TWI507862B - Electronic device and heat dissipation module thereof - Google Patents

Description

Electronic device and its heat dissipation module

The invention relates to a heat dissipation module, in particular to a heat dissipation module which provides better heat dissipation efficiency.

The heat dissipation design of notebook computers mainly relies on fans, heat pipes and heat sink fins. In recent years, the design of notebooks has been light and thin. The design of heat sink modules is a big test for thin notebooks. When the traditional heat dissipation module is used in a thin and thin notebook, the internal space of the notebook computer is insufficient, and the gap between the heat sink fin and the surface of the notebook computer is small, and the surface temperature of the notebook computer corresponding to the upper and lower sides of the heat dissipation fin is often Very high, causing user discomfort in operation.

The present invention provides a heat dissipation module for solving the problems of the prior art, including a fan and a heat sink. The fan includes an air outlet, wherein an air flow is guided by the fan to be blown out from the air outlet. The heat sink includes a heat pipe and a fin structure. The heat pipe includes a first heat pipe surface and a second heat pipe surface. The first heat pipe surface is opposite to the second heat pipe surface, wherein the heat pipe transmits a heat. The surface of the second heat pipe of the heat pipe is connected to the fin structure, and part of the heat enters the fin structure from the heat pipe in a conductive manner. The fin structure includes a plurality of heat dissipation channels, and the air outlet corresponds to the heat sink. a part of the airflow is directly sent through the heat dissipation channels after being sent out from the air outlet to partially The heat is carried away from the fin structure, and a portion of the airflow is directly blown through the first heat pipe surface after being sent out from the air outlet to remove a portion of the heat from the heat pipe. Each heat sinking prop has an air inlet. The height of the air outlet of the fan is greater than the height of the air inlets of the heat dissipation channels of the fin structure.

In an embodiment, the fin structure further includes a first structural surface and a second structural surface, the first structural surface contacting the second heat pipe surface, and a portion of the airflow is blown through the second structural surface to A portion of this heat is carried away from the fin structure.

In an embodiment of the invention, a gas stream is blown through the surface of the first heat pipe and the surface of the second structure to help dissipate heat from the upper and lower surfaces of the heat sink, to avoid heat concentration, and to prevent the outer surface of the electronic device from being too hot. User discomfort.

1‧‧‧ Thermal Module

10‧‧‧fan

11‧‧‧air outlet

12‧‧‧Shroud

121‧‧‧First flow guiding element

122‧‧‧Second flow guiding element

13‧‧‧ Windshield

14‧‧‧Auxiliary bonding structure

20‧‧‧ radiator

21‧‧‧ heat pipe

211‧‧‧First heat pipe surface

212‧‧‧second heat pipe surface

22‧‧‧Fin structure

221‧‧‧First structural surface

222‧‧‧Second structural surface

223‧‧‧heating runner

231‧‧‧First Thermal Connections

232‧‧‧Second heat conduction joint

E‧‧‧Electronic device

h‧‧‧Chassis

H1‧‧‧first inner wall

H2‧‧‧second inner wall

G1‧‧‧first spacing

G2‧‧‧first spacing

1 is a top view showing a heat dissipation module of an embodiment of the present invention; FIG. 2 is a perspective view showing a partial structure of a heat dissipation module according to an embodiment of the present invention; and FIG. 3 is a view showing a heat dissipation module of the embodiment of the present invention. A partial cross-sectional view of an electronic device.

1 is a plan view showing a heat dissipation module according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a partial structure of a heat dissipation module according to an embodiment of the present invention. Referring to Figures 1 and 2, the heat dissipation module 1 of the embodiment of the present invention includes a fan 10 and a heat sink 20. The fan 10 includes an air outlet 11 in which A gas flow is guided by the fan 10 and blown out from the air outlet 11. The heat sink 20 includes a heat pipe 21 and a fin structure 22.

Figure 3 is a partial cross-sectional view showing the heat dissipation module of the embodiment of the present invention in an electronic device. Referring to Figures 2 and 3, the heat pipe 21 includes a first heat pipe surface 211 and a second heat pipe surface 212 opposite to the second heat pipe surface 212, wherein the heat pipe 21 transmits a heat. The second heat pipe surface 212 of the heat pipe 21 is connected to the fin structure 22, and a portion of the heat enters the fin structure 22 from the heat pipe 21 in a conductive manner. The fin structure 22 includes a plurality of heat dissipation channels 223. The air outlet 11 corresponds to the heat sink 20, and part of the airflow passes through the heat dissipation channels 223 to take part of the heat away from the fin structure 22, and part of the airflow passes through the first heat pipe surface 211 to A portion of this heat is carried away from the heat pipe 21.

Referring to FIG. 3, the fin structure 22 further includes a first structural surface 221 and a second structural surface 222. The first structural surface 221 contacts the second heat pipe surface 212, whereby heat is transferred from the heat pipe 21 to The fin structure 22. A portion of the gas stream is blown through the second structural surface 222 to carry a portion of the heat away from the fin structure 22.

Referring to Figures 2 and 3, the fan further includes a shroud 12, the shroud 12 is disposed at the air outlet 11, the shroud 12 includes a first flow guiding element 121 and a second flow guiding element. 122. The first flow guiding element 121 and the second flow guiding element 122 are flared, and part of the airflow is guided by the first guiding component 121 and the second guiding component 122 to respectively pass through the first heat pipe. Surface 211 and the second structural surface 222.

Referring to Figures 2 and 3, each heat dissipation channel 223 has a pass. a first gap d1 is formed between the first flow guiding element 121 and the first heat pipe surface 211, and a second gap d2 is formed between the second flow guiding element 122 and the second structural surface 222. The first gap d1 and the second gap d2 are both equal to the channel width d.

In an embodiment of the invention, a gas stream is blown through the surface of the first heat pipe and the surface of the second structure to help dissipate heat from the upper and lower surfaces of the heat sink, to avoid heat concentration, and to prevent the outer surface of the electronic device from being too hot. User discomfort.

Referring to FIG. 2, the fan 10 further includes a second windshield wall 13 and an auxiliary bonding structure 14 respectively disposed on both sides of the longitudinal direction of the air outlet 11 and located on the surface of the first heat pipe. Above the 211, the windshield wall 13 limits the blowing direction of the airflow to concentrate the airflow, reduce eddy current generation, and improve heat dissipation efficiency. The auxiliary bonding structure 14 enhances the bond between the fan 10 and the heat sink 20.

Referring to FIG. 3, an embodiment of the present invention also provides an electronic device E including a casing h, a circuit board (not shown), and a heat source (not shown). The circuit board is disposed in the casing h. A heat source is provided on the circuit board. The heat source can be a central processing unit (CPU) or other wafer. The heat dissipation module 1 is disposed in the casing h, wherein the heat is transferred from the heat source to the heat pipe 21. Referring to FIG. 1 , in this embodiment, the heat pipe 21 is provided with a first heat-conducting connection portion 231 and a second heat-conducting connection portion 232 . The first heat-conducting connection portion 231 and the second heat-conducting connection portion 232 can respectively connect different heat sources. (eg, a wafer) dissipates heat from the heat generated by the heat source.

Referring to FIG. 3, the first heat pipe surface 211 and the casing h A first spacing g1 is formed between the first inner walls h1, and each of the heat dissipation channels has a channel width d (refer to FIG. 2). The first spacing g1 is about 1.5 to 2 times the width d of the channel. A second spacing g2 is formed between the second structural surface 222 and the second inner wall h2 of the casing, and the second spacing g2 is about 1.5 to 2 times the width d of the passage. It can be seen from FIG. 3 that in the embodiment of the present invention, by appropriately designing the sizes of the first pitch g1 and the second pitch g2, a heat dissipation flow path is formed between the inner wall of the casing and the upper and lower surfaces of the heat sink to help dissipate heat. The upper and lower surfaces of the device dissipate heat. In the embodiment of the present invention, since the first pitch g1 and the second pitch g2 are both about 1.5 to 2 times the width d of the channel, the wind pressure is not lost, and the wind resistance is reduced. To achieve the effect of improving heat dissipation efficiency.

Although the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

10‧‧‧fan

11‧‧‧air outlet

12‧‧‧Shroud

121‧‧‧First flow guiding element

122‧‧‧Second flow guiding element

21‧‧‧ heat pipe

211‧‧‧First heat pipe surface

212‧‧‧second heat pipe surface

22‧‧‧Fin structure

221‧‧‧First structural surface

222‧‧‧Second structural surface

223‧‧‧heating runner

E‧‧‧Electronic device

h‧‧‧Chassis

H1‧‧‧first inner wall

H2‧‧‧second inner wall

G1‧‧‧first spacing

G2‧‧‧first spacing

Claims (10)

A heat dissipation module includes: a fan, including an air outlet, wherein a airflow is guided by the fan and blown out from the air outlet; and a heat sink includes: a heat pipe including a first heat pipe surface and a second heat pipe a surface of the first heat pipe opposite to the surface of the second heat pipe, wherein the heat pipe transmits a heat; and a fin structure, wherein the second heat pipe surface of the heat pipe is connected to the fin structure, and the heat is partially The heat transfer tube enters the fin structure from the heat pipe. The fin structure includes a plurality of heat dissipation flow channels, and the air outlet port corresponds to the heat sink, and a part of the air flow is directly sent through the heat dissipation flow channels after being sent out from the air outlet. Taking a portion of the heat away from the fin structure, a portion of the airflow is directly blown through the first heat pipe surface after being sent out from the air outlet to remove a portion of the heat from the heat pipe, each heat dissipation prop There is an air inlet; wherein the height of the air outlet of the fan is greater than the height of the air inlets of the heat dissipation channels of the fin structure. The heat dissipation module of claim 1, wherein the fin structure further comprises a first structural surface and a second structural surface, the first structural surface contacting the second heat pipe surface, and the airflow is partially The second structural surface is blown to remove a portion of the heat away from the fin structure. The heat dissipation module of claim 2, wherein the fan further comprises a flow guide cover, the flow guide cover is disposed at the air outlet, the flow guide cover includes a first flow guiding component and a second a flow guiding element, part of the air flow being subjected to the first guide The flow element and the second flow guiding element are guided to blow through the first heat pipe surface and the second structure surface, respectively. The heat dissipation module of claim 3, wherein each of the heat dissipation flow props has a channel width, and a first gap is formed between the first flow guiding element and the first heat pipe surface, the second flow guiding A second gap is formed between the component and the surface of the second structure, and the first gap and the second gap are both equal to the width of the channel. The heat dissipation module of claim 1, wherein the fan further comprises a flow guide cover, the flow guide cover is disposed at the air outlet, the flow guide cover includes a first flow guiding component, and the portion The airflow is directed through the first flow guiding element and blows through the surface of the first heat pipe. The heat dissipation module of claim 5, wherein each of the heat dissipation flow props has a channel width, and a first gap is formed between the first flow guiding element and the first heat pipe surface, and the first gap is about Equal to the width of the channel. The heat dissipation module of claim 1, wherein the fan further comprises a second windshield wall respectively disposed on two sides of the longitudinal direction of the air outlet and located on the surface of the first heat pipe Above, the windshield wall restricts the blowing direction of the airflow. An electronic device comprising: a casing; a circuit board disposed in the casing; a heat source disposed on the circuit board; and the heat dissipation module according to claim 1 of the patent application In the casing, the heat is transferred from the heat source to the heat pipe. The electronic device of claim 8, wherein a first spacing is formed between a surface of the first heat pipe and a first inner wall of the casing, and each of the heat dissipation flow props has a channel width, the first The pitch is about 1.5 to 2 times the width of the channel. The electronic device of claim 9, wherein the fin structure further comprises a first structural surface and a second structural surface, the first structural surface contacting the surface of the second heat pipe, and the portion of the airflow is blown Passing the surface of the second structure to remove a portion of the heat from the fin structure, and forming a second spacing between the surface of the second structure and a second inner wall of the casing, the second spacing being approximately The channel is 1.5 to 2 times the width.