五、新型說明： 【新型所屬之技術領域】 [0001] 一種散熱模組，尤指一種可提升散熱模組熱傳效率並修 正熱管無效端無散熱效能之缺點的散熱模組。 【先前技術】 [0002] 按，隨著半導體技術的進步，積體電路的體積亦逐漸縮 小，對於内侧理器這一類之積體電路電子元件來說，運 行速度越快，其單位時間產生之熱量就越多，若不即時 排出，就會引起溫度升高，導致運行不穩定。為了降低 内側理器及南北橋晶片之溫度，故於其上設置一散熱器 •‘以幫助散熱。 請參閱第1圖，係為習知技術散熱模組之立體分解圖，如 圖所示，傳統散熱器3具有一吸熱部31及一散熱部32，由 該吸熱部31與一熱源4貼設傳導熱量，再由該散熱部32之 複數散熱鰭片321以輻射方式散熱藉以提升散熱之效率， 並為了進一步增加熱傳導之效率亦有業者將散熱器3結合 熱管5加速熱傳導之效能，由熱管5兩端分別連接該散熱 器3之吸熱部31及散熱部32藉以增加熱傳效率，但此一結 構並非皆無缺點，該熱管5之兩末端係為熱傳效率最差之 部位，該熱管5内部之工作流體容易滯留於兩末端形成散 熱無效端，進而令該散熱器3之散熱效能大幅降低，故熱 管5失去增加熱傳效率之效用。 請參閱第2圖，係為習知技術另一散熱模組之立體分解圖 ，如圖所示，再者亦有業者於該散熱器3之吸熱部31處開 設溝槽311，並將複數熱管5至入該溝槽311中增加熱傳導 表單編號A0101 第3頁/共24頁 M427771 效率，又因熱源4係與該散熱器3中央部位312貼設傳導熱 量，故將熱管5之設置於該吸熱部31之中央部位312，兩 端延伸於該中央部位312之外側加速熱傳導，但此一設置 係也因該熱管5兩端容易產生傳導無效端，故使得增設熱 管5後所提升該散熱器3之熱傳效能仍為有限，並未能達 到預期之效果。 【新型内容】 [0003] 爰此，為解決上述習知技術之缺點，本創作之主要目的 ，係提供一種可增加熱傳效率的散熱模組。 為達上述之目的，本創作係提供一種散熱模組，係包 含：一散熱器、一熱管； 所述散熱器具有一吸熱部及一散熱部，所述散熱部具有 複數散熱鰭片，該吸熱部設有至少一容置槽。 所述熱管容設於前述容置槽内，所述熱管具有一第一 端及一第二端及一中段部及一傳導部，所述第一、二端 及該中段部相互比鄰並共同界定一第一部分，所述傳導 部繞設於該第一部分外側。 透過本創作散熱模組之設計係可完全運用熱管之整體 結構來進行傳導熱源，令其可大幅提升散熱效率，並且 改善傳統熱管因無效端之產生，而降低熱傳效率之問題 〇 【實施方式】 [0004] 本創作之上述目的及其結構與功能上的特性，將依據所 附圖式之較佳實施例予以說明。 請參閱第3、4、5圖所示，係為本創作散熱模組第一實施 表單编號A0101 第4頁/共24頁 M427771 例之立體分解及組合及剖視圖’如圖所示，所述散熱模 組1 ’係包含：一散熱器11、一熱管12 ; 所述散熱器11具有一吸熱部111及一散熱部112 , 所述散熱部112具有複數散熱韓片1121，該吸熱部in設 有至少一容置槽113。 所述熱管12容設於前述容置槽Π3内，所述熱管12 具有一第一端121及一第二端122及一中段部{23及至少 一傳導部124，所述第一、二端121、122及該中段部123 相互比鄰並共同界定一第一部分13，所述傳導部124繞設 於該第一部分13外側。 所述容置槽113更具有一吸熱區1131及一擴散區 1132 ’所述吸熱區1131係設於該擴散區1132内側，該擴 散區113 2係設於該吸熱區1131外側，所述熱管12之第一 部分1 3係設於該吸熱區1131，該傳導部12 4設於該擴散 區1132 。 所述熱管12具有一第一側125及一第二側126，所述第一 、二侧125、126皆呈扁平狀。 所述熱管12之第一端121及第二端122與該中段部123係 對應相鄰設於該傳導部124内側，該傳導部124彎設於該 第一知1 21及第—端1 2 2與該中段部12.3外側，並連接該 第一、二端121、122及該中段部123。 前述容置槽Π 3更具有一開放側11 33及一封閉側1134， 所述熱管12更具有一第一側125及一第二側126，所述第 一側12 5利用焊接、膠合、嵌合或緊配方式相對貼設該封 閉側113 4，該第二側1 2 6相對前述開放側113 3。 請參閱第6圖，係為本創作之散熱模組第二實施例之立體 表單編號A0101 第5頁/共24頁 M427771 分解圖，如圖所示，本實施例係與前述第一實施例部分 結構相同，故在此將不再贅述，惟本實施例與前述第一 實施例之不同處係為所述所述熱管丨2之第一部份丨3比鄰 該傳導部124，所述熱管整體呈非對稱之態樣，所述第一 部份13係可對應欲接觸之熱源2位置偏移設置。 請參閱第7、8、9、10圖，係為本創作之散熱模組第三實 施例之立體分解及組合圖，如圖所示，本實施例具有兩 種態樣，本實施例係與前述第一實施例部分結構相同， 故在此將不再贅述，惟本實施例與前述第一實施例之不 同處係為所述散熱模組1更具有一基板6，所述基板6係對 應與如述熱管12之第一部份13貼設，並透過焊接、膠合 、喪合或緊配之方式與該熱管12及該散熱器11結合。 另一態樣，如第9、1 0圖所示，所述基板6係對應與前述 熱管12整體貼設，並透過焊接、膠合、嵌合或緊配之方 式與該熱管12及該散熱器11結合。 参 請參閱第11圖，係為本創作之散熱模組第四實施例之立 體分解圖，本貫施例係與前述第一實施例部分結構相同 ，故在此將不再贅述，惟本實施例與前述第一實施例之 不同處係為所述複數散熱部112係由複數散熱鰭片1121相 互堆疊所組成，並利用焊接 '膠合、緊配或嵌合之方式 貼設於該吸熱部111相反該熱管丨2之一側。 6月參閱第12、12A圖，係為本創作之熱管之立體及a_a剖 視圖，如圖所示，本實施例部分結構與前述第一實施例 相同，故在此將不再贅述，惟本實施例與前述散熱模組 第一貫施例之不同處係為所述熱管12之第二側126呈扁平 狀，所述熱管12之徑向截面呈〇型。 表單編St A0101 第6頁/共24頁 M427771 請參閱第13、14圖，係為本創作散熱模組之應用實施示 意圖，如圖所示，所述散熱模組1係應用與至少一熱源2 接觸傳導熱量，所述散熱模組1由該散熱器η之吸熱部 111與该熱源2作接觸，並同時設置於該吸熱部Η〗之容置 槽113内的熱管12亦相同與熱源2貼設，該熱管12之第一 部份13(即該第一端12丨及第二端122與該中段部123) 係位於該吸熱部1 1 1之内侧當然亦可設置於吸熱部1 Η其. 它部分（如第6圖所示），並最為直接與熱源2接觸，並 透過該第一部份13吸收該熱源2之熱董後向該熱管12之傳 導部124擴散，並進一步由該傳導部124直接將熱量傳導 擴散至該散熱器11之吸熱部lu整體達到均勻傳遞熱源之 目的。 所述熱管12傳遞熱量之方:向除了針對該散熱器n之水平 方向外4政熱器11之垂直方向亦相同具有導熱效果， 可直接由該熱源2將熱量直接傳導至該散熱器丨丨之吸熱部 111藉以大幅提升該散熱器11之散熱效能。 【圖式簡單說明】 [0005]第1圖係為係為習知散熱模組之立體分解圖； 第2圖係為係為習知另一散熱模組之立體分解圖； 第3圖係為本創作散熱模組第一實施例之立體分解圖； 第4圖係為本創作散熱模组第一實施例之立體組合圖； 第5圖係為本創作散熱模組第一實施例之剖視圖； 第6圖係為本創作之散熱模组第二實施例之立體分解圖； 第7圖係為本創作之散熱模組第三實施例之立體分解圖； 第8圖係為本創作之散熱模組第三實施例之立體組合圖； 第9圖係為本創作之散熱模組第三實施例另一態樣之立體V. New Description: [New Technology Field] [0001] A heat dissipation module, especially a heat dissipation module that can improve the heat transfer efficiency of the heat dissipation module and correct the heat dissipation effect of the heat pipe invalid end. [Prior Art] [0002] According to the advancement of semiconductor technology, the volume of the integrated circuit is gradually reduced. For the integrated circuit electronic components such as the inner processor, the faster the running speed is, the unit time is generated. The more heat, if not immediately discharged, it will cause the temperature to rise, resulting in unstable operation. In order to reduce the temperature of the inner and north-south bridges, a heat sink is installed on it to help dissipate heat. Referring to FIG. 1 , it is an exploded perspective view of a conventional heat dissipation module. As shown in the figure, the conventional heat sink 3 has a heat absorbing portion 31 and a heat dissipating portion 32 , and the heat absorbing portion 31 is attached to a heat source 4 . The heat is transferred, and the heat radiating fins 321 of the heat radiating portion 32 radiate heat to improve the heat dissipation efficiency, and in order to further increase the efficiency of heat conduction, the heat sink 3 is combined with the heat pipe 5 to accelerate the heat conduction performance, and the heat pipe 5 is used. The heat absorbing portion 31 and the heat dissipating portion 32 of the heat sink 3 are respectively connected to the two ends to increase the heat transfer efficiency. However, the structure is not disadvantageous. The two ends of the heat pipe 5 are the portions with the worst heat transfer efficiency, and the heat pipe 5 is internally The working fluid is easily retained at both ends to form a heat-dissipating end, thereby further reducing the heat dissipation performance of the heat sink 3, so that the heat pipe 5 loses the effect of increasing heat transfer efficiency. Please refer to FIG. 2 , which is a perspective exploded view of another heat dissipation module of the prior art. As shown in the figure, a manufacturer also opens a groove 311 at the heat absorption portion 31 of the heat sink 3 and has a plurality of heat pipes. 5, the heat transfer form number A0101 is added to the groove 311 to increase the efficiency of the M427771, and the heat source 4 is attached to the central portion 312 of the heat sink 3 to conduct heat. Therefore, the heat pipe 5 is disposed at the heat absorption. The central portion 312 of the portion 31 extends at both ends of the central portion 312 to accelerate heat conduction. However, since the arrangement is also easy to generate a conductive ineffective end at both ends of the heat pipe 5, the heat sink 3 is lifted after the heat pipe 5 is added. The heat transfer performance is still limited and fails to achieve the desired results. [New Content] [0003] In order to solve the above shortcomings of the prior art, the main purpose of the present invention is to provide a heat dissipation module that can increase heat transfer efficiency. For the purpose of the above, the present invention provides a heat dissipation module, comprising: a heat sink and a heat pipe; the heat sink has a heat absorbing portion and a heat dissipating portion, the heat dissipating portion has a plurality of heat dissipating fins, and the heat absorbing portion There is at least one receiving groove. The heat pipe is disposed in the accommodating groove, the heat pipe has a first end and a second end and a middle portion and a conducting portion, and the first, second ends and the middle portion are adjacent to each other and are jointly defined In a first portion, the conducting portion is disposed outside the first portion. Through the design of the heat dissipation module, the heat pipe can be used to conduct the heat source, which can greatly improve the heat dissipation efficiency and improve the heat transfer efficiency of the traditional heat pipe due to the invalid end. The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. Please refer to the figures 3, 4, and 5, which are the three-dimensional decomposition and combination and cross-sectional view of the first implementation form No. A0101, page 4 of 24, and the M427771 example of the creative heat dissipation module. The heat dissipation module 1' includes a heat sink 11 and a heat pipe 12; the heat sink 11 has a heat absorbing portion 111 and a heat dissipating portion 112, and the heat dissipating portion 112 has a plurality of heat dissipating pieces 1121, and the heat absorbing portion is provided There is at least one receiving groove 113. The heat pipe 12 is disposed in the accommodating groove 3. The heat pipe 12 has a first end 121 and a second end 122 and a middle portion {23 and at least one conducting portion 124. The first and second ends are 121, 122 and the middle portion 123 are adjacent to each other and define a first portion 13 , and the conductive portion 124 is disposed outside the first portion 13 . The accommodating groove 113 further has a heat absorbing area 1131 and a diffusion area 1132. The heat absorbing area 1131 is disposed inside the diffusion area 1132. The diffusion area 113 2 is disposed outside the heat absorbing area 1131. The heat pipe 12 is disposed. The first portion 13 is disposed in the heat absorption region 1131, and the conductive portion 12 4 is disposed in the diffusion region 1132. The heat pipe 12 has a first side 125 and a second side 126, and the first and second sides 125 and 126 are flat. The first end 121 and the second end 122 of the heat pipe 12 are disposed adjacent to the inner portion 123 and disposed on the inner side of the conductive portion 124. The conductive portion 124 is bent at the first and second ends. 2 and the outer side of the middle portion 12.3, and the first and second ends 121, 122 and the middle portion 123 are connected. The accommodating slot 3 further has an open side 11 33 and a closed side 1134. The heat pipe 12 further has a first side 125 and a second side 126. The first side 12 5 is welded, glued, and embedded. The closed side 113 4 is relatively attached to the closed side, and the second side 1 2 6 is opposite to the open side 113 3 . Please refer to FIG. 6 , which is an exploded view of the stereoscopic form number A0101 of the second embodiment of the heat dissipation module of the present invention, and the M427771 is shown in the figure, and the embodiment is the same as the foregoing first embodiment. The structure is the same, so it will not be described here. However, the difference between this embodiment and the first embodiment is that the first portion of the heat pipe 2 is adjacent to the conductive portion 124, and the heat pipe is integral. In an asymmetrical manner, the first portion 13 can be positioned corresponding to the position of the heat source 2 to be contacted. Please refer to Figures 7, 8, 9, and 10 for the three-dimensional decomposition and combination diagram of the third embodiment of the heat dissipation module of the present invention. As shown in the figure, this embodiment has two aspects, and this embodiment is related to The first embodiment has the same structure and is not described here. However, the difference between the embodiment and the first embodiment is that the heat dissipation module 1 further has a substrate 6 corresponding to the substrate 6 . It is attached to the first portion 13 of the heat pipe 12 as described above, and is combined with the heat pipe 12 and the heat sink 11 by welding, gluing, smashing or tight fitting. In another aspect, as shown in FIGS. 9 and 10, the substrate 6 is integrally attached to the heat pipe 12, and is welded, glued, fitted or tightly coupled to the heat pipe 12 and the heat sink. 11 combined. Please refer to FIG. 11 , which is a perspective exploded view of the fourth embodiment of the heat dissipation module of the present invention. The present embodiment is identical to the previous embodiment, and therefore will not be described again, but the implementation is not described herein. The difference between the example and the foregoing first embodiment is that the plurality of heat dissipating portions 112 are composed of a plurality of heat dissipating fins 1121 stacked on each other, and are attached to the heat absorbing portion 111 by soldering, gluing or fitting. On the contrary, one side of the heat pipe 丨2. Referring to Figures 12 and 12A in June, it is a three-dimensional and a-a cross-sectional view of the heat pipe of the present invention. As shown in the figure, the partial structure of this embodiment is the same as that of the first embodiment described above, and therefore will not be described herein again, but the present embodiment will be omitted. The difference from the first embodiment of the heat dissipation module is that the second side 126 of the heat pipe 12 is flat, and the heat pipe 12 has a radial cross section. Forms St A0101 Page 6 of 24 M427771 Please refer to Figures 13 and 14 for the application implementation of the creative cooling module. As shown in the figure, the heat dissipation module 1 is applied to at least one heat source 2 Contacting the heat transfer, the heat dissipation module 1 is in contact with the heat source 2 by the heat absorbing portion 111 of the heat sink η, and the heat pipe 12 disposed in the accommodating groove 113 of the heat absorbing portion is also attached to the heat source 2 The first portion 13 of the heat pipe 12 (ie, the first end 12 丨 and the second end 122 and the middle portion 123 ) is located inside the heat absorbing portion 1 1 1 and may of course be disposed in the heat absorbing portion 1 a portion thereof (as shown in FIG. 6), and most directly in contact with the heat source 2, and absorbing the heat of the heat source 2 through the first portion 13 and diffusing to the conductive portion 124 of the heat pipe 12, and further The conducting portion 124 directly conducts heat conduction to the heat absorbing portion lu of the heat sink 11 for the purpose of uniformly transferring the heat source. The heat pipe 12 transmits heat to the same direction as the vertical direction of the heat exchanger 11 except for the horizontal direction of the heat sink n, and the heat is directly transmitted from the heat source 2 to the heat sink. The heat absorbing portion 111 is used to greatly improve the heat dissipation performance of the heat sink 11. BRIEF DESCRIPTION OF THE DRAWINGS [0005] Fig. 1 is an exploded perspective view of a conventional heat dissipation module; Fig. 2 is an exploded perspective view of another conventional heat dissipation module; An exploded perspective view of the first embodiment of the heat dissipation module of the present invention; FIG. 4 is a perspective view of the first embodiment of the heat dissipation module of the present invention; FIG. 5 is a cross-sectional view of the first embodiment of the heat dissipation module of the present invention; Figure 6 is a perspective exploded view of the second embodiment of the heat dissipation module of the present invention; Figure 7 is an exploded perspective view of the third embodiment of the heat dissipation module of the present invention; The three-dimensional combination diagram of the third embodiment; the ninth figure is another aspect of the third embodiment of the heat dissipation module of the present invention
表單編號麵1 ^ti/.24S M427771 分解圖； 第1 〇圖係為本創作之散熱模組第三實施例另一態樣之立 體組合圖； 第11圖係為本創作之散熱模組第四實施例之立體分解圖 . t 第1 2圖係為本創作之熱管第一實施例之立體圖； 第12A圖係為本創作之熱管第—實施例之A_A立體剖視圖 7 第13圖係為本創作散熱模組之應用實施示意圖； 第14圖係為本創作散熱模組之應用實施示意圖。 【主要元件符號說明】 [0006] 散熱模組1 散熱器11 吸熱部111 散熱部112 散熱鰭片1121 容置槽113 熱管12 第一端121 第二端122 中段部123 傳導部124 第一側125 第二側126 第一部分1 3 吸熱區1131 第8頁/共24頁 表單编號A0101 M427771 擴散區1132 開放側11 33 封閉側1134 熱源2 基座6 表單編號A0101 第9頁/共24頁Form number plane 1 ^ ti / . 24S M427771 exploded view; 1 〇 diagram is a three-dimensional combination diagram of another aspect of the third embodiment of the heat dissipation module of the creation; Figure 11 is the heat dissipation module of the creation 3D exploded view of the fourth embodiment. t Fig. 12 is a perspective view of the first embodiment of the heat pipe of the present invention; Fig. 12A is a perspective view of the A_A perspective view of the heat pipe of the present invention. Schematic diagram of the application implementation of the creation of the thermal module; Figure 14 is a schematic diagram of the application implementation of the creation of the thermal module. [Main component symbol description] [0006] Heat dissipation module 1 Heat sink 11 Heat absorbing portion 111 Heat dissipation portion 112 Heat dissipation fin 1121 accommodating groove 113 Heat pipe 12 First end 121 Second end 122 Middle portion 123 Conduction portion 124 First side 125 Second side 126 First part 1 3 Heat absorbing area 1131 Page 8 of 24 Form number A0101 M427771 Diffusion area 1132 Open side 11 33 Closed side 1134 Heat source 2 Base 6 Form number A0101 Page 9 of 24