CN104470322A - Electronic device and heat dissipation module thereof - Google Patents
Electronic device and heat dissipation module thereof Download PDFInfo
- Publication number
- CN104470322A CN104470322A CN201310454390.5A CN201310454390A CN104470322A CN 104470322 A CN104470322 A CN 104470322A CN 201310454390 A CN201310454390 A CN 201310454390A CN 104470322 A CN104470322 A CN 104470322A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pipe
- tube surface
- fin structure
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title abstract description 6
- 238000009434 installation Methods 0.000 claims description 10
- 238000007664 blowing Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an electronic device and a heat dissipation module thereof. The heat dissipation module comprises a fan and a heat sink. The fan comprises an air outlet, wherein an air flow is guided by the fan to be blown out from the air outlet. The heat sink includes a heat pipe and a fin structure, the heat pipe includes a first heat pipe surface and a second heat pipe surface, the first heat pipe surface is opposite to the second heat pipe surface, wherein the heat pipe transfers a heat. The second heat pipe surface of the heat pipe is connected with the fin structure, part of the heat enters the fin structure from the heat pipe in a conduction mode, the fin structure comprises a plurality of heat dissipation flow channels, the air outlet corresponds to the radiator, part of the airflow passes through the plurality of heat dissipation flow channels to take part of the heat away from the fin structure, and part of the airflow blows over the first heat pipe surface to take part of the heat away from the heat pipe.
Description
Technical field
The present invention relates to a kind of radiating module, particularly relate to a kind of radiating module that better radiating efficiency is provided.
Background technology
The heat dissipation design of notebook computer mainly relies on fan, heat pipe and radiating fin, in recent years pen electricity be designed with lightening trend, radiating module design is a test to slim pen electricity.When traditional heat-dissipating module application is among frivolous pen electricity, not enough for fear of notebook computer inner space, space between radiating fin and notebook computer surface is little, and the notebook computer surface temperature of corresponding radiating fin upper and lower is often all very high, causes user's discomfort operationally.
Summary of the invention
A kind of radiating module that namely the present invention provides in order to the problem for solving prior art, comprises a fan and a radiator.Fan comprises an air outlet, and wherein, an air-flow blows out from this air outlet by this fan guides.Radiator comprises a heat pipe and a fin structure, and this heat pipe comprises one first tube surface and one second tube surface, and this first tube surface is contrary with this second tube surface, and wherein, this heat pipe transmits a heat.This second tube surface of this heat pipe connects this fin structure, this heat of part enters this fin structure in the mode of conduction from this heat pipe, this fin structure comprises multiple radiating flow passage, this air outlet is to should radiator, this air-flow of part is by the plurality of radiating flow passage, to be taken away from this fin structure by this heat of part, this air-flow of part blows over this first tube surface, to be taken away from this heat pipe by this heat of part.
In one embodiment, this fin structure also comprises one first body structure surface and one second body structure surface, this first body structure surface contacts this second tube surface, and this air-flow of part blows over this second body structure surface, to be taken away from this fin structure by this heat of part.
In an embodiment of the present invention, air-flow blows over this first tube surface and this second body structure surface, and to help the upper and lower surface of radiator to dispel the heat, the situation avoiding heat to concentrate produces, and avoids the outer surface of electronic installation to cross scalding and cause the discomfort of user.
Accompanying drawing explanation
Fig. 1 is the vertical view of the radiating module of the display embodiment of the present invention;
Fig. 2 is the part-structure stereogram of the radiating module of the display embodiment of the present invention; And
Fig. 3 is that the radiating module of the display embodiment of the present invention is arranged in the part sectioned view of an electronic installation.
Symbol description
1 ~ radiating module
10 ~ fan
11 ~ air outlet
12 ~ kuppe
121 ~ the first diversion members
122 ~ the second diversion members
13 ~ windbreak
14 ~ secondary combined structure
20 ~ radiator
21 ~ heat pipe
211 ~ the first tube surface
212 ~ the second tube surface
22 ~ fin structure
221 ~ the first body structure surfaces
222 ~ the second body structure surfaces
223 ~ radiating flow passage
231 ~ the first heat conduction linking parts
232 ~ the second heat conduction linking parts
E ~ electronic installation
H ~ casing
H1 ~ the first inwall
H2 ~ the second inwall
G1 ~ the first spacing
G2 ~ the first spacing
Embodiment
Fig. 1 is the vertical view of the radiating module of the display embodiment of the present invention, and Fig. 2 is the part-structure stereogram of the radiating module of the display embodiment of the present invention.Collocation is with reference to Fig. 1, Fig. 2, and the radiating module 1 of the embodiment of the present invention comprises fan 10 and a radiator 20.Fan 10 comprises an air outlet 11, and wherein, an air-flow guides by this fan 10 and blows out from this air outlet 11.Radiator 20 comprises heat pipe 21 and a fin structure 22.
Fig. 3 is that the radiating module of the display embodiment of the present invention is arranged in the part sectioned view of an electronic installation.Collocation is with reference to Fig. 2, Fig. 3, and heat pipe 21 comprises one first tube surface 211 and one second tube surface 212, and this first tube surface 211 is contrary with this second tube surface 212, and wherein, this heat pipe 21 transmits a heat.This second tube surface 212 of this heat pipe 21 connects this fin structure 22, this heat of part enters this fin structure 22 in the mode of conduction from this heat pipe 21, this fin structure 22 comprises multiple radiating flow passage 223, this air outlet 11 is to should radiator 20, this air-flow of part is by the plurality of radiating flow passage 223, to be taken away from this fin structure 22 by this heat of part, this air-flow of part blows over this first tube surface 211, to be taken away from this heat pipe 21 by this heat of part.
With reference to Fig. 3, this fin structure 22 also comprises one first body structure surface 221 and one second body structure surface 222, and this first body structure surface 221 contacts this second tube surface 212, and heat is passed to this fin structure 22 from this heat pipe 21 thus.This air-flow of part blows over this second body structure surface 222, to be taken away from this fin structure 22 by this heat of part.
Collocation is with reference to Fig. 2, Fig. 3, this fan also comprises a kuppe 12, this air outlet 11 is located at by this kuppe 12, this kuppe 12 comprises one first diversion member 121 and one second diversion member 122, first diversion member 121 and the second diversion member 122 are in outer expanding shape, and this air-flow of part is subject to the guiding of this first diversion member 121 and this second diversion member 122 and blows over this first tube surface 211 and this second body structure surface 222 respectively.
Collocation is with reference to Fig. 2, Fig. 3, each radiating flow passage 223 has a channel width d, one first gap d 1 is formed between this first diversion member 121 and this first tube surface 211, be formed with one second gap d 2 between this second diversion member 122 and this second body structure surface 222, this first gap d 1 and this second gap d 2 all approximate this channel width d.
In an embodiment of the present invention, air-flow blows over this first tube surface and this second body structure surface, and to help the upper and lower surface of radiator to dispel the heat, the situation avoiding heat to concentrate produces, and avoids the outer surface of electronic installation to cross scalding and cause the discomfort of user.
Collocation is with reference to Fig. 2, this fan 10 also comprises two windbreak 13 and secondary combined structures 14, the both sides of the length direction of this air outlet 11 are located at respectively by the plurality of windbreak 13, and be positioned at above this first tube surface 211, the blowing direction of this air-flow of the plurality of windbreak 13 restricted part, with by air flow collection, reduce eddy current and produce, and improving heat radiation efficiency.Secondary combined structure 14 can add the combination between strong wind fan 10 and radiator 20.
With reference to Fig. 3, embodiments of the invention also provide a kind of electronic installation E, comprise a casing h, circuit board (not shown) and thermal source (not shown).Circuit board is located among this casing h.Thermal source is located on this circuit board.This thermal source can be central processing unit (CPU) or other chips.Radiating module 1 is located among this casing h, and wherein, this heat is passed to this heat pipe 21 from this thermal source.Collocation is with reference to Fig. 1, in this embodiment, heat pipe 21 is provided with the first heat conduction linking part 231 and the second heat conduction linking part 232, first heat conduction linking part 231 and the second heat conduction linking part 232 and can connects different thermals source (such as, chip) respectively and dispel the heat with the heat produced thermal source.
With reference to Fig. 3, be formed with one first spacing g1 between this first tube surface 211 and the one first inwall h1 of this casing h, each radiating flow passage has channel width d (collocation is with reference to Fig. 2), and this first spacing g1 is about 1.5 ~ 2 times of this channel width d.Be formed with one second spacing g2 between this second body structure surface 222 and one second inwall h2 of this casing, this second spacing g2 is about 1.5 ~ 2 times of this channel width d.As shown in Figure 3, in an embodiment of the present invention, by the size of suitable design first spacing g1 and the second spacing g2, make to form radiating flow passage between the upper and lower surface of casing inner wall and radiator, dispel the heat to help the upper and lower surface of radiator.In an embodiment of the present invention, due to this first spacing g1 and this second spacing g2 1.5 ~ 2 times of being all about this channel width d, therefore can't cause the loss of blast, contribute to the reduction of windage on the contrary, reach the effect of improving heat radiation efficiency.
Although disclose the present invention in conjunction with above concrete preferred embodiment; but itself and be not used to limit the present invention; anyly be familiar with this operator; without departing from the spirit and scope of the present invention; can do a little change and retouching, what therefore protection scope of the present invention should define with the claim of enclosing is as the criterion.
Claims (10)
1. a radiating module, comprising:
Fan, comprises air outlet, and wherein, an air-flow blows out from this air outlet by this fan guides;
Radiator, comprising:
Heat pipe, comprises the first tube surface and the second tube surface, and this first tube surface is contrary with this second tube surface, and wherein, this heat pipe transmits a heat; And
Fin structure, wherein, this second tube surface of this heat pipe connects this fin structure, this heat of part enters this fin structure in the mode of conduction from this heat pipe, and this fin structure comprises multiple radiating flow passage, and this air outlet is to should radiator, this air-flow of part is by the plurality of radiating flow passage, to be taken away from this fin structure by this heat of part, this air-flow of part blows over this first tube surface, to be taken away from this heat pipe by this heat of part.
2. radiating module as claimed in claim 1, wherein, this fin structure also comprises the first body structure surface and the second body structure surface, and this first body structure surface contacts this second tube surface, this air-flow of part blows over this second body structure surface, to be taken away from this fin structure by this heat of part.
3. radiating module as claimed in claim 2, wherein, this fan also comprises kuppe, this air outlet is located at by this kuppe, this kuppe comprises the first diversion member and the second diversion member, and this air-flow of part is subject to the guiding of this first diversion member and this second diversion member and blows over this first tube surface and this second body structure surface respectively.
4. radiating module as claimed in claim 3, wherein, each radiating flow passage has a channel width, one first gap is formed between this first diversion member and this first tube surface, be formed with one second gap between this second diversion member and this second body structure surface, this first gap and this second gap all approximate this channel width.
5. radiating module as claimed in claim 1, wherein, this fan also comprises kuppe, and this air outlet is located at by this kuppe, and this kuppe comprises the first diversion member, and this air-flow of part is subject to the guiding of this first diversion member and blows over this first tube surface.
6. radiating module as claimed in claim 5, wherein, each radiating flow passage has channel width, is formed with one first gap between this first diversion member and this first tube surface, and this first gap approximates this channel width.
7. radiating module as claimed in claim 1, wherein, this fan also comprises two windbreaks, and the both sides of the length direction of this air outlet are located at respectively by the plurality of windbreak, and be positioned at above this first tube surface, the blowing direction of this air-flow of the plurality of windbreak restricted part.
8. an electronic installation, comprising:
Casing;
Circuit board, is located among this casing;
Thermal source, is located on this circuit board; And
Radiating module as claimed in claim 1, is located among this casing, and wherein, this heat is passed to this heat pipe from this thermal source.
9. electronic installation as claimed in claim 8, wherein, be formed with one first spacing between this first tube surface and one first inwall of this casing, each radiating flow passage has a channel width, and this first spacing is about 1.5 ~ 2 times of this channel width.
10. electronic installation as claimed in claim 9, wherein, this fin structure also comprises the first body structure surface and the second body structure surface, this first body structure surface contacts this second tube surface, this air-flow of part blows over this second body structure surface, to be taken away from this fin structure by this heat of part, be formed with one second spacing between this second body structure surface and one second inwall of this casing, this second spacing is about 1.5 ~ 2 times of this channel width.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102133801A TWI507862B (en) | 2013-09-18 | 2013-09-18 | Electronic device and heat dissipation module thereof |
| TW102133801 | 2013-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104470322A true CN104470322A (en) | 2015-03-25 |
Family
ID=52915452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310454390.5A Pending CN104470322A (en) | 2013-09-18 | 2013-09-29 | Electronic device and heat dissipation module thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104470322A (en) |
| TW (1) | TWI507862B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115315131A (en) * | 2021-05-06 | 2022-11-08 | 广州视焓科技有限公司 | Heat dissipation module and electronic equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM429315U (en) * | 2011-12-01 | 2012-05-11 | Quanta Comp Inc | Heat dissipation module |
-
2013
- 2013-09-18 TW TW102133801A patent/TWI507862B/en not_active IP Right Cessation
- 2013-09-29 CN CN201310454390.5A patent/CN104470322A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115315131A (en) * | 2021-05-06 | 2022-11-08 | 广州视焓科技有限公司 | Heat dissipation module and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI507862B (en) | 2015-11-11 |
| TW201512820A (en) | 2015-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI505073B (en) | Electronic device | |
| CN101998812B (en) | Heat-dissipating module | |
| JP2005328012A (en) | Heatsink module with wind guide fin structure | |
| CN104246648B (en) | Electronic equipment with passive type cooling | |
| CN209710561U (en) | Radiator and communication equipment | |
| CN102316700A (en) | Air guiding cover suitable for simultaneously dissipating heat of a plurality of electronic components and electronic device having air guiding cover | |
| CN213818423U (en) | Electronic equipment and heat dissipation device thereof | |
| US20140218864A1 (en) | Electronic device with cooling assembly | |
| CN204229298U (en) | Terminal device | |
| CN101916135A (en) | Electronic device | |
| CN104470322A (en) | Electronic device and heat dissipation module thereof | |
| TW201443624A (en) | Heat-dissipating structure and electronic apparatus using the same | |
| CN203884118U (en) | Active heat radiation structure in cabinet | |
| TW201309918A (en) | Heat dissipation apparatus | |
| CN205594253U (en) | Display device | |
| CN104898813B (en) | Radiator and server | |
| US7558065B2 (en) | Air guide with heat pipe and heat sink and electronic apparatus equipped with the same | |
| CN203588183U (en) | High-performance computer graphic card radiator device | |
| CN204667316U (en) | Computer radiator | |
| CN103188918B (en) | Electronic installation | |
| CN101907912B (en) | Electronic equipment | |
| TW201222216A (en) | Computer system and heat sink thereof | |
| TW201124691A (en) | Heat dissipation device | |
| CN203630711U (en) | Heat dissipation module for notebook computer | |
| CN109240472A (en) | A kind of computer host box with heat dissipation wind channel structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150325 |