TWI401406B - Method of producing heat dissipating fin and structure thereof and method of producing heat dissipating device comprising the heat dissipating fin and structure thereof - Google Patents
Method of producing heat dissipating fin and structure thereof and method of producing heat dissipating device comprising the heat dissipating fin and structure thereof Download PDFInfo
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- TWI401406B TWI401406B TW98121730A TW98121730A TWI401406B TW I401406 B TWI401406 B TW I401406B TW 98121730 A TW98121730 A TW 98121730A TW 98121730 A TW98121730 A TW 98121730A TW I401406 B TWI401406 B TW I401406B
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Description
本發明係與散熱器有關,特別有關於一種具有大散熱面積的散熱器。 The present invention relates to a heat sink, and more particularly to a heat sink having a large heat dissipation area.
一般電子元件運作時皆會產生熱,特別是近來隨著科技的進步,電子產品的功能及性能大為提升後,其內部產生的熱更是大幅地增加,為此,大多電子元件均需配設散熱裝置,藉以控制工作溫度而維持電子元件之正常運作,其中,將多片層層疊置的散熱鰭片中穿設有熱管之散熱器,即為常見的一種散熱裝置。 In general, electronic components generate heat when they operate. Especially with the advancement of technology, the function and performance of electronic products are greatly improved, and the heat generated inside them is greatly increased. For this reason, most electronic components are required to be equipped. A heat dissipating device is provided to maintain the normal operation of the electronic component by controlling the operating temperature. Among them, a heat sink having a heat pipe is disposed in a plurality of stacked heat dissipating fins, which is a common heat dissipating device.
請參第一圖,係為習知熱管與散熱鰭。片的組合示意圖;該散熱器1a係包含一導熱座10a、二支U型熱管20a及多數鰭片30a,該導熱座10a上設有複數溝槽11a,該二支U型熱管20a係嵌設於該等溝槽11a中,此外,設有穿孔之多數鰭片30a係套設於該熱管20a上,依此,令該導熱座10a貼接一發熱電子元件,該散熱器1a即可導離該發熱電子元件所產生的熱。 Please refer to the first figure, which is a conventional heat pipe and heat sink fin. The heat sink 1a includes a heat conducting base 10a, two U-shaped heat pipes 20a and a plurality of fins 30a. The heat conducting base 10a is provided with a plurality of grooves 11a, and the two U-shaped heat pipes 20a are embedded. In the trenches 11a, a plurality of fins 30a provided with perforations are sleeved on the heat pipe 20a. Accordingly, the heat conducting base 10a is attached to a heat-generating electronic component, and the heat sink 1a can be guided away. The heat generated by the heat-generating electronic component.
上述結構中,熱係自熱管20a傳導至該等鰭片30a上,再藉由該等鰭片30a而將熱快速地逸散;惟,該等熱管20a並非均勻地將熱傳導至該鰭片30a各處,於該鰭片30a上,離熱管10a較遠處的散熱效率不高;再者,由於電子元件的效能不斷地提升,其產生的熱跟隨著增加,故散熱器的散熱效能亦需不斷地提升,在現今產品講求輕薄 精巧外型的限制下,如何在有限的空間中盡可能地擴大該散熱器1a的散熱面積,進而提升其散熱效率,即為本發明人所欲解決之課題。 In the above structure, the heat is conducted from the heat pipe 20a to the fins 30a, and the heat is quickly dissipated by the fins 30a; however, the heat pipes 20a do not uniformly conduct heat to the fins 30a. In the whole, on the fin 30a, the heat dissipation efficiency from the heat pipe 10a is not high; in addition, as the performance of the electronic component is continuously improved, the heat generated by the heat sink is increased, so the heat dissipation performance of the heat sink is also required. Constantly improving, light and thin in today's products Under the limitation of the compact appearance, how to expand the heat dissipation area of the heat sink 1a as much as possible in a limited space, thereby improving the heat dissipation efficiency, is a problem to be solved by the inventors.
有鑑於此,本發明人為改善並解決上述之缺失,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本發明。 In view of the above, the present inventors have made great efforts to improve and solve the above-mentioned shortcomings, and have finally made a proposal to rationally and effectively improve the above-mentioned defects.
本發明之主要目的,在於提供一種鰭片及大面積散熱器,係可在一限定的空間中另增設一散熱體,並令鰭片及散熱體可同時對發熱元件進行散熱,進而提高其散熱效率。 The main purpose of the present invention is to provide a fin and a large-area heat sink, which can add a heat sink in a limited space, and allow the fin and the heat sink to simultaneously dissipate heat from the heat-generating component, thereby improving heat dissipation. effectiveness.
為了達成上述之目的,本發明係為一種大面積散熱器的製造方法,其步驟係包括:a)提供複數鰭片及一熱管;b)切割各該鰭片,以分別於該鰭片上形成複數切割線,該等切割線係形成至少一掀片;c)反折該掀片以將其疊設於該鰭片上,於該鰭片上並形成有一容置孔;d)對該鰭片及該掀片進行沖孔,以形成重疊的二穿孔;e)將該鰭片及該掀片之二穿孔套設該熱管;以及f)依照該e)步驟,將其他鰭片依序套設於該熱管上。 In order to achieve the above object, the present invention is a method for manufacturing a large-area heat sink, the steps of which include: a) providing a plurality of fins and a heat pipe; b) cutting each of the fins to form a plurality of the fins respectively. a cutting line, the cutting lines forming at least one cymbal; c) folding the cymbal to superimpose the cymbal on the fin, and forming a receiving hole on the fin; d) the fin and the The cymbal is punched to form overlapping two perforations; e) the fin and the cymbal are pierced by the heat pipe; and f) according to the step e), the other fins are sequentially placed on the On the heat pipe.
為了達成上述之目的,本發明係為一種大面積散熱器,係包括一熱管及複數鰭片,複數鰭片平行且間隔排列以套設熱管,鰭片設有一掀片,掀片係反折而疊設於鰭片上,以於鰭片上形成有一容置孔,反折之掀片及鰭片設有重疊的二穿孔,二穿孔係供鰭片套設於熱管上。 In order to achieve the above object, the present invention is a large-area heat sink comprising a heat pipe and a plurality of fins, the plurality of fins being arranged in parallel and spaced apart to form a heat pipe, the fins being provided with a cymbal piece, and the cymbals are reflexed. The fins are stacked on the fins to form a receiving hole on the fins, and the folded flaps and the fins are provided with overlapping two perforations, and the two perforations are provided for the fins to be sleeved on the heat pipe.
為了達成上述之目的,本發明係為一種散熱鰭片之製造方法,其步驟係包括:a)提供一鰭片;b)切割該鰭片以於其上形成複數切割線,該等切割線係形成至少一掀片;c)反折該掀片以將其疊設於該鰭片上,於該鰭片上並形成有一容置孔;以及d)對該鰭片及該掀片進行沖孔,以形成重疊的二穿孔。 In order to achieve the above object, the present invention is a method for manufacturing a heat dissipating fin, the steps of which include: a) providing a fin; b) cutting the fin to form a plurality of cutting lines thereon, the cutting lines Forming at least one cymbal; c) folding the cymbal to stack it on the fin, forming a receiving hole on the fin; and d) punching the fin and the cymbal to Forming overlapping two perforations.
為了達成上述之目的,本發明係為一種散熱鰭片,該鰭片係設有一掀片,該掀片係反折而疊設於該鰭片,以於該鰭片上形成有一容置孔,反折之該掀片及該鰭片設有重疊的二穿孔。 In order to achieve the above object, the present invention is a heat dissipating fin, the fin is provided with a cymbal, and the cymbal is folded over and stacked on the fin to form a receiving hole on the fin. The gusset and the fin are provided with overlapping two perforations.
相較於習知技術,由於本發明之鰭片設有反折之掀片,並形成有容置孔,在相同限制空間的條件下,本發明不需額外的配設空間,其散熱器不但具有多數鰭片,並可另於該等鰭片之容置孔中再置入一散熱體,相較於習知散熱器具有更多、更大的散熱面積,由於鰭片及散熱體係同時對發熱元件進行散熱,故可提高散熱器之散熱效率,增加本發明之實用性。 Compared with the prior art, since the fin of the present invention is provided with a folded sheet and formed with a receiving hole, the present invention does not require an additional space under the same limited space, and the heat sink is not only provided with the heat sink. It has a plurality of fins and can be further placed with a heat sink in the receiving holes of the fins. Compared with the conventional heat sink, it has more and larger heat dissipation area, because the fins and the heat dissipation system are simultaneously Since the heat generating component dissipates heat, the heat dissipation efficiency of the heat sink can be improved, and the utility of the present invention can be increased.
有關本發明之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。 The detailed description and technical content of the present invention are set forth in the accompanying drawings.
請參照第二圖及第三圖,係分別為本發明大面積散熱器的製造流程圖及組合示意圖;首先,提供穿設有一熱管10之一導熱基座20、一散熱體30及複數鰭片40(步驟 100)。 Please refer to FIG. 2 and FIG. 3 respectively, which are respectively a manufacturing flow chart and a combination diagram of the large-area heat sink of the present invention. First, a heat-conductive base 20, a heat sink 30 and a plurality of fins provided with a heat pipe 10 are provided. 40 (step 100).
本實施例係設有三支U型熱管10,但不以此數量及型態為限,該導熱基座導熱座20之底面係對應該等熱管10之數量而設有三個溝槽21,該三支熱管10係嵌設於該等溝槽21中,該散熱體30可為一鋁擠型鰭片,係具有一底座31及多數自該底座31向上延伸之延伸片32,該等延伸片32係平行且間隔排列,於任二延伸片32之間係形成有一通道300,此外,套設於該等熱管10上的係為該鰭片40。 In this embodiment, three U-shaped heat pipes 10 are provided, but not limited to the number and type. The bottom surface of the heat-conducting base heat-conducting base 20 is provided with three grooves 21 corresponding to the number of heat pipes 10, and the three The heat pipe 10 is embedded in the groove 21, and the heat sink 30 can be an aluminum extruded fin having a base 31 and a plurality of extending pieces 32 extending upward from the base 31. The extending pieces 32 The channels are formed in parallel and spaced apart. A channel 300 is formed between any two extension sheets 32. Further, the fins 40 are disposed on the heat pipes 10.
請再參第4圖A至第4圖D,係顯示該鰭片40之製法;首先,以一工具(圖未式)切割該鰭片40(步驟200),以於該鰭片40上形成多條切割線41,藉由該等切割線41而於該鰭片40上形成至少一掀片42,如使該等切割線41形成一U字型,即可於該鰭片40上形成一掀片42,倘若該等切割線41係形成一工字型,則可於該鰭片40上形成左、右各有一掀片42。 Referring to FIG. 4A to FIG. 4D again, the method for manufacturing the fin 40 is shown. First, the fin 40 is cut by a tool (step 200) to form on the fin 40. A plurality of cutting lines 41 are formed on the fins 40 by the cutting lines 41. If the cutting lines 41 are formed in a U shape, a fin shape can be formed on the fins 40. The cymbal piece 42 can be formed on the fin 40 by a cymbal 42 on the left and right sides of the fin 40.
參第4圖B,接著反折該掀片42,以將該掀片42疊設於該鰭片40上,反折的該掀片42係與該鰭片40之間形成有一中空流道420,該中空流道420可供氣流流經而將熱帶走,同時於該鰭片40形成有一容置孔400(步驟300),接著,對該鰭片40及該掀片42進行沖孔,以形成重疊的二穿孔401、421(步驟400),於本實施例中,該步驟400係於步驟300後進行,亦即,本實施例係對該鰭片40及反折於其上的該掀片42同時進行沖孔,另一方面,該步驟400亦可於步驟300前進行,即先於步驟400中,對該鰭片40及該 掀片42分別進行沖孔,以形成可重疊的二穿孔401、421,再進行步驟300,反折該掀片42以將其疊設於該鰭片40上,令該二穿孔401、421重疊;後續,可再以一工具50來對重疊的該二穿孔401、421之周緣進行壓掣,以於該二穿孔401、421之周緣形成重疊的二凸緣402、422。 Referring to FIG. 4B, the cymbal sheet 42 is folded back to overlap the cymbal 42 on the fin 40. A hollow flow channel 420 is formed between the folded slab 42 and the fin 40. The hollow flow channel 420 is configured to allow the airflow to flow through the tropics, and a receiving hole 400 is formed in the fin 40 (step 300). Then, the fin 40 and the cymbal 42 are punched to Forming the overlapping two perforations 401, 421 (step 400), in the embodiment, the step 400 is performed after the step 300, that is, the embodiment is the fin 40 and the crucible folded thereon The sheet 42 is simultaneously punched. On the other hand, the step 400 can also be performed before the step 300, that is, before the step 400, the fin 40 and the The cymbals 42 are respectively punched to form the overlapped two through holes 401 and 421, and then the step 300 is performed, and the cymbal sheet 42 is folded back to be superposed on the fins 40, so that the two through holes 401 and 421 are overlapped. Subsequently, the periphery of the overlapping two perforations 401, 421 can be further compressed by a tool 50 to form overlapping two flanges 402, 422 around the circumference of the two perforations 401, 421.
將該鰭片40及該掀片42之二穿孔401、422對準該熱管10,以將該鰭片40套設於其上(步驟500),其中,該散熱體30之底座31係置設於該導熱基座導熱座20之頂面,且容置於該鰭片40之容置孔400中。 Aligning the fins 40 and the two through holes 401 and 422 of the cymbal 42 to the heat pipe 10 to lay the fin 40 thereon (step 500), wherein the base 31 of the heat sink 30 is disposed The top surface of the heat conducting base 20 is received in the receiving hole 400 of the fin 40.
請參第五圖至第七圖,係分別為本發明之散熱器的立體外觀圖及其兩剖視圖;接著,循上述步驟,再將其他鰭片依序套設於該等熱管10上(步驟600),藉以完成一散熱器1,從圖中可看出,該鰭片40之穿孔401的凸緣402係緊密貼附於該熱管10之外壁(熱管10之縮管段101除外),而該散熱體30之延伸片32係大部分容置於堆疊的該些鰭片40之容置孔400中,此外,該散熱體30之通道300係為相互連通。 Please refer to FIG. 5 to FIG. 7 , which are respectively a perspective view of the heat sink of the present invention and two cross-sectional views thereof; then, according to the above steps, the other fins are sequentially sleeved on the heat pipes 10 (steps). 600), in order to complete a heat sink 1, as can be seen from the figure, the flange 402 of the through hole 401 of the fin 40 is closely attached to the outer wall of the heat pipe 10 (except for the shrink pipe section 101 of the heat pipe 10), and The extensions 32 of the heat sink 30 are mostly accommodated in the receiving holes 400 of the stacked fins 40. Further, the channels 300 of the heat sink 30 are in communication with each other.
請參照第八圖,係為本發明大面積散熱器的使用示意圖;當該散熱器1用於一發熱電子元件60之散熱時,係將其導熱座20及其底部之熱管10貼接於該發熱電子元件60表面,該發熱電子元件60所產生的熱即傳導至該導熱座20及該熱管10上,經由該熱管10而將熱再傳導至該些鰭片40上,另一方面,傳導至該導熱座20的熱係再傳導至該散熱體30,經由該些延伸片32而將熱逸散至相互流通的該通道 300中,藉由該些鰭片40及該散熱體30同時對發熱電子元件60進行散熱,並逐一將熱量排出,進而降低該發熱電子元件60之溫度,可避免熱積於該發熱電子元件60上,提高該散熱器1之散熱效率。 Please refer to the eighth figure, which is a schematic diagram of the use of the large-area heat sink of the present invention; when the heat sink 1 is used for heat dissipation of a heat-generating electronic component 60, the heat-conducting base 20 and the heat pipe 10 at the bottom thereof are attached thereto. The heat generated by the heat-generating electronic component 60 is transmitted to the heat-conducting base 20 and the heat pipe 10, and heat is re-conducted to the fins 40 via the heat pipe 10, and conduction is conducted on the other hand. The heat system to the heat conducting base 20 is re-conducted to the heat sink 30, and the heat is dissipated to the mutually circulated passages via the extending pieces 32. In the 300, the fins 40 and the heat sink 30 simultaneously dissipate heat from the heat-generating electronic component 60, and discharge heat one by one, thereby reducing the temperature of the heat-generating electronic component 60, thereby preventing heat from being accumulated in the heat-generating electronic component 60. The heat dissipation efficiency of the heat sink 1 is improved.
請續參照第九圖,係為本發明大面積散熱器的第二實施例;本實施例與第一實施例大致相同,其不同之處係在於散熱器1’並無設置導熱座,且其鰭片40’中所穿設的為一平板式熱管10’,該鰭片40’上設有二掀片42’並形成有容置孔400’,該容置孔400’中亦容置有一散熱體30’。 Please refer to the ninth embodiment, which is a second embodiment of the large-area heat sink of the present invention; the embodiment is substantially the same as the first embodiment, and the difference is that the heat sink 1' is not provided with a heat conducting seat, and The fin 40' is provided with a flat heat pipe 10'. The fin 40' is provided with a second piece 42' and is formed with a receiving hole 400'. The receiving hole 400' is also accommodated therein. Heat sink 30'.
以上所述僅為本發明之較佳實施例,非用以限定本發明之專利範圍,其他運用本發明之專利精神之等效變化,均應俱屬本發明之專利範圍。 The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and other equivalent variations of the patent spirit of the present invention are all within the scope of the invention.
<習知> <知知>
1a‧‧‧散熱器 1a‧‧‧heatsink
10a‧‧‧導熱座 10a‧‧‧thermal seat
11a‧‧‧溝槽 11a‧‧‧ trench
20a‧‧‧熱管 20a‧‧‧heat pipe
30a‧‧‧鰭片 30a‧‧‧Fins
<本發明> <present invention>
1‧‧‧散熱器 1‧‧‧heatsink
10‧‧‧熱管 10‧‧‧heat pipe
101‧‧‧縮管段 101‧‧ ‧ shrinkage section
20‧‧‧導熱座 20‧‧‧heating seat
21‧‧‧溝槽 21‧‧‧ trench
30‧‧‧散熱體 30‧‧‧ Heat sink
300‧‧‧通道 300‧‧‧ channel
31‧‧‧底座 31‧‧‧Base
32‧‧‧延伸片 32‧‧‧Extension
40‧‧‧鰭片 40‧‧‧Fins
400‧‧‧容置孔 400‧‧‧ accommodating holes
401‧‧‧穿孔 401‧‧‧Perforation
402‧‧‧凸緣 402‧‧‧Flange
41‧‧‧切割線 41‧‧‧ cutting line
42‧‧‧掀片 42‧‧‧ Picture
421‧‧‧穿孔 421‧‧‧Perforation
422‧‧‧凸緣 422‧‧‧Flange
50‧‧‧工具 50‧‧‧ Tools
60‧‧‧發熱電子元件 60‧‧‧Fever electronic components
1’‧‧‧散熱器 1'‧‧‧ radiator
10’‧‧‧平板式熱管 10'‧‧‧ flat heat pipe
30’‧‧‧散熱體 30'‧‧‧ heat sink
40’‧‧‧鰭片 40’‧‧‧Fins
400’‧‧‧容置孔 400’‧‧‧ 容孔
42’‧‧‧掀片 42’‧‧‧ Pictures
100~600‧‧‧步驟 100~600‧‧‧Steps
第一圖 係為習知熱管與散熱鰭片的組合示意圖;第二圖 係本發明大面積散熱器的製造流程圖;第三圖 係本發明大面積散熱器的組合示意圖;第四圖A 係本發明鰭片的切割;第四圖B 係本發明鰭片之掀片的反折;第四圖C 係本發明之鰭片及掀片的沖孔;第四圖D 係本發明之鰭片及掀片的壓掣;第五圖 係本發明之散熱器的立體外觀圖;第六圖 係本發明之散熱器的縱向剖視圖;第七圖 係本發明之散熱器的橫向剖視圖;第八圖 係為本發明之散熱器的使用示意圖;以及 第九圖 係為本發明之散熱器的第二實施例。 The first figure is a schematic diagram of a combination of a conventional heat pipe and a heat sink fin; the second figure is a manufacturing flow chart of the large area heat sink of the present invention; the third figure is a combined schematic view of the large area heat sink of the present invention; The cutting of the fin of the present invention; the fourth drawing B is the reflex of the fin of the fin of the invention; the fourth drawing C is the punching of the fin and the cymbal of the invention; and the fourth drawing D is the fin of the invention The fifth drawing is a perspective view of the heat sink of the present invention; the sixth drawing is a longitudinal sectional view of the heat sink of the present invention; and the seventh drawing is a transverse sectional view of the heat sink of the present invention; Is a schematic diagram of the use of the heat sink of the present invention; The ninth diagram is a second embodiment of the heat sink of the present invention.
1‧‧‧散熱器 1‧‧‧heatsink
10‧‧‧熱管 10‧‧‧heat pipe
101‧‧‧縮管段 101‧‧ ‧ shrinkage section
20‧‧‧導熱座 20‧‧‧heating seat
21‧‧‧溝槽 21‧‧‧ trench
30‧‧‧散熱體 30‧‧‧ Heat sink
31‧‧‧底座 31‧‧‧Base
32‧‧‧延伸片 32‧‧‧Extension
40‧‧‧鰭片 40‧‧‧Fins
400‧‧‧容置孔 400‧‧‧ accommodating holes
402‧‧‧凸緣 402‧‧‧Flange
42‧‧‧掀片 42‧‧‧ Picture
420‧‧‧中空流道 420‧‧‧hollow runner
422‧‧‧凸緣 422‧‧‧Flange
Claims (26)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW98121730A TWI401406B (en) | 2009-06-26 | 2009-06-26 | Method of producing heat dissipating fin and structure thereof and method of producing heat dissipating device comprising the heat dissipating fin and structure thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW98121730A TWI401406B (en) | 2009-06-26 | 2009-06-26 | Method of producing heat dissipating fin and structure thereof and method of producing heat dissipating device comprising the heat dissipating fin and structure thereof |
Publications (2)
Publication Number | Publication Date |
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TW201100740A TW201100740A (en) | 2011-01-01 |
TWI401406B true TWI401406B (en) | 2013-07-11 |
Family
ID=44836728
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW98121730A TWI401406B (en) | 2009-06-26 | 2009-06-26 | Method of producing heat dissipating fin and structure thereof and method of producing heat dissipating device comprising the heat dissipating fin and structure thereof |
Country Status (1)
Country | Link |
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TW (1) | TWI401406B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2545796Y (en) * | 2002-04-26 | 2003-04-16 | 林海清 | Heat radiator |
TWM281394U (en) * | 2005-06-10 | 2005-11-21 | Foxconn Tech Co Ltd | Heat dissipation device |
CN1755316A (en) * | 2004-07-23 | 2006-04-05 | 臼井国际产业株式会社 | Fin, method of fabricating the same and heat exchanger tube, heat exchanger and gas cooling apparatus |
CN101309577A (en) * | 2007-05-17 | 2008-11-19 | 日立电线机械技术株式会社 | Heat sink and method of making same |
-
2009
- 2009-06-26 TW TW98121730A patent/TWI401406B/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2545796Y (en) * | 2002-04-26 | 2003-04-16 | 林海清 | Heat radiator |
CN1755316A (en) * | 2004-07-23 | 2006-04-05 | 臼井国际产业株式会社 | Fin, method of fabricating the same and heat exchanger tube, heat exchanger and gas cooling apparatus |
TWM281394U (en) * | 2005-06-10 | 2005-11-21 | Foxconn Tech Co Ltd | Heat dissipation device |
CN101309577A (en) * | 2007-05-17 | 2008-11-19 | 日立电线机械技术株式会社 | Heat sink and method of making same |
Also Published As
Publication number | Publication date |
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TW201100740A (en) | 2011-01-01 |
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