US20090056928A1 - Heat dissipation assembly - Google Patents
Heat dissipation assembly Download PDFInfo
- Publication number
- US20090056928A1 US20090056928A1 US11/849,271 US84927107A US2009056928A1 US 20090056928 A1 US20090056928 A1 US 20090056928A1 US 84927107 A US84927107 A US 84927107A US 2009056928 A1 US2009056928 A1 US 2009056928A1
- Authority
- US
- United States
- Prior art keywords
- curved
- cooling fin
- heat dissipation
- heat
- dissipation assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention is related to a heat dissipation assembly and particularly to a heat dissipation assembly in which a heat pipe with a curved section and a curved shaped cooling fin set with a curved recess for being attached to the curved section.
- the conventional heat dissipation assembly which provides a heat pipe and a cooling fin set, can be classified into three categories.
- Taiwan Utility Model Application No. 094221564 entitled “ASSEMBLABLE HEAT DISSIPATION DEVICE”, which discloses a heat pipe with a horizontally extended curved section being attached to a first cooling fin set and a second cooling fin set, which provide a recess respectively.
- Taiwan Utility Model Application No. 094222753 entitled “HEAT DISSIPATION DEVICE”, which discloses a heat pipe with an upright extended curved section passing through at least a cooling fin set.
- Taiwan Utility Model Application No. 094210338 entitled “COOLING FINS ASSEMBLY”, which discloses a heat pipe passing through a plurality of cooling fins and then having a curved shape.
- the first and second categories of the conventional heat dissipation assemblies have a common feature that the curved sections of the heat pipes are attached to the cooling fin sets and the horizontally extending curved section of the heat pipe provided in the first category of the conventional heat dissipation assembly occupies more space and is too close to the motherboard.
- the curved shaped section of the heat pipe provided in the third category of the conventional heat dissipation assembly is fabricated after the heat pipe being attached to the cooling fin set such that it is incapable of controlling the size of curved shaped section in the process of fabricating effectively.
- a primary object of the present invention is to provide a heat dissipation assembly in which a heat pipe with an upright curved section and the cooling fin set with a lateral curved recess are attached to each other precisely.
- Another object of the present invention is to provide a heat dissipation assembly in which the curved section of a heat pipe is made with a preset tortuotsity before the lateral recess of a cooling fin set is attached to the curved section.
- a further object of the present invention is to provide a heat dissipation assembly with which the sizes of the upright curved section of the heat pipe and the lateral curved recess of the cooling fin set can be controlled effectively during the heat pipe and the cooling fin set being fabricated.
- a heat dissipation assembly includes a heat pipe and a cooling fin set.
- the heat pipe provides an upright curved section and the cooling fin set provides a plurality of cooling fins to be attached to the curved section.
- the cooling fin set has a curved shape corresponding to the curved section and provides a lateral curved recess for the curved section being capable of fitting with the curved recess precisely due to the sizes of the curved section and the curved cooling fin are controlled effectively and the required tortuosity is obtained during being worked.
- FIG. 1 is an exploded perspective view of a heat dissipation assembly according to the present invention
- FIG. 2 is an assembled perspective view of a heat dissipation assembly according the present invention.
- FIG. 3 is a sectional view of a heat dissipation assembly according the present invention.
- the preferred embodiment of a heat dissipation assembly includes a heat pipe 1 , a heat dissipating fin set 2 and a heat sink 3 .
- the heat pipe 1 provides an upright curved section 11 .
- the cooling fin set 2 further includes a plurality of heat dissipating fins 21 and provides a curved shape with a curved lateral recess 211 corresponding to the curved section 11 of the heat pipe 1 such the cooling fin set 2 is capable of being attached to the heat pipe 1 by means of the curved lateral recess 211 fitting with the upright curved section 11 of the heat pipe 1 .
- the outer surface of the upright curved section 11 and the wall surface of the curved lateral recess 211 are coated with heat conducting medium 5 such that the cooling fin set 2 can be joined to the heat pipe 1 firmly.
- the heat conducting medium 5 can be solder paste.
- any shapes of the cooling fins 21 can be provided even if different shapes of the cooling fins 21 are arranged in the same cooling fin set 2 as long as the cooling fins 21 have greater areas to contact airflow and good heat exchange efficiency is capable of being obtained.
- the upright curved section 11 of the heat pipe 1 can be arranged to be attached to two cooling fin sets 2 or the heat pipe 1 with a plurality of upright curved sections can be made to fit with a cooling fin set 2 respectively.
- the heat pipe 1 can be made of either copper or aluminum. Further, a plurality of heat pipe 1 can be arranged in the heat dissipation assembly of the present invention.
- the outer diameter of the respective heat pipe 1 is equal to or greater than the size of the lateral curved recess 211 for obtaining better a contact surface and being favorable for soldering joint.
- the respective heat pipe 1 is fabricated with a bending machine associated with molds to perform tube bending or with a press machine associated with press molds to perform plastic working till a preset tortuosity is reached before being assembled to the heat sink 3 .
- the heat sink 3 is employed to contact with a heating device 4 and the heat sink 3 is integrally made with extruded aluminum and provides a plurality of fins spaced apart from each other attached to the surface of a substrate or is fabricated with a plurality of aluminum fins being soldered to the surface of a copper substrate.
- the heat source 4 can be an integrated circuit, a central processing unit (CPU), a storage device, a light emitting device, a transformer or the like.
- a fan can be disposed beside the cooling fin set 2 to speed up heat removal from the cooling fin set 2 . Because the cooling fin set 2 has a curved shape, the airflow induced by the fan is capable of contacting more cooling fins 21 than those on the conventional line shaped cooling fin set such that the heat dissipation assembly of the present invention enhances effect of heat dissipation.
- the heat pipe 1 , the cooling fins 21 or the heat sink 3 is made of copper, aluminum, alloy, ceramics or the like, which provides high heat conductive efficiency.
- the heat dissipation assembly of the present invention extends upright from the heat sink to occupy less space than the prior art and provides a larger gap from the motherboard of a computer such that heat removed from the heat dissipation assembly is incapable of moving toward the mother board or other components on the motherboard.
- the heat pipe is worked to have a preset tortuosity such that the size of the heat dissipation assembly is controlled effectively while the cooling fin set fitting with the heat pipe.
- the cooling fin set can be fabricated to meet the curved section of the heat pipe easily.
Abstract
A heat dissipation assembly includes a heat pipe and a cooling fin set. The heat pipe provides an upright curved section and the cooling fin set provides a plurality of cooling fins to be attached to the curved section. Wherein, the cooling fin set has a curved shape corresponding to the curved section and provides a lateral curved recess for the curved section being capable of fitting with the curved recess precisely due to the sizes of the curved section and the curved cooling fin are controlled effectively and the required tortuosity is obtained during being worked.
Description
- 1. Field of the Invention
- The present invention is related to a heat dissipation assembly and particularly to a heat dissipation assembly in which a heat pipe with a curved section and a curved shaped cooling fin set with a curved recess for being attached to the curved section.
- 2. Brief Description of the Related Art
- The conventional heat dissipation assembly, which provides a heat pipe and a cooling fin set, can be classified into three categories.
- The first category of the conventional heat dissipation assembly is Taiwan Utility Model Application No. 094221564, entitled “ASSEMBLABLE HEAT DISSIPATION DEVICE”, which discloses a heat pipe with a horizontally extended curved section being attached to a first cooling fin set and a second cooling fin set, which provide a recess respectively.
- The second category of the conventional heat dissipation assembly is Taiwan Utility Model Application No. 094222753, entitled “HEAT DISSIPATION DEVICE”, which discloses a heat pipe with an upright extended curved section passing through at least a cooling fin set.
- The third category of the conventional heat dissipation assembly is Taiwan Utility Model Application No. 094210338, entitled “COOLING FINS ASSEMBLY”, which discloses a heat pipe passing through a plurality of cooling fins and then having a curved shape.
- However, the first and second categories of the conventional heat dissipation assemblies have a common feature that the curved sections of the heat pipes are attached to the cooling fin sets and the horizontally extending curved section of the heat pipe provided in the first category of the conventional heat dissipation assembly occupies more space and is too close to the motherboard. The curved shaped section of the heat pipe provided in the third category of the conventional heat dissipation assembly is fabricated after the heat pipe being attached to the cooling fin set such that it is incapable of controlling the size of curved shaped section in the process of fabricating effectively.
- In order to overcome the deficiencies of the preceding prior art, a primary object of the present invention is to provide a heat dissipation assembly in which a heat pipe with an upright curved section and the cooling fin set with a lateral curved recess are attached to each other precisely.
- Another object of the present invention is to provide a heat dissipation assembly in which the curved section of a heat pipe is made with a preset tortuotsity before the lateral recess of a cooling fin set is attached to the curved section.
- A further object of the present invention is to provide a heat dissipation assembly with which the sizes of the upright curved section of the heat pipe and the lateral curved recess of the cooling fin set can be controlled effectively during the heat pipe and the cooling fin set being fabricated.
- Accordingly, a heat dissipation assembly according to the present invention includes a heat pipe and a cooling fin set. The heat pipe provides an upright curved section and the cooling fin set provides a plurality of cooling fins to be attached to the curved section. Wherein, the cooling fin set has a curved shape corresponding to the curved section and provides a lateral curved recess for the curved section being capable of fitting with the curved recess precisely due to the sizes of the curved section and the curved cooling fin are controlled effectively and the required tortuosity is obtained during being worked.
- The detail structure, the applied principle, the function and the effectiveness of the present invention can be more fully understood with reference to the following description and accompanying drawings, in which:
-
FIG. 1 is an exploded perspective view of a heat dissipation assembly according to the present invention; -
FIG. 2 is an assembled perspective view of a heat dissipation assembly according the present invention; and -
FIG. 3 is a sectional view of a heat dissipation assembly according the present invention. - Referring to
FIGS. 1 to 3 , the preferred embodiment of a heat dissipation assembly according to the present invention includes aheat pipe 1, a heat dissipating fin set 2 and aheat sink 3. Theheat pipe 1 provides an uprightcurved section 11. Thecooling fin set 2 further includes a plurality ofheat dissipating fins 21 and provides a curved shape with a curvedlateral recess 211 corresponding to thecurved section 11 of theheat pipe 1 such thecooling fin set 2 is capable of being attached to theheat pipe 1 by means of the curvedlateral recess 211 fitting with the uprightcurved section 11 of theheat pipe 1. The outer surface of the uprightcurved section 11 and the wall surface of the curvedlateral recess 211 are coated withheat conducting medium 5 such that thecooling fin set 2 can be joined to theheat pipe 1 firmly. Theheat conducting medium 5 can be solder paste. - Any shapes of the
cooling fins 21 can be provided even if different shapes of thecooling fins 21 are arranged in the same cooling fin set 2 as long as thecooling fins 21 have greater areas to contact airflow and good heat exchange efficiency is capable of being obtained. Alternatively, the uprightcurved section 11 of theheat pipe 1 can be arranged to be attached to twocooling fin sets 2 or theheat pipe 1 with a plurality of upright curved sections can be made to fit with acooling fin set 2 respectively. - The
heat pipe 1 can be made of either copper or aluminum. Further, a plurality ofheat pipe 1 can be arranged in the heat dissipation assembly of the present invention. The outer diameter of therespective heat pipe 1 is equal to or greater than the size of the lateralcurved recess 211 for obtaining better a contact surface and being favorable for soldering joint. Therespective heat pipe 1 is fabricated with a bending machine associated with molds to perform tube bending or with a press machine associated with press molds to perform plastic working till a preset tortuosity is reached before being assembled to theheat sink 3. - The
heat sink 3 is employed to contact with aheating device 4 and theheat sink 3 is integrally made with extruded aluminum and provides a plurality of fins spaced apart from each other attached to the surface of a substrate or is fabricated with a plurality of aluminum fins being soldered to the surface of a copper substrate. - The
heat source 4 can be an integrated circuit, a central processing unit (CPU), a storage device, a light emitting device, a transformer or the like. - A fan can be disposed beside the cooling fin set 2 to speed up heat removal from the
cooling fin set 2. Because thecooling fin set 2 has a curved shape, the airflow induced by the fan is capable of contactingmore cooling fins 21 than those on the conventional line shaped cooling fin set such that the heat dissipation assembly of the present invention enhances effect of heat dissipation. - It is noted that the
heat pipe 1, thecooling fins 21 or theheat sink 3 is made of copper, aluminum, alloy, ceramics or the like, which provides high heat conductive efficiency. - It is appreciated that the heat dissipation assembly according to the present invention has the following advantages and effectiveness:
- 1. The heat dissipation assembly of the present invention extends upright from the heat sink to occupy less space than the prior art and provides a larger gap from the motherboard of a computer such that heat removed from the heat dissipation assembly is incapable of moving toward the mother board or other components on the motherboard.
- 2. The heat pipe is worked to have a preset tortuosity such that the size of the heat dissipation assembly is controlled effectively while the cooling fin set fitting with the heat pipe.
- 3. The cooling fin set can be fabricated to meet the curved section of the heat pipe easily.
- While the invention has been described with referencing to the preferred embodiment thereof, it is to be understood that modifications or variations may be easily made without departing from the spirit of this invention, which is defined by the appended claims.
Claims (4)
1. A heat dissipation assembly comprising:
a heat pipe providing an upright curved section;
at least a cooling fin set providing a plurality of cooling fins and being attached to said curved section;
wherein, said cooling fin set has a curved shape corresponding to the curved section and provides a lateral curved recess for said curved section capable of fitting with said curved recess.
2. The heat dissipation assembly as defined in claim 1 , wherein said cooling fin set is soldered to said heat pipe with a heat conductive medium.
3. The heat dissipation assembly as defined in claim 1 , wherein said heat pipe is coated with a heat conductive medium for said cooling fin set being joined to said heat pipe.
4. The heat dissipation assembly as defined in claim 1 , wherein two or more cooling fin sets are provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/849,271 US20090056928A1 (en) | 2007-09-01 | 2007-09-01 | Heat dissipation assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/849,271 US20090056928A1 (en) | 2007-09-01 | 2007-09-01 | Heat dissipation assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
US20090056928A1 true US20090056928A1 (en) | 2009-03-05 |
Family
ID=40405598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/849,271 Abandoned US20090056928A1 (en) | 2007-09-01 | 2007-09-01 | Heat dissipation assembly |
Country Status (1)
Country | Link |
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US (1) | US20090056928A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140203707A1 (en) * | 2011-07-28 | 2014-07-24 | The Board Of Trustees Of The University Of Illinois | Electron emission device |
US20160233404A1 (en) * | 2013-10-18 | 2016-08-11 | Board Of Regents, The University Of Texas System | Heat exchanger for thermoelectric power generation with the thermoelectric modules in direct contact with the heat source |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6315033B1 (en) * | 2000-05-22 | 2001-11-13 | Jia Hao Li | Heat dissipating conduit |
US20030079862A1 (en) * | 2000-04-14 | 2003-05-01 | Aavid Thermalloy, Llc | Notched finned heat sink structure |
US20030094273A1 (en) * | 2001-11-21 | 2003-05-22 | Toth Jerome E. | Corrugated fin assembly |
US6625021B1 (en) * | 2002-07-22 | 2003-09-23 | Intel Corporation | Heat sink with heat pipes and fan |
US6752201B2 (en) * | 2002-11-27 | 2004-06-22 | International Business Machines Corporation | Cooling mechanism for an electronic device |
US7011147B1 (en) * | 2004-11-17 | 2006-03-14 | Chung-Tsai Hung | Heat pipe type circular radiator with sector cooling fins |
US20060060332A1 (en) * | 2004-09-17 | 2006-03-23 | Foxconn Technology Co.,Ltd | Heat dissipating device |
US7059391B2 (en) * | 2004-04-09 | 2006-06-13 | Aavid Thermalloy, Inc. | Multiple evaporator heat pipe assisted heat sink |
US20060185821A1 (en) * | 2005-02-24 | 2006-08-24 | Comp Take Technology Co., Ltd. | Thermal dissipation device |
US20060227506A1 (en) * | 2005-04-11 | 2006-10-12 | Zalman Tech Co., Ltd. | Apparatus for cooling computer parts and method of manufacturing the same |
US20070047206A1 (en) * | 2005-08-24 | 2007-03-01 | Delta Electronics, Inc. | Composite heat dissipating apparatus |
-
2007
- 2007-09-01 US US11/849,271 patent/US20090056928A1/en not_active Abandoned
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030079862A1 (en) * | 2000-04-14 | 2003-05-01 | Aavid Thermalloy, Llc | Notched finned heat sink structure |
US6315033B1 (en) * | 2000-05-22 | 2001-11-13 | Jia Hao Li | Heat dissipating conduit |
US20030094273A1 (en) * | 2001-11-21 | 2003-05-22 | Toth Jerome E. | Corrugated fin assembly |
US6625021B1 (en) * | 2002-07-22 | 2003-09-23 | Intel Corporation | Heat sink with heat pipes and fan |
US6752201B2 (en) * | 2002-11-27 | 2004-06-22 | International Business Machines Corporation | Cooling mechanism for an electronic device |
US7059391B2 (en) * | 2004-04-09 | 2006-06-13 | Aavid Thermalloy, Inc. | Multiple evaporator heat pipe assisted heat sink |
US20060060332A1 (en) * | 2004-09-17 | 2006-03-23 | Foxconn Technology Co.,Ltd | Heat dissipating device |
US7011147B1 (en) * | 2004-11-17 | 2006-03-14 | Chung-Tsai Hung | Heat pipe type circular radiator with sector cooling fins |
US20060185821A1 (en) * | 2005-02-24 | 2006-08-24 | Comp Take Technology Co., Ltd. | Thermal dissipation device |
US20060227506A1 (en) * | 2005-04-11 | 2006-10-12 | Zalman Tech Co., Ltd. | Apparatus for cooling computer parts and method of manufacturing the same |
US20070047206A1 (en) * | 2005-08-24 | 2007-03-01 | Delta Electronics, Inc. | Composite heat dissipating apparatus |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140203707A1 (en) * | 2011-07-28 | 2014-07-24 | The Board Of Trustees Of The University Of Illinois | Electron emission device |
US9685295B2 (en) * | 2011-07-28 | 2017-06-20 | The Board Of Trustees Of The University Of Illinois | Electron emission device |
US20160233404A1 (en) * | 2013-10-18 | 2016-08-11 | Board Of Regents, The University Of Texas System | Heat exchanger for thermoelectric power generation with the thermoelectric modules in direct contact with the heat source |
US9660168B2 (en) * | 2013-10-18 | 2017-05-23 | Board Of Regents, The University Of Texas System | Heat exchanger for thermoelectric power generation with the thermoelectric modules in direct contact with the heat source |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |