TW200930969A - Heat dissipation plate - Google Patents

Heat dissipation plate Download PDF

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Publication number
TW200930969A
TW200930969A TW97100755A TW97100755A TW200930969A TW 200930969 A TW200930969 A TW 200930969A TW 97100755 A TW97100755 A TW 97100755A TW 97100755 A TW97100755 A TW 97100755A TW 200930969 A TW200930969 A TW 200930969A
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Taiwan
Prior art keywords
heat
heat sink
improved
heat dissipation
vacuum
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TW97100755A
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Chinese (zh)
Inventor
Jong-Fun Liu
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Chuntlon Entpr Co Ltd
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Priority to TW97100755A priority Critical patent/TW200930969A/en
Publication of TW200930969A publication Critical patent/TW200930969A/en

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Abstract

A structure improvement for a dissipation plate disposed on the heat source is made of material with a high heat-conduction. Vacuum and closed rooms filled with thermal conductive material and volatile liquid are formed in the dissipation plate, and a plurality of heat sink fins are disposed on the outer surface of the dissipation plate. Thereby, the heat can be exchanged quickly and efficiently, and the shape design of the dissipation plate can be varied freely.

Description

200930969 九、發明說明: 【發明所屬之技術領域】 本發明係一種冷卻或加熱裝置,特別是指一種散热板結構改 良,其能快速有效率地進行熱交換,且可配合不同產品的外型進 行設計變化。 0 【先前技術】 現今的冷卻裝置於工業方面之應用愈來愈多,除了作為光源 ,政熱效果之外,更多常見於電子熱源的散熱之用,因此,各種冷 卻裝置對於現今各種熱源產品的重要性與日俱增。 —目前的光源(例如:發光二極體LED)、電子熱源(例如:運 t中〜aa>j CPU)為了讓產品避免受到高溫、高熱的傷害,皆會在 0產品上安裳冷卻裝置;而上述冷卻裝置則是讓光源、電子熱源保 持運作及延長壽命的關鍵,所以,如何針對冷卻裝置研發改良出 更具競爭力的產品自然成為目前業界之重點。 現今最常㈣冷卻裝置—般是指由溫度良導材料$作的金屬 板肢,且在板體上—體連接有錄彼賴隔的賴㈣,利用熱 片原::體的直接密合來傳導熱能,並且配合風扇來加快該散_ Ά乳之_熱交換作用;由於此制設計_金屬直接傳 200930969 導,造成其造瘦設計加工不易、難以變化; 此外,傳導速率受限金屬材質本身的熱導係數,無法大幅提 '升熱傳導效能,雖然市場上已有另一種熱導管出現,但是仍然是 、透過層層金屬材料傳導的設計,且單純空冷的模式無法有效率地 進行熱交換,造成冷卻效果有限的困境。200930969 IX. Description of the Invention: [Technical Field] The present invention relates to a cooling or heating device, and more particularly to an improved heat sink structure, which can perform heat exchange quickly and efficiently, and can be matched with the appearance of different products. Design changes. 0 [Prior Art] Today's cooling devices are used more and more in the industrial field. In addition to being used as a light source and a thermal effect, they are more commonly used for heat dissipation of electronic heat sources. Therefore, various cooling devices are available for various heat source products today. The importance of it is increasing day by day. - The current light source (for example: LEDs), electronic heat source (for example: transport t ~ aa > j CPU) in order to protect the product from high temperature, high heat damage, will be on the 0 product on the cooling device; The above cooling device is the key to keeping the light source and the electronic heat source in operation and prolonging the life. Therefore, how to develop and improve the more competitive products for the cooling device has naturally become the focus of the industry. Today's most common (four) cooling device - generally refers to the metal plate limb made of temperature good guiding material $, and the body is connected to the body of the board (4), using the hot film original:: direct contact of the body To conduct heat energy, and cooperate with the fan to speed up the heat exchange effect of the _ Ά ; milk; due to the design of this system _ metal directly transmitted 200930969 lead, its thin design is difficult to process, difficult to change; In addition, the conduction rate is limited metal material Its own thermal conductivity coefficient cannot greatly increase the heat transfer performance. Although another heat pipe has appeared on the market, it is still designed to transmit through the layered metal materials, and the air-cooled mode cannot efficiently exchange heat. , causing a dilemma of limited cooling effect.

Ο 為了解決效率問題,市場上出現了各種改良設計,目前較為 眾人使用及認知的冷卻裝置如中華民國專利第M321496號的『具 有政熱結構的燈具』習用設計,請參閱以下說明: 此習用係一種具有散熱結構的燈具,包含:一殼體、一散熱 板、-電路單元及—導熱單元,該殼體具有—圍繞—軸線的容室, 及-連通該容室的透光口’該散熱板是裝設於該容室内,並具有 —貼觸該殼體的外圍部’該電路單元是裝設於該容室内,並包括 1占觸該散熱板的基板’及—設置於該基板且朝向該透光口的發 ^且件’料熱單元是設置於該容室内,並具有其巾—端面貼觸 該t板底面的—導熱柱,及連結該導敝另—端面且周緣貼觸 與該鉞2、胃熱料#,來自該電路單元的熱可迅速透過該導熱柱 導散熱。¥片傳導至該殼體,藉此確能將燈具產生的熱能快速傳Ο In order to solve the problem of efficiency, various improved designs have appeared on the market. At present, the cooling devices that are used and recognized by many people, such as the luminaires of the lamps with political structure of the Republic of China Patent No. M321496, please refer to the following description: A luminaire having a heat dissipating structure, comprising: a casing, a heat dissipating plate, a circuit unit and a heat conducting unit, the casing having a chamber surrounding the axis, and a light transmitting port connecting the chamber The board is mounted in the chamber and has a peripheral portion that is in contact with the housing. The circuit unit is mounted in the housing and includes a substrate that touches the heat sink and is disposed on the substrate. The heat-generating unit facing the light-transmissive port is disposed in the chamber, and has a heat-conducting column whose towel-end surface is in contact with the bottom surface of the t-plate, and the other end surface of the guide body is attached and the peripheral edge is contacted With the 钺2, stomach hot material#, the heat from the circuit unit can quickly dissipate heat through the heat conducting column. The sheet is conducted to the housing, thereby enabling rapid transmission of heat generated by the luminaire

=是’前述制技術之中是導熱單元配合麵外導引敎 ,’、、、'而使用熱傳導片、導熱柱的技術,卻同樣受到材料直接傳 6 200930969 導效率的限制,導致別的熱交換效率仍是處於無法高速散熱的 狀況。 、為了能夠有效解決前述相關議題,本發明創作人基於過去在 冷卻裝置領域所累積的研發技術與經驗,從加強熱交換效率、辦 加設計自由㈣缝下手,終於發展出—種全·散熱板結狀 良。 【發明内容】 本I狀主要目的係提供—種散熱板結構改良,其故交換效 率較佳; ’' ' 為達成以目的,本發批散熱板結觀良舰置在熱源之 .上,該散熱板以溫度良導材料製作,且於散熱板内開設有真空密 閉空間,且在纽_空_填裝有導歸材及揮發液體,另在 〇 該散熱板外表面製作有若干散熱鰭片; 藉由前述導熱素材及揮發在真空密閉空間進行高速熱交 換’且讓高溫可以先行勒揮發液體的蒸發而立即被帶離熱源, 且以溫度良導材料製作的散熱板及散熱鰭片立即銜接導出教能; 故本發明缺速有效率顧行熱錢,賴_生較直接傳導更 佳的傳導效率。 進-步言’本發明可以產生高於鑽石熱導係數⑵瞻射)直 接溫導效率,並且有效立即導出熱源位置的熱能。 200930969 本發明之另一目的係提供一種散熱板結構改良,其能配合產 :^卜奴位置自由賴形狀,更能_内部設計快速^傳遞熱 月b使彳于受包覆的熱源能藉由散熱板與外界溝通傳導. 為達成上述目的,本發明之憾板結構改_於散熱板内開 設有真空_空間,且在真空韻印_裝树歸材及揮發 =體’由於真空密閉空間内的導熱素材及揮錄體可以隨著空間 ❹艾化傳導缝,故本發明的散熱板崎能依歸品絲變化尺寸 大小 '彎折角度,而散熱籍片僅需製作在產品外側即可配合導熱 - 素材及揮發液體向外傳導散熱; - 林發日⑽設計十分自由’製作者可赚品需求讓散熱 板尺寸、角度變化’有效向外高速傳導散熱,卻不會受到直接傳 導缺陷的限制。 Ο 此外,本發明的散熱板内真空密閉空間將内壁面製作為凹凸 不平的粗糙表面,藉此可以加大導熱諸及揮發液體熱交換的面 積,也可以加速熱交換的效率。 前述導熱素材可以是鋼賴、銅絲絨或製賴繞細絲狀的溫 度良導材料;.而該揮發液體則是汽化溫度較低的液體’例如:= 頮、醚類及水的混合液體,前述混合液體的混合比例依照工作溫 度來逐一設定。 另需一提的是,該散熱板銜接有銅管,該銅管三通銜接一真 8 200930969 空管及-私管’且真蜂及狀管时 咖者先以真空管抽真空,並以注入管將揮發液體:二 岔閉空間内’揮發液體注人後再將銅管朗, 發 結的循龜,H域軸發她娜術=、:似 Ο 其中’該散熱㈣僅需製作在產品外卿可配合料素材及 ==外傳導散熱,而多數散熱鳍片的排列方式可:彼此 且同樣能另配合空冷風扇加_熱效果。 【實施方式】 有關核伽為達成上述目的、所制之技術,手段及立他 =明佳實施例並配合㈣詳細說明如後,相信本 ” 、彳错及其他伽,當可由之獲得具體瞭解。 =剌實施墙參„ i圖,本_實_絲板結構改良 ο如騎不’但本糾實施·非唯—實施財,獅本發明特徵 的一般結構皆屬本發龍護侧之-。 該散熱板結構改良係配置在熱源(糊示)之上,該胸㈣ =溫度良導材料製作,且於散熱板1G _設有抽真㈣密閉空間 面T熱板=之密_ u將_作_不平的轉 又,而在该密閉空間11内填裳有導熱素材12及揮發液體 200930969 13,另在該散熱板Η)外表面1Q1製作有若干散熱如4, 散熱韓片14的彼此等間距丨. 顶排列,5亥放熱板1G的密閉空間u向外 銜接有-銅管20,該钢管2〇三通銜接—真空管21及一注入管怨 且真空管21及注人管22皆裝設有閥件22卜211,藉真空管21 將选閉空間11抽直空,诉以、、* λ其〇〇 八二JL以庄入官22將揮發液體13注入 介= "It is the technology of the above-mentioned system that the heat-conducting unit is used to guide the outer surface of the heat-conducting unit, ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The switching efficiency is still in a state where it is not possible to dissipate heat at high speed. In order to effectively solve the aforementioned related issues, the creators of the present invention have finally developed a kind of full heat sink based on the research and development technology and experience accumulated in the field of cooling devices in the past, from strengthening heat exchange efficiency and designing freedom (4). Good shape. SUMMARY OF THE INVENTION The main purpose of the present I is to provide an improved heat sink structure, so that the exchange efficiency is better; '' 'To achieve the purpose, the heat sink is placed on the heat source. The heat dissipating plate is made of a temperature-guided material, and a vacuum confined space is opened in the heat dissipating plate, and a guide material and a volatilized liquid are filled in the NEW_空_, and a plurality of fins are formed on the outer surface of the heat dissipating plate. By the above-mentioned heat-conducting material and volatilization in the vacuum sealed space for high-speed heat exchange 'and let the high temperature can be first evaporated, the liquid is immediately removed from the heat source, and the heat-dissipating plate and the heat-dissipating fin made of the temperature-good material are immediately connected. The teaching energy can be derived; therefore, the invention lacks the speed and efficiency to take care of the hot money, and the _ _ raw transmission is better than the conduction efficiency. The invention can produce a direct thermal conductivity higher than the diamond thermal conductivity coefficient (2) and effectively derive the thermal energy from the heat source location. 200930969 Another object of the present invention is to provide an improved structure of a heat dissipating plate, which can be used in conjunction with the production of a free-standing shape, and more capable of internal design, rapid transfer of heat, b, and heat of the coated heat source. The heat dissipation plate communicates with the outside world. In order to achieve the above object, the structure of the regret plate of the present invention is modified to have a vacuum space in the heat dissipation plate, and in the vacuum printing, the tree is categorized and the volatilized body is in the vacuum confined space. The heat-conducting material and the swept body can be insulated and sewed along with the space. Therefore, the heat-dissipating plate of the present invention can change the size of the wire by the size of the bending angle, and the heat-dissipating film can be made only by the outer side of the product to be combined with heat conduction- The material and the volatile liquid conduct heat to the outside; - Lin Fa Ri (10) is very free to design. 'The producer can earn demand for the size and angle of the heat sink to effectively radiate heat to the outside, but it is not limited by direct conduction defects. Further, in the vacuum sealed space in the heat radiating plate of the present invention, the inner wall surface is formed as a rough surface having irregularities, whereby the heat exchange and the heat exchange area of the volatile liquid can be increased, and the efficiency of heat exchange can be accelerated. The heat conductive material may be a steel lacquer, a copper velvet or a temperature-conducting material which is made of a filament-like filament; and the volatile liquid is a liquid having a lower vaporization temperature, for example: a mixed liquid of hydrazine, ether and water. The mixing ratio of the aforementioned mixed liquid is set one by one in accordance with the operating temperature. It should also be mentioned that the heat sink is connected with a copper tube, and the copper tube is connected to a true 8 200930969 empty tube and a private tube, and when the bee and the tube are used, the vacuum is first vacuumed and injected. The tube will volatilize the liquid: in the second closed space, 'the volatile liquid is injected, then the copper tube is lang, the knot is the turtle, the H domain axis is sent to her. =,: like Ο where 'the heat dissipation (four) only needs to be made in the product The foreigner can mix materials and == external conduction heat dissipation, and most of the heat dissipation fins can be arranged in the same way: they can also be combined with the air cooling fan plus _ heat effect. [Embodiment] The nuclear gamma is to achieve the above objectives, the technology, the means and the statistic and the (4) detailed description, and believe that this, erroneous and other gamma, when you can get a specific understanding剌 剌 剌 剌 „ i i i i i i i i i i „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ . The heat sink structure is improved on the heat source (paste), the chest (four) = temperature good guide material, and the heat sink 1G _ is provided with a vacuum (four) confined space surface T hot plate = the secret _ u will _ In the confined space 11, the heat-conducting material 12 and the volatile liquid 200930969 13 are filled in the sealed space 11 and the outer surface 1Q1 of the heat-dissipating plate is made with a plurality of heat-dissipating such as 4, and the heat-dissipating Korean film 14 and the like. The spacing is 丨. The top arrangement, the closed space of the 5G heat release plate 1G is connected to the copper pipe 20, the steel pipe 2〇 three-way connection—the vacuum pipe 21 and an injection pipe blame, and the vacuum pipe 21 and the injection pipe 22 are installed. There is a valve member 22 211, and the selection and closing space 11 is taken up by the vacuum tube 21, and the 挥发 〇〇 〇〇 J J J J J J J 庄 庄 庄 庄 庄 庄 庄

密閉空間11内。 一 I 〇 〇 藉由前述結構’本發明利用前述導熱素材12及揮發液體13 在密閉空間11進行高速熱交換’且讓熱職生的高溫接觸傳導至 散熱板Η)内粗糙表面ln後,再利用粗糖表面U1傳導給導熱素 材12及揮發液體13 (導熱素材12及揮發液體13之間也會熱交 =)’、此時’該揮發液體13會蒸發形成氣體a,並且將高溫接觸傳 =粗糙表面in ’在此同時被粗縣面⑴吸收熱能的氣體a 曰再度下降凝結成揮發液體13,而前述過程中該導熱素材12及揮 發^體13之間仍然會快速熱交換,最後,該粗链表面⑴吸收的 傳導至外表面10卜並且傳導至排列的散熱鰭片14向外散 發;$於本發明先行運用導熱素材12配合揮發液體13的蒸發而 立即τ離熱源’似溫度良導材料製作的散熱板iQ及散熱韓片Μ 也,即導出熱能;故本發明能快速有效率地進行熱交換循環,且 明頒產生較直接傳導更佳的料效率(辭可以產生高於鑽石直 接溫導效率的效果)。 10 200930969 另需一提的是,請參閱第2圖所示,本發明之僅需於該散熱 板10内開設有密閉空間11,就可以利用導熱素材12配合揮發液 .體13產生熱交換循環,此實施例是將散熱板1〇設計成4字型, 且其密閉空f曰1 11也隨之彎折配置成卜字型,故散熱板1〇的一端 令熱源(未圖示)可以藏在設備内,而散熱板1〇的另一端則可以讓 排列的散熱鰭片14延伸設備之外散發熱能; 〇 故本發明的散熱板設計能依照產品需求變化尺寸大小、彎折 角度,而散熱鰭片14僅需製作在產品設備外側即可配合導熱素材 - 12及揮發液體13向外傳導散熱。 最後,第3圖為本發明使用在路燈設備3〇上的實施例,由於 散熱板10設計藏在設備内,且該散熱板1〇的一端令熱源31可以 被吸收,而散熱板10的另一端則可以讓排列的散熱鰭片14延伸 ^ 出路燈設備30外散發熱能。 綜上所述,本發明係—種散熱板結構改良,其係配置在熱源 之上,雜熱板以溫度良導材料製作,且於散熱板㈣設有真空 检閉空間’且在真空密閉空間内填裝有導熱素材及揮發液體,另 在該散熱板外表面製作有若干散熱鰭片; 藉此’本發明能快速有效率地進行熱交換,且散熱板的外型 11 200930969 設計變化十分自由; 斤' 本I明之『具有產業之可彻性』應已毋庸置疑,除此 之外在本木芦施例所揭露出的特徵技術,於申請之前並未曾見 於諸刊物,亦未曾被公開使用’不但具有如上所述功效增進之事 實’更具有不可輕忽的附加功效,是故,本發明的『新紐 及『進步性』都已符合專利法規,纽法提出發明專利之二 祈請惠予審查並早日賜准專利,實感德便。 叫’ 12 200930969 【圖式簡單說明】 第1圖 係本發明實施例之組合剖視圖; . 第2圖 係本發明另一實施例之組合剖視圖;以及 . 第3圖 係應用在路燈設備上的示意圖。 【主要元件符號說明】 散熱板10 外表面101 密閉空間11 粗f造表面111 ° 導熱素材12 散熱鰭片14 揮發液體13 • 銅管20 真空管21 閥件 221、211 氣體A ◎ 注入管22 路燈設備30 熱源31 13Inside the confined space 11. According to the foregoing structure, the present invention utilizes the above-mentioned heat conductive material 12 and the volatile liquid 13 to perform high-speed heat exchange in the sealed space 11 and conducts the high-temperature contact of the hot vocational student to the rough surface ln of the heat sink ,, and then The surface of the raw sugar U1 is transferred to the heat conductive material 12 and the volatile liquid 13 (the heat conductive material 12 and the volatile liquid 13 are also heated to be exchanged). At this time, the volatile liquid 13 evaporates to form the gas a, and the high temperature contact is transmitted. The rough surface in ' at the same time, the gas a 曰 which absorbs heat energy from the coarse county surface (1) is again lowered and condensed into a volatile liquid 13 , and in the foregoing process, the heat transfer material 12 and the volatile body 13 still exchange heat rapidly. Finally, the The absorption of the thick chain surface (1) to the outer surface 10b and conduction to the arranged heat dissipation fins 14 is outwardly dissipated; in the present invention, the heat conduction material 12 is first used in conjunction with the evaporation of the volatile liquid 13 to immediately decouple the heat source from the heat source. The heat sink iQ and the heat sink made by the material also derive the heat energy; therefore, the invention can perform the heat exchange cycle quickly and efficiently, and the production of the material is better than the direct conduction. Diamond to produce a higher transduction efficiency direct effect of temperature). 10 200930969 It should be noted that, as shown in FIG. 2, in the present invention, only the sealed space 11 is opened in the heat dissipation plate 10, and the heat transfer material 12 can be used to mix the volatile liquid. The body 13 generates a heat exchange cycle. In this embodiment, the heat dissipating plate 1 is designed to have a 4-shaped shape, and the sealed air gap 曰1 11 is also bent and arranged in a zigzag shape, so that one end of the heat dissipating plate 1 令 allows a heat source (not shown) to It is hidden in the device, and the other end of the heat dissipation plate 1 can allow the arranged heat dissipation fins 14 to extend heat dissipation outside the device; therefore, the heat dissipation plate design of the present invention can change the size and the bending angle according to the product requirements. The heat dissipating fins 14 need only be fabricated on the outside of the product equipment to be combined with the heat conductive material - 12 and the volatile liquid 13 to conduct heat. Finally, FIG. 3 is an embodiment of the present invention used in a street lamp device 3, since the heat sink 10 is designed to be hidden in the device, and one end of the heat sink 1 令 allows the heat source 31 to be absorbed, and the heat sink 10 is another At one end, the arranged heat dissipating fins 14 can be extended to generate heat energy outside the street lamp device 30. In summary, the present invention is an improved heat sink structure, which is disposed above a heat source, the heat spreader is made of a temperature-guided material, and the heat sink (4) is provided with a vacuum inspection space' and is in a vacuum sealed space. The heat-filling material and the volatile liquid are filled therein, and a plurality of heat-dissipating fins are formed on the outer surface of the heat-dissipating plate; thereby, the invention can perform heat exchange quickly and efficiently, and the heat-dissipating plate shape 11 200930969 is very freely designed.斤' I, Ming Ming's "have the ability to be industrially" should be unquestionable. In addition, the characteristic techniques revealed in this example are not seen in publications before, and have not been publicly used. 'The fact that not only has the effect of improving the above-mentioned effect' is more indispensable, and therefore, the "New New Zealand and "Progressiveness" of the present invention have been in compliance with the patent regulations, and New Zealand has proposed the invention patent. After reviewing and granting patents as soon as possible, it is really sensible. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a combined embodiment of the present invention; FIG. 2 is a cross-sectional view of another embodiment of the present invention; and FIG. 3 is a schematic view of a street lamp device . [Main component symbol description] Heat sink 10 External surface 101 Confined space 11 Thick f surface 111 ° Thermal material 12 Heat sink fins 14 Volatile liquid 13 • Copper tube 20 Vacuum tube 21 Valves 221, 211 Gas A ◎ Injection tube 22 Street light equipment 30 heat source 31 13

Claims (1)

200930969 · ·十、申請專利範圍: 1_ -種散熱板結構改良,係配置在熱源之上,該散熱板以溫度良 導材料製作’且於散熱板内真空製設有密閉空間,且在密閉空間 .内縣有導熱諸及揮魏體;·述導齡材及揮發液體進行 熱交換循環,且以散熱板銜接導出熱能。 2.如申请專纖圍第丨項所述之散賊結構改良,其中 ❹板外表面製作有若干散熱鰭片。 、 該散熱 .如申請翻職第丨項所述之散熱板結構改良,其中, 板内壁面製作為凹凸不平的粗輪表面。 b•如申請專利範圍第1 —鋼管於該散熱板上, 真空及注入揮發液體。 貝所述之散熱板結構改良,其中,另設有 該散熱板内的密閉空間銜接於該銅管供抽 6.如申請專利範圍第5 二通銜接一真空管及— 件,以該真空管抽真空 項所述之散熱板結構改良’其中,該銅管 注入管,且真空管及注入管皆裝設有閥 ,並以注入管將揮發液體注入該密閉空間 14 200930969 内。 7. 如申請專利範圍第1項所述 丨、之政熱板結構改良,其中,該導熱 素材可以是鋼絲絨、銅絲絨或制士、帕^ 4氣成纏繞細絲狀的溫度良導材料。 8. 如申請專利範圍第1項所述 叮、之政熱板結構改良,其中,該揮發 液體是汽化溫度較低的液體。 Ο 9.如申請專繼_ 8項所述之散熱板結構改良, 液體是醇類、醚類及水的混合液] 照工作溫度設定。 其中,該揮發 ,前述混合液體的混合比例依 .^如申請專利範_項所私散熱板結構改良,其中 數政熱鰭片在該散熱板外,而多 衣夕 Θ間距排列。 而夕數散熱韓片的排列方式是彼此等 Π.如申咖之散舰構改良, 熱鰭片 另配合空冷風扇加強散熱 其中 效果。 該散 12.如申s青專利範圍第2項戶斤、+、 該散熱 ㈣配一心 ^細1反結構改良,其令, ','、曰片力配σ二冷風扇加強散熱欵果。200930969 · ·10, the scope of application for patents: 1_ - The structure of the heat sink is improved, which is arranged above the heat source. The heat sink is made of a good temperature guide material and has a closed space in the heat sink and is in a closed space. The inner county has heat conduction and Wei Wei body; · describes the ageing material and the volatile liquid for heat exchange cycle, and uses heat sink to connect and derive heat energy. 2. For the improvement of the structure of the thief as described in the special item, the outer surface of the raft is made with a number of fins. The heat dissipation is improved as described in the application for the dismantling of the third aspect, wherein the inner wall surface of the plate is made of a rough surface of the uneven wheel. b• If the scope of the patent application is 1st—the steel pipe is on the heat sink, vacuum and inject the volatile liquid. The structure of the heat dissipation plate is improved, wherein a sealed space in the heat dissipation plate is connected to the copper pipe for pumping. 6. If the vacuum pipe and the vacuum pipe are connected to the fifth pass, the vacuum pipe is vacuumed. The structure of the heat sink is improved. The copper tube is injected into the tube, and the vacuum tube and the injection tube are all provided with a valve, and the volatile liquid is injected into the sealed space 14 200930969 by the injection tube. 7. If the structure of the hot plate is as described in item 1 of the patent application scope, the heat conductive material may be steel wool, copper velvet or warp, and the gas is wrapped into a filament-like temperature guide material. . 8. If the structure of the hot plate is as described in item 1 of the patent application, the volatile liquid is a liquid having a lower vaporization temperature. Ο 9. If you apply for the improvement of the heat sink structure described in _8, the liquid is a mixture of alcohols, ethers and water] set according to the working temperature. Wherein, the volatilization, the mixing ratio of the mixed liquid is improved according to the structure of the private heat sink of the patent application, wherein the number of heat fins is outside the heat sink, and the plurality of heat sinks are arranged at intervals. The arrangement of the number of radiant Korean films is the same as each other. For example, Shenhai's loose ship structure is improved, and the hot fins are combined with air-cooled fans to enhance heat dissipation. The scattered 12. For example, Shen Sing's patent scope is the second item of the household, +, the heat dissipation (four) with one heart ^ fine 1 anti-structure improvement, which makes, ', ', 曰 力 force with σ two cooling fan to enhance the cooling effect.
TW97100755A 2008-01-08 2008-01-08 Heat dissipation plate TW200930969A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI729564B (en) * 2019-11-14 2021-06-01 承奕科技股份有限公司 Composite heat dissipation device for heating element with plug-in port and heat sink with the device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI729564B (en) * 2019-11-14 2021-06-01 承奕科技股份有限公司 Composite heat dissipation device for heating element with plug-in port and heat sink with the device

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