TWM453880U - Heat dissipating device and display card module - Google Patents

Abstract

A heat dissipating device includes a base, a heat pipe, a fan, a cover, a plurality of heat dissipating fins and a plurality of wind guiding caps. The heat pipe is disposed on the base, wherein the heat pipe has a heat absorbing segment and a heat dissipating segment extended from one side of the heat absorbing segment. The fan is disposed on the heat absorbing segment. The cover is disposed on the fan and has a wind enter opening. The heat dissipating fins are disposed on the heat dissipating segment and an air channel is formed between the heat dissipating fins and a bottom of the base. The wind guiding caps are disposed on the heat dissipating segment, one of the wind guiding caps is connected to one side of the cover, and a wind exhaust opening is formed between two adjacent wind guiding caps.

Description

Heat sink and display card module

The present invention relates to a heat dissipating device and a display card module, and more particularly to a heat dissipating device using an air guiding hood to enhance the heat dissipating effect, and a display card module using the heat dissipating device.

Heat sinks are closely related to the development of electronic products. Since the current in the circuit generates unnecessary heat due to the influence of the impedance when the electronic product is in operation, if the thermal energy cannot be effectively eliminated and accumulated on the electronic components inside the electronic product, the electronic component may be raised because of the rising The temperature is damaged. Therefore, the advantages and disadvantages of the heat sink affect the operation of electronic products. At present, the most commonly used heat sink for electronic products is to connect the heat-dissipating section of the heat pipe to the heat-dissipating fins by contacting the heat-absorbing section of the heat pipe, and to dissipate heat-dissipating fins by the fan. However, the conventional heat pipe and the fan system are respectively disposed on the opposite sides of the heat dissipation fins, and the heat dissipation fins reduce the wind flow of the fan to the heat dissipation section of the heat pipe, so that the heat dissipation effect is deteriorated.

The present invention provides a heat sink using a wind deflector to enhance the heat dissipation effect, and a display card module using the heat sink to solve the above problems.

According to an embodiment, the heat sink of the present invention comprises a base, a heat pipe, a fan, a cover, a plurality of heat dissipation fins, and a plurality of air hoods. The heat pipe is disposed on the base, wherein the heat pipe has a heat absorption section and a heat dissipation section, and the heat dissipation section is one of the self-heat absorption sections The side extends. The fan is placed on the heat absorption section. The cover body is disposed on the fan, and the cover body has an air inlet. The heat dissipation fins are disposed on the heat dissipation section, and an air flow channel is formed between the heat dissipation fins and one of the bottom surfaces of the base. The air guiding cover is disposed on the heat dissipating portion and covers the heat dissipating fins. One of the air guiding hoods is adjacent to one side of the cover body, and each of the two adjacent air guiding hoods has an air outlet. The airflow blown by the fan from the air inlet of the cover body flows through the gap between the air flow passage and the heat dissipation fin, and is blown out from the air outlet of the air guide.

In this embodiment, each of the air guiding hoods has an air deflecting slab, the angle between the wind deflecting swash plate and a horizontal line is greater than 0 degrees and less than 90 degrees, and the air outlet is formed in each of the two adjacent air guiding hoods. Between the two wind deflectors.

According to another embodiment, the display card module of the present invention comprises a display card and a heat sink. The display card contains a display wafer. The heat sink is disposed on the display card. The heat dissipating device comprises a base, a heat pipe, a fan, a cover body, a plurality of heat dissipating fins and a plurality of air guiding hoods. The heat pipe is disposed on the base, wherein the heat pipe has a heat absorption section and a heat dissipation section, wherein the heat absorption section absorbs heat generated by the display wafer, and the heat dissipation section extends from one side of the heat absorption section. The fan is placed on the heat absorption section. The cover body is disposed on the fan, and the cover body has an air inlet. The heat dissipation fins are disposed on the heat dissipation section, and an air flow channel is formed between the heat dissipation fins and one of the bottom surfaces of the base. The air guiding cover is disposed on the heat dissipating portion and covers the heat dissipating fins. One of the air guiding hoods is adjacent to one side of the cover body, and each of the two adjacent air guiding hoods has an air outlet. The airflow blown by the fan from the air inlet of the cover body flows through the gap between the air flow passage and the heat dissipation fin, and is blown out from the air outlet of the air guide.

In this embodiment, each of the air guiding hoods has an air deflecting slab, the angle between the wind deflecting swash plate and a horizontal line is greater than 0 degrees and less than 90 degrees, and the air outlet is formed in each of the two adjacent air guiding hoods. Between the two wind deflectors.

In summary, the airflow blown by the fan from the air inlet of the cover body first flows through the airflow passage between the heat dissipation fin and the bottom surface of the base, and then flows through the gap between the heat dissipation fins through the airflow passage to make the airflow The heat dissipation section and the heat dissipation fin of the heat pipe can be more evenly blown, thereby effectively improving the heat dissipation effect. In addition, the angle between the wind deflecting swash plate of the air guiding hood and the horizontal line is greater than 0 degrees and less than 90 degrees, so that the air flow is blown out from the air outlet of the air guiding hood away from the air inlet, thereby effectively preventing the air outlet from being blown out. The hot air is blown in by the fan from the air inlet.

The advantages and spirit of this creation can be further understood by the following detailed description of the creation and the drawings.

Please refer to FIG. 1 to FIG. 8 . FIG. 1 is a combination diagram of the display card module 1 according to the first embodiment of the present creation, and FIG. 2 is a combination diagram of the heat dissipation device 12 in the first view. FIG. 3 is a combination view of the heat sink 12 in FIG. 1 after removing the cover 126, FIG. 4 is an exploded view of the heat sink 12 in FIG. 1, and FIG. 5 is a display card in FIG. FIG. 6 is a cross-sectional view of the heat dissipation fins 128 and the air guiding cover 130 in FIG. Explosion diagram from another perspective, Fig. 8 is the heat pipe 122 in Fig. 1, A combination view of the heat dissipation fins 128 and the air hood 130 at another viewing angle.

As shown in FIGS. 1 to 5, the display card module 1 includes a display card 10 and a heat sink 12. Display card 10 includes a display wafer 100. The heat sink 12 is disposed on the display card 10 for dissipating heat from the display wafer 100 of the display card 10. It should be noted that the heat sink 12 can also be disposed on other electronic components, and is not limited to being disposed on the display card 10.

The heat sink 12 includes a base 120 , a heat pipe 122 , a fan 124 , a cover 126 , a plurality of heat dissipation fins 128 , and a plurality of air hoods 130 . The heat pipe 122 is disposed on the base 120. In this embodiment, four heat pipes 122 are disposed on the base 120. It should be noted that the number of heat pipes 122 may be increased or decreased according to practical applications, and is not limited to the embodiment illustrated in the drawings. The heat pipe 122 has a heat absorption section 1220 and a heat dissipation section 1222, wherein the heat dissipation section 1222 extends from one side of the heat absorption section 1220. The heat absorption section 1220 is for absorbing the heat generated by the display wafer 100 and then conducting the heat to the heat dissipation section 1222. The fan 124 is disposed on the heat absorption section 1220. The fan 124 can be a centrifugal fan or an axial fan, depending on the application.

In this embodiment, the heat dissipation fins 128 and the plurality of air guiding covers 130 are respectively disposed on two sides of the fan 124. Therefore, each heat pipe 122 has two heat dissipation sections extending from two sides of the heat absorption section 1220. 1222, in combination with the corresponding heat dissipation fins 128 and the plurality of air hoods 130 for heat dissipation. However, in another embodiment, the present invention can also provide the heat dissipation fins 128 and the plurality of air hoods 130 on only one side of the fan 124. Each of the heat pipes 122 has only a single heat dissipating section 1222 extending from one side of the heat absorbing section 1220. It should be noted that the structural composition of the heat pipe 122 and the principle of its operation are well known to those skilled in the art, and will not be described herein. In addition, the structural design and operation principle of the heat dissipating fins 128 disposed on the two sides of the fan 124 are substantially the same. The following uses only the one-side heat dissipating fins 128 and the air guiding hood 130 to illustrate the technical features of the present invention. .

In this embodiment, the heat sink 12 can include a heat conducting seat 132 disposed on the base 120. At this time, the heat absorption section 1220 of the heat pipe 122 is fixed to the heat conduction seat 132. The thermally conductive seat 132 can be made of copper or other thermally conductive material. After the display card module 1 is assembled, one surface of the thermal conductive seat 120 is exposed and contacts the display wafer 100 to conduct heat generated during operation of the display wafer 100 to the heat absorption section 1220 of the heat pipe 122, and then conduct heat by the heat absorption section 1220. To the heat sink segment 1222.

The cover 126 is disposed on the fan 124, and the cover 126 has an air inlet 1260. The heat dissipation fins 128 are disposed on the heat dissipation portion 1222 of the heat pipe 122 such that an air flow channel 134 is formed between the heat dissipation fins 128 and one of the bottom surfaces 1200 of the base 120. In this embodiment, the heat dissipation fins 128 may have a U-shape to increase the space between the air flow channels 134. The air hood 130 is also disposed on the heat dissipation portion 1222 of the heat pipe 122 and covers the heat dissipation fins 128. One of the air guiding covers 130 is adjacent to one side of the cover body 126 to prevent airflow A blown by the fan 124 from the air inlet 1260 from leaking between the air guiding cover 130 and the cover body 126.

In this embodiment, each of the heat dissipation fins 128 has a fixing hole 1280 through which the heat dissipation portion 1222 of the heat pipe 122 is disposed, and each of the air conduction cover 130 has a heat dissipation tube 122. The heat segment 1222 is provided with a fixing hole 1300 as shown in FIGS. 6 and 7. The assembly personnel can pass the heat dissipation portion 1222 of the heat pipe 122 through the fixing hole 1300 of the air guiding cover 130 and the fixing hole 1280 of the heat dissipation fin 128, and the air guiding cover 130 and the heat dissipation fin 128 are alternately disposed on the heat dissipation portion of the heat pipe 122. On the 1222, as shown in Figure 8.

After the assembly is completed, there is an air outlet 1302 between each two adjacent air hoods 130. In this embodiment, each of the air hoods 130 has an air deflector 1304, wherein an angle α between the wind deflector 1304 and a horizontal line 136 is greater than 0 degrees and less than 90 degrees. The air outlet 1302 is formed between the two wind deflecting plates 1304 of each two adjacent air guiding covers 130. As shown in FIGS. 6 and 7, the wind deflecting plate 1304 has a first air guiding portion 1304a and a second air guiding portion 1304b, wherein the length L1 of the first air guiding portion 1304a is greater than the second air guiding portion 1304b. The length L2 is such that the first air guiding portion 1304a and the second air guiding portion 1304b of each two adjacent air guiding covers 130 are offset from each other. Thereby, the air outlet 1302 between each two adjacent air hoods 130 can be effectively increased, and the visual effect of the appearance of the heat sink 12 is enhanced.

With the above arrangement, the airflow A blown by the fan 124 from the air inlet 1260 of the cover 126 first flows through the air flow passage 134 between the heat dissipation fin 128 and the bottom surface 1200 of the base 120, and then flows through the heat dissipation fin. The gap between the sheets 128 is blown out from the air outlet 1302 of the air hood 130. As shown in FIG. 5, the airflow A blown by the fan 124 from the air inlet 1260 of the cover 126 flows through the airflow passage 134 in a first direction D1 and flows through the heat dissipation fins 128 in a second direction D2. The gap is blown out from the air outlet 1302 in a third direction D3. In this embodiment, the first direction D1 is substantially parallel to the base 120. The bottom surface 1200, the second direction D2 is substantially perpendicular to the bottom surface 1200 of the base 120, and the angle α between the third direction D3 and the horizontal line 136 is greater than 0 degrees and less than 90 degrees. Thereby, the airflow can more uniformly blow the heat dissipation section 1222 of the heat pipe 122 and the heat dissipation fins 128, thereby effectively improving the heat dissipation effect. In addition, the angle α between the wind deflector 1304 of the air guiding hood 130 and the horizontal line 136 is greater than 0 degrees and less than 90 degrees, so that the airflow may be from the air outlet 1302 of the air guiding hood 130 toward the air inlet 1260 away from the cover 126. Since it is blown out, it is possible to effectively prevent the hot air blown out from the air outlet 1302 from being blown in by the fan 124 from the air inlet 1260. In this embodiment, the air hood 130 and the heat dissipation fins 128 may be made of a metal material having good thermal conductivity (for example, aluminum), but not limited thereto. In another embodiment, the air hood 130 can also be made of a plastic material.

With Figure 6, please refer to Figure 9. FIG. 9 is a schematic view of the air guiding hood 130' and the heat dissipating fins 128 according to the second embodiment of the present invention. The main difference between the air hood 130' and the air hood 130 described above is that the wind deflector 1304' of the air hood 130' has a wave shape. When the air guiding hood 130 in FIGS. 1 to 8 is replaced with the air guiding hood 130' in FIG. 9, the peaks of each two adjacent air guiding hoods 130' are opposite to the troughs. In other words, the creation can change the visual effect of the appearance of the heat sink by changing the shape of the wind deflector of the air duct. It should be noted that the components of the same reference numerals as those shown in FIG. 6 have substantially the same operation principle, and are not described herein again.

With Figure 6, please refer to Figure 10. 10 is a schematic view of the air hood 130" and the heat dissipation fins 128 according to the third embodiment of the present invention. The main difference between the air hood 130 and the air hood 130 is that the air hood 130" Wind deflector 1304" for etc. length. The air hood 130 in FIGS. 1 to 8 can be replaced by the air hood 130" in Fig. 10. In other words, the present invention can change the appearance of the heat sink by changing the shape of the wind deflector of the air hood. The visual effect of the components of the same reference numerals as those shown in FIG. 6 in FIG. 10 is substantially the same, and details are not described herein again.

For the cooperation with Figures 6 to 8, please refer to Figure 11. 11 is a schematic view of the air guiding hood 130 ′′′, the heat pipe 122 and the heat dissipation fins 128 according to the fourth embodiment of the present invention. The air hood 130 ′′′ is mainly different from the air hood 130 described above in that a plurality of air hoods 130 ′′′ are integrally formed, and each air hood 130 ′′′ has heat dissipation by the heat pipe 122 ′′. Slot 1222 is embedded in segment 1222 as shown in FIG. The assembly personnel can first pass the heat dissipation portion 1222 of the heat pipe 122 through the fixing hole 1280 of the heat dissipation fin 128, and then insert the heat dissipation portion 1222 of the heat pipe 122 into the slot 1306 of the air guide cover 130"" to guide the air. The cover 130'" is covered on the heat dissipation fins 128. When the air guiding cover 130 in FIGS. 1 to 8 is replaced with the air guiding cover 130"' in FIG. 11, the assembly efficiency can be effectively increased. It should be noted that the components of the same reference numerals as those shown in FIG. 11 and FIG. 8 are substantially the same, and are not described herein again.

In summary, the airflow blown by the fan from the air inlet of the cover body first flows through the airflow passage between the heat dissipation fin and the bottom surface of the base, and then flows through the gap between the heat dissipation fins through the airflow passage to make the airflow The heat dissipation section and the heat dissipation fin of the heat pipe can be more evenly blown, thereby effectively improving the heat dissipation effect. In addition, the angle between the wind deflecting swash plate of the air guiding hood and the horizontal line is greater than 0 degrees and less than 90 degrees, so that the air flow is blown out from the air outlet of the air guiding hood away from the air inlet, thereby effectively preventing the air outlet from being blown out. The hot air is blown by the fan again In. Furthermore, the creation can change the visual effect of the appearance of the heat sink by changing the shape of the wind deflector of the air duct.

The above descriptions are only preferred embodiments of the present invention, and all changes and modifications made by the scope of the patent application of the present invention should be covered by the present invention.

1‧‧‧Display Card Module

10‧‧‧ display card

12‧‧‧ Heat sink

100‧‧‧ display chip

120‧‧‧Base

122‧‧‧heat pipe

124‧‧‧Fan

126‧‧‧ cover

128‧‧‧Heat fins

130, 130', 130", 130'''‧‧‧ hood

132‧‧‧heating seat

134‧‧‧Air passage

136‧‧‧ horizontal line

1200‧‧‧ bottom

1220‧‧‧heating section

1222‧‧‧heating section

1260‧‧‧air inlet

1280, 1300‧‧‧ fixing holes

1302‧‧‧air outlet

1304, 1304', 1304" ‧‧‧ wind deflector

1304a‧‧‧First Air Guide

1304b‧‧‧Second air duct

1306‧‧‧Slots

A‧‧‧ airflow

‧‧‧‧ angle

D1‧‧‧ first direction

D2‧‧‧ second direction

D3‧‧‧ third direction

X-X‧‧‧ hatching

Fig. 1 is a combination diagram of a display card module according to a first embodiment of the present creation.

Fig. 2 is a combination view of the heat sink of Fig. 1 in another view.

Fig. 3 is a combination view of the heat sink of Fig. 1 after the cover is removed.

Fig. 4 is an exploded view of the heat sink in Fig. 1.

Figure 5 is a cross-sectional view of the display card module taken along line X-X in Figure 1.

Figure 6 is an exploded view of the heat sink fin and the air hood in Fig. 1.

Fig. 7 is an exploded view of the heat dissipating fin and the air hood in Fig. 1 from another angle of view.

Fig. 8 is a combination view of the heat pipe, the heat dissipating fin and the air hood in Fig. 1 at another viewing angle.

Figure 9 is a schematic view of a wind deflector and a heat sink fin according to a second embodiment of the present invention.

Figure 10 is a schematic view of a wind deflector and a heat sink fin according to a third embodiment of the present invention.

Figure 11 is a schematic view of a wind deflector, a heat pipe and a heat sink fin according to a fourth embodiment of the present invention.

1‧‧‧Display Card Module

10‧‧‧ display card

12‧‧‧ Heat sink

100‧‧‧ display chip

120‧‧‧Base

122‧‧‧heat pipe

124‧‧‧Fan

126‧‧‧ cover

128‧‧‧Heat fins

130‧‧‧wind hood

132‧‧‧heating seat

134‧‧‧Air passage

136‧‧‧ horizontal line

1200‧‧‧ bottom

1220‧‧‧heating section

1222‧‧‧heating section

1260‧‧‧air inlet

1302‧‧‧air outlet

1304‧‧‧ Wind deflector

A‧‧‧ airflow

‧‧‧‧ angle

D1‧‧‧ first direction

D2‧‧‧ second direction

D3‧‧‧ third direction

Claims (20)

A heat dissipating device comprises: a base; a heat pipe disposed on the base, the heat pipe having a heat absorption section and a heat dissipation section extending from one side of the heat absorption section; a fan disposed in the heat absorption section a cover body is disposed on the fan, the cover body has an air inlet; a plurality of heat dissipation fins are disposed on the heat dissipation section, and an air flow channel is formed on the bottom surface of the heat dissipation fin and the base And a plurality of air hoods disposed on the heat dissipating portion and covering the heat dissipating fins, one of the air hoods being adjacent to one side of the cover body, and each of the two adjacent air hoods There is an air outlet; wherein the airflow blown by the fan from the air inlet flows through the gap between the airflow passage and the heat dissipation fins, and is blown out from the air outlet. The heat dissipation device of claim 1, wherein the airflow flows through the airflow passage in a first direction, flows through a gap between the heat dissipation fins in a second direction, and is blown out from the air outlet in a third direction. The first direction is parallel to the bottom surface of the base, and the second direction is perpendicular to the bottom surface of the base, and the angle between the third direction and a horizontal line is greater than 0 degrees and less than 90 degrees. The heat dissipating device of claim 1, wherein each of the air guiding hoods has a wind deflecting plate, and an angle between the wind deflecting plate and a horizontal line is greater than 0 degrees and less than 90 degrees. The air outlet is formed between the two wind deflecting plates of each two adjacent air guiding hoods. The heat dissipation device of claim 3, wherein the wind deflector has a first air guiding portion and a second air guiding portion, the length of the first air guiding portion being greater than the length of the second air guiding portion, each The first air guiding portion and the second air guiding portion of the two adjacent air guiding hoods are offset from each other. The heat sink of claim 3, wherein the wind deflector is of equal length. The heat sink of claim 3, wherein the wind deflecting slab is wavy, and the peaks of each two adjacent air hoods are opposite to the troughs. The heat sink of claim 1, wherein the air hoods are integrally formed. The heat sink of claim 1, wherein the fan is a centrifugal fan. The heat dissipating device of claim 1, wherein the fins are in a U shape. The heat dissipating device of claim 1, further comprising a heat conducting seat disposed on the base, the surface of one of the heat conducting seats being exposed, and the heat absorbing section being fixed on the heat conducting seat. A display card module comprising: a display card comprising a display chip; and a heat sink disposed on the display card, the heat sink comprising: a heat pipe having a heat absorbing section for absorbing heat generated by the display wafer, and a heat pipe extending from one side of the heat absorbing section; a fan is disposed on the heat absorbing section; a cover body is disposed on the fan, the cover body has an air inlet; a plurality of heat dissipation fins are disposed on the heat dissipation section, and an air flow channel is formed on the heat dissipation fins Between the bottom surface of the base and the bottom surface of the base; and a plurality of air hoods disposed on the heat dissipation portion and covering the heat dissipation fins, one of the air hoods adjacent to one side of the cover body, each two An air outlet is disposed between the adjacent air hoods; wherein the airflow blown by the fan from the air inlet flows through the gap between the airflow passage and the heat dissipation fins, and is blown out from the air outlet. The display card module of claim 11, wherein the airflow flows through the airflow channel in a first direction, flows through the gap between the heat dissipation fins in a second direction, and exits in a third direction The tuyere blows out, the first direction is parallel to the bottom surface of the base, the second direction is perpendicular to the bottom surface of the base, and the angle between the third direction and a horizontal line is greater than 0 degrees and less than 90 degrees. The display card module of claim 11, wherein each of the air guiding hoods has a wind deflecting plate, and the angle between the wind deflecting plate and a horizontal line is greater than 0 degrees and less than 90 degrees, and the air outlet is formed. Between the two wind deflecting slabs of each two adjacent air hoods. The display card module of claim 13, wherein the wind deflecting plate has a first air guiding portion and a second air guiding portion, wherein the length of the first air guiding portion is greater than the length of the second air guiding portion The first air guiding portion and the second air guiding portion of each two adjacent air guiding hoods are mutually offset. The display card module of claim 13, wherein the wind deflector is of equal length. The display card module of claim 13, wherein the wind deflecting slab is wavy, and the peaks of each two adjacent air hoods are opposite to the troughs. The display card module of claim 11, wherein the air hoods are integrally formed. The display card module of claim 11, wherein the fan is a centrifugal fan. The display card module of claim 11, wherein the heat dissipation fins are in a U shape. The display card module of claim 11, wherein the heat dissipating device further comprises a heat conducting seat disposed on the base, the heat absorbing segment is fixed on the heat conducting seat, and a surface of the heat conducting seat is exposed and contacts the display chip And transferring heat generated by the display wafer to the heat absorption section.