TWM512885U - Heat-dissipation module - Google Patents

Description

Thermal module

This creation is about a heat dissipation module, especially a heat dissipation module that can greatly increase the heat conduction effect and improve the heat dissipation efficiency.

With the advancement of technology, the number of transistors per unit area of electronic components is increasing, causing an increase in the amount of heat generated during operation. On the other hand, the operating frequency of electronic components is also getting higher and higher. The heat caused by the on/off switching of the transistor is also the cause of the increase in the heat generated by the electronic components. If this heat is not properly handled, it will cause The reduction in the speed of the wafer operation, even severely affects the life of the wafer; to enhance the heat dissipation effect of the electronic components, the heat is dissipated into the environment by natural or forced convection via the fins of the heat sink.

Since the heat pipe can dissipate a large amount of heat transfer distance at a small cross-sectional area and temperature difference, and can operate without an external power supply, without the need for power supply and space utilization economy, Various heat pipes have become one of the widely used heat transfer components in electronic heat dissipation products.

The most commonly used heat dissipation method is to install a heat-dissipating device (such as a heat sink) on the heating element, in particular, a heat sink having a heat pipe structure, which is made of a material having a high thermal conductivity. And through the working fluid and capillary structure provided in the heat pipe, the heat sink has the characteristics of high thermal conductivity, and the structure has the advantage of light weight, which can reduce the weight and cost derived from the heat sink. The problem of system complexity.

The conventional heat pipe heat sink structure includes a plurality of heat dissipation fins and at least one heat pipe, the heat dissipation fins having at least one hole, the heat pipe is disposed in the hole to make the heat sink and the heat pipe Combination, but since the conventional heat pipe cross-sectional shape is a simple circular or elliptical shape, when the heat is transferred to the heat dissipation fins, the area where the heat pipe and the heat sink contact each other is too small (only point-to-point contact) The range and speed of heat transfer are limited, and the effect of heat conduction is less obvious, and the heat dissipation rate is slower.

As mentioned above, the conventional disadvantages have the following disadvantages:

1. The heat conduction effect is less obvious;

2. The heat dissipation rate is slower.

Therefore, how to solve the above problems and problems in the past, that is, the inventors of this case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipation module which can greatly increase the heat conduction effect and thereby improve the heat dissipation performance.

The second objective of this creation is to provide a thermal module that can increase the rate of heat release.

In order to achieve the above object, the present invention provides a heat dissipation module comprising a heat pipe and a heat dissipating unit, the heat pipe having a body and integrally extending at least one continuous or axially outward from the circumferential side of the body. a non-continuous first heat conducting portion, the heat dissipating unit has a plurality of heat dissipating fins, and the heat dissipating fins are spaced apart from each other, and the heat dissipating fins have a through hole extending outwardly from the at least one first positioning groove The body and the first heat conducting portion respectively pass through the through hole and the first positioning groove is tightly coupled with the heat dissipating unit.

Through the structure of the foregoing structure, when the heat source contacts the heat pipe, the heat generated by the heat source is transmitted to the body of the heat pipe and the first heat conducting portion through a structure integrally formed by the body and the first heat conducting portion. The heat dissipating unit, at this time, the heat generated by the heat source is transmitted to the heat dissipating fin through the main body and the first heat conducting portion, and the heat is extended by the body by using the first heat conducting portion. The main body is transmitted to the first heat conducting portion, and is further transmitted to the other heat dissipating fins by the first heat conducting portion for heat dissipation. Since the first heat conducting portion is a large heat dissipating surface, the heat dissipating fin can be formed. The larger contact surface is used to increase the heat conduction area, thereby greatly improving the heat transfer effect and efficiency.

2‧‧‧ Thermal Module

21‧‧‧ heat pipe

211‧‧‧ body

212‧‧‧First heat transfer department

213‧‧‧Second heat transfer department

22‧‧‧Heat unit

221‧‧‧Heat fins

222‧‧‧Perforation

223‧‧‧First positioning slot

224‧‧‧Second positioning slot

1 is an exploded perspective view of a first embodiment of the present heat dissipation module;

Figure 2 is a perspective assembled view of the first embodiment of the heat dissipation module of the present invention;

Figure 3 is a front view of the first embodiment of the heat dissipation module of the present invention;

Figure 4 is a perspective assembled view of the second embodiment of the creative heat dissipation module;

Figure 5 is a front view of the second embodiment of the creative heat dissipation module;

Figure 6 is a perspective exploded view of the third embodiment of the heat dissipation module of the present invention;

Figure 7 is an exploded perspective view of a fourth embodiment of the heat dissipation module of the present invention;

Figure 8 is a perspective exploded view of the fifth embodiment of the heat dissipation module of the present invention;

Figure 9 is a perspective assembled view of the fifth embodiment of the creative heat dissipation module;

Figure 10 is a perspective exploded view of a sixth embodiment of the present heat dissipation module.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

Please refer to the figures 1 , 2 , 3 , 4 , and 5 , which are the perspective exploded view and the stereoscopic combination diagram of the first embodiment of the heat dissipation module. As shown in the figure, a heat dissipation module 2 includes a heat pipe. And a heat dissipating unit 22, wherein the heat pipe 21 has a body 21, 1 and integrally extends at least one continuous or discontinuous first heat conducting portion 212 radially from the circumferential side of the body 211. The heat dissipating unit 22 is formed by stacking a plurality of heat dissipating fins 221, and a plurality of through holes 222 are defined in the heat dissipating fins 221. The through holes 222 extend outwardly from the at least one first positioning slot 223. The through hole 222 and the first positioning groove 223 are respectively disposed corresponding to the first heat conducting portion 212, and the heat radiating unit 22 is coupled to the heat pipe 21.

Continuing to refer to FIG. 3, which is a front view of the first embodiment of the present invention. In the embodiment, the first heat conducting portion 212 and the body 211 are perpendicular to each other, and corresponding to each other. The perforations 222 and the first positioning grooves 223 are also perpendicular to each other (as shown in FIG. 3) or inclined or at any angle (the second embodiment of the present invention, as shown in FIGS. 4 and 5) to make the heat pipe 21 corresponds to the heat dissipation unit 22. In addition, in this embodiment, the shape of the cross section of the heat pipe 21 is circular.

Through the design of the structure of the present invention, by the structure in which the body 211 is integrally formed with the first heat conducting portion 212, the heat pipe has a large heat conduction area due to the design of the first heat conducting portion 212, when the heat source (not shown) When the heat pipe 21 is in contact with the heat pipe 21, the heat generated by the heat source is transmitted to the heat dissipation fins 221 through the body 211 of the heat pipe 21 and the first heat conduction portion 212. At this time, heat is simultaneously transmitted through the body 211 and The first heat conducting portion 212 is transmitted to the heat dissipating unit 22, and the first heat conducting portion 212 is in contact with the heat dissipating fins 221 for a large area to increase the heat conduction area, thereby rapidly transferring heat to The heat dissipation unit 22 performs heat dissipation to greatly improve heat dissipation efficiency.

Please refer to FIG. 6 , which is a perspective exploded view of the third embodiment of the heat dissipation module. The corresponding relationship between the components and the components of the heat dissipation module is the same as that of the heat dissipation module. Further, the main difference between the heat dissipating module and the foregoing is that the shape of the cross section of the heat pipe 21 is flat in the embodiment, but it is not limited thereto, and may be used according to actual implementation. The heat pipe 21 can be elliptical or any other shape, and the aforementioned effects can also be achieved.

Please refer to FIG. 7 , which is a perspective exploded view of a fourth embodiment of the heat dissipation module. The corresponding relationship between the components and the components of the heat dissipation module is the same as that of the heat dissipation module, so Further, the main difference between the heat dissipation module and the foregoing is that the circumferential side of the body 211 integrally extends outwardly from the two first heat conducting portions 212, and the heat dissipation fins 221 correspond to the through holes 222 outward. The two first positioning grooves 223 are extended, so that the two first heat conducting portions 212 are correspondingly disposed in the two first positioning grooves 223 to combine the heat pipes 21 and the heat dissipation unit 22. In the present embodiment, the two first heat conducting portions 212 are used for description. In actual implementation, the number of the first heat conducting portions 212 can be arbitrarily increased according to the needs of the user, and the same effect can be achieved.

Please refer to FIG. 8 and FIG. 9 , which are the three-dimensional exploded and three-dimensional combination diagram of the fifth embodiment of the heat dissipation module. The corresponding components of the heat dissipation module and the corresponding relationship between the components are the same as the heat dissipation module. Therefore, the main difference between the heat dissipating module and the foregoing is that the first heat conducting portion 212 further has a second heat conducting portion 213, and the second heat conducting portion 213 is formed by the first heat conducting portion. 212 is integrally formed, and the first heat conducting portion 212 and the second heat conducting portion 213 have an angle between 0 degrees and 360 degrees, and the first positioning groove 223 extends outwardly. The second heat conducting portion 213 is correspondingly disposed through the second positioning groove 224.

The structure of the first heat conducting portion 212 and the second heat conducting portion 213 extending outwardly from the body 211 can transfer heat from the body 211 to the first heat conducting portion 212 and the second heat conducting portion 213, and then The heat transfer portion 212 and the second heat transfer portion 213 are quickly transferred to other portions of the heat dissipation fins 221 for heat dissipation to increase the heat conduction area, thereby greatly improving the heat conduction effect.

Finally, please refer to FIG. 10 , which is a perspective exploded view of a sixth embodiment of the heat dissipation module. The corresponding relationship between the components and the components of the heat dissipation module is the same as that of the heat dissipation module. Therefore, the main difference between the heat dissipation module and the foregoing is that the three sides of the body 211 extend outwardly from the three first heat conduction portions 212, and each of the first heat conduction portions 212 extends outwardly. The second heat conducting portion 213 is disposed, and the corresponding holes 222 of the heat dissipating fins 221 extend outwardly from the three first positioning slots 223, and each of the first positioning slots 223 extends outwardly from the second positioning slot. 224, the body 211 and the first heat conducting portion 212 and the second heat conducting portion 213 are respectively disposed in the through hole 222 and the first positioning groove 223 and the second positioning groove 224, so that the heat pipe 21 and the heat dissipation unit 22 Combine. In the embodiment, the first heat conducting portion 212 and the second heat conducting portion 213 are used for description. In actual implementation, the number of the first heat conducting portion 212 and the second heat conducting portion 213 can be arbitrarily increased according to the needs of the user. The same effect can be achieved as well.

As mentioned above, this creation has the following advantages over the prior art:

1. It has a large area contact with the heat dissipation fins, and the heat conduction effect is good;

2. The heat dissipation speed is fast;

3. Significantly increase heat dissipation efficiency.

The present invention has been described in detail above, but the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited. That is, all changes and modifications made in accordance with the scope of this creation application shall remain covered by the patents of this creation.

2‧‧‧ Thermal Module

21‧‧‧ heat pipe

211‧‧‧ body

212‧‧‧First heat transfer department

22‧‧‧Heat unit

221‧‧‧Heat fins

222‧‧‧Perforation

223‧‧‧First positioning slot

Claims (5)

A heat dissipation module includes:
a heat pipe having a body and integrally extending at least one first heat conducting portion axially from a radial direction of a circumferential side of the body; and a heat dissipating unit having a plurality of heat dissipating fins, and the heat dissipating fins are spaced apart from each other, The heat dissipation fins are provided with a through hole, and the through hole extends outwardly to the first positioning groove. The body and the first heat conducting portion respectively pass through the through hole and the first positioning groove is coupled to the heat dissipation unit. The heat dissipation module of claim 1, wherein the first heat conducting portion further has a second heat conducting portion, and the second heat conducting portion is integrally formed by the first heat conducting portion. The heat dissipation module of claim 2, wherein the first positioning groove extends outwardly from a second positioning slot, and the second heat conducting portion corresponds to the second positioning slot. The heat dissipation module of claim 2, wherein the first heat conducting portion and the second heat conducting portion have an angle between 0 degrees and 360 degrees. The heat dissipation module of claim 1, wherein the first heat conduction portion is continuous or discontinuous.