TWM455152U - Micro-loop type isothermal heat dissipation device - Google Patents

Description

Microcircuit type uniform temperature heat sink

This creation belongs to the field of heat dissipation technology for thin electronic products, especially a micro-circuit type that uses temperature difference and pressure difference as power to push the working fluid in a closed pipeline to unidirectional circulating flow to achieve uniform temperature and rapid heat dissipation. A uniform temperature heat sink.

According to the current computer or electronics industry, heat dissipation devices are usually used to dissipate the heat generated during use, so as to prevent various heat sources (such as transistors) from operating abnormally due to high operating temperatures or long periods of high temperature operation. The problem is that these heat sinks use conduction, convection or radiation to assist the heat source to dissipate heat while ensuring that it operates at normal operating temperatures.

In the current most common heat dissipating device, it is composed of a base, a plurality of heat dissipating fins and a cooling fan. After the base is in close contact with the surface of the heat source, and the heat generated by the heat source is absorbed, The heat is radiated to the heat dissipating fins, and the heat is dissipated by the heat dissipating fan to dissipate heat to the outside. Or a combination of a heat pipe (Heat Pipe) to enhance the heat dissipation effect, which utilizes the bidirectional change of the gas phase and the liquid phase generated by the working fluid of one of the heat pipes to absorb heat, and takes a large amount of heat at a time to enhance heat dissipation. effectiveness.

However, the above various heat sinks are often limited by various use conditions. For example, a thin electronic product with a small space (such as a notebook computer or a tablet computer) cannot be used. The conventional heat sink, and the heat sink designed by the heat pipe is expensive, and is limited by distance, which causes problems such as poor heat dissipation performance.

Especially in a thin electronic product, there are usually more than one heat source. Although the heat power of each heat source is different, the heat will accumulate and cause instability of the whole system. On the other hand, today's various heat sinks are designed for a single heat source, especially those with the highest heat generation. At present, the heat dissipation area is increased or the forced air cooling is added to improve the heat dissipation efficiency, so the overall manufacturing cost. And the noise generated is relatively increased, so it is necessary to improve the existing heat sink, so as to obtain better heat dissipation efficiency, and the thin electronic product can remain stable for a long time.

In view of this, one of the purposes of the present invention is to provide a micro-loop type uniform temperature heat dissipating device, which is bent into a ring-shaped structure by a plurality of heat sources having different heating powers in a closed pipeline, and correspondingly The abutting portion is provided with a working fluid filled with the heat of the heat source to generate unequal temperature of the working fluid, so that the working fluid can be used The pressure caused by the temperature difference pushes the working fluid to unidirectional circulating flow in the closed pipeline, and the flow rate is fast and the heat exchange effect is good, and the heat dissipation efficiency can be improved. Moreover, it does not need to use any pump to generate power during use, so there is no noise, so there is also a mute effect.

In order to achieve the above purpose, the micro-circuit type uniform temperature heat dissipation device of the present invention is applied to a thin electronic product, wherein the thin electronic product is internally provided with a plurality of heat sources having different heating powers, and one of the heat sources The heating power is higher than other and is called a main heating source, and the others are called secondary heat sources, which include: a closed pipeline, corresponding to the main heating source Forming an annular structure with the position of the heat source, and the closed pipe is provided with a first abutting portion corresponding to the main heat source, and at least one second abutting corresponding to the secondary heat source a working fluid filled in the closed line with a set amount, the working fluid absorbing unequal heat at a position corresponding to the first abutting portion and a position of the second abutting portion to generate different temperatures a temperature corresponding to the first abutting portion is greater than a temperature of the remaining second abutting portion; and a heat dissipating member disposed on the closed pipe and not located at the first abutting portion and the second abutting portion Position of the portion; in use, the working fluid generates a highest temperature at a position corresponding to the first abutment portion, and generates a pressure relative to a temperature difference between the second abutment portion to urge the working fluid to One-way circulation flow and heat dissipation in the closed pipeline.

The first abutting portion, the second abutting portion and the heat dissipating member are flat tubular structures formed by clamping the closed pipe. Helps increase the conduction rate when absorbing heat and dissipating heat. Or a heat absorbing member is respectively disposed between the first abutting portion and the main heat source, and the second abutting portion and the secondary heat source to increase a contact area with the heat source, and Helps to conduct the rate of heat when absorbing heat. Furthermore, since the working fluid is likely to be partially vaporized after absorbing heat, a buffer chamber is disposed adjacent to one side of the first abutting portion to serve as a volume expansion application of the working fluid there. The portion of the joint portion or the type of the abutting portion is directly formed as a buffer chamber to serve as a volume buffer space for vaporizing the working fluid, and the internal mechanism design can also be utilized to avoid the reverse flow of the working fluid. Moreover, in order to increase the flow rate of the working fluid, the present invention is provided with at least one micro-flow-conducting structure in one section of the inner wall surface of the closed pipe, and the flow velocity is increased by the capillary principle, and the micro-flowing structure is metal particles and metal. Net, thread, microchannel or a combination thereof.

In an embodiment, the heat sink of the present invention can be a metal back of a large area. The metal backing plate or part of the thin electronic product directly increases the contact area with the outside through the metal backing plate, and directly dissipates heat to the outside through the metal backing plate. Or the heat dissipating component is formed by a plurality of heat dissipating fins, and can actively dissipate heat.

In another embodiment, the microcircuit type uniform temperature heat dissipation device of the present invention can also be used for combining two or more closed pipelines, including: a microcircuit type uniform temperature heat dissipation device, which is applied to a thin type In the electronic product, the thin electronic product is internally provided with a plurality of heat sources having different heating powers, and the heating power of one of the heat sources is higher than other, and is called a main heat source, and the others are called secondary heat generation. a source comprising: at least one pair of closed conduits, each of the closed conduits forming an annular structure corresponding to a location of the primary heat source and the secondary heat sources, the respective closed conduits corresponding to each other The main heat source is jointly provided with a first abutting portion, and at least one second abutting portion corresponding to the secondary heat source; a working fluid is filled in the respective closed pipes with a set amount The working fluid absorbs unequal heat at a position corresponding to the first abutting portion and the position of the second abutting portions to generate different temperatures, and the temperature corresponding to the first abutting portion is greater than the remaining second portion The temperature at the abutment; and one a hot component disposed at the respective closed conduit and not at the position of the first abutting portion and the second abutting portion; in use, the working fluid produces the highest at the first abutting portion The temperature generates a pressure relative to a temperature difference between the second abutting portions for urging the working fluid to perform a unidirectional circulating flow and a heat dissipating amount in the respective closed conduits.

1‧‧‧Microcircuit type uniform temperature heat sink

11‧‧‧Closed pipeline

111‧‧‧First Abutment

112‧‧‧Heats

113‧‧‧ buffer room

114‧‧‧Micro-flow structure

115‧‧‧Second abutment

12‧‧‧Working fluid

13‧‧‧ Heat sink

2‧‧‧Thin Electronics

21‧‧‧heat source

211‧‧‧First heat source

212‧‧‧second heat source

213‧‧‧ Third heat source

Fig. 1 is a schematic structural view of a preferred embodiment of the present invention.

Fig. 2 is a schematic view showing another structure of the preferred embodiment of the present invention.

Fig. 3 is a schematic view showing the state of the preferred embodiment of the present invention.

Figure 4 is a schematic view showing the state of the preferred embodiment of the present invention.

Figure 5 is a first embodiment of the preferred embodiment of the present invention.

Figure 6 is a second embodiment of the preferred embodiment of the present invention.

Figure 7 is a third embodiment of the preferred embodiment of the present invention.

In order for your review board to have a clear understanding of the content of this creation, please refer to the following description only.

Please refer to the figures 1, 2, 3 and 4, which are schematic diagrams of various structures of the preferred embodiment of the present invention and a schematic diagram of the state during installation, and a schematic diagram of the state during operation. As shown in the figure, the microcircuit type uniform temperature heat dissipating device 1 of the present invention is applied to a thin electronic product 2, wherein the thin electronic product 2 is internally provided with a plurality of heat sources 21 having different heating powers (for example In the present embodiment, the heat source 21 has three heat sources 211, a second heat source 212, and a third heat source 213, and the first heat source 211 generates heat. The power of the second heat source 212 is greater than the heat power of the second heat source 212, and the heat of the first heat source 211 is greater than the heat of the second heat source 212. The temperature is greater than the temperature of the third heat source 213. The microcircuit type temperature equalizing device 1 includes a closed line 11, a working fluid 12 and a heat sink 13. It should be noted that the first heat source 211 is regarded as a main heat source and has the highest temperature. The second heat source 212 and the third heat source 213 are regarded as secondary heat sources, and the heat generation power thereof is not limited to the above implementation. For example, the heating power of the third heat source 213 may be greater than the heat power of the second heat source 212.

The closed conduit 11 forms an annular structure according to the position distribution of the heat sources 21, and the closed conduit 11 is provided with a first source corresponding to the heat source 21 a connecting portion 111 and two second abutting portions 115, and the first abutting portion 111, the second abutting portion 115 and the heat dissipating member 13 are flat tubular structures formed by flattening the closed conduit 11 As shown in the figure, the closed pipeline 11 is sequentially passed through the first heat source 211, the second heat source 212, and the third heat source 213, that is, connected to the first heat source 211. The second heat source 212 is further connected to the third heat source 213 by the second heat source 212. Furthermore, in order to further increase the contact area with the heat source 21, a heat absorbing member 112 is attached under the first abutting portion 111 and the second abutting portion 115, and the heat absorbing members 112 are Rectangular flat structure made of heat-conductive metal material.

The working fluid 12 is filled in the closed pipe 11 with a set amount, and the working fluid 12 is absorbed at the position of the first abutting portion 111 and the second abutting portion 115 corresponding to the closed pipe. The heat generated by the heat source 21 has different temperatures.

The heat dissipating member 13 is formed by a plurality of fins 131 spaced apart from each other, and is disposed on the closed conduit 11 and not located at the first abutting portion 111, and is located at the first heat source 211 and the first Between three heat sources 213. It should be noted that the heat dissipating member 13 is located at the lowest temperature position of the thin electronic product 2, and the heat to be dissipated is prevented from being repeatedly absorbed by the closed pipe 11, and the heat is effectively dissipated to the outside. As shown in the figure, the heat dissipating member 13 is formed by a plurality of fins spaced apart from each other and covered on the outside of the closed duct 11.

In use, the first abutting portion 111 absorbs the first heat source 211, and the second abutting portion 115 absorbs heat generated by the second heat source 212 and the third heat source 213, respectively. The volume of the working fluid 12 is changed by the temperature difference therebetween, that is, the working fluid 12 at the highest temperature is expanded by partial or full vaporization, and the temperature is second, the volume of the working fluid 12 is slightly expanded, but the expansion is not as high as the highest temperature. , thus creating a pressure difference, so it can push The working fluid 12 is unidirectionally circulated between the closed conduits 11, and the heat is dissipated to the outside by the heat dissipating member 13 to achieve uniform heat dissipation.

In addition, as shown in FIG. 2, since the working fluid 12 is in the process of absorbing heat, or partial vaporization may occur, a buffer chamber 113 is further disposed at a portion corresponding to the first abutting portion 111 for use as the The volume buffer space when the working fluid 12 is vaporized, and the phenomenon that the working fluid 12 is reversely flowed can be avoided.

Moreover, in order to increase the flow speed of the working fluid 12, a micro-flow structure 114 is disposed on the inner wall surface of the closed pipe 11, and the capillary principle between the working fluid 12 and the micro-flow structure 114 is utilized. The effect of increasing the flow rate is achieved, and the micro-flow structure 114 is a metal particle, a metal mesh, a thread, a micro flow channel, or a combination thereof.

Referring again to Figures 5, 6, and 7, it is a further embodiment of the preferred embodiment of the present invention. According to different requirements, the heat sink 13 of the present invention can also be implemented in different forms to obtain a desired heat dissipation effect. As shown in FIG. 5, the heat sink 13 is formed by flattening the closed pipe 11 to form an upward convexity. A flat tubular structure is connected to a metal backing plate of a large area, and the metal backing plate is coated on the back surface of the thin electronic product 2, and gradually flows along with the circulating temperature of the working fluid 12 The heat is dissipated to the outside, and no external power is required, not only can obtain a good heat dissipation effect, but also maintain its mute effect; and, as the area of the heat sink 13 is larger, the heat dissipation effect is better. As shown in FIG. 6, the heat dissipating member 13 is a flat tubular structure that is flattened by the closed pipe 11, and the type thereof is different from that described in FIG. 5, but can be changed by the extension length or angle thereof. The metal back plates (not shown) are connected. In addition, as shown in FIG. 7, the above-mentioned two or more closed conduits 11 may be serially connected in the same manner as the same heat absorbing member 112, and each of the closed conduits 11 also corresponds to the same. The position of the heat source 21 is provided with a complex The plurality of abutting portions 111, especially the heat generating sources 21 are relatively far apart, or the closed pipes 11 must be bent into a complicated shape, which can effectively reduce the manufacturing cost, and it should be noted that With the shape or size of the heat absorbing member 112, if possible, one part of the plurality of closed pipes 11 can be fixed to the same heat absorbing member 112, thereby forming a plurality of closed loop designs. As far as the application is concerned, it is possible to use a wide variety of different situations.

However, the above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, it is common knowledge in the technical field or equivalent or easy to be familiar with the technology. The changes and modifications made by the changer without departing from the spirit and scope of this creation shall be covered by the scope of this creation.

1‧‧‧Microcircuit type uniform temperature heat sink

11‧‧‧Closed pipeline

111‧‧‧First Abutment

112‧‧‧Heats

113‧‧‧ buffer room

114‧‧‧Micro-flow structure

115‧‧‧Second abutment

12‧‧‧Working fluid

13‧‧‧ Heat sink

Claims (11)

A micro-circuit type uniform temperature heat dissipation device is applied to a thin electronic product, wherein the thin electronic product is internally provided with a plurality of heat sources having different heating powers, and one of the heat sources has higher heating power than others It is called a primary heat source, and the others are called secondary heat sources. It includes: a closed pipe, which respectively forms a ring structure corresponding to the position of the main heat source and the secondary heat source, and the closed pipe is provided with a first abutting portion corresponding to the main heat source, and At least one second abutment portion is provided with a secondary heat source; a working fluid is filled in the closed pipeline with a set amount, and the working fluid absorbs unequal heat at a position corresponding to the first abutting portion and a position of the second abutting portion to generate different temperatures, The temperature at the first abutment portion is greater than the temperature at the second abutment portion; and a heat dissipating member disposed at the closed conduit and not at the position of the first abutting portion and the second abutting portion; in use, the working fluid generates the highest temperature at the corresponding first abutting portion, A temperature difference is generated between the second abutting portion to generate a pressure for pushing the working fluid to perform a unidirectional circulating flow and a heat dissipating amount in the closed pipe. The microcircuit type uniform temperature heat dissipating device according to claim 1, wherein the first abutting portion and the second abutting portion are flat tubular structures formed by splicing the closed pipe. The microcircuit type uniform temperature heat dissipating device according to claim 1, wherein the heat dissipating member is a flat tubular structure formed by sandwiching the closed pipe. The microcircuit type uniform temperature heat dissipating device according to claim 1 or 2 or 3, further comprising at least one heat absorbing member disposed on the first abutting portion and the main heat source, and the second abutting portion Between this secondary heat source. The microcircuit type uniform temperature heat dissipating device according to claim 4, further comprising at least one buffer chamber disposed on one side of the first abutting portion. The microcircuit type uniform temperature heat dissipating device according to claim 5, further comprising at least one micro-conducting structure, which is disposed on at least one section of the inner wall surface of the closed pipe, and the micro-ducting structure is metal particles. , metal mesh, thread, micro flow channel or a combination thereof. The microcircuit type uniform temperature heat dissipating device according to claim 6, wherein the heat dissipating member is a metal backing plate of a large area. The microcircuit type uniform temperature heat dissipating device according to claim 6, wherein the heat dissipating member is formed by a plurality of heat dissipating fins. The microcircuit type uniform temperature heat dissipating device according to claim 1, further comprising at least one micro-flow guiding structure disposed on at least one section of the inner wall surface of the closed pipe, and the micro-ducting structure is metal particles, Metal mesh, thread, microchannel or a combination thereof. The microcircuit type uniform temperature heat dissipating device according to claim 9, wherein the heat dissipating member is a metal backing plate of a large area. A micro-circuit type uniform temperature heat dissipation device is applied to a thin electronic product, wherein the thin electronic product is internally provided with a plurality of heat sources having different heating powers, and one of the heat sources has higher heating power than others Referred to as a primary heat source, the other is referred to as a secondary heat source, comprising: at least one pair of closed conduits, each closed conduit forming a ring corresponding to the location of the primary heat source and the secondary heat source a structure, the respective closed pipelines are provided with a first abutting portion corresponding to the main heat source, and at least one second abutting portion is provided corresponding to the secondary heat source; a working fluid is filled in the respective closed conduits with a set amount, and the working fluid absorbs unequal heat at a position corresponding to the first abutting portion and a position of the second abutting portions to generate a difference a temperature corresponding to a temperature at the first abutting portion being greater than a temperature at the remaining second abutting portion; and a heat dissipating member disposed on the respective closed conduit and not located at the first abutting portion The position of the second abutting portion; in use, the working fluid generates the highest temperature at the corresponding first abutting portion, and generates a pressure relative to a temperature difference between the second abutting portions, To promote the unidirectional circulation flow and the amount of heat dissipation of the working fluid in the respective closed pipelines.