JP3186624U - Radiation fin and heat dissipation device using the same - Google Patents
Radiation fin and heat dissipation device using the same Download PDFInfo
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- JP3186624U JP3186624U JP2013004510U JP2013004510U JP3186624U JP 3186624 U JP3186624 U JP 3186624U JP 2013004510 U JP2013004510 U JP 2013004510U JP 2013004510 U JP2013004510 U JP 2013004510U JP 3186624 U JP3186624 U JP 3186624U
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
- F28F3/027—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements with openings, e.g. louvered corrugated fins; Assemblies of corrugated strips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
【課題】波形の放熱フィン、および、それを用いた放熱装置を提供する。
【解決手段】放熱フィン1は、プレス加工により大面積の波形表面が形成されている波形板12、および、波形板12の一端に形成されている挿置部11を備える。波形板12の波形の振動方向および進行方向がいずれも前記挿置部の挿置方向と垂直となる。放熱装置は、複数の放熱フィン1および一つのブロック状ベース2を備える。放熱フィン1の底部端の挿置部11をブロック状ベース2に挿入することによって、放熱フィン1全体の放熱面積を増やして、放熱装置全体の放熱効果を向上することができる。
【選択図】図3A corrugated heat dissipating fin and a heat dissipating device using the corrugated heat dissipating fin are provided.
A heat dissipating fin includes a corrugated plate having a corrugated surface having a large area formed by pressing and an insertion portion formed at one end of the corrugated plate. Both the vibration direction and the traveling direction of the waveform of the corrugated plate 12 are perpendicular to the insertion direction of the insertion portion. The heat dissipating device includes a plurality of heat dissipating fins 1 and one block-like base 2. By inserting the insertion portion 11 at the bottom end of the radiating fin 1 into the block-like base 2, the radiating area of the entire radiating fin 1 can be increased, and the radiating effect of the entire radiating device can be improved.
[Selection] Figure 3
Description
本考案は、放熱フィン、及び、それを用いた放熱装置に関する。 The present invention relates to a heat radiating fin and a heat radiating device using the same.
従来の放熱装置は、複数の放熱フィンと一つのベースとを組合せることにより構成される。また、ベースには一つ以上の伝熱管が嵌着されている。従来の放熱装置の放熱フィンのシート体は、平面状に形成されており、ベースまたは伝熱管により吸収された熱エネルギーが放熱フィンを介して放出される。よって、放熱フィンの数およびフィンプレートの面積は、全体の放熱効率に直接に影響を与える。放熱フィンの数が多く、取付密度が高いほどに放熱効果が良いことは明らかである。 The conventional heat radiating device is configured by combining a plurality of heat radiating fins and one base. In addition, one or more heat transfer tubes are fitted to the base. The sheet body of the radiating fin of the conventional radiating device is formed in a flat shape, and the thermal energy absorbed by the base or the heat transfer tube is released through the radiating fin. Therefore, the number of radiating fins and the area of the fin plate directly affect the overall radiating efficiency. It is clear that the more the number of heat dissipating fins and the higher the mounting density, the better the heat dissipating effect.
特許文献1または特許文献2に記載されている放熱装置は、高密度の放熱フィンをプレス加工によりベースに結合する。よって、同じベース上に放熱フィンの数が多いほど、当然として放熱効果が良くなる。しかし、従来の放熱フィンのフィン体は単純な平面状でるため、同じ大きさの放熱フィンの面積も同じであり、現状のままでは全体の放熱面積を増やすことができない。
本考案の目的は、波形の放熱フィン、および、それを用いた放熱装置を提供することにある。
The heat dissipating device described in
An object of the present invention is to provide a corrugated heat dissipation fin and a heat dissipation device using the same.
本考案による放熱フィンは、プレス加工により大面積の波形表面が形成されている波形板、および、波形板の一端に形成されている挿置部を備える。波形板の波形の振動方向および進行方向がいずれも前記挿置部の設置方向と垂直となる。 The radiation fin by this invention is equipped with the corrugated board in which the corrugated surface of the large area was formed by press work, and the insertion part currently formed in the end of a corrugated board. The vibration direction and the traveling direction of the corrugated plate are both perpendicular to the installation direction of the insertion portion.
また、波形板と挿置部との間には、プレス加工により形成されている局部変形の過渡部を有する。 Moreover, it has the transient part of the local deformation | transformation formed by press work between a corrugated plate and an insertion part.
また、挿置部は、中央に一つ以上の嵌着溝が形成されており、両側に切削加工により形成されている低層溝を有する。嵌着溝と低層溝との間には、挿置部の板厚方向に立設している折りシートが形成されている。 Moreover, the insertion part has one or more fitting grooves formed in the center, and has low-layer grooves formed by cutting on both sides. A folded sheet standing in the plate thickness direction of the insertion portion is formed between the fitting groove and the low-layer groove.
本考案の放熱装置は、複数の放熱フィンおよび一つのベースを備える。放熱フィンの底部端の挿置部をベースに挿入することによって、放熱フィン全体の放熱面積を増やして、放熱装置全体の放熱効果を向上することができる。 The heat radiating device of the present invention includes a plurality of heat radiating fins and one base. By inserting the insertion portion at the bottom end of the heat radiation fin into the base, the heat radiation area of the entire heat radiation fin can be increased, and the heat radiation effect of the entire heat radiation device can be improved.
ベースは、ブロック状または棒状であり、放熱フィンに対応する複数の溝部が形成されており、放熱フィンと緊密に結合している。 The base has a block shape or a rod shape, and has a plurality of grooves corresponding to the heat radiating fins, and is closely coupled to the heat radiating fins.
複数の放熱フィンには、一つ以上の貫通穴、および、伝熱管の嵌設に用いられる嵌着溝が形成されている。伝熱管は貫通穴を貫通して、放熱フィンに密着されている。 The plurality of radiating fins are formed with one or more through holes and fitting grooves used for fitting the heat transfer tubes. The heat transfer tube passes through the through hole and is in close contact with the radiating fin.
放熱フィンにはプレス加工により大面積の波形表面が形成されており、ベースに挿入可能な挿置部が底部端に形成されている。ベースと複数の放熱フィンとが緊密に結合することができ、放熱フィンの面積が増加することによって、全体の放熱効率を向上することができる。 The heat dissipating fin has a corrugated surface with a large area formed by press working, and an insertion portion that can be inserted into the base is formed at the bottom end. The base and the plurality of radiating fins can be tightly coupled and the area of the radiating fins can be increased, thereby improving the overall radiating efficiency.
(第1実施形態)
本考案の第1実施形態を図1、2に基づいて説明する。
図1、2を参照する。本考案の第1実施形態による放熱フィン1はプレート状を形成し、底部端に挿置部11を有し、プレス加工により大面積の波形板12を短時間に形成して、ブロック状ベース2(図3)または2つの棒状ベース2´(図11)に挿置して置き、波形板12で増加された全体の放熱面積によって、放熱フィンまたは放熱器全体の放熱効率を向上させる。
(First embodiment)
A first embodiment of the present invention will be described with reference to FIGS.
Please refer to FIGS. The
前述放熱フィン1において、波形板12の波形の振動方向および進行方向がいずれも底部端に備える挿置部11の挿置方向と垂直となり、かつ波形板12と放熱フィン1底部端に備える挿置部11との間に位置していて、プレス加工により局部変形の過渡部13を形成する。前述波形板12の波形の振動方向および進行方向はいずれもベース2の接合面と平行しているため、垂直の波形板12を利用して、より良い構造強度の放熱器を組合せることができる。
In the
前述挿置部11の形態には限定されない。ベース2(または2´)に対応した溝部21と緊密な挿置結合できれば良い。一例として、図1に示す挿置部11は折り返し貼り合わせ状を形成することもできる。同じく、挿置部11を緊密に嵌着または圧着締結その他形態によることも可能である。例えば、挿置部11の末端部をL型の屈折状を形成しても良い。
The form of the
図3、4、本考案の放熱フィン1を放熱器に適用して組み合わせた第1実施例を参照する。放熱器は複数の放熱フィン1と、一つのブロック状ベース2とを備え、各放熱フィン1底部端の挿置部11をベース2の溝部21に合わせて挿入嵌着し固定することによって、すべての放熱フィン1ともベース2の接合面に安定に結合できる。各放熱フィン1とも波形板12を有しており、同じ大きさの放熱フィンであっても、放熱フィンの合計放熱面積を増やすことができるため、放熱器全体の放熱効率を向上できる。
3 and 4, reference is made to a first embodiment in which the
(第2実施形態)
本考案の第2実施形態を図5〜7に基づいて説明する。
図5ないし7、本考案の放熱フィンを放熱器に適用して組み合わせた第2実施例を参照する。本実施例において、放熱フィン1aは同じく底部端の挿置部11aと、垂直に配置された波形板12aと、過渡部13aとを備えており、放熱器は複数の放熱フィン1aと、ブロック状ベース2aと、一つ以上の伝熱管3とを備える。そのうち、放熱フィン1aは波形板12aにて一つ以上の対応の貫通穴121aを開けられ、ベース2a上には複数の放熱フィン1aに対応された溝部21aのほか、ベース2aの底面に伝熱管3の嵌着結合に用いる一つ以上の嵌着溝22aを開けられ、伝熱管3を上方に曲がって波形板12aの貫通穴121aに貫いて、安定な密着結合を形成する。
(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIGS.
5 to 7, reference is made to a second embodiment in which the radiating fins of the present invention are applied to a radiator and combined. In the present embodiment, the heat radiating fin 1a is similarly provided with an insertion portion 11a at the bottom end, a
前述した第1実施例と第2実施例は、本考案をコンピュータに備える中央演算装置の放熱器の適用例であるが、後者には伝熱管3が追加されている。
The first embodiment and the second embodiment described above are application examples of a radiator of a central processing unit provided with the present invention in a computer, but a
(第3実施形態)
本考案の第3実施形態を図8〜10に基づいて説明する。
図8ないし10に示す第3実施例は、本考案をコンピュータに備えるビデオカードの放熱器に適用された組合せ例である。そのうち、放熱フィン1bは扁平状を形成していて、同じく底部端の挿置部11bと、垂直に配置された波形状板12bと、過渡区域板13bのほか、局部変形の過渡区域板13bを含まれている。波形板12bの両側にそれぞれ対応の貫通穴121bを開けられ、すべての放熱フィン1bを合わせてベース2bの溝部21bに挿入した後に、2つの伝熱管3をそれぞれベース2bの嵌着溝22bに嵌設することによって、伝熱管3を上方に曲がって波形板12bの貫通穴121bを貫いて、安定な密着結合を形成する。
(Third embodiment)
A third embodiment of the present invention will be described with reference to FIGS.
The third embodiment shown in FIGS. 8 to 10 is a combination example in which the present invention is applied to a radiator of a video card provided in a computer. Among them, the radiating fin 1b has a flat shape, and similarly includes an
(第4実施形態)
本考案の第4実施形態を図11、12に基づいて説明する。
図11、12に示す第4実施例は、本考案の放熱フィン1cと2つの棒状ベース2´とを組み合わせたもう一つ形態の放熱器である。本実施例において、放熱器は複数の放熱フィン1cと、2つの棒状ベース2´と、一つ以上の伝熱管3とを備えているが、伝熱管3を省略することができる。そのうち、放熱フィン1cは挿置部11cの中央場所に一つまたは以上の嵌着溝111cを開けられ、両側はそれぞれ切削加工して低層溝112cを形成され、嵌着溝111cと低層溝112cとの間はそれぞれ折りシート113cを設けることによって、嵌着溝111cが伝熱管3に合わせて、貼り合わせ嵌着(図12)を形成し、両側の低層溝112cはそれぞれ2つの溝部21´を有する棒状ベース2´の嵌着に用いられ、放熱フィン1cの挿置部11cと緊密な挿置結合を形成する。さらに、各折りシート113cを隣り合わせて配列し連続した平面を形成する。前述した放熱フィン1cには同じく底部端の挿置部11cと、垂直に配置された波形状板12cと、過渡部13cと、対応の貫通穴121cと、を備えている。
(Fourth embodiment)
A fourth embodiment of the present invention will be described with reference to FIGS.
The fourth embodiment shown in FIGS. 11 and 12 is another type of radiator that combines the radiating
伝熱管3は上方に曲がって波形板12cの貫通穴121cを貫いて、密着結合を形成する。
The
放熱フィン1cに複数の嵌着溝111cを設けられているときは、各嵌着溝111cには接続または分離した隣接状態を形成しても良い。図11に示す第4実施例において、2つの嵌着溝111cは隣設しており、これに合わせて嵌着さした2つの伝熱管3を合わせて隙間を有しない平面(図12)を形成する。これに対して、2つの嵌着溝111cを分離して隣設するとき、2つの伝熱管3の間に隙間を有する平面が形成される。
When the plurality of
前述2つの棒状ベース2´と、一つの伝熱管3と、折りシート113cからなる連続平面を同じ水平位置に位置させ、共同の平面を形成しても良い。
A continuous plane composed of the two rod-like bases 2 ', the one
前述した各実施例は本考案の主な技術特徴及び応用例を開示する目的であり、本考案の技術範疇に制限を加わるものでない。等効果の応用または本考案の主な技術特徴に基づくその他の簡単な変化または置き換えは、なお本考案の技術範疇に含める。 Each of the embodiments described above is for the purpose of disclosing main technical features and application examples of the present invention, and does not limit the technical scope of the present invention. Applications of equal effects or other simple changes or substitutions based on the main technical features of the present invention are still included in the technical category of the present invention.
前述とおり、本考案の放熱フィンとその放熱器の組合せ設計は、特に放熱フィンより形成される大面積の波形板構造は今までに例をみない、かつ放熱フィンまたは放熱器全体の放熱面積を有効に増やせるため、新規性と進歩性の要件を満たしているため、法により登録を出願する。 As described above, the combination design of the heat dissipating fin and the heat dissipating device of the present invention is particularly unprecedented for the large area corrugated plate structure formed from the heat dissipating fin, and the heat dissipating area of the heat dissipating fin or the entire heat dissipating device is unprecedented. To meet the requirements of novelty and inventive step to apply effectively, apply for registration by law.
1、1a、1b、1c・・・放熱フィン、
11、11a、11b、11c・・・挿置部、
12、12a、12b、12c・・・波形板、
2、2a、2b・・・ブロック状ベース、
2´・・・棒状ベース、
13、13a、13b、13c・・・過渡部、
21、21´、21a・・・溝部、
3・・・伝熱管、
121a、121b、121c・・・貫通穴、
22a、22b、111c・・・嵌着溝、
112c・・・低層溝、
113c・・・折りシート。
1, 1a, 1b, 1c ... heat dissipation fins,
11, 11a, 11b, 11c ... insertion part,
12, 12a, 12b, 12c ... corrugated plate,
2, 2a, 2b ... block-shaped base,
2 '... Rod base,
13, 13a, 13b, 13c ... transient part,
21, 21 ′, 21 a... Groove portion,
3 ... Heat transfer tube,
121a, 121b, 121c ... through holes,
22a, 22b, 111c ... fitting groove,
112c ... low layer groove,
113c: Folded sheet.
Claims (10)
前記波形板の波形の振動方向および進行方向がいずれも前記挿置部の挿置方向と垂直となることを特徴とする放熱フィン。 A corrugated plate in which a corrugated surface having a large area is formed by pressing, and an insertion portion formed at one end of the corrugated plate,
The radiating fin according to claim 1, wherein both the vibration direction and the traveling direction of the corrugated plate are perpendicular to the insertion direction of the insertion portion.
前記嵌着溝と前記低層溝との間には、前記挿置部の板厚方向に立設している折りシートが形成されていることを特徴とする請求項1記載の放熱フィン。 The insertion portion has one or more fitting grooves formed in the center, and has low-layer grooves formed by cutting on both sides,
The radiating fin according to claim 1, wherein a folded sheet standing in the plate thickness direction of the insertion portion is formed between the fitting groove and the low-layer groove.
前記放熱フィンが挿入可能である溝部が形成されており、前記放熱フィンの密着嵌設に用いられるブロック状ベースと、を備えることを特徴とする放熱装置。 A corrugated plate having a corrugated surface having a large area formed by pressing, and an insertion portion formed at one end of the corrugated plate; A radiation fin perpendicular to the insertion direction of the insertion portion;
A heat radiating apparatus comprising: a groove base in which the radiating fin can be inserted, and a block-like base used for close fitting of the radiating fin.
前記放熱フィンが挿入可能である溝部が形成されており、前記放熱フィンの密着嵌設に用いられ、底面に一つ以上の嵌着溝が形成されているブロック状ベースと、
前記ブロック状ベースの前記嵌着溝に嵌設されており、前記波形板に形成されている貫通穴を貫通している伝熱管と、を備えることを特徴とする放熱装置。 A corrugated plate having a corrugated surface having a large area formed by pressing, and an insertion portion formed at one end of the corrugated plate; A radiation fin perpendicular to the insertion direction of the insertion portion;
A groove base into which the heat dissipating fins can be inserted is formed, used for close fitting of the heat dissipating fins, and a block-like base in which one or more fitting grooves are formed on the bottom surface;
And a heat transfer tube that is fitted in the fitting groove of the block-shaped base and passes through a through hole formed in the corrugated plate.
前記放熱フィンの挿入に用いられる溝部が形成されており、前記低層溝に嵌設されている2つの棒状ベースと、
前記放熱フィンの前記嵌着溝に嵌着されている伝熱管と、を備えることを特徴とする放熱装置。 A corrugated plate having a corrugated surface having a large area formed by pressing, and an insertion portion formed at one end of the corrugated plate; Heat dissipation having a low-layer groove that is perpendicular to the insertion direction of the insertion portion, has one or more fitting grooves formed in the center of the insertion portion, and is formed by cutting on both sides of the insertion portion. Fins,
A groove portion used for inserting the heat dissipating fins is formed, and two rod-like bases fitted in the low-layer groove;
And a heat transfer tube fitted in the fitting groove of the radiating fin.
前記伝熱管は、前記波形板の前記貫通穴を貫通し、前記波形板と密着結合することを特徴とする請求項7記載の放熱装置。 The heat radiating fin has one or more through holes formed in the corrugated plate,
The heat dissipation device according to claim 7, wherein the heat transfer tube penetrates the through hole of the corrugated plate and is tightly coupled to the corrugated plate.
Applications Claiming Priority (2)
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CN201310142333.3 | 2013-04-23 | ||
CN201310142333.3A CN103234378B (en) | 2013-04-23 | 2013-04-23 | Waveform radiating fin and radiator thereof |
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JP3186624U true JP3186624U (en) | 2013-10-17 |
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JP2013004510U Expired - Fee Related JP3186624U (en) | 2013-04-23 | 2013-08-05 | Radiation fin and heat dissipation device using the same |
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US (1) | US20140311712A1 (en) |
JP (1) | JP3186624U (en) |
KR (1) | KR20140005621U (en) |
CN (1) | CN103234378B (en) |
DE (1) | DE202013103297U1 (en) |
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- 2013-04-23 CN CN201310142333.3A patent/CN103234378B/en active Active
- 2013-07-09 TW TW102124503A patent/TW201442611A/en unknown
- 2013-07-09 TW TW102212928U patent/TWM465560U/en not_active IP Right Cessation
- 2013-07-18 US US13/945,179 patent/US20140311712A1/en not_active Abandoned
- 2013-07-23 DE DE202013103297U patent/DE202013103297U1/en not_active Expired - Lifetime
- 2013-07-30 KR KR2020130006327U patent/KR20140005621U/en not_active Application Discontinuation
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CN103234378A (en) | 2013-08-07 |
KR20140005621U (en) | 2014-10-31 |
DE202013103297U1 (en) | 2013-09-10 |
CN103234378B (en) | 2015-09-30 |
TW201442611A (en) | 2014-11-01 |
US20140311712A1 (en) | 2014-10-23 |
TWM465560U (en) | 2013-11-11 |
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