TWM516181U - Combinational heat dissipating unit - Google Patents

Combinational heat dissipating unit Download PDF

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Publication number
TWM516181U
TWM516181U TW104214878U TW104214878U TWM516181U TW M516181 U TWM516181 U TW M516181U TW 104214878 U TW104214878 U TW 104214878U TW 104214878 U TW104214878 U TW 104214878U TW M516181 U TWM516181 U TW M516181U
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Taiwan
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heat
combined
dissipating unit
heat dissipating
pipes
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TW104214878U
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Chinese (zh)
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Ming-Han Yu
Chung-Hua Liao
Wen-Jui Chuang
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Asia Vital Components Co Ltd
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Priority to TW104214878U priority Critical patent/TWM516181U/en
Publication of TWM516181U publication Critical patent/TWM516181U/en

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Description

組合式散熱單元Combined heat sink

本創作是有關於一種組合式散熱單元,尤指一種具有提升散熱之功效並依照使用者的解熱需求配置熱管數量之組合式散熱單元。The present invention relates to a combined heat dissipating unit, and more particularly to a combined heat dissipating unit having the effect of improving heat dissipation and configuring the number of heat pipes according to the user's anti-heating demand.

隨著技術的進步,電子元件單位面積上的電晶體數量越來越多,造成其工作時發熱量的增加。另一方面,電子元件的工作頻率也越來越高,電晶體工作時開/關轉換所造成的熱量,亦是電子元件發熱量增加的原因,若未能適當的處理這些熱量,將會造成晶片運算速度的降低,嚴重者甚至影響到晶片的壽命;為加強電子元件之散熱效果,就必須藉用被動式散熱的散熱器及或熱管及或均溫板來進行導熱,令熱源得經由散熱器之鰭片以自然或強制對流方式將熱散逸至環境中進行散熱。With the advancement of technology, the number of transistors per unit area of electronic components is increasing, causing an increase in the amount of heat generated during operation. On the other hand, the operating frequency of electronic components is also getting higher and higher. The heat caused by the on/off switching of the transistor is also the cause of the increase in the heat generated by the electronic components. If this heat is not properly handled, it will cause The reduction of the speed of the wafer operation may even affect the life of the wafer. To enhance the heat dissipation effect of the electronic components, it is necessary to use a passive heat sink and or a heat pipe and a temperature equalizing plate for heat conduction, so that the heat source is passed through the heat sink. The fins dissipate heat into the environment in a natural or forced convection manner to dissipate heat.

而上述的熱管由於可在很小的截面積與溫度差之下,將大量的熱傳送至遠距離進行散熱,且不需外加電源供應即可運作,在無須動力提供和空間利用經濟性的考量之下,各式熱管已是電子散熱產品中廣為應用的傳熱元件之一。The above heat pipe can transfer a large amount of heat to a long distance for heat dissipation under a small cross-sectional area and a temperature difference, and can operate without an external power supply, without the need for power supply and space utilization economy. Underneath, various heat pipes have become one of the widely used heat transfer components in electronic heat dissipation products.

而最常被採用的散熱方式便是發熱源上裝設具有散熱作用之裝置(如散熱器),特別是裝設具有熱管結構之散熱器,該散熱器係由具高導熱係數的材質所製成,再經由熱管管內所設置的工作流體及毛細組織運作,使該散熱器具有高導熱傳導力之特性,且其結構上具有重量輕之優勢,可減低在散熱裝置所衍生之重量、成本及系統複雜性之問題。The most commonly used heat dissipation method is to install a heat-dissipating device (such as a heat sink) on the heat source, in particular, a heat sink having a heat pipe structure, which is made of a material having a high thermal conductivity. Then, through the working fluid and capillary structure provided in the heat pipe, the heat sink has the characteristics of high thermal conductivity, and the structure has the advantage of light weight, which can reduce the weight and cost derived from the heat sink. And the complexity of the system.

由於習知在發熱源上裝設具有熱管結構的散熱器,其熱管的數量及尺寸大小皆無法改變,使用者也無法依照發熱源的大小調整熱管數量的多寡,導致使用上無法彈性調整熱管的數量,此外該熱管無法單獨自行使用都必須利用或藉由一散熱器或是一基座來與熱管進行組結來應用,致使其熱源都是先傳導到該基座或散熱器再傳至熱管進行遠端散熱,無法令熱管單獨與熱源接觸熱傳導提升熱傳效率及依解熱需求來進行組合應用。Since it is conventional to install a heat sink having a heat pipe structure on a heat source, the number and size of the heat pipes cannot be changed, and the user cannot adjust the number of the heat pipes according to the size of the heat source, so that the heat pipe cannot be elastically adjusted in use. In addition, the heat pipe cannot be used by itself or by a heat sink or a base to be assembled with the heat pipe, so that the heat source is first transmitted to the base or the heat sink and then transferred to the heat pipe. For remote heat dissipation, the heat pipe alone cannot be combined with the heat source to improve the heat transfer efficiency and the heat demand.

以上所述,習知具有下列之缺點:As mentioned above, the conventional disadvantages have the following disadvantages:

1.無法依照使用者的解熱需求配置熱管的數量;1. The number of heat pipes cannot be configured according to the user's heat dissipation requirements;

2.無法依照發熱源尺寸的不同而具備彈性調整熱管的數量。2. It is not possible to adjust the number of heat pipes according to the size of the heat source.

是以,要如何解決上述習用之問題與缺失,即為本案之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。Therefore, how to solve the above problems and problems in the past, that is, the inventors of this case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

爰此,為有效解決上述之問題,本創作之主要目的在於提供一種可提升散熱效果之組合式散熱單元。Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a combined heat dissipation unit that can improve the heat dissipation effect.

本創作之次要目的,在於提供一種可依照使用者根據發熱源的尺寸不同以調整熱管數量之組合式散熱單元。The second objective of the present invention is to provide a combined heat dissipating unit that can adjust the number of heat pipes according to the size of the heat source.

為達上述目的,本創作係提供一種組合式散熱單元,係包括至少一拼合體及複數熱管,該拼合體具有相對的兩接合部,該等熱管分別跟該拼合體的兩接合部透過緊配方式或焊接方式或膠黏方式結合以構成一具較大面積的熱接觸面。In order to achieve the above object, the present invention provides a combined heat dissipating unit comprising at least one split body and a plurality of heat pipes, the split body having opposite joint portions, and the heat pipes are respectively closely coupled with the joint portions of the split body. The method or the welding method or the adhesive method is combined to form a large-area thermal contact surface.

透過本創作此結構的設計,使用者可依照使用者的欲解熱的熱瓦數需求來進行熱管數量的調整,或是依照發熱源的尺寸大小或數量不同,亦或是依照複數發熱源設置位置處的距離遠近不同進行所述熱管數量的配置,當發熱源的尺寸較大或是複數發熱源彼此間相隔距離較遠時,可透過交錯排列複數個拼合體與熱管以形成該組合式散熱單元,若當發熱源的尺寸較小或是複數發熱源彼此間相隔距離較近時,使用者可減少所述熱管與拼合體的數量,透過該拼合體的結構,進以達到可彈性地使該組合式散熱單元的尺寸任意變化之效果,並提升散熱功效。Through the design of the structure of the creation, the user can adjust the number of heat pipes according to the heat wattage requirement of the user, or according to the size or quantity of the heat source, or according to the position of the plurality of heat sources. The distance between the heat pipes is different, and when the heat source has a large size or a plurality of heat sources are separated from each other, the plurality of split bodies and the heat pipes are staggered to form the combined heat sink unit. If the size of the heat source is small or the plurality of heat sources are close to each other, the user can reduce the number of the heat pipes and the split body, and the structure of the split body can be elastically made. The size of the combined heat sink unit is arbitrarily changed and the heat dissipation effect is improved.

1‧‧‧組合式散熱單元1‧‧‧Combined heat sink

10‧‧‧拼合體10‧‧‧Synthesis

101‧‧‧接合部101‧‧‧ joints

11‧‧‧熱管11‧‧‧ Heat pipe

110‧‧‧第一端110‧‧‧ first end

111‧‧‧第二端111‧‧‧ second end

12‧‧‧熱接觸面12‧‧‧Hot contact surface

2‧‧‧導熱介質2‧‧‧ Thermal medium

3‧‧‧發熱源3‧‧‧heat source

第1圖係為本創作組合式散熱單元之第一實施例之立體分解圖;1 is an exploded perspective view of a first embodiment of the creative combined heat dissipating unit;

第2圖係為本創作組合式散熱單元之第一實施例之立體組合圖;Figure 2 is a perspective assembled view of the first embodiment of the creative combined heat dissipating unit;

第3圖係為本創作組合式散熱單元之第二實施例之剖面圖;Figure 3 is a cross-sectional view showing a second embodiment of the creative combined heat dissipating unit;

第4圖係為本創作組合式散熱單元之第三實施例之剖面圖;Figure 4 is a cross-sectional view showing a third embodiment of the creative combined heat dissipating unit;

第5圖係為本創作組合式散熱單元之第四實施例之剖面圖;Figure 5 is a cross-sectional view showing a fourth embodiment of the creative combined heat dissipating unit;

第6圖係為本創作組合式散熱單元之第五實施例之剖面圖;Figure 6 is a cross-sectional view showing a fifth embodiment of the creative combined heat dissipating unit;

第7圖係為本創作組合式散熱單元之第一實施例之實施示意圖;Figure 7 is a schematic view showing the implementation of the first embodiment of the creative combined heat dissipating unit;

第8圖係為本創作組合式散熱單元之第六實施例之實施示意圖;Figure 8 is a schematic view showing the implementation of the sixth embodiment of the creative combined heat dissipating unit;

第9圖係為本創作組合式散熱單元之第七實施例之剖面圖;Figure 9 is a cross-sectional view showing a seventh embodiment of the creative combined heat dissipating unit;

第10圖係為本創作組合式散熱單元之第八實施例之立體分解圖;Figure 10 is an exploded perspective view of the eighth embodiment of the creative combined heat dissipating unit;

第11圖係為本創作組合式散熱單元之第九實施例之立體分解圖。Figure 11 is a perspective exploded view of a ninth embodiment of the creative combined heat sink unit.

本創作之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

請參閱第1、2圖,係為本創作組合式散熱單元之第一實施例之立體分解圖及立體組合圖,如圖所示,一種組合式散熱單元1,包括至少一拼合體10及複數熱管11,該拼合體10具有相對的兩接合部101,該等熱管11分別跟該拼合體10的兩接合部101透過緊配方式或焊接方式或膠黏方式相結合以被構形成一大面積的熱接觸面12,令所述熱管11與拼合體10組合起來後形成類似熱板的型態具有均溫及或遠端散熱的功效者。Please refer to FIG. 1 and FIG. 2 , which are a perspective exploded view and a perspective assembled view of the first embodiment of the combined heat sink unit. As shown in the figure, a combined heat sink unit 1 includes at least one split body 10 and a plurality of The heat pipe 11 has the opposite joint portions 101, and the heat pipes 11 are respectively combined with the joint portions 101 of the split body 10 through a tight fitting manner or a welding manner or an adhesive manner to form a large area. The thermal contact surface 12 combines the heat pipe 11 and the split body 10 to form a heat-like type having the effect of uniform temperature or remote heat dissipation.

另外,於本實施例中,所述兩熱管11透過所述拼合體10組合起來之型態,其可以是兩熱管11同一端相互齊平,也可以是兩熱管11前後設置之組合型態。In addition, in this embodiment, the two heat pipes 11 are combined with each other by the combination of the assembled bodies 10, which may be that the same ends of the two heat pipes 11 are flush with each other, or may be a combination of the two heat pipes 11 disposed in front and rear.

除此之外,於本實施例中,該熱管11之截面形狀係為圓形,但並不引以為限,熱管11之截面形狀也可以是半圓形(如第3圖所示)或橢圓形或平板形或其他任意形狀,又或者可以是任意兩種形狀的熱管11相互組合(如第4圖所示),皆不影響本案所達成之功效。In addition, in this embodiment, the cross-sectional shape of the heat pipe 11 is circular, but is not limited thereto, and the cross-sectional shape of the heat pipe 11 may also be semi-circular (as shown in FIG. 3) or An elliptical or flat shape or any other shape, or a heat pipe 11 of any two shapes may be combined with each other (as shown in Fig. 4), and the effects achieved by the present invention are not affected.

再者,於本實施例中,所述拼合體10的外型(大、小、長、短)可以依照使用者的需求而任意變化,並且該拼合體10可以是具有導熱或是非導熱之材料所製成,其係可使用金屬或非金屬材質製成,而所述接合部101可被設計形成凹槽的態樣,但並不引以為限,該接合部101也可形成凸部的態樣(如第5圖所示,為本創作之第四實施例)或是一凹一凸(如第6圖所示,為本創作之第五實施例)的搭配,其並不會影響本案所達成之功效。Furthermore, in the embodiment, the outer shape (large, small, long, short) of the split body 10 can be arbitrarily changed according to the needs of the user, and the split body 10 can be a material having heat conduction or non-thermal conductivity. It can be made of metal or non-metal material, and the joint portion 101 can be designed to form a groove, but it is not limited thereto, and the joint portion 101 can also form a convex portion. The aspect (as shown in Fig. 5, which is the fourth embodiment of the creation) or a concave-concave (as shown in Fig. 6, which is the fifth embodiment of the creation), does not affect The effect achieved in this case.

請參閱第7圖,透過本創作的結構設計,所述組合式散熱單元1之熱接觸面12係與一發熱源3相貼附,使用者可依照使用者的欲解熱的熱瓦數需求來進行熱管11數量的調整,或是依照發熱源3的尺寸大小或數量不同進行所述熱管11數量的配置,當發熱源3的尺寸較大時,可透過交錯排列複數個拼合體10與熱管11而形成該組合式散熱單元1,若當發熱源3的尺寸較小時,使用者可適時減少所述熱管11與拼合體10的數量,透過該拼合體10的結構,進以達到可彈性地使該組合式散熱單元1的尺寸任意變化之效果,且可提升散熱功效。Referring to FIG. 7 , through the structural design of the present invention, the thermal contact surface 12 of the combined heat dissipating unit 1 is attached to a heat source 3, and the user can follow the heat wattage requirement of the user. The number of the heat pipes 11 is adjusted, or the number of the heat pipes 11 is different according to the size or quantity of the heat source 3. When the size of the heat source 3 is large, the plurality of split bodies 10 and the heat pipes 11 can be staggered. When the combined heat dissipating unit 1 is formed, if the size of the heat generating source 3 is small, the user can reduce the number of the heat pipe 11 and the assembling body 10 in a timely manner, and the structure of the assembling body 10 can be elastically The effect of arbitrarily changing the size of the combined heat dissipating unit 1 can improve the heat dissipation efficiency.

除此之外,請參閱第8圖,於另一實施例中,利用本創作的結構設計,若於一電子裝置內同時具有複數個發熱源3時,且該等發熱源3彼此之間相隔距離較遠時,此時,可增加該拼合體10與該熱管11組合以形成該組合式散熱單元1以構成一具有較大面積之熱接觸面12,以令該組合式散熱單元1可以完全覆蓋住該等發熱源3,反之,若發熱源3彼此之間相隔距離較近時,則減少所述拼合體10與熱管11的數量,進以達到可任意彈性地調整所述熱管11的數量,並可提升解熱之功效。In addition, referring to FIG. 8 , in another embodiment, with the structural design of the present invention, if there are multiple heat sources 3 in an electronic device, and the heat sources 3 are separated from each other. When the distance is far away, at this time, the combined body 10 and the heat pipe 11 can be combined to form the combined heat dissipating unit 1 to form a thermal contact surface 12 having a large area, so that the combined heat dissipating unit 1 can be completely completed. The heat source 3 is covered, and if the heat sources 3 are spaced apart from each other, the number of the split body 10 and the heat pipe 11 is reduced, so that the number of the heat pipes 11 can be adjusted arbitrarily elastically. And can enhance the effect of antipyretic.

請參閱第9圖,係為本創作組合式散熱單元之第七實施例之剖面圖,所述組合式散熱單元部份元件及元件間之相對應之關係與前述組合式散熱單元相同,故在此不再贅述,惟本組合式散熱單元與前述最主要之差異為,所述拼合體10與該等熱管11之間更具有一導熱介質2,其係佈設於所述接合部101內,該導熱介質2係可為錫膏或接著劑,透過該導熱介質2可令該等熱管11緊密地與該拼合體10相結合。Please refer to FIG. 9 , which is a cross-sectional view of a seventh embodiment of the combined heat dissipating unit. The corresponding relationship between the components and components of the combined heat dissipating unit is the same as that of the combined heat dissipating unit. Therefore, the heat dissipation medium 2 is disposed between the split body 10 and the heat pipes 11 and is disposed in the joint portion 101. The heat transfer medium 2 can be a solder paste or an adhesive through which the heat pipes 11 can be tightly bonded to the split body 10.

請參閱第10圖,係為本創作組合式散熱單元之第八實施例之立體分解圖,所述組合式散熱單元部份元件及元件間之相對應之關係與前述組合式散熱單元相同,故在此不再贅述,惟本組合式散熱單元與前述最主要之差異為,所述熱管11更具有一第一端110及一第二端111,所述拼合體10係分別設置於該等熱管11之第一、二端110、111位置處,並利用所述拼合體10的接合部101分別與所述熱管11之第一、二端110、111相結合。Please refer to FIG. 10 , which is a perspective exploded view of the eighth embodiment of the combined heat dissipating unit. The corresponding relationship between the components and components of the combined heat dissipating unit is the same as that of the combined heat dissipating unit. The heat pipe 11 has a first end 110 and a second end 111, and the split body 10 is respectively disposed on the heat pipes. At the first and second ends 110, 111 of the first and second ends, the joint portion 101 of the split body 10 is combined with the first and second ends 110, 111 of the heat pipe 11, respectively.

最後,請參閱第11圖,係為本創作組合式散熱單元之第九實施例之立體分解圖,所述組合式散熱單元部份元件及元件間之相對應之關係與前述組合式散熱單元相同,故在此不再贅述,惟本組合式散熱單元與前述最主要之差異為,所述拼合體10係可分別設置於所述第一、二端110、111的末端位置處,並該接合部101分別與所述第一、二端110、111的末端相結合,同樣也可達到前述之功效。Finally, please refer to FIG. 11 , which is a perspective exploded view of a ninth embodiment of the combined heat dissipating unit of the present invention. The corresponding relationship between the components and components of the combined heat dissipating unit is the same as that of the combined heat dissipating unit. Therefore, the details of the combined heat dissipating unit and the above-mentioned main difference are that the split body 10 can be respectively disposed at the end positions of the first and second ends 110, 111, and the joint is The portion 101 is combined with the ends of the first and second ends 110, 111, respectively, and the aforementioned effects can also be achieved.

另外,該拼合體10之接合部101上可形成有粗糙面或凹凸區域(圖中未示出),用以與熱管11更加緊密結合者。In addition, a rough surface or a concave-convex region (not shown) may be formed on the joint portion 101 of the split body 10 for closer integration with the heat pipe 11.

以上所述,本創作相較於習知具有下列優點:As mentioned above, this creation has the following advantages over the prior art:

1.可依照使用者的解熱需求配置熱管的數量;1. The number of heat pipes can be configured according to the user's heat release requirements;

2.可依照發熱源尺寸的不同而具備彈性調整熱管的數量;2. The number of heat pipes can be adjusted elastically according to the size of the heat source;

3.提升散熱效果。3. Improve the heat dissipation effect.

以上已將本創作做一詳細說明,惟以上所述者,僅為本創作之一較佳實施例而已,當不能限定本創作實施之範圍。即凡依本創作申請範圍所作之均等變化與修飾等,皆應仍屬本創作之專利涵蓋範圍。The present invention has been described in detail above, but the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited. That is, all changes and modifications made in accordance with the scope of this creation application shall remain covered by the patents of this creation.

1‧‧‧組合式散熱單元 1‧‧‧Combined heat sink

10‧‧‧拼合體 10‧‧‧Synthesis

101‧‧‧接合部 101‧‧‧ joints

11‧‧‧熱管 11‧‧‧ Heat pipe

12‧‧‧熱接觸面 12‧‧‧Hot contact surface

Claims (9)

一種組合式散熱單元,係包括:
至少一拼合體,具有相對的兩接合部;及
複數熱管,係分別跟該拼合體的兩接合部結合以構成一熱接觸面。
A combined heat dissipation unit includes:
At least one split body having opposite joints; and a plurality of heat pipes combined with the joints of the split body to form a thermal contact surface.
如申請專利範圍第1項所述之組合式散熱單元,其中該拼合體係為導熱材質或非導熱材質所製成。The combined heat dissipating unit according to claim 1, wherein the assembling system is made of a heat conductive material or a non-heat conductive material. 如申請專利範圍第1項所述之組合式散熱單元,其中該等熱管之截面形狀係可為圓形或橢圓形或半圓形或平板形或其他任意形狀。The combined heat dissipating unit of claim 1, wherein the cross-sectional shape of the heat pipes may be circular or elliptical or semi-circular or flat or other arbitrary shape. 如申請專利範圍第1項所述之組合式散熱單元,其中該接合部係呈凹槽或凸部或凹槽與凸部的搭配者。The combined heat dissipating unit according to claim 1, wherein the joint portion is a groove or a protrusion or a groove and a mate. 如申請專利範圍第1項所述之組合式散熱單元,其中該拼合體與該等熱管係透過緊配方式或焊接方式或膠黏方式相結合。The combined heat dissipating unit according to claim 1, wherein the assembling body and the heat pipe are combined by a tight fitting method or a welding method or a bonding method. 如申請專利範圍第5項所述之組合式散熱單元,其中該拼合體與該等熱管之間更具有一導熱介質,其係佈設於所述接合部內,該導熱介質係可為錫膏或接著劑。The combined heat dissipating unit of claim 5, wherein the heat dissipating medium is further disposed between the assembling body and the heat pipe, and is disposed in the joint portion, and the heat conducting medium is solder paste or Agent. 如申請專利範圍第1項所述之組合式散熱單元,其中該等熱管更具有一第一端及一第二端,所述拼合體分別設置於該等熱管之第一、二端位置處,並該接合部係分別與所述第一、二端相結合。The combined heat dissipating unit of claim 1, wherein the heat pipes further have a first end and a second end, and the split bodies are respectively disposed at the first and second ends of the heat pipes. And the joint is combined with the first and second ends, respectively. 如申請專利範圍第7項所述之組合式散熱單元,其中所述拼合體係可分別設置於所述第一、二端之末端位置處,並該接合部係分別與所述第一、二端之末端相結合。The combined heat dissipating unit of claim 7, wherein the splitting system is respectively disposed at end positions of the first and second ends, and the engaging portions are respectively associated with the first and second ends The ends are combined. 如申請專利範圍第1項所述之組合式散熱單元,其中所述拼合體之接合部上可形成有粗糙面或凹凸區域,用以與熱管更加緊密結合者。The combined heat dissipating unit according to claim 1, wherein the joint portion of the split body may be formed with a rough surface or a concave-convex region for more tightly bonding with the heat pipe.
TW104214878U 2015-09-15 2015-09-15 Combinational heat dissipating unit TWM516181U (en)

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Publications (1)

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TWM516181U true TWM516181U (en) 2016-01-21

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