TWI435207B - Heat-dissipating device for dissipating heat generated from a heat source - Google Patents

Description

Heat sink for dissipating heat generated by a heat source

The invention relates to a heat dissipating device, in particular to a heat dissipating device having a plurality of heat dissipating paths for improving heat dissipating efficiency.

With the advancement of technology, electronic devices are gradually moving toward a thin and light design trend, and the overall heat dissipation performance is closely related to the operational efficiency of electronic devices. The conventional heat sink is composed of a heat dissipation module and a heat pipe. The heat dissipation module can include a fan and a heat sink fin set. The heat pipe is respectively connected to a heat source and the heat dissipation fin group of the heat dissipation module, so that heat generated by the heat source can be transmitted to the heat dissipation fin group through the heat pipe, and the fan is used to assist Accelerating the dissipation of heat from the heat pipe to the heat sink fin set. Conventional heat sinks transfer heat in a single heat dissipation path, and their heat dissipation performance cannot effectively dissipate the heat generated by thin electronic devices such as thin notebook computers. The traditional improvement method is to provide a soaking plate on the heat source to accelerate the transfer of heat energy to the efficiency of the heat dissipation module. However, the heat plate is expensive, does not meet the demand for mass production of consumer electronic products, and additional additions are required. The hot plate also occupies the internal mechanism space of the electronic device, so how to design a heat sink with small volume and better heat dissipation efficiency is an urgent task for the electronic industry today.

The present invention provides a heat sink having a plurality of heat dissipation paths to improve heat dissipation efficiency to solve the above problems.

The patent application scope of the present invention discloses a heat dissipating device including a heat dissipating module for dissipating heat, and a heat pipe including a first end section, a middle section and a second end section The intermediate section is between the first end section and the second end section, and the first end section, the intermediate section and the second end section are respectively disposed on the heat source and the The heat dissipating device is configured to transmit heat generated by the heat source to the heat dissipating device according to different heat dissipating paths.

The heat dissipation module of the present invention further includes a heat dissipation fin assembly and a fan unit. The heat pipe is disposed on the heat dissipation fin set, and the fan unit is configured to dissipate the heat dissipation from the heat pipe to the heat dissipation. The heat of the fin set.

In the scope of the invention, the intermediate section of the heat pipe is disposed on the heat source, and the first end section and the second end section of the heat pipe are respectively disposed on the heat dissipation module, The heat generated by the heat source is respectively transmitted to the first end section and the second end section via the intermediate section, thereby dissipating the heat by the heat dissipation module.

In the scope of the invention, the first end section and the second end section of the heat pipe are disposed on the heat source, and the intermediate section of the heat pipe is disposed on the heat dissipation module. The generated heat is respectively transmitted to the intermediate section via the first end section and the second end section, thereby dissipating the heat by the heat dissipation module.

The intermediate section of the heat pipe includes two regions, and the first end segment and the second end segment of the heat pipe are respectively disposed on the heat source and the heat dissipation module, One of the intermediate sections of the heat pipe is disposed on the heat source, and another area of the intermediate section of the heat pipe is disposed on the heat dissipation module, and the heat generated by the heat source is via the first end section and the The region of the intermediate section is respectively transferred to the other region of the intermediate section and the second end section, whereby the heat generated by the heat source is dissipated by the heat dissipation module.

The heat dissipating device of the present invention extends the length of the heat pipe and surrounds it between the heat source and the heat dissipation module, so that different sections of the heat pipe can be respectively disposed on the heat source and the heat sink, so that the heat generated by the heat source can be The invention has better heat dissipation efficiency by transmitting a plurality of heat dissipation paths to the heat dissipation fin groups of the heat dissipation module. In addition, since the present invention has a plurality of heat dissipation paths, the heat dissipation device of the present invention can apply a small-sized (thin) heat pipe as a heat conduction path, which not only has the advantages of small volume, but also can greatly reduce the cost to improve market competitiveness.

Please refer to FIG. 1. FIG. 1 is a schematic view showing the appearance of a heat dissipating device 10 according to a first embodiment of the present invention. The heat sink 10 is used to dissipate heat generated by a heat source 12. For example, the heat source 12 can be a microprocessor. The heat sink 10 includes a heat dissipation module 14 for dissipating heat generated by the heat source 12 and a heat pipe 16 for transferring the heat from the heat source 12 to the heat dissipation module 14. The heat dissipation module 14 can include a heat dissipation fin set 141 and a fan unit 143. The heat pipe 16 can be disposed on the heat dissipation fin group 141, and the fan unit 143 can be used to dissipate heat transferred from the heat pipe 16 to the heat dissipation fin group 141. The heat pipe 16 includes a first end section 161, an intermediate section 163 and a second end section 165, and the intermediate section 163 is interposed between the first end section 161 and the second end section 165. The first end section 161, the middle section 163 and the second end section 165 of the heat pipe 16 are respectively overlapped on the heat source 12 and the heat dissipation fin set 141 of the heat sink 10, so that the heat generated by the heat source 12 is generated. It can be transferred to the heat sink 10 according to two different heat dissipation paths.

In the first embodiment of the present invention, the intermediate section 163 of the heat pipe 16 can be disposed on the heat source 12, and the first end section 161 and the second end section 165 of the heat pipe 16 can be respectively disposed on the heat dissipation module. The heat generated by the heat source 12 can be transferred to the first end section 161 and the second end section 165 via the intermediate section 163, respectively, so that the heat is dissipated by the heat dissipation module 14. In general, the heat pipe 16 may contain a working medium useful to assist in improving heat dissipation efficiency, such as pure water. Liquid phase gasification occurs when the working medium receives the heat generated by the heat source 12 in the evaporation zone (intermediate section 163) of the heat pipe 16, and then the gas phase fluid flows to a lower temperature by the heat convection effect. The condensation zone (the first end section 161 and the second end section 165) condenses into a liquid phase in the condensation zone to release heat. On the other hand, the liquid phase of the condensing zone also flows back to the evaporation zone via the capillary phenomenon, and absorbs heat in the evaporation zone to re-liquidify the liquid phase to form a heat exchange circulation system.

Please refer to FIG. 2, which is a schematic diagram of the appearance of the heat dissipation device 10 according to the second embodiment of the present invention. The elements of the second embodiment that have the same reference numerals as the first embodiment have the same structure and function, and thus will not be described in detail herein. The difference between the second embodiment and the first embodiment lies in the position of the heat pipe 16. The first end section 161 and the second end section 165 of the heat pipe 16 of the second embodiment can be disposed on the heat source 12, and the intermediate section 163 of the heat pipe 16 can be disposed on the heat dissipation fin set of the heat dissipation module 14. The heat generated by the heat source 12 can be transferred to the intermediate section 163 via the first end section 161 and the second end section 165, respectively, so that the heat is dissipated by the heat dissipation module 14. In the second embodiment, the heat pipe 16 has two places (the first end section 161 and the second end section 165) are overlapped with the heat source 12, so that it has the advantage of quickly dissipating heat, and the heat pipe 16 can be effectively prevented from being partially dried. Local Dry Out phenomenon. Please refer to FIG. 3, which is a schematic diagram of the appearance of the heat dissipation device 10 according to the third embodiment of the present invention. The components of the third embodiment that have the same reference numerals as those of the first embodiment and the second embodiment have the same structure and function, and therefore will not be described in detail herein. The difference between the third embodiment and the second embodiment lies in that different manufacturing methods are applied to overlap the first end section 161 and the second end section 165 of the heat pipe 16 to the heat source 12, and thus will not be described in detail herein. .

Please refer to FIG. 4, which is a schematic diagram of the appearance of the heat dissipation device 10 according to the fourth embodiment of the present invention. The components of the fourth embodiment that have the same reference numerals as the previous embodiments have the same structure and function, and therefore will not be described in detail herein. The fourth embodiment differs from the first embodiment, the second embodiment, and the third embodiment in the surrounding manner and the position of the heat pipe 16. The intermediate section 163 of the heat pipe 16 of the fourth embodiment may include two regions 163A and 163B. The first end section 161 and the second end section 165 of the heat pipe 16 may be respectively disposed on the heat source 12 and the heat dissipation module 14 The heat sink fin set 141. For example, the region 163A of the intermediate portion 163 of the heat pipe 16 may be disposed on the heat source 12, and the region 163B of the intermediate portion 163 of the heat pipe 16 may be disposed on the heat dissipation fin group 141 of the heat dissipation module 14, so that the heat source 12 The generated heat can be utilized via two heat dissipation paths (from the first end segment 161 to the region 163B of the intermediate segment 163 and from the region 163A of the intermediate segment 163 to the second end segment 165) 14 quickly dissipates the heat generated by the heat source 12.

Compared with the prior art, the heat dissipating device of the present invention extends the length of the heat pipe and surrounds it between the heat source and the heat dissipation module, so that different sections of the heat pipe can be respectively disposed on the heat source and the heat sink, so that The heat generated by the heat source can be transmitted to the heat dissipation fin set of the heat dissipation module via a plurality of heat dissipation paths, so the invention has better heat dissipation efficiency. In addition, since the present invention has a plurality of heat dissipation paths, the heat dissipation device of the present invention can apply a small-sized (thin) heat pipe as a heat conduction path, which not only has the advantages of small volume, but also can greatly reduce the cost to improve market competitiveness.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

10. . . Heat sink

12. . . Heat source

14. . . Thermal module

141. . . Heat sink fin set

143. . . Fan unit

16. . . Heat pipe

161. . . First end section

163. . . Intermediate section

163A. . . region

163B. . . region

165. . . Second end section

Fig. 1 is a schematic view showing the appearance of a heat sink according to a first embodiment of the present invention.

Fig. 2 is a schematic view showing the appearance of a heat sink according to a second embodiment of the present invention.

Fig. 3 is a schematic view showing the appearance of a heat sink according to a third embodiment of the present invention.

Fig. 4 is a schematic view showing the appearance of a heat sink according to a fourth embodiment of the present invention.

10. . . Heat sink

12. . . Heat source

14. . . Thermal module

141. . . Heat sink fin set

143. . . Fan unit

16. . . Heat pipe

161. . . First end section

163. . . Intermediate section

165. . . Second end section

Claims (5)

A heat dissipating device for dissipating heat generated by a heat source, comprising: a heat dissipating module for dissipating heat; and a heat pipe including a first end section and an intermediate section a segment and a second end segment between the first end segment and the second end segment, the first end segment, the intermediate segment and the second end segment Separatingly disposed on the heat source and the heat dissipating device, the intermediate section of the heat pipe includes two regions, and the first end segment and the second end segment of the heat pipe are respectively disposed on the heat source and the heat dissipation die An area of the middle section of the heat pipe is disposed on the heat source, and another area of the middle section of the heat pipe is disposed on the heat dissipation module, and heat generated by the heat source is generated through the first end The segment and the region of the intermediate segment are respectively transferred to the other region of the intermediate segment and the second end segment, thereby utilizing the heat dissipation module to dissipate the heat generated by the heat source. The heat dissipating device of claim 1, wherein the heat dissipating module comprises a heat dissipating fin set and a fan unit, wherein the heat pipe is disposed on the heat dissipating fin set, and the fan unit is configured to dissipate from the heat pipe. The heat to the heat sink fin group. The heat dissipation device of claim 1, wherein the heat generated by the heat source is respectively transmitted to the heat dissipation device according to different heat dissipation paths. The heat dissipating device of claim 3, wherein the intermediate section of the heat pipe is disposed on the heat source, and the first end section and the second end section of the heat pipe are respectively disposed on the heat dissipation module The heat generated by the heat source is respectively transmitted through the intermediate section The heat dissipation module is used to dissipate the heat to the first end section and the second end section. The heat dissipating device of claim 3, wherein the first end section and the second end section of the heat pipe are disposed on the heat source, and the intermediate section of the heat pipe is disposed on the heat dissipation module The heat generated by the heat source is respectively transmitted to the intermediate section via the first end section and the second end section, thereby dissipating the heat by using the heat dissipation module.