TWM477763U - Electronic device - Google Patents
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- TWM477763U TWM477763U TW102224403U TW102224403U TWM477763U TW M477763 U TWM477763 U TW M477763U TW 102224403 U TW102224403 U TW 102224403U TW 102224403 U TW102224403 U TW 102224403U TW M477763 U TWM477763 U TW M477763U
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- heat
- electronic device
- circuit board
- heat dissipation
- pipe
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 77
- 238000010521 absorption reaction Methods 0.000 claims abstract description 10
- 239000012530 fluid Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 12
- 230000020169 heat generation Effects 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000004744 fabric Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本新型創作是有關於一種電子裝置，且特別是有關於一種具有整合式散熱管設計的電子裝置。The present invention relates to an electronic device, and more particularly to an electronic device having an integrated heat pipe design.
隨著現今科技的進步，由於筆記型電腦的功能日益茁壯，且其體積越來越小也便於攜帶，因此逐漸地成為消費性電子產品的市場主流。一般而言，筆記型電腦內部通常會配置有中央處理器(central processing unit，CPU)、處理晶片或其他電子元件，由於上述內部元件在運作時會產生熱能，因此筆記型電腦內大多會設置散熱模組，以進行散熱。With the advancement of today's technology, notebook computers have gradually become the mainstream of consumer electronics products due to their increasingly powerful functions and their small size and portability. Generally speaking, a notebook computer is usually equipped with a central processing unit (CPU), a processing chip or other electronic components. Since the internal components generate heat during operation, most of the notebooks are provided with heat dissipation. Module for heat dissipation.
詳細而言，習知的散熱模組可包括熱管及散熱鰭片組，熱管連接於內部元件與散熱鰭片組之間，以將內部元件運作時所產生的熱能傳導至散熱鰭片組，且散熱風扇產生可引導氣流來對散熱鰭片組進行散熱。然而，仍有內部元件運作時所產生的部分熱能會傳導至電路板上，且較難透過連接內部元件的熱管及散熱 鰭片組來將傳導至電路板上的熱能帶走，使得電路板的部分區域溫度不斷升高，進而影響到內部元件的壽命，甚至是造成電子裝置的殼體的溫度過熱。In detail, the conventional heat dissipation module may include a heat pipe and a heat dissipation fin group, and the heat pipe is connected between the internal component and the heat dissipation fin set to conduct heat energy generated by the operation of the internal component to the heat dissipation fin set, and The cooling fan produces a steerable airflow to dissipate the heat sink fin set. However, some of the thermal energy generated by the operation of the internal components is transmitted to the circuit board, and it is difficult to transmit heat through the internal components and heat dissipation. The fin group carries away the heat energy conducted to the circuit board, so that the temperature of a part of the circuit board is continuously increased, thereby affecting the life of the internal components, and even causing the temperature of the housing of the electronic device to overheat.
本新型創作提供一種電子裝置，具有良好的散熱效率。The novel creation provides an electronic device with good heat dissipation efficiency.
本新型創作的電子裝置，包括殼體、電路板、第一風扇、發熱元件以及第一散熱管。殼體具有第一側壁與面對此第一側壁的第二側壁。電路板配置於殼體內。第一風扇配置於殼體內，且鄰近第一側壁上的第一散熱孔。發熱元件配置於電路板上，且位於電路板與第一側壁之間。第一散熱管配置於電路板上，且位於電路板與第二側壁之間。第一散熱管具有吸熱端與相對於此吸熱端的散熱端，其中吸熱端鄰近發熱元件，使得發熱元件所產生的熱從該電路板傳至吸熱端，並從吸熱端傳至散熱端以進行散熱。The electronic device created by the present invention comprises a casing, a circuit board, a first fan, a heating element and a first heat pipe. The housing has a first side wall and a second side wall that faces the first side wall. The circuit board is disposed in the housing. The first fan is disposed in the housing and adjacent to the first heat dissipation hole on the first sidewall. The heating element is disposed on the circuit board and located between the circuit board and the first sidewall. The first heat pipe is disposed on the circuit board and located between the circuit board and the second sidewall. The first heat pipe has a heat absorbing end and a heat radiating end opposite to the heat absorbing end, wherein the heat absorbing end is adjacent to the heat generating component, so that heat generated by the heat generating component is transmitted from the circuit board to the heat absorbing end, and is transmitted from the heat absorbing end to the heat radiating end for heat dissipation. .
基於上述，本新型創作係將第一散熱管整合至電路板，其中第一散熱管具有相對的吸熱端與散熱端。第一散熱管的吸熱端鄰近電路板上的發熱元件，而散熱端遠離發熱元件，因此發熱元件運作時所產生的熱能可從電路板傳至第一散熱管的吸熱端，並從吸熱端傳至散熱端，以藉由散熱氣流對散熱端進行散熱，從而提升電子裝置的散熱效率。Based on the above, the novel creation system integrates the first heat pipe into the circuit board, wherein the first heat pipe has opposite heat absorption ends and heat dissipation ends. The heat absorbing end of the first heat pipe is adjacent to the heat generating component on the circuit board, and the heat radiating end is away from the heat generating component, so the heat energy generated when the heat generating component operates can be transmitted from the circuit board to the heat absorbing end of the first heat pipe, and transmitted from the heat absorbing end The heat dissipation end is used to dissipate the heat dissipation end by the heat dissipation airflow, thereby improving the heat dissipation efficiency of the electronic device.
為讓本新型創作的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will become more apparent and understood from the following description.
100、100A、100B、100C‧‧‧電子裝置100, 100A, 100B, 100C‧‧‧ electronic devices
110‧‧‧殼體110‧‧‧shell
111‧‧‧第一側壁111‧‧‧First side wall
111a‧‧‧第一散熱孔111a‧‧‧First vent
112‧‧‧第二側壁112‧‧‧ second side wall
112a‧‧‧第二散熱孔112a‧‧‧second vent
120‧‧‧電路板120‧‧‧ boards
121‧‧‧接地層121‧‧‧ Grounding layer
122‧‧‧凹槽122‧‧‧ Groove
130‧‧‧第一風扇130‧‧‧First fan
131‧‧‧散熱鰭片組131‧‧‧Fixing fin group
140‧‧‧發熱元件140‧‧‧heating components
141‧‧‧導熱板141‧‧‧heat conducting plate
142‧‧‧熱介面材料142‧‧‧Hot interface materials
150、150a、150b、150c‧‧‧第一散熱管150, 150a, 150b, 150c‧‧‧ first heat pipe
151‧‧‧吸熱端151‧‧‧heat end
152‧‧‧散熱端152‧‧‧heating end
153‧‧‧散熱流體153‧‧‧heating fluid
160‧‧‧第二散熱管160‧‧‧second heat pipe
170‧‧‧第二風扇170‧‧‧second fan
D‧‧‧厚度D‧‧‧thickness
圖1為本新型創作一實施例的電子裝置的局部剖面示意圖。1 is a partial cross-sectional view of an electronic device according to an embodiment of the present invention.
圖2為圖1的第一散熱管的示意圖。2 is a schematic view of the first heat pipe of FIG. 1.
圖3為本新型創作另一實施例的電子裝置的局部剖面示意圖。3 is a partial cross-sectional view showing an electronic device according to another embodiment of the present invention.
圖4為本新型創作再一實施例的電子裝置的局部剖面示意圖。4 is a partial cross-sectional view showing an electronic device according to still another embodiment of the present invention.
圖5為本新型創作又一實施例的電子裝置的局部剖面示意圖。FIG. 5 is a partial cross-sectional view showing an electronic device according to still another embodiment of the present invention.
圖6A至6C為本新型創作其他實施例的第一散熱管的示意圖。6A to 6C are schematic views of a first heat pipe of another embodiment of the present invention.
圖1為本新型創作一實施例的電子裝置的局部剖面示意圖。圖2為圖1的第一散熱管的示意圖。請參考圖1，在本實施例中，電子裝置100包括殼體110、電路板120、第一風扇130、發熱元件140以及第一散熱管150。電子裝置100例如為平板電腦或筆記型電腦的主機，電路板120例如是硬式電路板，其可以是紙基材銅箔積層板(FR-1、FR-2、XXXPc、XPc)、紙．環氧樹脂銅箔積層板(FR-3)、玻璃布．環氧樹脂銅箔積層板(FR-4、G10)、耐 熱玻璃布．環氧樹脂銅箔積層板(FR-5、G11)、玻璃布．聚醯亞胺系樹脂銅箔積層板(GPY)、紙．玻璃布．環氧樹脂銅箔積層板(CEM-1)、玻璃不織布．玻璃布．環氧樹脂銅箔積層板(CEM-2)、玻璃不織布．玻璃布．聚酯樹脂銅箔積層板(FR-6)或陶瓷等基材所構成的印刷電路板。在其他實施例中，電子裝置100可為其它種類之電子裝置，本新型創作不對此加以限制。1 is a partial cross-sectional view of an electronic device according to an embodiment of the present invention. 2 is a schematic view of the first heat pipe of FIG. 1. Referring to FIG. 1 , in the embodiment, the electronic device 100 includes a housing 110 , a circuit board 120 , a first fan 130 , a heating element 140 , and a first heat dissipation tube 150 . The electronic device 100 is, for example, a host computer of a tablet computer or a notebook computer. The circuit board 120 is, for example, a hard circuit board, which may be a paper substrate copper foil laminate (FR-1, FR-2, XXXPc, XPc), paper. Epoxy copper foil laminate (FR-3), glass cloth. Epoxy copper foil laminate (FR-4, G10), resistant Hot glass cloth. Epoxy copper foil laminate (FR-5, G11), glass cloth. Polyimide resin copper foil laminate (GPY), paper. Glass cloth. Epoxy copper foil laminate (CEM-1), glass non-woven fabric. Glass cloth. Epoxy copper foil laminate (CEM-2), glass non-woven fabric. Glass cloth. A printed circuit board comprising a polyester resin copper foil laminate (FR-6) or a substrate such as ceramic. In other embodiments, the electronic device 100 can be other types of electronic devices, and the present invention does not limit this.
殼體110具有第一側壁111與面對此第一側壁111的第二側壁112，其中電路板120配置於殼體100內且與第一側壁111、第二側壁112大致平行。第一風扇130配置於殼體110內，且鄰近第一側壁111上的第一散熱孔111a。另一方面，發熱元件140配置於電路板120上，其例如是接合於電路板120上的中央處理器(CPU)且位於電路板130與第一側壁111之間。在其他實施例中，發熱元件140亦可為繪圖晶片或其他在運行時會產生熱能的電子元件，本新型創作不對此加以限制。The housing 110 has a first sidewall 111 and a second sidewall 112 facing the first sidewall 111. The circuit board 120 is disposed in the housing 100 and substantially parallel to the first sidewall 111 and the second sidewall 112. The first fan 130 is disposed in the housing 110 and adjacent to the first heat dissipation hole 111 a on the first sidewall 111 . On the other hand, the heat generating component 140 is disposed on the circuit board 120, which is, for example, a central processing unit (CPU) coupled to the circuit board 120 and located between the circuit board 130 and the first sidewall 111. In other embodiments, the heat generating component 140 can also be a drawing chip or other electronic component that generates thermal energy during operation, and the present invention does not limit this.
請參考圖1與圖2，在本實施例中，第一散熱管150配置於電路板120上，且位於電路板120與第二側壁112之間。第一散熱管150例如是超薄散熱管(厚度D約為0.6釐米)且呈棒狀或板狀輪廓，其材質例如是銅或其他導熱性佳的金屬材質。具體而言，電路板120包括接地層121，其中第一散熱管121連接地層121，且例如是透過焊接的方式與接地層121接合。換言之，第一散熱管121僅作為散熱之用，並不會影響到電路板120上的各種類型電子元件的運作。進一步而言，電路板120具有透過蝕刻或 鑽孔等方式所形成的凹槽122，第一散熱管150例如是容置於凹槽122內，並與凹槽122內的接地層121相接合。在未繪示實施例中，第一散熱管也可以是與電路板表面上的接地層相接合，本新型作不對此加以限制。Referring to FIG. 1 and FIG. 2 , in the embodiment, the first heat dissipation pipe 150 is disposed on the circuit board 120 and located between the circuit board 120 and the second sidewall 112 . The first heat pipe 150 is, for example, an ultra-thin heat pipe (thickness D is about 0.6 cm) and has a rod-like or plate-like profile, and the material thereof is, for example, copper or other metal material having good thermal conductivity. Specifically, the circuit board 120 includes a ground layer 121, wherein the first heat pipe 121 is connected to the ground layer 121 and is joined to the ground layer 121 by soldering, for example. In other words, the first heat pipe 121 serves only for heat dissipation and does not affect the operation of various types of electronic components on the circuit board 120. Further, the circuit board 120 has a transparent etching or The first heat dissipation pipe 150 is received in the groove 122 and engaged with the ground layer 121 in the groove 122, for example, by the groove 122 formed by drilling or the like. In the embodiment, the first heat dissipating tube may also be coupled to the ground layer on the surface of the circuit board, which is not limited by the present invention.
第一散熱管150具有吸熱端151與相對於吸熱端151的散熱端152，其中吸熱端151鄰近發熱元件140。此外，第一散熱管150內充滿散熱流體153例如水，而第一散熱管150的管壁通常具有毛細結構，其可以是溝槽式、網目式(編織)、纖維式及燒結式等類型的毛細結構，以使散熱流體153能夠循環於吸熱端151與散熱端152之間。具體而言，當發熱元件140所產生的熱能從電路板120傳至第一散熱管150的吸熱端151時，此部分的散熱流體153在吸熱能後溫度隨之升高，且在熱對流的作用下，使得高溫散熱流體153流動制散熱端152，而散熱端152的低溫散熱流體153流動至吸熱端151以接收熱能。其中，流動至散熱端152的高溫散熱流體153可與第一風扇130提供的散熱氣流進行熱交換，此時，高溫散熱流體153的溫度降低，而散熱氣流的溫度則相對升高。溫度降低後的散熱流體153回流至吸熱端151，而溫度升高後的散熱氣流由第一風扇130引導至第一散熱孔111a排出殼體110，如此反覆循環，以提升電子裝置的散熱效率。The first heat pipe 150 has a heat absorbing end 151 and a heat radiating end 152 opposite to the heat absorbing end 151, wherein the heat absorbing end 151 is adjacent to the heat generating component 140. In addition, the first heat pipe 150 is filled with a heat dissipating fluid 153 such as water, and the pipe wall of the first heat pipe 150 usually has a capillary structure, which may be of a groove type, a mesh type (woven), a fiber type, and a sintered type. The capillary structure is such that the heat dissipation fluid 153 can circulate between the heat absorption end 151 and the heat dissipation end 152. Specifically, when the heat energy generated by the heat generating component 140 is transmitted from the circuit board 120 to the heat absorbing end 151 of the first heat pipe 150, the temperature of the heat radiating fluid 153 of the portion is increased after the heat absorbing energy, and the heat convection is increased. Under the action, the high temperature heat dissipation fluid 153 flows to form the heat dissipation end 152, and the low temperature heat dissipation fluid 153 of the heat dissipation end 152 flows to the heat absorption end 151 to receive the heat energy. The high-temperature heat-dissipating fluid 153 flowing to the heat-dissipating end 152 can exchange heat with the heat-dissipating airflow provided by the first fan 130. At this time, the temperature of the high-temperature heat-dissipating fluid 153 is lowered, and the temperature of the heat-dissipating airflow is relatively increased. The temperature-reduced heat-dissipating fluid 153 is returned to the heat-absorbing end 151, and the heat-dissipating airflow after the temperature rise is guided by the first fan 130 to the first heat-dissipating hole 111a to discharge the casing 110, so as to repeatedly circulate to improve the heat-dissipating efficiency of the electronic device.
另一方面，本實施例的電子裝置100更包括第二散熱管160，第二散熱管160連接發熱元件140與第一風扇130。具體而言，第二散熱管160例如是與配置於發熱元件140上方的導熱板 141相連接，其中導熱板141藉由熱介面材料(thermal interface material)142貼合於發熱元件140。一般而言，導熱板141例如是銅或其他導熱性佳的金屬材質所構成，藉此發熱元件140運作時所產生的熱能可依序經由熱介面材料142與導熱板141傳至第二散熱管160，而第二散熱管160例如是與配置第一風扇130的出風側的散熱鰭片組131相連接。換言之，前述傳至第二散熱管160的熱能會傳至散熱鰭片組131，使第一風扇130提供的散熱氣流能夠對散熱鰭片組131進行散熱。在本實施例中，第二散熱管160例如是超薄散熱管，其工作原理可參照第一散熱管150的說明，本新型創作於此不加贅述。在其他實施例中，第二散熱管160亦可以是一般常見的散熱管，本新型創作不對此加以限制。On the other hand, the electronic device 100 of the embodiment further includes a second heat pipe 160, and the second heat pipe 160 connects the heat generating component 140 and the first fan 130. Specifically, the second heat dissipation pipe 160 is, for example, a heat conduction plate disposed above the heat generating component 140 The 141 is connected, wherein the heat conducting plate 141 is attached to the heat generating component 140 by a thermal interface material 142. Generally, the heat conducting plate 141 is made of copper or other metal material with good thermal conductivity. The heat generated by the heating element 140 can be sequentially transmitted to the second heat pipe via the thermal interface material 142 and the heat conducting plate 141. The second heat pipe 160 is connected to the heat radiation fin group 131 on the air outlet side where the first fan 130 is disposed, for example. In other words, the heat energy transmitted to the second heat dissipation pipe 160 is transmitted to the heat dissipation fin group 131, so that the heat dissipation airflow provided by the first fan 130 can dissipate the heat dissipation fin group 131. In the present embodiment, the second heat dissipating tube 160 is, for example, an ultra-thin heat dissipating tube, and the working principle thereof can be referred to the description of the first heat dissipating tube 150, which is not described herein. In other embodiments, the second heat pipe 160 can also be a common heat pipe. The present invention does not limit this.
簡言之，本實施例的電子裝置100具有整合至電路板110的第一散熱管150與連接發熱元件140的第二散熱管160，此兩散熱管提供電路板120上的發熱元件140多個散熱途徑，如此配置之下，不僅提高了電子裝置100的散熱效率，亦可避免發熱元件140因工作溫度過高而失效或損毀。In short, the electronic device 100 of the embodiment has a first heat pipe 150 integrated into the circuit board 110 and a second heat pipe 160 connecting the heat generating component 140. The heat pipes 140 provide a plurality of heat generating components 140 on the circuit board 120. The heat dissipation path, under such a configuration, not only improves the heat dissipation efficiency of the electronic device 100, but also prevents the heat generating component 140 from being invalid or damaged due to an excessively high operating temperature.
圖3是本新型創作另一實施例的電子裝置。請參考圖3，本實施例的電子裝置100A相較於圖1的電子裝置100而言，其更包括第二風扇170。第一散熱管150位於發熱元件140與第二風扇170之間，且第一散熱管150的散熱端152與第二風扇170相連。換言之，本實施例電子裝置100A可同時藉由第一風扇130與第二風扇170個別提供的散熱氣流對第一散熱管150的散熱端152進 行散熱，以加速其散熱的效果。3 is an electronic device of another embodiment of the present invention. Referring to FIG. 3 , the electronic device 100A of the present embodiment further includes a second fan 170 compared to the electronic device 100 of FIG. 1 . The first heat pipe 150 is located between the heat generating component 140 and the second fan 170 , and the heat radiating end 152 of the first heat pipe 150 is connected to the second fan 170 . In other words, the electronic device 100A of the present embodiment can simultaneously enter the heat dissipation end 152 of the first heat dissipation pipe 150 by the heat dissipation airflow provided by the first fan 130 and the second fan 170. Cooling heat to accelerate its heat dissipation.
圖4是本新型創作再一實施例的電子裝置的局部剖面示意圖。請參考圖4，本實施例的電子裝置100B相較於圖3的電子裝置100A而言，其殼體110還具有第二散熱孔112a。第二散熱孔112a開設於第二側壁112，其中第一散熱管150於第二側壁112上的正投影與第二散熱孔112a部分重疊。另一方面，在本實施例中，第二風扇170引導散熱氣流從第二散熱孔112a進入殼體110內，並且在散熱氣流對第一散熱管150與第二散熱管160進行散熱後，第一風扇130會引導散熱氣流自第一散熱孔111a離開殼體110，以加速殼體110內氣流的循環，如此配置之下，將有助於提升電子裝置100的散熱效率。4 is a partial cross-sectional view showing an electronic device according to still another embodiment of the present invention. Referring to FIG. 4 , the electronic device 100B of the present embodiment has a second heat dissipation hole 112 a compared to the electronic device 100A of FIG. 3 . The second heat dissipation hole 112a is defined in the second sidewall 112. The orthographic projection of the first heat dissipation tube 150 on the second sidewall 112 partially overlaps the second heat dissipation hole 112a. On the other hand, in the embodiment, the second fan 170 guides the heat dissipation airflow from the second heat dissipation hole 112a into the housing 110, and after the heat dissipation airflow dissipates the first heat dissipation pipe 150 and the second heat dissipation pipe 160, A fan 130 will guide the heat dissipation airflow away from the housing 110 from the first heat dissipation hole 111a to accelerate the circulation of the airflow in the housing 110. Under such a configuration, the heat dissipation efficiency of the electronic device 100 will be improved.
圖5是本新型創作又一實施例的電子裝置的局部剖面示意圖。請參考圖5，本實施例的電子裝置100C相較於圖4的電子裝置100B而言，其並未設置有第二風扇170。如此配置之下，第一風扇130亦能引導散熱氣流從第二散熱孔112a進入殼體110內，並且在散熱氣流對第一散熱管150與第二散熱管160進行散熱後，再引導散熱氣流自第一散熱孔111a離開殼體110，以提升電子裝置100C的散熱效率。FIG. 5 is a partial cross-sectional view of an electronic device according to still another embodiment of the present invention. Referring to FIG. 5 , the electronic device 100C of the present embodiment is not provided with the second fan 170 compared to the electronic device 100B of FIG. 4 . In this configuration, the first fan 130 can also guide the heat dissipation airflow from the second heat dissipation hole 112a into the housing 110, and then guide the heat dissipation airflow after the heat dissipation airflow dissipates the first heat dissipation pipe 150 and the second heat dissipation pipe 160. The first heat dissipation hole 111a is separated from the housing 110 to improve the heat dissipation efficiency of the electronic device 100C.
雖然上述實施例的第一散熱管150是以具有棒狀輪廓或板狀輪廓的超薄散熱管作說明，但本新型創作不限於此。圖6A至6C即分別繪示了本新型創作其他實施例的第一散熱管150a、150b與150c，其中第一散熱管150a例如是波狀(undulated)輪廓的超 薄散熱管，第一散熱管150b例如是方波狀(square wave)輪廓的超薄散熱管，而第一散熱管150c鋸齒狀輪廓的超薄散熱管。具體而言，本新型創作的第一散熱管輪廓外型，當視電子元件於電路板上的佈局而定。Although the first heat pipe 150 of the above embodiment is described as an ultra-thin heat pipe having a rod-like profile or a plate-like profile, the novel creation is not limited thereto. 6A to 6C respectively illustrate first heat pipes 150a, 150b and 150c of other embodiments of the present invention, wherein the first heat pipe 150a is, for example, an undulated profile. The thin heat pipe, the first heat pipe 150b is, for example, an ultra-thin heat pipe of a square wave profile, and the first heat pipe 150c has an ultra-thin heat pipe with a serrated profile. Specifically, the profile shape of the first heat pipe created by the present invention depends on the layout of the electronic components on the circuit board.
綜上所述，本新型創作係將第一散熱管整合至電路板，其中第一散熱管具有相對的吸熱端與散熱端。第一散熱管的吸熱端鄰近電路板上的發熱元件，而散熱端遠該發熱元件，因此發熱元件運作時所產生的熱能可從電路板傳至第一散熱管的吸熱端，並從吸熱端傳至散熱端，以藉由散熱氣流對散熱端進行散熱。具體而言，本新型創作的電子裝置還具有連接發熱元件的第二散熱管，其中第二散熱管連接至第一風扇，換言之，此兩散熱管提供電路板上的發熱元件多個散熱途徑，不僅提高了電子裝置散熱效率，亦可避免發熱元件因工作溫度過高而失效或損毀。另一方面，本新型創作的可選擇性地設置有第二風扇，並且於第二側壁上開設第二散熱孔，以藉由此兩風扇加速殼體內的散熱氣流的循環速率。In summary, the novel creation system integrates the first heat pipe into the circuit board, wherein the first heat pipe has opposite heat absorption ends and heat dissipation ends. The heat absorbing end of the first heat pipe is adjacent to the heat generating component on the circuit board, and the heat radiating end is far away from the heat generating component, so the heat energy generated when the heat generating component operates can be transmitted from the circuit board to the heat absorbing end of the first heat pipe, and from the heat absorbing end. Pass to the heat sink to dissipate heat from the heat sink. Specifically, the electronic device of the present invention further has a second heat pipe connected to the heat generating component, wherein the second heat pipe is connected to the first fan, in other words, the heat pipe provides a plurality of heat dissipation paths of the heat generating component on the circuit board. It not only improves the heat dissipation efficiency of the electronic device, but also prevents the heating element from being invalid or damaged due to excessive operating temperature. On the other hand, the present invention can be selectively provided with a second fan, and a second heat dissipation hole is opened on the second side wall, so that the two fans accelerate the circulation rate of the heat dissipation airflow in the casing.
雖然本新型創作已以實施例揭露如上，然其並非用以限定本新型創作，任何所屬技術領域中具有通常知識者，在不脫離本新型創作的精神和範圍內，當可作些許的更動與潤飾，故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.
100‧‧‧電子裝置100‧‧‧Electronic devices
110‧‧‧殼體110‧‧‧shell
111‧‧‧第一側壁111‧‧‧First side wall
111a‧‧‧第一散熱孔111a‧‧‧First vent
112‧‧‧第二側壁112‧‧‧ second side wall
120‧‧‧電路板120‧‧‧ boards
121‧‧‧接地層121‧‧‧ Grounding layer
122‧‧‧凹槽122‧‧‧ Groove
130‧‧‧第一風扇130‧‧‧First fan
131‧‧‧散熱鰭片組131‧‧‧Fixing fin group
140‧‧‧發熱元件140‧‧‧heating components
141‧‧‧導熱板141‧‧‧heat conducting plate
142‧‧‧熱介面材料142‧‧‧Hot interface materials
150‧‧‧第一散熱管150‧‧‧First heat pipe
151‧‧‧吸熱端151‧‧‧heat end
152‧‧‧散熱端152‧‧‧heating end
153‧‧‧散熱流體153‧‧‧heating fluid
160‧‧‧第二散熱管160‧‧‧second heat pipe
D‧‧‧厚度D‧‧‧thickness
Claims (10)
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| TW102224403U TWM477763U (en) | 2013-12-25 | 2013-12-25 | Electronic device |
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| TW102224403U TWM477763U (en) | 2013-12-25 | 2013-12-25 | Electronic device |
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| TWM477763U true TWM477763U (en) | 2014-05-01 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105491785A (en) * | 2014-10-10 | 2016-04-13 | 先丰通讯股份有限公司 | Phase-change heat conduction circuit board module and circuit board structure thereof |
| CN105578716A (en) * | 2015-12-30 | 2016-05-11 | 联想(北京)有限公司 | Printed circuit board (PCB), fabrication method of PCB and electronic device |
| TWI565373B (en) * | 2014-09-29 | 2017-01-01 | 先豐通訊股份有限公司 | Circuit board module with thermally conductive phase change type and circuit board structure thereof |
| CN110171523A (en) * | 2019-06-17 | 2019-08-27 | 徐州远翔机车科技有限公司 | A kind of electric accessory motor foot pedal |
| CN111615784A (en) * | 2018-05-04 | 2020-09-01 | Oppo广东移动通信有限公司 | Buck conversion circuit assembly and electronic equipment |
| TWI720828B (en) * | 2019-10-04 | 2021-03-01 | 台達電子工業股份有限公司 | Linear actuator |
-
2013
- 2013-12-25 TW TW102224403U patent/TWM477763U/en not_active IP Right Cessation
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI565373B (en) * | 2014-09-29 | 2017-01-01 | 先豐通訊股份有限公司 | Circuit board module with thermally conductive phase change type and circuit board structure thereof |
| CN105491785A (en) * | 2014-10-10 | 2016-04-13 | 先丰通讯股份有限公司 | Phase-change heat conduction circuit board module and circuit board structure thereof |
| CN105578716A (en) * | 2015-12-30 | 2016-05-11 | 联想(北京)有限公司 | Printed circuit board (PCB), fabrication method of PCB and electronic device |
| CN105578716B (en) * | 2015-12-30 | 2019-06-25 | 联想(北京)有限公司 | Pcb board, the preparation method of pcb board and electronic equipment |
| CN111615784A (en) * | 2018-05-04 | 2020-09-01 | Oppo广东移动通信有限公司 | Buck conversion circuit assembly and electronic equipment |
| CN111615784B (en) * | 2018-05-04 | 2023-11-21 | Oppo广东移动通信有限公司 | Step-down conversion circuit assembly and electronic equipment |
| CN110171523A (en) * | 2019-06-17 | 2019-08-27 | 徐州远翔机车科技有限公司 | A kind of electric accessory motor foot pedal |
| TWI720828B (en) * | 2019-10-04 | 2021-03-01 | 台達電子工業股份有限公司 | Linear actuator |
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