US20200232710A1 - Heat dissipation unit connection structure - Google Patents
Heat dissipation unit connection structure Download PDFInfo
- Publication number
- US20200232710A1 US20200232710A1 US16/251,075 US201916251075A US2020232710A1 US 20200232710 A1 US20200232710 A1 US 20200232710A1 US 201916251075 A US201916251075 A US 201916251075A US 2020232710 A1 US2020232710 A1 US 2020232710A1
- Authority
- US
- United States
- Prior art keywords
- heat dissipation
- section
- dissipation unit
- connection structure
- unit connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/0233—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
Definitions
- the present invention relates generally to a heat dissipation unit connection structure, and more particularly to a heat dissipation unit connection structure, which can quickly connect the heat dissipation units and save the connection cost.
- the conventional roll-bond plate evaporator 5 has been widely applied to the radiating fin or the product employing two-phase heat exchange to dissipate the heat.
- the roll-bond plate evaporator 5 has two faces. One of the two faces of some roll-bond plate evaporator 5 is formed with blown and raised pipelines.
- a cooling medium which can be a gas or a liquid, is filled in the pipelines to enhance the heat dissipation performance.
- the conventional inserted roll-bond plate evaporators 5 can be classified into two types of structures. One is single-face roll-bond plate evaporator and the other is double-face roll-bond plate evaporator.
- the single-face roll-bond plate evaporator has a plane face and another face formed with the blown and raised pipelines.
- the double-face roll-bond plate evaporator has two faces both of which are formed with the blown and raised pipelines.
- the above two types of roll-bond plate evaporators 5 are both two-piece units assembled by means of adhesion or welding. A chamber is defined between the two units and a working gas is filled in the chamber.
- the roll-bond plate evaporator 5 has a free end 51 and a fixed end 52 .
- the free end 51 has multiple locating bosses 511 .
- the fixed end of the roll-bond plate evaporator 5 is fixed in a channel 61 formed on a substrate 6 .
- the substrate 6 is in contact with a heat source to conduct the heat thereof.
- the free end of the roll-bond plate evaporator 5 is connected with a plate body 7 .
- the plate body 7 is formed with multiple perforations 71 in a position corresponding to the locating bosses 511 of the free ends 51 of the roll-bond plate evaporators 5 .
- the locating bosses 511 are inserted in the perforations 71 and then fixed by means of welding or the like.
- the plate body 7 serves to provide dustproof effect and secure the roll-bond plate evaporators 5 to prevent the roll-bond plate evaporators 5 from being flexed and deformed.
- connection method for assembling the plate body 7 with the conventional roll-bond plate evaporators 5 is relatively complicated. It is necessary to precisely align the roll-bond plate evaporators 5 with the plate body 7 and then weld the roll-bond plate evaporators 5 with the plate body 7 . Such process is time-costing and the difficulty in working is increased. Moreover, once assembled, it is impossible or very hard to rework on the plate body 7 . Furthermore, the securing structure of the conventional roll-bond plate evaporators 5 is too complicated so that the manufacturing cost is relatively high.
- the heat dissipation unit connection structure of the present invention includes a substrate and multiple heat dissipation units.
- the substrate has a first face and a second face.
- Each heat dissipation unit has a first section and a second section. One end of the first section is connected with the second face of the substrate. The first section has an internal space. The second section extends from the other end of the first section. The second sections of each two adjacent heat dissipation units abut against and connect with each other.
- the heat dissipation unit connection structure improves the shortcoming of the conventional heat dissipation unit connection structure that it is necessary to additionally connect a plate body with the free ends of the heat dissipation units so that the connection structure and process are complicated. Therefore, the heat dissipation unit connection structure is simplified and the working time is shortened. Also, the manufacturing cost is lowered.
- FIG. 1 is a perspective view of a conventional roll-bond plate evaporator structure
- FIG. 2 a is a perspective view of the heat dissipation unit of a first embodiment of the heat dissipation unit connection structure of the present invention
- FIG. 2 b is a perspective sectional view of the heat dissipation unit of the first embodiment of the heat dissipation unit connection structure of the present invention
- FIG. 3 is a perspective assembled view of the first embodiment of the heat dissipation unit connection structure of the present invention.
- FIG. 4 is a perspective assembled view of a second embodiment of the heat dissipation unit connection structure of the present invention.
- FIG. 5 a is a perspective exploded view of a third embodiment of the heat dissipation unit connection structure of the present invention.
- FIG. 5 b is a perspective exploded view of the third embodiment of the heat dissipation unit connection structure of the present invention.
- FIG. 6 is a perspective assembled view of a fourth embodiment of the heat dissipation unit connection structure of the present invention.
- FIG. 7 is a perspective assembled view of a fifth embodiment of the heat dissipation unit connection structure of the present invention.
- FIG. 8 is a perspective assembled view of the heat dissipation unit connection structure of the present invention.
- FIG. 9 is a perspective assembled view of the heat dissipation unit connection structure of the present invention.
- FIG. 10 is a perspective assembled view of a sixth embodiment of the heat dissipation unit connection structure of the present invention.
- FIG. 2 a is a perspective view of the heat dissipation unit of a first embodiment of the heat dissipation unit connection structure of the present invention.
- FIG. 2 b is a perspective sectional view of the heat dissipation unit of the first embodiment of the heat dissipation unit connection structure of the present invention.
- FIG. 3 is a perspective assembled view of the first embodiment of the heat dissipation unit connection structure of the present invention.
- the heat dissipation unit connection structure of the present invention includes a substrate 1 and multiple heat dissipation units 2 .
- the substrate 1 has a first face 11 and a second face 12 .
- the first and second faces 11 , 12 are respectively positioned on an upper side and a lower side of the substrate 1 .
- the first face 11 is in contact with at least one heat source (not shown) to conduct the heat of the heat source.
- the second face 12 is formed with multiple channels 121 .
- the heat dissipation units 2 are made of a material selected from a group consisting of gold, silver, copper, aluminum, commercial pure titanium, titanium alloy, stainless steel, ceramic material, ceramic aluminum-based complex material and any combination thereof.
- Each heat dissipation unit 2 has a first section 21 and a second section 22 .
- the first section 21 has an internal space 211 , which is an airtight chamber or flow passage. In this embodiment, the space 211 is, but not limited to, an airtight chamber 211 for illustration purposes.
- a working fluid 3 is filled in the airtight chamber 211 .
- the working fluid 3 can be a gas or a liquid.
- the first section 21 is a section for two-phase (vapor phase and liquid phase) heat exchange.
- Various working fluids 3 can be filled in the airtight chamber 211 to achieve vapor-liquid circulation heat exchange effect.
- the internal space 211 of the first section 21 can be a flow passage.
- a roughened structure or a capillary structure can be selectively disposed in the flow passage to enhance the backflow effect of the working fluid 3 .
- the first section 21 is connected with and inserted in the channel 121 of the second face 12 of the substrate 1 .
- the end of the first section 21 that is connected with the channel 121 is an engagement end 212 .
- the channel 121 has an engagement notch 1211 corresponding to the engagement end 212 .
- the engagement end 212 is correspondingly engaged with the engagement notch 1211 .
- the first section 21 of the heat dissipation unit 2 is securely connected with the channel 121 of the substrate 1 by means of press fit, welding, adhesion, insertion or engagement.
- the engagement end 212 and the engagement notch 1211 can be a dovetailed tenon and a cooperative dovetailed mortise, which are assembled with each other (not shown).
- the second section 22 extends from the other end of the first section 21 .
- the second sections 22 of each two adjacent heat dissipation units 2 abut against and connect/assemble with each other.
- the first and second sections 21 , 22 are normal to each other.
- the second section 22 has at least one vent 223 .
- the second sections 22 not only serve to provide dustproof effect, but also serve to enlarge the total heat dissipation area of the heat dissipation units 2 .
- the second section 22 has a first end 221 and a second end 222 .
- the second end 222 is positioned at a junction between the first and second sections 21 , 22 .
- the first end 221 is a free end of the second section 22 .
- the first and second ends 221 , 222 of the second sections 22 of each two adjacent heat dissipation units 2 abut against and connect/assemble with each other, whereby the second sections 22 normal to the first sections 21 can enhance the structural strength and provide dustproof effect.
- the second sections 22 of each two adjacent heat dissipation units 2 can be further securely connected with each other by means of engagement, latching, welding, adhesion or hooping to increase the connection strength.
- FIG. 4 is a perspective assembled view of a second embodiment of the heat dissipation unit connection structure of the present invention.
- the second embodiment is partially identical to the first embodiment in structure and thus will not be redundantly described hereinafter.
- the second embodiment is different from the first embodiment in that the second end 222 of the second section 22 of the heat dissipation unit 2 has a groove 2221 .
- the first end 221 of the second section 22 of the heat dissipation unit 2 abuts against and connects with the groove 2221 of the second end 222 of the second section 22 of the adjacent heat dissipation unit 2 , whereby the second sections 22 of the two adjacent heat dissipation units 2 are connected with each other and flush with each other.
- FIG. 5 a is a perspective exploded view of a third embodiment of the heat dissipation unit connection structure of the present invention.
- FIG. 5 b is a perspective exploded view of the third embodiment of the heat dissipation unit connection structure of the present invention.
- the third embodiment is partially identical to the first and second embodiments in structure and thus will not be redundantly described hereinafter.
- the third embodiment is different from the first embodiment in that the third embodiment further includes a holding unit 4 .
- the holding unit 4 has a first holding arm 41 and a second holding arm 42 and a connection arm 43 . Two ends of the connection arm 43 are connected with the first and second holding arms 41 , 42 to together define a holding space 44 .
- the first and second holding arms 41 , 42 of the holding unit 4 serve to tightly hold the first and last heat dissipation units 2 of the arranged heat dissipation units 2 , which abut against and connect with each other as disclosed in the first and second embodiments. Accordingly, the heat dissipation units 2 are received in the holding space 44 to enhance the securing effect.
- the second sections 22 of each two adjacent heat dissipation units 2 are formed with connection structures, which are connected with each other by means of engagement or latching to securely connect the adjacent heat dissipation units 2 with each other.
- FIG. 6 is a perspective assembled view of a fourth embodiment of the heat dissipation unit connection structure of the present invention.
- the fourth embodiment is partially identical to the first embodiment in structure and thus will not be redundantly described hereinafter.
- the fourth embodiment is different from the first embodiment in that the fourth embodiment has a structure with latching or engagement effect. That is, the first end 221 of the second section 22 has a latch section 2211 , while the second end 222 has a latched section 2221 .
- the latch section 2211 of the first end 221 of the heat dissipation unit 2 is latched with the latched section 2221 of the second end 222 of the adjacent heat dissipation unit 2 , whereby the second sections 22 of the two adjacent heat dissipation units 2 are engaged with each other.
- FIG. 7 is a perspective assembled view of a fifth embodiment of the heat dissipation unit connection structure of the present invention.
- the fifth embodiment is partially identical to the fourth embodiment in structure and thus will not be redundantly described hereinafter.
- the fifth embodiment is different from the third embodiment in that in the fifth embodiment, the latch section 2211 is a T-shaped tenon, while the latched section 2221 is a T-shaped mortise corresponding to the T-shaped tenon.
- Such structure is similar to that of the fourth embodiment in which the free end 2211 a has a width larger than the width of the connection end 2211 b and the closed side 2221 b has a width larger than the width of the open side 2221 a .
- Such structure can achieve an engagement and latching effect.
- the latch section 2211 and the latched section 2221 have some other aspects (as shown in FIGS. 8 and 9 ).
- the first section 21 of another adjacent heat dissipation unit 2 is formed with a structure having a configuration identical to that of the last heat dissipation unit 2 for correspondingly latching therewith (as shown in FIG. 8 ).
- two sides of the second section 22 are formed with a hooking structure having a hooking end 227 for hooking and latching with the first section 21 of another adjacent heat dissipation unit 2 (as shown in FIG. 9 ).
- the latching structures as shown in the drawings are only for illustration. Many modifications of the above embodiments can be made without departing from the spirit of the present invention and should be included in the protection scope of the present invention.
- FIG. 10 is a perspective assembled view of a sixth embodiment of the heat dissipation unit connection structure of the present invention.
- the sixth embodiment is partially identical to the first embodiment in structure and thus will not be redundantly described hereinafter.
- the sixth embodiment is different from the first embodiment in that the sixth embodiment further has at least one extension arm 23 perpendicularly extending from one side of the first section 21 of the heat dissipation unit 2 .
- the extension arm 23 is latched with the first section 21 of another adjacent heat dissipation unit 2 .
- the extension arm 23 can perpendicularly extend from one side of the first section 21 or perpendicularly extend from both sides of the first section 21 .
- the second sections 22 perpendicularly extending from the first sections 21 can enhance the structural strength of the free ends of the heat dissipation units 2 and provide dustproof effect.
- the second sections 22 are additionally formed with the latch sections 2211 and the latched sections 2221 , which are latched with each other. Therefore, the second sections 22 of the two adjacent heat dissipation units 2 can be connected without welding or adhesion or any other means. Accordingly, the working time and the manufacturing cost for the welding or adhesion can be saved.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- The present invention relates generally to a heat dissipation unit connection structure, and more particularly to a heat dissipation unit connection structure, which can quickly connect the heat dissipation units and save the connection cost.
- Please refer to
FIG. 1 . In the heat dissipation field, the conventional roll-bond plate evaporator 5 has been widely applied to the radiating fin or the product employing two-phase heat exchange to dissipate the heat. The roll-bond plate evaporator 5 has two faces. One of the two faces of some roll-bond plate evaporator 5 is formed with blown and raised pipelines. A cooling medium, which can be a gas or a liquid, is filled in the pipelines to enhance the heat dissipation performance. - The conventional inserted roll-
bond plate evaporators 5 can be classified into two types of structures. One is single-face roll-bond plate evaporator and the other is double-face roll-bond plate evaporator. The single-face roll-bond plate evaporator has a plane face and another face formed with the blown and raised pipelines. The double-face roll-bond plate evaporator has two faces both of which are formed with the blown and raised pipelines. The above two types of roll-bond plate evaporators 5 are both two-piece units assembled by means of adhesion or welding. A chamber is defined between the two units and a working gas is filled in the chamber. The roll-bond plate evaporator 5 has afree end 51 and a fixedend 52. Thefree end 51 has multiple locatingbosses 511. - The fixed end of the roll-
bond plate evaporator 5 is fixed in achannel 61 formed on asubstrate 6. Thesubstrate 6 is in contact with a heat source to conduct the heat thereof. The free end of the roll-bond plate evaporator 5 is connected with aplate body 7. Theplate body 7 is formed withmultiple perforations 71 in a position corresponding to the locatingbosses 511 of thefree ends 51 of the roll-bond plate evaporators 5. The locatingbosses 511 are inserted in theperforations 71 and then fixed by means of welding or the like. Theplate body 7 serves to provide dustproof effect and secure the roll-bond plate evaporators 5 to prevent the roll-bond plate evaporators 5 from being flexed and deformed. The connection method for assembling theplate body 7 with the conventional roll-bond plate evaporators 5 is relatively complicated. It is necessary to precisely align the roll-bond plate evaporators 5 with theplate body 7 and then weld the roll-bond plate evaporators 5 with theplate body 7. Such process is time-costing and the difficulty in working is increased. Moreover, once assembled, it is impossible or very hard to rework on theplate body 7. Furthermore, the securing structure of the conventional roll-bond plate evaporators 5 is too complicated so that the manufacturing cost is relatively high. - It is therefore tried by the applicant to provide a heat dissipation unit connection structure to improve the shortcomings of the conventional heat dissipation unit connection structure that it is complicated to secure the roll-
bond plate evaporators 5 and it is impossible to rework on the roll-bond plate evaporators 5. - It is therefore a primary object of the present invention to provide a heat dissipation unit connection structure, which can easily secure the heat dissipation units and achieve dustproof effect.
- To achieve the above and other objects, the heat dissipation unit connection structure of the present invention includes a substrate and multiple heat dissipation units.
- The substrate has a first face and a second face. Each heat dissipation unit has a first section and a second section. One end of the first section is connected with the second face of the substrate. The first section has an internal space. The second section extends from the other end of the first section. The second sections of each two adjacent heat dissipation units abut against and connect with each other.
- The heat dissipation unit connection structure improves the shortcoming of the conventional heat dissipation unit connection structure that it is necessary to additionally connect a plate body with the free ends of the heat dissipation units so that the connection structure and process are complicated. Therefore, the heat dissipation unit connection structure is simplified and the working time is shortened. Also, the manufacturing cost is lowered.
- The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
-
FIG. 1 is a perspective view of a conventional roll-bond plate evaporator structure; -
FIG. 2a is a perspective view of the heat dissipation unit of a first embodiment of the heat dissipation unit connection structure of the present invention; -
FIG. 2b is a perspective sectional view of the heat dissipation unit of the first embodiment of the heat dissipation unit connection structure of the present invention; -
FIG. 3 is a perspective assembled view of the first embodiment of the heat dissipation unit connection structure of the present invention; -
FIG. 4 is a perspective assembled view of a second embodiment of the heat dissipation unit connection structure of the present invention; -
FIG. 5a is a perspective exploded view of a third embodiment of the heat dissipation unit connection structure of the present invention; -
FIG. 5b is a perspective exploded view of the third embodiment of the heat dissipation unit connection structure of the present invention; -
FIG. 6 is a perspective assembled view of a fourth embodiment of the heat dissipation unit connection structure of the present invention; -
FIG. 7 is a perspective assembled view of a fifth embodiment of the heat dissipation unit connection structure of the present invention; -
FIG. 8 is a perspective assembled view of the heat dissipation unit connection structure of the present invention; -
FIG. 9 is a perspective assembled view of the heat dissipation unit connection structure of the present invention; and -
FIG. 10 is a perspective assembled view of a sixth embodiment of the heat dissipation unit connection structure of the present invention. - Please refer to
FIGS. 2a, 2b and 3.FIG. 2a is a perspective view of the heat dissipation unit of a first embodiment of the heat dissipation unit connection structure of the present invention.FIG. 2b is a perspective sectional view of the heat dissipation unit of the first embodiment of the heat dissipation unit connection structure of the present invention.FIG. 3 is a perspective assembled view of the first embodiment of the heat dissipation unit connection structure of the present invention. According to the first embodiment, the heat dissipation unit connection structure of the present invention includes asubstrate 1 and multipleheat dissipation units 2. - The
substrate 1 has afirst face 11 and asecond face 12. The first and second faces 11, 12 are respectively positioned on an upper side and a lower side of thesubstrate 1. Thefirst face 11 is in contact with at least one heat source (not shown) to conduct the heat of the heat source. Thesecond face 12 is formed withmultiple channels 121. - The
heat dissipation units 2 are made of a material selected from a group consisting of gold, silver, copper, aluminum, commercial pure titanium, titanium alloy, stainless steel, ceramic material, ceramic aluminum-based complex material and any combination thereof. Eachheat dissipation unit 2 has afirst section 21 and asecond section 22. Thefirst section 21 has aninternal space 211, which is an airtight chamber or flow passage. In this embodiment, thespace 211 is, but not limited to, anairtight chamber 211 for illustration purposes. A workingfluid 3 is filled in theairtight chamber 211. The workingfluid 3 can be a gas or a liquid. Thefirst section 21 is a section for two-phase (vapor phase and liquid phase) heat exchange. Various workingfluids 3 can be filled in theairtight chamber 211 to achieve vapor-liquid circulation heat exchange effect. Alternatively, theinternal space 211 of thefirst section 21 can be a flow passage. A roughened structure or a capillary structure can be selectively disposed in the flow passage to enhance the backflow effect of the workingfluid 3. - One end of the
first section 21 is connected with and inserted in thechannel 121 of thesecond face 12 of thesubstrate 1. The end of thefirst section 21 that is connected with thechannel 121 is anengagement end 212. Thechannel 121 has anengagement notch 1211 corresponding to theengagement end 212. Theengagement end 212 is correspondingly engaged with theengagement notch 1211. Thefirst section 21 of theheat dissipation unit 2 is securely connected with thechannel 121 of thesubstrate 1 by means of press fit, welding, adhesion, insertion or engagement. Alternatively, theengagement end 212 and theengagement notch 1211 can be a dovetailed tenon and a cooperative dovetailed mortise, which are assembled with each other (not shown). - The
second section 22 extends from the other end of thefirst section 21. Thesecond sections 22 of each two adjacentheat dissipation units 2 abut against and connect/assemble with each other. The first andsecond sections second section 22 has at least onevent 223. Thesecond sections 22 not only serve to provide dustproof effect, but also serve to enlarge the total heat dissipation area of theheat dissipation units 2. Thesecond section 22 has afirst end 221 and asecond end 222. Thesecond end 222 is positioned at a junction between the first andsecond sections first end 221 is a free end of thesecond section 22. The first and second ends 221, 222 of thesecond sections 22 of each two adjacentheat dissipation units 2 abut against and connect/assemble with each other, whereby thesecond sections 22 normal to thefirst sections 21 can enhance the structural strength and provide dustproof effect. In addition, thesecond sections 22 of each two adjacentheat dissipation units 2 can be further securely connected with each other by means of engagement, latching, welding, adhesion or hooping to increase the connection strength. - Please refer to
FIG. 4 , which is a perspective assembled view of a second embodiment of the heat dissipation unit connection structure of the present invention. The second embodiment is partially identical to the first embodiment in structure and thus will not be redundantly described hereinafter. The second embodiment is different from the first embodiment in that thesecond end 222 of thesecond section 22 of theheat dissipation unit 2 has agroove 2221. Thefirst end 221 of thesecond section 22 of theheat dissipation unit 2 abuts against and connects with thegroove 2221 of thesecond end 222 of thesecond section 22 of the adjacentheat dissipation unit 2, whereby thesecond sections 22 of the two adjacentheat dissipation units 2 are connected with each other and flush with each other. - Please refer to
FIGS. 5a and 5b .FIG. 5a is a perspective exploded view of a third embodiment of the heat dissipation unit connection structure of the present invention.FIG. 5b is a perspective exploded view of the third embodiment of the heat dissipation unit connection structure of the present invention. The third embodiment is partially identical to the first and second embodiments in structure and thus will not be redundantly described hereinafter. The third embodiment is different from the first embodiment in that the third embodiment further includes a holdingunit 4. The holdingunit 4 has afirst holding arm 41 and asecond holding arm 42 and aconnection arm 43. Two ends of theconnection arm 43 are connected with the first and second holdingarms space 44. The first and second holdingarms unit 4 serve to tightly hold the first and lastheat dissipation units 2 of the arrangedheat dissipation units 2, which abut against and connect with each other as disclosed in the first and second embodiments. Accordingly, theheat dissipation units 2 are received in the holdingspace 44 to enhance the securing effect. - In the following embodiments, the
second sections 22 of each two adjacentheat dissipation units 2 are formed with connection structures, which are connected with each other by means of engagement or latching to securely connect the adjacentheat dissipation units 2 with each other. - Please refer to
FIG. 6 , which is a perspective assembled view of a fourth embodiment of the heat dissipation unit connection structure of the present invention. The fourth embodiment is partially identical to the first embodiment in structure and thus will not be redundantly described hereinafter. The fourth embodiment is different from the first embodiment in that the fourth embodiment has a structure with latching or engagement effect. That is, thefirst end 221 of thesecond section 22 has a latch section 2211, while thesecond end 222 has a latchedsection 2221. The latch section 2211 of thefirst end 221 of theheat dissipation unit 2 is latched with the latchedsection 2221 of thesecond end 222 of the adjacentheat dissipation unit 2, whereby thesecond sections 22 of the two adjacentheat dissipation units 2 are engaged with each other. - Please refer to
FIG. 7 , which is a perspective assembled view of a fifth embodiment of the heat dissipation unit connection structure of the present invention. The fifth embodiment is partially identical to the fourth embodiment in structure and thus will not be redundantly described hereinafter. The fifth embodiment is different from the third embodiment in that in the fifth embodiment, the latch section 2211 is a T-shaped tenon, while the latchedsection 2221 is a T-shaped mortise corresponding to the T-shaped tenon. Such structure is similar to that of the fourth embodiment in which thefree end 2211 a has a width larger than the width of theconnection end 2211 b and theclosed side 2221 b has a width larger than the width of the open side 2221 a. Such structure can achieve an engagement and latching effect. - The latch section 2211 and the latched
section 2221 have some other aspects (as shown inFIGS. 8 and 9 ). Thefirst section 21 of another adjacentheat dissipation unit 2 is formed with a structure having a configuration identical to that of the lastheat dissipation unit 2 for correspondingly latching therewith (as shown inFIG. 8 ). Alternatively, two sides of thesecond section 22 are formed with a hooking structure having a hookingend 227 for hooking and latching with thefirst section 21 of another adjacent heat dissipation unit 2 (as shown inFIG. 9 ). The latching structures as shown in the drawings are only for illustration. Many modifications of the above embodiments can be made without departing from the spirit of the present invention and should be included in the protection scope of the present invention. - Please refer to
FIG. 10 , which is a perspective assembled view of a sixth embodiment of the heat dissipation unit connection structure of the present invention. The sixth embodiment is partially identical to the first embodiment in structure and thus will not be redundantly described hereinafter. The sixth embodiment is different from the first embodiment in that the sixth embodiment further has at least oneextension arm 23 perpendicularly extending from one side of thefirst section 21 of theheat dissipation unit 2. Theextension arm 23 is latched with thefirst section 21 of another adjacentheat dissipation unit 2. Theextension arm 23 can perpendicularly extend from one side of thefirst section 21 or perpendicularly extend from both sides of thefirst section 21. - According to the above arrangement, the
second sections 22 perpendicularly extending from thefirst sections 21 can enhance the structural strength of the free ends of theheat dissipation units 2 and provide dustproof effect. Moreover, thesecond sections 22 are additionally formed with the latch sections 2211 and the latchedsections 2221, which are latched with each other. Therefore, thesecond sections 22 of the two adjacentheat dissipation units 2 can be connected without welding or adhesion or any other means. Accordingly, the working time and the manufacturing cost for the welding or adhesion can be saved. - The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in such as the form or layout pattern or practicing step of the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/251,075 US20200232710A1 (en) | 2019-01-18 | 2019-01-18 | Heat dissipation unit connection structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/251,075 US20200232710A1 (en) | 2019-01-18 | 2019-01-18 | Heat dissipation unit connection structure |
Publications (1)
Publication Number | Publication Date |
---|---|
US20200232710A1 true US20200232710A1 (en) | 2020-07-23 |
Family
ID=71609813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/251,075 Abandoned US20200232710A1 (en) | 2019-01-18 | 2019-01-18 | Heat dissipation unit connection structure |
Country Status (1)
Country | Link |
---|---|
US (1) | US20200232710A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117457934A (en) * | 2023-11-29 | 2024-01-26 | 北京朔景新能源科技有限公司 | Heat dissipation support plate for fuel cell and fuel cell stack |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5038858A (en) * | 1990-03-13 | 1991-08-13 | Thermalloy Incorporated | Finned heat sink and method of manufacture |
US6176304B1 (en) * | 1998-11-24 | 2001-01-23 | Hon Hai Precision Ind. Co., Ltd. | Heat sink |
US6615910B1 (en) * | 2002-02-20 | 2003-09-09 | Delphi Technologies, Inc. | Advanced air cooled heat sink |
US6672379B1 (en) * | 2002-07-29 | 2004-01-06 | Waffer Technology Corp. | Positioning and buckling structure for use in a radiator |
US6742581B2 (en) * | 2001-11-21 | 2004-06-01 | Fujikura Ltd. | Heat sink and fin module |
US7032650B1 (en) * | 2004-12-28 | 2006-04-25 | Cooler Master Co., Ltd. | Cooling fin set |
US20090194255A1 (en) * | 2008-02-04 | 2009-08-06 | Tsung-Hsien Huang | Cooler device |
US20110061847A1 (en) * | 2009-09-11 | 2011-03-17 | Meng-Hsiu Hsieh | Heat dissipation device |
US20120014067A1 (en) * | 2010-07-16 | 2012-01-19 | Rockwell Automation Technologies, Inc. | Heat sink for power circuits |
US20120160467A1 (en) * | 2010-12-24 | 2012-06-28 | Foxconn Technology Co., Ltd. | Heat sink and assembly method thereof |
US8555952B2 (en) * | 2009-04-17 | 2013-10-15 | Tsung-Hsien Huang | Heat sink with fins having angled foot portion |
US20140321059A1 (en) * | 2013-04-26 | 2014-10-30 | Giga-Byte Technology Co., Ltd. | Heat dissipation module with heat pipe |
-
2019
- 2019-01-18 US US16/251,075 patent/US20200232710A1/en not_active Abandoned
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5038858A (en) * | 1990-03-13 | 1991-08-13 | Thermalloy Incorporated | Finned heat sink and method of manufacture |
US6176304B1 (en) * | 1998-11-24 | 2001-01-23 | Hon Hai Precision Ind. Co., Ltd. | Heat sink |
US6742581B2 (en) * | 2001-11-21 | 2004-06-01 | Fujikura Ltd. | Heat sink and fin module |
US6615910B1 (en) * | 2002-02-20 | 2003-09-09 | Delphi Technologies, Inc. | Advanced air cooled heat sink |
US6672379B1 (en) * | 2002-07-29 | 2004-01-06 | Waffer Technology Corp. | Positioning and buckling structure for use in a radiator |
US7032650B1 (en) * | 2004-12-28 | 2006-04-25 | Cooler Master Co., Ltd. | Cooling fin set |
US20090194255A1 (en) * | 2008-02-04 | 2009-08-06 | Tsung-Hsien Huang | Cooler device |
US8555952B2 (en) * | 2009-04-17 | 2013-10-15 | Tsung-Hsien Huang | Heat sink with fins having angled foot portion |
US20110061847A1 (en) * | 2009-09-11 | 2011-03-17 | Meng-Hsiu Hsieh | Heat dissipation device |
US20120014067A1 (en) * | 2010-07-16 | 2012-01-19 | Rockwell Automation Technologies, Inc. | Heat sink for power circuits |
US20120160467A1 (en) * | 2010-12-24 | 2012-06-28 | Foxconn Technology Co., Ltd. | Heat sink and assembly method thereof |
US20140321059A1 (en) * | 2013-04-26 | 2014-10-30 | Giga-Byte Technology Co., Ltd. | Heat dissipation module with heat pipe |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117457934A (en) * | 2023-11-29 | 2024-01-26 | 北京朔景新能源科技有限公司 | Heat dissipation support plate for fuel cell and fuel cell stack |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7775067B2 (en) | Heat exchanger header tank and heat exchanger comprising same | |
US6196306B1 (en) | Lamination type heat exchanger with pipe joint | |
US7275587B2 (en) | Combination cooler module | |
US6032726A (en) | Low-cost liquid heat transfer plate and method of manufacturing therefor | |
JP2019534560A (en) | Cooling plate | |
JP2007163004A (en) | Heat exchanger | |
US6675883B1 (en) | Manifold for heat exchanger | |
US20200232710A1 (en) | Heat dissipation unit connection structure | |
EP1425546A2 (en) | Heat exchanger | |
AU2002234898A1 (en) | Heat exchanger | |
JP6583071B2 (en) | Tank and heat exchanger | |
EP3772629A1 (en) | Heat dissipating fin with thermosiphon | |
US20070267185A1 (en) | Header for high pressure heat exchanger | |
US10302373B2 (en) | Heat exchanger | |
US20200309465A1 (en) | Heat exchange device | |
JP2020076535A (en) | Heat exchanger and method of manufacturing the same | |
KR20100025194A (en) | A heat exchanger and a making method for the same | |
JP2006200862A (en) | Flat tube for heat exchanger | |
TWI804863B (en) | Heat dissipation module | |
TW201300722A (en) | A thermal module structure and a manufacturing method thereof | |
JP2009008347A (en) | Heat exchanger | |
TWM576653U (en) | Heat dissipation unit combining structure | |
JP2008292070A (en) | Heat exchanger | |
KR101182185B1 (en) | A Structure and Assembling Method for a Heat Exchanger | |
JP4225744B2 (en) | Heat exchanger |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ASIA VITAL COMPONENTS (CHINA) CO., LTD., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIN, KUO-SHENG;REEL/FRAME:049632/0447 Effective date: 20190110 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |