ❹ ,. |之弟一斜面的傾斜角度相同。 如申請專利範圍第8項之導 邱座"丁 貝之導風罩’其中,該氣流擴散 邛與水平面的夾角小於三十度。 1 〇·如申請專利範圍第5項 «. „ 項之ν風罩,其中,該入風部復 具有一氣流下壓部,為芍於兮λ π t 之門& & 為°又於該入風口與該氣流紊流部 之間的向下傾斜面。 如申請專利範圍第1〇 歡加k 貝(導風罩,其中,該氣流下 U與該氣流|流部之第—斜面相連。 12.如申請專利範圍第】〇 m±n k 視ι等風罩,其中,該氣流下 屋口 ί5與該氣流紊流部之第一钭 么 a弟斜面的傾斜角度相同。 110879 17201008458 * X. Patent application scope: 1) A type of hood is applied to an electronic device having a heating element, and the electronic device includes a main board and a fan module, and the heating element is disposed on the main board. The air hood covers the heating element to form a air duct with the main board, and the air hood includes: - an air inlet portion having an air inlet on a side of the air duct, the air inlet connecting the fan module The cold airflow generated by the fan module enters the air passage from the air inlet; the β air outlet portion has an air outlet located on one side of the air passage opposite to the air inlet; and the heat exchange area is disposed at the air outlet Between the air inlet and the air outlet, and located above the heat generating 7C, the cold airflow entering through the air inlet is heat exchanged with the heat generating component in the heat exchange zone, and a hot air flow is formed in the heat exchange zone. The air outlet of the air outlet portion is exhausted, the heat exchange region has a gas flow turbulence portion, and the air flow turbulence portion is adjacent to the air inlet portion, so that the cold airflow entering the heat exchange region is increased by the Φ airflow turbulence portion Airflow disturbance' to increase heat transfer coefficient2. The windshield of the scope of the patent application, wherein the air inlet portion has a lower air pressure pressing portion disposed between the air inlet and the heat exchange region, so that the fan module is The resulting cold gas stream is concentrated under pressure into the heat exchange zone to increase the flow rate of the cold gas stream. 3. The air hood of claim 1, wherein the heat exchange zone has a gas flow diffusion portion disposed between the airflow turbulence portion and the air outlet portion to reduce the airflow resistance of the airflow. 110879 16 201008458 4. As in the scope of patent application, item ii has a minimum of -V-type hemming structure. The guide wind of the first paragraph of the patent application has a first-slope and a second slope, and the second slope is disposed on the first slope along the airflow direction: For the inner wall of the top of the heat exchange zone, the direction of the airflow direction is ❸ 7. 1 Please refer to the windshield of the fifth item of the fourth (4), wherein the slope of the first slope and the first slope of the surface form a V-shaped flange structure. For example, the windshield according to item 5 of the patent scope, wherein: the chariot expansion department is disposed between the first air outlet portion of the air flow downstream portion. For a long time, the guideline of the seventh paragraph of the patent application is for the purpose of robbery ". hood" where the airflow is diffused and the top inner wall of the heat exchange zone is inclined upwards in the direction of the airflow, and is discarded with the airflow. The sloping surface of the _ ' ❹ ,. | is the same as the inclined angle of the sloping surface of the syllabus. For example, in the case of the 8th item of the patent application, the Qiuzuo " Dingbei's windshield', the angle between the airflow 邛 and the horizontal plane is smaller than Thirty degrees. 1 〇·If you apply for the Scope of the Scope of the Scope of the Scope of the . π 如 如 如 如 如 如 如 如 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风 风It is a downward inclined surface between the air inlet and the airflow turbulence. For example, in the scope of the patent application, the k-shell (the air hood) is connected to the slanting surface of the airflow|flow section. 12. If the patent scope is 〇m±nk a cover, wherein the airflow lower door ί5 is inclined at the same angle as the first slope of the airflow turbulence portion. 110879 17
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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10420254B2 (en) * 2011-11-02 2019-09-17 National University Of Singapore Heat sink assembly apparatus
WO2014038179A1 (en) * 2012-09-05 2014-03-13 パナソニック株式会社 Cooling device, electric automobile equipped with said cooling device, and electronic device
US10047457B2 (en) * 2013-09-16 2018-08-14 Applied Materials, Inc. EPI pre-heat ring
US10269325B2 (en) * 2016-02-05 2019-04-23 Advoli Limited Display system for an array of video displays
US10555441B2 (en) * 2018-01-26 2020-02-04 Super Micro Computer Inc. Winds shroud and server using the same
JP7124425B2 (en) * 2018-05-02 2022-08-24 富士電機株式会社 Chillers, semiconductor modules and vehicles
CN110715433A (en) * 2019-10-14 2020-01-21 珠海格力电器股份有限公司 Air port assembly, total heat exchange core body and fresh air system comprising same
CN113050763B (en) * 2019-12-28 2023-11-03 鸿富锦精密工业(武汉)有限公司 Wind scooper and heat radiation system
CN117395853A (en) * 2023-10-08 2024-01-12 广州南威电子有限公司 Air-cooled radiating power amplification plate radiator

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3261396A (en) * 1963-11-13 1966-07-19 Staver Co Heat dissipator for electronic circuitry
US3462553A (en) * 1966-06-02 1969-08-19 Columbia Broadcasting Syst Inc Solid-state amplifier,and control panel assembly incorporated therein
JPS6465372A (en) * 1987-09-01 1989-03-10 Saginomiya Seisakusho Inc Temperature type pressure regulating valve
JPH10200278A (en) * 1997-01-13 1998-07-31 Yaskawa Electric Corp Cooler
JP2000059058A (en) * 1998-08-04 2000-02-25 Sony Corp Cooling device
JP2003007938A (en) * 2001-06-27 2003-01-10 Ando Electric Co Ltd Cooling device of ic
US6678157B1 (en) * 2002-09-17 2004-01-13 Sun Microsystems, Inc. Electronics assembly with cooling arrangement
JP2005044857A (en) * 2003-07-23 2005-02-17 Kyocera Corp Cooling mechanism
US7061761B2 (en) * 2004-07-30 2006-06-13 Hewlett-Packard Development Company, L.P. System and method for cooling components in an electronic device
US7180740B2 (en) * 2004-09-30 2007-02-20 Datech Technology Co., Ltd. Method and apparatus for side-type heat dissipation
US7506682B2 (en) * 2005-01-21 2009-03-24 Delphi Technologies, Inc. Liquid cooled thermosiphon for electronic components

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